%0 Journal Article
	%A S. Y. Choi and  Y. H. Na and  J. H. Kim
	%D 2009
	%J International Journal of Mechanical and Mechatronics Engineering
	%B World Academy of Science, Engineering and Technology
	%I Open Science Index 32, 2009
	%T Thermoelastic Damping of Inextensional Hemispherical Shell
	%U https://publications.waset.org/pdf/3710
	%V 32
	%X In this work, thermoelastic damping effect on the hemi- spherical shells is investigated. The material is selected silicon, and heat conduction equation for thermal flow is solved to obtain the temperature profile in which bending approximation with inextensional assumption of the model. Using the temperature profile, eigen-value analysis is performed to get the natural frequencies of hemispherical shells. Effects of mode numbers, radii and radial thicknesses of the model on the natural frequencies are analyzed in detail. Furthermore, the quality factor (Q-factor) is defined, and discussed for the ring and hemispherical shell. 
	%P 892 - 897