Search results for: wafer level packaging.

Authors: Z. W. Zhong, C. Xu, W. K. Choi

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To build a thin fan-out wafer-level package, the package had to be ground to a thin level. In this work, the influence of the grinding processes on the strength of the fan-out wafer-level packages was investigated. After different grinding processes, all specimens were placed on a three-point-bending fixture installed on a universal tester for three-point-bending testing, and the strength of the fan-out wafer-level packages was measured. The experiments revealed that the average flexure strength increased with the decreasing surface roughness height of the fan-out wafer-level package tested. The grinding processes had a significant influence on the strength of the fan-out wafer-level packages investigated.

Keywords: FOWLP strength, surface roughness, three-point bending, grinding.

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Authors: T. Brettschneider, C. Dorrer, H. Suy, T. Braun, E. Jung, R. Hoofman, M. Bründel, R. Zengerle, F. Lärmer

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We present an integration approach of a CMOS biosensor into a polymer based microfluidic environment suitable for mass production. It consists of a wafer-level-package for the silicon die and laser bonding process promoted by an intermediate hot melt foil to attach the sensor package to the microfluidic chip, without the need for dispensing of glues or underfiller. A very good condition of the sensing area was obtained after introducing a protection layer during packaging. A microfluidic flow cell was fabricated and shown to withstand pressures up to Δp = 780 kPa without leakage. The employed biosensors were electrically characterized in a dry environment.

Keywords: CMOS biosensor, laser bonding, silicon polymer integration, wafer level packaging.

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Authors: Ian Kree, Davina Chin Lee Yien

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This paper presents Cost per Equivalent Wafer Out, which we find useful in wafer fab operational cost monitoring and controlling. It removes the loading and product mix effect in the cost variance analysis. The operation heads, therefore, could immediately focus on identifying areas for cost improvement. Without this, they would have to measure the impact of the loading variance and product mix variance between actual and budgeted prior to make any decision on cost improvement. Cost per Equivalent Wafer Out, thereby, increases efficiency in wafer fab operational cost monitoring and controlling.

Keywords: Cost Control, Cost Variance, Operational Expenditure, Semiconductor.

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Authors: Tim Giesen, Christian Fischmann, Fabian Böttinger, Alexander Ehm, Alexander Verl

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In a state-of-the-art industrial production line of photovoltaic products the handling and automation processes are of particular importance and implication. While processing a fully functional crystalline solar cell an as-cut photovoltaic wafer is subject to numerous repeated handling steps. With respect to stronger requirements in productivity and decreasing rejections due to defects the mechanical stress on the thin wafers has to be reduced to a minimum as the fragility increases by decreasing wafer thicknesses. In relation to the increasing wafer fragility, researches at the Fraunhofer Institutes IPA and CSP showed a negative correlation between multiple handling processes and the wafer integrity. Recent work therefore focused on the analysis and optimization of the dry wafer stack separation process with compressed air. The achievement of a wafer sensitive process capability and a high production throughput rate is the basic motivation in this research.

Keywords: Automation, Photovoltaic Manufacturing, Thin Wafer, Material Handling

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Authors: Vincent King Soon Wong, Hong Seng Ng, Florinna Sim

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Negative Bias Temperature Instability (NBTI) is one of the critical degradation mechanisms in semiconductor device reliability that causes shift in the threshold voltage (Vth). However, thorough understanding of this reliability failure mechanism is still unachievable due to a recovery characteristic known as NBTI recovery. This paper will demonstrate the severity of NBTI recovery as well as one of the effective methods used to mitigate, which is the minimization of measurement system delays. Comparison was done in between two measurement systems that have significant differences in measurement delays to show how NBTI recovery causes result deviations and how fast measurement systems can mitigate NBTI recovery. Another method to minimize NBTI recovery without the influence of measurement system known as Fast Wafer Level Reliability (FWLR) NBTI was also done to be used as reference.

Keywords: Fast vs slow BTI, Fast wafer level reliability, Negative bias temperature instability, NBTI measurement system, metal-oxide-semiconductor field-effect transistor, MOSFET, NBTI recovery, reliability.

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Authors: Eva Vorma, Sandra Muizniece-Brasava, Lija Dukalska, Janis Skalbe

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The objective of the research was to evaluate the hardness stability of milk pomade sweets packed in several packaging materials (OPP, Multibarrier 60 HFP, BIALON 65 HFP, BIALON 50 HFP, ECOLEAN) by several packaging technologies – modified atmosphere (MAP) (consisting of 30% CO2+70% N2; 30% N2+70% CO2 and 100% CO2) and control – in air ambiance. Samples were stored at the room temperature +21±1 °C. The studies of the samples were carried out before packaging and after 2, 4, 6, 8, and 10 storage weeks.

Keywords: packaging, shelf life, sherbet with crunchy peanutchips, hardness.

