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The Effects of RCA Clean Variables on Particle Removal Efficiency
Abstract:Shrunken patterning for integrated device manufacturing requires surface cleanliness and surface smoothness in wet chemical processing . It is necessary to control all process parameters perfectly especially for the common cleaning technique RCA clean (SC-1 and SC-2) . In this paper the characteristic and effect of surface preparation parameters are discussed. The properties of RCA wet chemical processing in silicon technology is based on processing time, temperature, concentration and megasonic power of SC-1 and QDR. An improvement of wafer surface preparation by the enhanced variables of the wet cleaning chemical process is proposed.
Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1062690Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 2778
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