Search results for: silicon carbide
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 252

Search results for: silicon carbide

102 Experimental Investigation of Adjacent Hall Structures Parameters

Authors: Ivelina N. Cholakova, Tihomir B. Takov, Radostin Ts. Tsankov, Nicolas Simonne, Slavka S. Tzanova

Abstract:

Adjacent Hall microsensors, comprising a silicon substrate and four contacts, providing simultaneously two supply inputs and two differential outputs, are characterized. The voltage related sensitivity is in the order of 0.11T-1, and a cancellation method for offset compensation is used, achieving residual offset in the micro scale which is also compared to a single Hall plate.

Keywords: Adjacent Hall sensors, offset compensation, voltage related sensitivity, 0.18μm CMOS technology.

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101 Photoluminescence Properties of β-FeSi2 on Cu- or Au-coated Si

Authors: Kensuke Akiyama, Satoru Kaneko, Takeshi Ozawa, Kazuya Yokomizo, Masaru Itakura

Abstract:

The photoluminescence (PL) at 1.55 μm from semiconducting β-FeSi2 has attracted a noticeable interest for silicon-based optoelectronic applications. Moreover, its high optical absorption coefficient (higher than 105 cm-1 above 1.0 eV) allows this semiconducting material to be used as photovoltanics devices. A clear PL spectrum for β-FeSi2 was observed by Cu or Au coating on Si(001). High-crystal-quality β-FeSi2 with a low-level nonradiative center was formed on a Cu- or Au- reated Si layer. This method of deposition can be applied to other materials requiring high crystal quality.

Keywords: iron silicide, semiconductor, epitaxial, photoluminescence.

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100 3D Modeling of Temperature by Finite Element in Machining with Experimental Authorization

Authors: P. Mottaghizadeh, M. Bagheri

Abstract:

In the present paper, the three-dimensional temperature field of tool is determined during the machining and compared with experimental work on C45 workpiece using carbide cutting tool inserts. During the metal cutting operations, high temperature is generated in the tool cutting edge which influence on the rate of tool wear. Temperature is most important characteristic of machining processes; since many parameters such as cutting speed, surface quality and cutting forces depend on the temperature and high temperatures can cause high mechanical stresses which lead to early tool wear and reduce tool life. Therefore, considerable attention is paid to determine tool temperatures. The experiments are carried out for dry and orthogonal machining condition. The results show that the increase of tool temperature depends on depth of cut and especially cutting speed in high range of cutting conditions.

Keywords: Finite element method, Machining, Temperature measurement, Thermal fields

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99 Inspection of Geometrical Integrity of Work Piece and Measurement of Tool Wear by the Use of Photo Digitizing Method

Authors: R. Alipour, F. Nadjarian, A. Alinaghizade

Abstract:

Considering complexity of products, new geometrical design and investment tolerances that are necessary, measuring and dimensional controlling involve modern and more precise methods. Photo digitizing method using two cameras to record pictures and utilization of conventional method named “cloud points" and data analysis by the use of ATOUS software, is known as modern and efficient in mentioned context. In this paper, benefits of photo digitizing method in evaluating sampling of machining processes have been put forward. For example, assessment of geometrical integrity surface in 5-axis milling process and measurement of carbide tool wear in turning process, can be can be brought forward. Advantages of this method comparing to conventional methods have been expressed.

Keywords: photo digitizing, tool wear, geometrical integrity, cloud points

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98 The Effects of RCA Clean Variables on Particle Removal Efficiency

Authors: Siti Kudnie Sahari, Jane Chai Hai Sing, Khairuddin Ab. Hamid

Abstract:

Shrunken patterning for integrated device manufacturing requires surface cleanliness and surface smoothness in wet chemical processing [1]. It is necessary to control all process parameters perfectly especially for the common cleaning technique RCA clean (SC-1 and SC-2) [2]. In this paper the characteristic and effect of surface preparation parameters are discussed. The properties of RCA wet chemical processing in silicon technology is based on processing time, temperature, concentration and megasonic power of SC-1 and QDR. An improvement of wafer surface preparation by the enhanced variables of the wet cleaning chemical process is proposed.