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Authors: Ching-Feng Chen, Ching-Chih Tsai

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With the size of the transistor gradually approaching the physical limit, it challenges the persistence of Moore’s Law due to such issues of the short channel effect and the development of the high numerical aperture (NA) lithography equipment. In the context of the ever-increasing technical requirements of portable devices and high-performance computing (HPC), relying on the law continuation to enhance the chip density will no longer support the prospects of the electronics industry. Weighing the chip’s power consumption-performance-area-cost-cycle time to market (PPACC) is an updated benchmark to drive the evolution of the advanced wafer nanometer (nm). The advent of two and half- and three-dimensional (2.5 and 3D)- Very-Large-Scale Integration (VLSI) packaging based on Through Silicon Via (TSV) technology has updated the traditional die assembly methods and provided the solution. This overview investigates the up-to-date and cutting-edge packaging technologies for 2.5D and 3D integrated circuits (IC) based on the updated transistor structure and technology nodes. We conclude that multi-chip solutions for 2.5D and 3D IC packaging can prolong Moore’s Law.

Keywords: Moore’s Law, High Numerical Aperture, Power Consumption-Performance-Area-Cost-Cycle Time to Market, PPACC, 2.5 and 3D-Very-Large-Scale Integration Packaging, Through Silicon Vi.

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Authors: G. Götz, P. Stich, J. Backhaus, G. Reinhart

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The rising demand for format-flexible packaging machines is caused by current market changes. Increasing the formatflexibility is a new goal for the packaging machine manufacturers’ product development process. There are no methodical or designorientated tools for a comprehensive consideration of this target. This paper defines the term format-flexibility in the context of packaging machines and shows the state-of-the-art for improving the changeover of production machines. The requirements for a new approach and the concept itself will be introduced, and the method elements will be explained. Finally, the use of the concept and the result of the development of a format-flexible packaging machine will be shown.

Keywords: Packaging machine, format-flexibility, changeover, design method.

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Authors: A. C. Khor, M. R. Mohamed, M. H. Sulaiman, M. R. Daud

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Packaging for vanadium redox flow battery is one of the key elements for successful implementation of flow battery in the electrical energy storage system. Usually the bulky battery size and low energy densities make this technology not available for mobility application. ThereforeRFB with improved packaging size and energy capacity are highly desirable. This paper focuses on the study of packaging improvement for unit cell V-RFB to the application on Series Hybrid Electric Vehicle. Two different designs of 25cm² and 100cm² unit cell V-RFB at same current density are used for the sample in this investigation. Further suggestions on packaging improvement are highlighted.

Keywords: Electric vehicle, Redox flow battery, Packaging, Vanadium.

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Authors: Eva Ungure, Sandra Muizniece-Brasava, Lija Dukalska, Vita Levkane

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The objective of the research was to evaluate the quality of milk pomade sweet – sherbet packed in different packaging materials (Multibarrier 60, met.BOPET/PE, Aluthen), by several packaging technologies – active and modified atmosphere (MAP) (consisting of 100% CO2), and control – in air ambiance. Experiments were carried out at the Faculty of Food Technology of Latvia University of Agriculture. Samples were stored at the room temperature +21±1 °C. The physiochemical properties – weight losses, moisture, hardening, colour and changes in headspace atmosphere concentration (CO2 and O2) of packs were analysed before packaging and after 2, 4, 6, 8, 10 and 12 storage weeks.

Keywords: packaging, shelf life, sherbet with crunchy peanut chip's

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Authors: Sugiono, W. Ardiatna, H. Firdaus, N. Kusnandar, B. Utomo, J. A. Kadar

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It is desirable that most human food is warm when eaten, including when food is obtained by taking it away from the point of sale in disposable food packaging. However, such packaging does not retain heat for a long time, which is necessary to ensure the food remains warm when eaten. The study looked for single-use food packaging that could retain the heat of the food for a long time. The methodology for obtaining such packaging is either by modifying available packages on the market or by making new ones with materials that are easily obtained locally, then testing by loading the local food and measuring its temperature and the length of time until it reaches the lowest acceptable temperature for hot food (56°C). Packages made of plastic boxes lined with thin aluminum foil on the inside are the best way to keep food warm for up to 44 minutes from the time it is put in the package to the time the required temperature is reached. Moreover, packaging made of local common food paper, where the food was put in a transparent plastic bag inside the package, was found to be the simplest package that could retain heat for 82.31% as long as the best packaging could, in this study. Plastic boxes with thin aluminum foil inside were the best single-use food packaging in this study that served to keep hot food warm and fit for consumption.

Keywords: Aluminum foil, hot food, local food, packaging.

