@article{(Open Science Index):https://publications.waset.org/pdf/6321, title = {The Effects of RCA Clean Variables on Particle Removal Efficiency}, author = {Siti Kudnie Sahari and Jane Chai Hai Sing and Khairuddin Ab. Hamid}, country = {}, institution = {}, abstract = {Shrunken patterning for integrated device manufacturing requires surface cleanliness and surface smoothness in wet chemical processing [1]. It is necessary to control all process parameters perfectly especially for the common cleaning technique RCA clean (SC-1 and SC-2) [2]. In this paper the characteristic and effect of surface preparation parameters are discussed. The properties of RCA wet chemical processing in silicon technology is based on processing time, temperature, concentration and megasonic power of SC-1 and QDR. An improvement of wafer surface preparation by the enhanced variables of the wet cleaning chemical process is proposed.}, journal = {International Journal of Electrical and Computer Engineering}, volume = {3}, number = {2}, year = {2009}, pages = {262 - 264}, ee = {https://publications.waset.org/pdf/6321}, url = {https://publications.waset.org/vol/26}, bibsource = {https://publications.waset.org/}, issn = {eISSN: 1307-6892}, publisher = {World Academy of Science, Engineering and Technology}, index = {Open Science Index 26, 2009}, }