Keywords: RCA, SC-1, SC-2, QDR

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97 Examining of Tool Wear in Cryogenic Machining of Cobalt-Based Haynes 25 Superalloy

Authors: Murat Sarıkaya, Abdulkadir Güllü

Abstract:

Haynes 25 alloy (also known as L-605 alloy) is cobalt based super alloy which has widely applications such as aerospace industry, turbine and furnace parts, power generators and heat exchangers and petroleum refining components due to its excellent characteristics. However, the workability of this alloy is more difficult compared to normal steels or even stainless. In present work, an experimental investigation was performed under cryogenic cooling to determine cutting tool wear patterns and obtain optimal cutting parameters in turning of cobalt based superalloy Haynes 25. In experiments, uncoated carbide tool was used and cutting speed (V) and feed rate (f) were considered as test parameters. Tool wear (VBmax) were measured for process performance indicators. Analysis of variance (ANOVA) was performed to determine the importance of machining parameters.

Keywords: Cryogenic machining, difficult-to-cut alloy, tool wear, turning.

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96 Turning Thin-Walled Workpieces with Variable Depth of Cut

Authors: M. Sadilek, L. Petrkovska, J. Kratochvil

Abstract:

The article deals with the possibilities of increasing the efficiency of turning thin-walled workpieces. It proposes a new strategy for turning and it proposes new implementation of roughing cycles where a variable depth of cut is applied. Proposed roughing cycles are created in the CAD/CAM system. These roughing cycles are described in relation to their further use in practice.

The experimental research has focused on monitoring the durability of cutting tool and increases its tool life. It compares the turning where the standard roughing cycle is used and the turning where the proposed roughing cycle with variable depth of cut is applied. In article are monitored tool wear during cutting with the sintered carbide cutting edge. The result verifies theoretical prerequisites of tool wear.

Keywords: Variable depth of cut, CAD-CAM system, turning, durability.

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95 SCR-Based Advanced ESD Protection Device for Low Voltage Application

Authors: Bo Bae Song, Byung Seok Lee, Hyun Young Kim, Chung Kwang Lee, Yong Seo Koo

Abstract:

This paper proposed a silicon controller rectifier (SCR) based ESD protection device to protect low voltage ESD for integrated circuit. The proposed ESD protection device has low trigger voltage and high holding voltage compared with conventional SCR-based ESD protection devices. The proposed ESD protection circuit is verified and compared by TCAD simulation. This paper verified effective low voltage ESD characteristics with low trigger voltage of 5.79V and high holding voltage of 3.5V through optimization depending on design variables (D1, D2, D3 and D4).

Keywords: ESD, SCR, Holding voltage, Latch-up.

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94 2-D Realization of WiMAX Channel Interleaver for Efficient Hardware Implementation

Authors: Rizwan Asghar, Dake Liu

Abstract:

The direct implementation of interleaver functions in WiMAX is not hardware efficient due to presence of complex functions. Also the conventional method i.e. using memories for storing the permutation tables is silicon consuming. This work presents a 2-D transformation for WiMAX channel interleaver functions which reduces the overall hardware complexity to compute the interleaver addresses on the fly. A fully reconfigurable architecture for address generation in WiMAX channel interleaver is presented, which consume 1.1 k-gates in total. It can be configured for any block size and any modulation scheme in WiMAX. The presented architecture can run at a frequency of 200 MHz, thus fully supporting high bandwidth requirements for WiMAX.

Keywords: Interleaver, deinterleaver, WiMAX, 802.16e.

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93 Research of Concentratibility of Low Quality Bauxite Raw Materials

Authors: Nadezhda Nikolaeva, Tatyana Alexandrova, Alexandr Alexandrov

Abstract:

Processing of high-silicon bauxite on the base of the traditional clinkering method is related to high power consumption and capital investments, which makes production of alumina from those ores non-competitive in terms of basic economic showings. For these reasons, development of technological solutions enabling to process bauxites with various chemical and mineralogical structures efficiently with low level of thermal power consumption is important. Flow sheet of the studies on washability of ores from the Timanskoe and the Severo-Onezhskoe deposits is on the base of the flotation method.