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Authors: A. Hematian Sourki, F. Tabatabaei Yazdi, M. Ghiafeh Davoodi, S.A. Mortazavi, M. Karimi, S.H. Razavizadegan Jahromi, A. Pourfarzad

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This study investigated the use of modified atmosphere packaging (MAP) and different packaging to extend the shelf life of Barbari flat bread. Three atmospheres including 70%CO2 and 30%N2, 50% CO2 and 50%N2 and a normal air as control were used. The bread samples were packaged in three type pouches. The shelf life was determined by appearance of mold and yeast (M +Y) in Barbari bread samples stored at 25 ± 1°C and 38 ± 2% relative humidity. The results showed that it is possible to prolong the shelf life of Barbari bread from four days to about 21 days by using modified atmosphere packaging with high carbon dioxide concentration and high-barrier laminated and vacuum bags packages. However, the hardness of samples kept in MAP increase significantly by increase of carbon dioxide concentration. The correlation coefficient (r) between headspace CO2 concentration and hardness was 0.997, 0.997 and 0.599 for A, B and C packaging respectively. High negative correlation coefficients were found between the crumb moisture and the hardness values in various packaging. There were significant negative correlation coefficients between sensory parameters and hardness of texture.

Keywords: modified atmosphere packaging, flat bread, Iranian bread, staling, correlation.

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Authors: Sheng-Ming Huang, Nan-Chyuan Tsai, Chih-Che Lin, Chun-Chi Lin

Abstract:

An innovative design for intelligent Chemical Mechanical Polishing (CMP) system is proposed and verified by experiments in this report. On-line measurement and real-time feedback are integrated to eliminate the shortcomings of traditional approaches, e.g., the batch-to-batch discrepancy of required polishing time, over consumption of chemical slurry, and non-uniformity across the wafer. The major advantage of the proposed method is that the finish of local surface roughness can be consistent, no matter where the inner-ring region or outer-ring region is concerned. Secondly, it is able to eliminate the Edge effect. Conventionally, the interfacial induced stress near the wafer edge is generally much higher than that near the wafer center. At last, by using the proposed intelligent chemical mechanical polishing strategy, the cost of the entire machining cycle can be much reduced while the quality of the finished goods certainly upgraded.

Keywords: Chemical Mechanical Polishing, Active Magnetic Actuator, On-Line Measurement.

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Authors: Raed A. Amro

Abstract:

Standard packaging and interconnection technologies of power devices have difficulties meeting the increasing thermal demands of new application fields of power electronics devices. Main restrictions are the decreasing reliability of bond-wires and solder layers with increasing junction temperature. In the last few years intensive efforts have been invested in developing new packaging and interconnection solutions which may open a path to future application of power devices. In this paper, the main failure mechanisms of power devices are described and principle of new packaging and interconnection concepts and their power cycling reliability are presented.

Keywords: Power electronics devices, Reliability, Power Cycling, Low-temperature joining technique (LTJT)

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Authors: Kasra Ghaemi, Syeda Tasnim, Shohel Mahmud

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One of the main issues affecting the quality and shelf life of food products is temperature fluctuation during transportation and storage. Packaging plays an important role in protecting food from environmental conditions, especially thermal variations. In this study, the performance of using microencapsulated Phase Change Material (PCM) as a promising thermal buffer layer in smart food packaging is investigated. The considered insulation layer is evaluated for different thicknesses and the absorbed heat from the environment. The results are presented in terms of the melting time of PCM or provided thermal protection period.

Keywords: Food packaging, phase change material, thermal buffer, protection time.

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Authors: N. Asadi, M. Jackson

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Today, the central role of industrial robots in automation in general and in material handling in particular is crystal clear. Based on the current status of Photovoltaics and by focusing on lightweight material handling, PV industry has turned into a potential candidate for introducing a fresh “pick and place" robot technology. Thus, to examine the industry needs in this regard, firstly the best suited applications for such robotic automation,and then the essential prerequisites in PV industry should be identified. The objective of this paper is to present holistic views on the industry trends, general automation status and existing challenges facing lightweight robotic material handling in PV Silicon Wafer and Thin Film technologies. The results of this study show that currently no uniform pick and place solution prevails among PV Silicon Wafer manufacturers and the industry calls for a new robot solution to satisfy its needs in new directions.

Keywords: Automation, Material handling, Photovoltaic, Robot.