Keywords: Low-quality bauxite, resource-saving technology, optimization, aluminum, conditioning of composition, separation characteristics.

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92 Thermoelastic Damping of Inextensional Hemispherical Shell

Authors: S. Y. Choi, Y. H. Na, J. H. Kim

Abstract:

In this work, thermoelastic damping effect on the hemi- spherical shells is investigated. The material is selected silicon, and heat conduction equation for thermal flow is solved to obtain the temperature profile in which bending approximation with inextensional assumption of the model. Using the temperature profile, eigen-value analysis is performed to get the natural frequencies of hemispherical shells. Effects of mode numbers, radii and radial thicknesses of the model on the natural frequencies are analyzed in detail. Furthermore, the quality factor (Q-factor) is defined, and discussed for the ring and hemispherical shell.

Keywords: Thermoelastic damping, hemispherical shell, quality factor

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91 Electrical Characteristics of SCR - based ESD Device for I/O and Power Rail Clamp in 0.35um Process

Authors: Yong Seo Koo, Dong Su Kim, Byung Seok Lee, Won Suk Park, Bo Bea Song

Abstract:

This paper presents a SCR-based ESD protection devices for I/O clamp and power rail clamp, respectably. These devices have a low trigger voltage and high holding voltage characteristics than conventional SCR device. These devices are fabricated by using 0.35um BCD (Bipolar-CMOS-DMOS) processes. These devices were validated using a TLP system. From the experimental results, the device for I/O ESD clamp has a trigger voltage of 5.8V. Also, the device for power rail ESD clamp has a holding voltage of 7.7V.

Keywords: ESD (Electro-Static Discharge), ESD protection device, SCR (Silicon Controlled Rectifier), Latch-up

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90 Development of Predictive Model for Surface Roughness in End Milling of Al-SiCp Metal Matrix Composites using Fuzzy Logic

Authors: M. Chandrasekaran, D. Devarasiddappa

Abstract:

Metal matrix composites have been increasingly used as materials for components in automotive and aerospace industries because of their improved properties compared with non-reinforced alloys. During machining the selection of appropriate machining parameters to produce job for desired surface roughness is of great concern considering the economy of manufacturing process. In this study, a surface roughness prediction model using fuzzy logic is developed for end milling of Al-SiCp metal matrix composite component using carbide end mill cutter. The surface roughness is modeled as a function of spindle speed (N), feed rate (f), depth of cut (d) and the SiCp percentage (S). The predicted values surface roughness is compared with experimental result. The model predicts average percentage error as 4.56% and mean square error as 0.0729. It is observed that surface roughness is most influenced by feed rate, spindle speed and SiC percentage. Depth of cut has least influence.

Keywords: End milling, fuzzy logic, metal matrix composites, surface roughness

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89 Tool Damage and Adhesion Effects in Turning and Drilling of Hardened Steels

Authors: Chris M. Taylor, Ian Cook, Raul Alegre, Pedro Arrazola, Phil Spiers

Abstract:

Noteworthy results have been obtained in the turning and drilling of hardened high-strength steels using tungsten carbide based cutting tools. In a finish turning process, it was seen that surface roughness and tool flank wear followed very different trends against cutting time. The suggested explanation for this behaviour is that the profile cut into the workpiece surface is determined by the tool’s cutting edge profile. It is shown that the profile appearing on the cut surface changes rapidly over time, so the profile of the tool cutting edge should also be changing rapidly. Workpiece material adhered onto the cutting tool, which is also known as a built-up edge, is a phenomenon which could explain the observations made. In terms of tool damage modes, workpiece material adhesion is believed to have contributed to tool wear in examples provided from finish turning, thread turning and drilling. Additionally, evidence of tool fracture and tool abrasion were recorded.

Keywords: Turning, drilling, adhesion, wear, hard steels.

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88 Fabrication and Characterization of Poly-Si Vertical Nanowire Thin Film Transistor

Authors: N. Shen, T. T. Le, H. Y. Yu, Z. X. Chen, K. T. Win, N. Singh, G. Q. Lo, D. -L. Kwong

Abstract:

In this paper, we present a vertical nanowire thin film transistor with gate-all-around architecture, fabricated using CMOS compatible processes. A novel method of fabricating polysilicon vertical nanowires of diameter as small as 30 nm using wet-etch is presented. Both n-type and p-type vertical poly-silicon nanowire transistors exhibit superior electrical characteristics as compared to planar devices. On a poly-crystalline nanowire of 30 nm diameter, high Ion/Ioff ratio of 106, low drain-induced barrier lowering (DIBL) of 50 mV/V, and low sub-threshold slope SS~100mV/dec are demonstrated for a device with channel length of 100 nm.

Keywords: Nanowire (NW), Gate-all-around (GAA), polysilicon (poly-Si), thin-film transistor (TFT).

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87 Analyses of Wear Mechanisms Occurring During Machining of the Titanium Alloy Ti- 6Al-2Sn-4Zr-6Mo

Authors: Z. Rihova, K. Saksl, C. Siemers, D. Ostroushko

Abstract:

Titanium alloys like the modern alloy Ti 6Al 2Sn 4Zr 6Mo (Ti-6246) combine excellent specific mechanical properties and corrosion resistance. On the other hand,due to their material characteristics, machining of these alloys is difficult to perform. The aim of the current study is the analyses of wear mechanisms of coated cemented carbide tools applied in orthogonal cutting experiments of Ti-6246 alloy. Round bars were machined with standard coated tools in dry conditions on a CNC latheusing a wide range of cutting speeds and cutting depths. Tool wear mechanisms were afterwards investigated by means of stereo microscopy, optical microscopy, confocal microscopy and scanning electron microscopy. Wear mechanisms included fracture of the tool tip (total failure) and abrasion. Specific wear features like crater wear, micro cracks and built-up edgeformation appeared depending of the mechanical and thermal conditions generated in the workpiece surface by the cutting action.

Keywords: Alloy 6246, machining, tool wear, optical microscopy, SEM, EDX analysis

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86 Performance of Nine Different Types of PV Modules in the Tropical Region

Authors: Jiang Fan

Abstract:

With growth of PV market in tropical region, it is necessary to investigate the performance of different types of PV technology under the tropical weather conditions. Singapore Polytechnic was funded by Economic Development Board (EDB) to set up a solar PV test-bed for the research on performance of different types of PV modules in the country. The PV test-bed installed the nine different types of PV systems that are integrated to power utility grid for monitoring and analyzing their operating performances. This paper presents the 12 months operational data of nine different PV systems and analyses on performances of installed PV systems using energy yield and performance ratio. The nine types of PV systems under test have shown their energy yields ranging from 2.67 to 3.36 kWh/kWp and their performance ratios (PRs) ranging from 70% to 88%.

Keywords: Monocrystalline, Multicrystalline, Amorphous Silicon, Cadmium Telluride and thin film PV.

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85 Highly Sensitive Label Free Biosensor for Tumor Necrosis Factor

Authors: Tze Sian Pui, Tushar Bansal, Patthara Kongsuphol, Sunil K. Arya

Abstract:

We present a label-free biosensor based on electrochemical impedance spectroscopy for the detection of proinflammatory cytokine Tumor Necrosis Factor (TNF-α). Secretion of TNF-α has been correlated to the onset of various diseases including rheumatoid arthritis, Crohn-s disease etc. Gold electrodes were patterned on a silicon substrate and self assembled monolayer of dithiobis-succinimidyl propionate was used to develop the biosensor which achieved a detection limit of ~57fM. A linear relationship was also observed between increasing TNF-α concentrations and chargetransfer resistance within a dynamic range of 1pg/ml – 1ng/ml.

Keywords: Tumor necrosis factor, electrochemical impedance spectroscopy, label free, self assembled monolayer

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84 Comparative Analysis of Transient-Fault Tolerant Schemes for Network on Chips

Authors: Muhammad Ali, Awais Adnan

Abstract:

Network on a chip (NoC) has been proposed as a viable solution to counter the inefficiency of buses in the current VLSI on-chip interconnects. However, as the silicon chip accommodates more transistors, the probability of transient faults is increasing, making fault tolerance a key concern in scaling chips. In packet based communication on a chip, transient failures can corrupt the data packet and hence, undermine the accuracy of data communication. In this paper, we present a comparative analysis of transient fault tolerant techniques including end-to-end, node-by-node, and stochastic communication based on flooding principle.

Keywords: NoC, fault-tolerance, transient faults.

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83 Effect of Composite Material on Damping Capacity Improvement of Cutting Tool in Machining Operation Using Taguchi Approach

Authors: S. Ghorbani, N. I. Polushin

Abstract:

Chatter vibrations, occurring during cutting process, cause vibration between the cutting tool and workpiece, which deteriorates surface roughness and reduces tool life. The purpose of this study is to investigate the influence of cutting parameters and tool construction on surface roughness and vibration in turning of aluminum alloy AA2024. A new design of cutting tool is proposed, which is filled up with epoxy granite in order to improve damping capacity of the tool. Experiments were performed at the lathe using carbide cutting insert coated with TiC and two different cutting tools made of AISI 5140 steel. Taguchi L9 orthogonal array was applied to design of experiment and to optimize cutting conditions. By the help of signal-to-noise ratio and analysis of variance the optimal cutting condition and the effect of the cutting parameters on surface roughness and vibration were determined. Effectiveness of Taguchi method was verified by confirmation test. It was revealed that new cutting tool with epoxy granite has reduced vibration and surface roughness due to high damping properties of epoxy granite in toolholder.

Keywords: ANOVA, damping capacity, surface roughness, Taguchi method, vibration.

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82 A Comparative Study of Electrical Transport Phenomena in Ultrathin vs. Nanoscale SOI MOSFETs Devices

Authors: A. Karsenty, A. Chelly

Abstract:

Ultrathin (UTD) and Nanoscale (NSD) SOI-MOSFET devices, sharing a similar W/L but with a channel thickness of 46nm and 1.6nm respectively, were fabricated using a selective “gate recessed” process on the same silicon wafer. The electrical transport characterization at room temperature has shown a large difference between the two kinds of devices and has been interpreted in terms of a huge unexpected series resistance. Electrical characteristics of the Nanoscale device, taken in the linear region, can be analytically derived from the ultrathin device ones. A comparison of the structure and composition of the layers, using advanced techniques such as Focused Ion Beam (FIB) and High Resolution TEM (HRTEM) coupled with Energy Dispersive X-ray Spectroscopy (EDS), contributes an explanation as to the difference of transport between the devices.

Keywords: Nanoscale Devices, SOI MOSFET, Analytical Model, Electron Transport.

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81 New Iterative Algorithm for Improving Depth Resolution in Ionic Analysis: Effect of Iterations Number

Authors: N. Dahraoui, M. Boulakroune, D. Benatia

Abstract:

In this paper, the improvement by deconvolution of the depth resolution in Secondary Ion Mass Spectrometry (SIMS) analysis is considered. Indeed, we have developed a new Tikhonov- Miller deconvolution algorithm where a priori model of the solution is included. This is a denoisy and pre-deconvoluted signal obtained from: firstly, by the application of wavelet shrinkage algorithm, secondly by the introduction of the obtained denoisy signal in an iterative deconvolution algorithm. In particular, we have focused the light on the effect of the iterations number on the evolution of the deconvoluted signals. The SIMS profiles are multilayers of Boron in Silicon matrix.

Keywords: DRF, in-depth resolution, multiresolution deconvolution, SIMS, wavelet shrinkage.

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80 Sol-gel Synthesis and Optical Characterisation of TiO2 Thin Films for Photovoltaic Application

Authors: N. H. Arabi, Aicha Iratni, Talaighil Razika, Bruno Capoen, Mohamed Bouazaoui

Abstract:

TiO2 thin films have been prepared by the sol-gel dipcoating technique in order to elaborate antireflective thin films for monocrystalline silicon (mono-Si). The titanium isopropoxyde was chosen as a precursor with hydrochloric acid as a catalyser for preparing a stable solution. The optical properties have been tailored with varying the solution concentration, the withdrawn speed, and the heat-treatment. We showed that using a TiO2 single layer with 64.5 nm in thickness, heat-treated at 450°C or 300°C reduces the mono-Si reflection at a level lower than 3% over the broadband spectral domains [669-834] nm and [786-1006] nm respectively. Those latter performances are similar to the ones obtained with double layers of low and high refractive index glasses respectively.

Keywords: Dip coating, mono-Si, titanium oxide, thin film.

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79 Optimization of Surface Roughness and Vibration in Turning of Aluminum Alloy AA2024 Using Taguchi Technique

Authors: Vladimir Aleksandrovich Rogov, Ghorbani Siamak

Abstract:

Determination of optimal conditions of machining parameters is important to reduce the production cost and achieve the desired surface quality. This paper investigates the influence of cutting parameters on surface roughness and natural frequency in turning of aluminum alloy AA2024. The experiments were performed at the lathe machine using two different cutting tools made of AISI 5140 and carbide cutting insert coated with TiC. Turning experiments were planned by Taguchi method L9 orthogonal array.Three levels for spindle speed, feed rate, depth of cut and tool overhang were chosen as cutting variables. The obtained experimental data has been analyzed using signal to noise ratio and analysis of variance. The main effects have been discussed and percentage contributions of various parameters affecting surface roughness and natural frequency, and optimal cutting conditions have been determined. Finally, optimization of the cutting parameters using Taguchi method was verified by confirmation experiments.

Keywords: Turning, Cutting conditions, Surface roughness, Natural frequency, Taguchi method, ANOVA, S/N ratio.

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78 Microstructure and Mechanical Properties of Duplex Stainless steel for Anchor Bolt Application

Authors: Gil Hwan Na , Woo Young Jung , Tae Kwon Ha

Abstract:

Most buildings have been using anchor bolts commonly for installing outdoor advertising structures. Anchor bolts of common carbon steel are widely used and often installed indiscriminately by inadequate installation standards. In the area where strong winds frequently blow, falling accidents of outdoor advertising structures can occur and cause a serious disaster, which is very dangerous and to be prevented. In this regard, the development of high-performance anchor bolts is urgently required. In the present study, 25Cr-8Ni-1.5Si-1Mn-0.4C alloy was produced by traditional vacuum induction melting (VIM) for the application of anchor bolt. The alloy composition is revealed as a duplex microstructure from thermodynamic phase analysis by FactSage® and confirmed by metallographic experiment. Addition of Nitrogen to the alloy was found to reduce the ferritic phase domain and significantly increase the hardness and the tensile strength. Microstructure observation revealed mixed structure of austenite and ferrite with fine carbide distributed along the grain and phase boundaries.

Keywords: Anchor bolt, Duplex stainless steel, FactSage®, Hardness, Thermodynamic phase analysis.

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77 Kinetics Study of Ammonia Removal from Synthetic Waste Water

Authors: Edison Muzenda, John Kabuba, Freeman Ntuli, Mansoor Mollagee

Abstract:

The aim of this study was to investigate ammonium exchange capacity of natural and activated clinoptilolite from Kwazulu-Natal Province, South Africa. X – ray fluorescence (XRF) analysis showed that the clinoptilolite contained exchangeable ions of sodium, potassium, calcium and magnesium. This analysis also confirmed that the zeolite sample had a high silicon composition compared to aluminium. Batch equilibrium studies were performed in an orbital shaker and the data fitted the Langmuir isotherm very well. The ammonium exchange capacity was found to increase with pH and temperature. Clinoptilolite functionalization with hydrochloric acid increased its ammonia uptake ability.

Keywords: Activated clinoptilolite, Ammonium exchange, Equilibrium, Functionalization, Langmuir isotherm

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76 A Study on ESD Protection Circuit Applying Silicon Controlled Rectifier-Based Stack Technology with High Holding Voltage

Authors: Hee-Guk Chae, Bo-Bae Song, Kyoung-Il Do, Jeong-Yun Seo, Yong-Seo Koo

Abstract:

In this study, an improved Electrostatic Discharge (ESD) protection circuit with low trigger voltage and high holding voltage is proposed. ESD has become a serious problem in the semiconductor process because the semiconductor density has become very high these days. Therefore, much research has been done to prevent ESD. The proposed circuit is a stacked structure of the new unit structure combined by the Zener Triggering (SCR ZTSCR) and the High Holding Voltage SCR (HHVSCR). The simulation results show that the proposed circuit has low trigger voltage and high holding voltage. And the stack technology is applied to adjust the various operating voltage. As the results, the holding voltage is 7.7 V for 2-stack and 10.7 V for 3-stack.

Keywords: ESD, SCR, latch-up, power clamp, holding voltage.

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75 Raman Scattering and PL Studies on AlGaN/GaN HEMT Layers on 200 mm Si(111)

Authors: W. Z. Wang, S. Todd, S. B. Dolmanan, K. B. Lee, L. Yuan, H. F. Sun, S. L. Selvaraj, M.Krishnakumar, G. Q. Lo, S. Tripathy

Abstract:

The crystalline quality of the AlGaN/GaN high electron mobility transistor (HEMT) structure grown on a 200 mm silicon substrate has been investigated using UV-visible micro- Raman scattering and photoluminescence (PL). The visible Raman scattering probes the whole nitride stack with the Si substrate and shows the presence of a small component of residual in-plane stress in the thick GaN buffer resulting from a wafer bowing, while the UV micro-Raman indicates a tensile interfacial stress induced at the top GaN/AlGaN/AlN layers. PL shows a good crystal quality GaN channel where the yellow band intensity is very low compared to that of the near-band-edge transition. The uniformity of this sample is shown by measurements from several points across the epiwafer.

Keywords: Raman, photo luminescence, AlGaN/GaN, HEMT.

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74 A Novel Method for Areal Surface Roughness Measurement

Authors: Romuald Synak, Wlodzimierz Lipinski, Marcin Pawelczak

Abstract:

An area-integrating method that uses the technique of total integrated light scatter for evaluating the root mean square height of the surface Sq has been presented in the paper. It is based on the measurement of the scatter power using a flat photodiode integrator rather than an optical sphere or a hemisphere. By this means, one can obtain much less expensive and smaller instruments than traditional ones. Thanks to this, they could find their application for surface control purposes, particularly in small and medium size enterprises. A description of the functioning of the measuring unit as well as the impact caused by different factors on its properties is presented first. Next, results of measurements of the Sq values performed for optical, silicon and metal samples have been shown. It has been also proven that they are in a good agreement with the results obtained using the Ulbricht sphere instrument.

Keywords: ISO 25178 Standard, scatterometry, surface metrology, surface roughness

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73 Doping of Conveyor Belt Materials with Nanostructured Fillers to Adapt Innovative Performance Characteristics

Authors: S. Falkenberg, L. Overmeyer

Abstract:

The “conveyor belt" as a product represents a complex high performance component with a wide range of different applications. Further development of these highly complex components demands an integration of new technologies and new enhanced materials. In this context nanostructured fillers appear to have a more promising effect on the performance of the conveyor belt composite than conventional micro-scaled fillers. Within the project “DotTrans" nanostructured fillers, for example silicon dioxide, are used to optimize performance parameters of conveyor belt systems. The objective of the project includes operating parameters like energy consumption or friction characteristics as well as adaptive parameters like cut or wear resistance.

Keywords: Conveyor belt, nanostructured fillers, wear resistance, friction characteristics.

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