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Authors: Solvita Kampuse, Elga Berna, Sandra Muizniece-Brasava, Lija Dukalska, Irisa Murniece, Martins Sabovics, Zanda Kruma, Karina Ruse, Svetlana Sarvi, Kaspars Kampuss

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Experiments with pumpkin-rowanberry marmalade candies were carried out at the Faculty of Food Technology of the Latvia University of Agriculture. The objective of this investigation was to evaluate the quality changes of pumpkin-rowanberry marmalade candies packed in different packaging materials during the storage of 15 weeks, and to find the most suitable packaging material for prolongation of low sugar marmalade candies shelf-life. An active packaging in combination with modified atmosphere (MAP, CO2 100%) was examined and compared with traditional packaging in air ambiance. Polymer Multibarrier 60 and paper bags were used. Influence of iron based oxygen absorber in sachets of 500 cc obtained from Mitsubishi Gas Chemical Europe Ageless® on the marmalade candies’ quality was tested during shelf life. Samples of 80±5 g were packaged in polymer pouches (110 mm x 110 mm), hermetically sealed by MULTIVAC C300 vacuum chamber machine, and stored in a room temperature +21±0.5 °C. The physiochemical properties –moisture content, hardness, aw, pH, changes of atmosphere content (CO2 and O2), ascorbic acid, total carotenoids, total phenols in headspace of packs, and microbial conditions were analysed before packaging and in the 1st, 3rd , 5th, 8th, 11th and 15th weeks of storage.

Keywords: Active packaging, marmalade candies, shelf life

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Authors: Sandra Muizniece-Brasava, Lija Dukalska, Irisa Murniece, Ilona Dabina-Bicka, Emils Kozlinskis, Svetlana Sarvi, Ralfs Santars, Anna Silvjane

Abstract:

The research object was wheat bread. Experiments were carried out at the Faculty of Food Technology of the Latvia University of Agriculture. An active packaging in combination with modified atmosphere (MAP, CO2 60% and N2 40%) was examined and compared with traditional packaging in air ambiance. Polymer Multibarrier 60, PP and OPP bags were used. Influence of iron based oxygen absorber in sachets of 100 cc obtained from Mitsubishi Gas Chemical Europe Ageless® was tested on the quality during the shelf of wheat bread. Samples of 40±4 g were packaged in polymer pouches (110 mm x 120 mm), hermetically sealed by MULTIVAC C300 vacuum chamber machine, and stored in room temperature +21.0±0.5 °C. The physiochemical properties – weight losses, moisture content, hardness, pH, colour, changes of atmosphere content (CO2 and O2) in headspace of packs, and microbial conditions were analysed before packaging and in the 7th, 14th, 21st and 28th days of storage.

Keywords: Active packaging, wheat bread, shelf life.

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Authors: D. Kliaugaitė, J. K, Staniškis

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In this study tree types of multilayer gas barrier plastic packaging films were compared using life cycle assessment as a tool for resource efficient and environmentally low-impact materials selection. The first type of multilayer packaging film (PET-AlOx/LDPE) consists of polyethylene terephthalate with barrier layer AlOx (PET-AlOx) and low density polyethylene (LDPE). The second type of polymer film (PET/PE-EVOH-PE) is made of polyethylene terephthalate (PET) and co-extrusion film PE-EVOH-PE as barrier layer. And the third one type of multilayer packaging film (PET-PVOH/LDPE) is formed from polyethylene terephthalate with barrier layer PVOH (PET-PVOH) and low density polyethylene (LDPE).

All of analyzed packaging has significant impact to resource depletion, because of raw materials extraction and energy use and production of different kind of plastics. Nevertheless the impact generated during life cycle of functional unit of II type of packaging (PET/PE-EVOH-PE) was about 25% lower than impact generated by I type (PET-AlOx/LDPE) and III type (PET-PVOH/LDPE) of packaging.

Result revealed that the contribution of different gas barrier type to the overall environmental problem of packaging is not significant. The impact are mostly generated by using energy and materials during raw material extraction and production of different plastic materials as plastic polymers material as PE, LDPE and PET, but not gas barrier materials as AlOx, PVOH and EVOH.

The LCA results could be useful in different decision-making processes, for selecting resource efficient and environmentally low-impact materials.

Keywords: Polymer packaging, life cycle assessment, resource efficiency.

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Authors: Sandra Muizniece-Brasava, Lija Dukalska, Solvita Kampuse, Irisa Murniece, Martins Sabovics, IlonaDabina-Bicka, Emils Kozlinskis, Svetlana Sarvi

Abstract:

The research object was apple-black currant marmalade candies. Experiments were carried out at the Faculty of Food Technology of the Latvia University of Agriculture. An active packaging in combination with modified atmosphere (MAP, CO2 100%) was examined and compared with traditional packaging in air ambiance. Polymer Multibarrier 60 and paper bags were used. Influence of iron based oxygen absorber in sachets of 500 cc obtained from Mitsubishi Gas Chemical Europe Ageless® was tested on the quality during the shelf of marmalade. Samples of 80±5 g were packaged in polymer pouches (110 mm x 110 mm), hermetically sealed by MULTIVAC C300 vacuum chamber machine, and stored in room temperature +20.0±1.0 °C. The physiochemical properties – weight losses, moisture content, hardness, aw, pH, colour, changes of atmosphere content (CO2 and O2) in headspace of packs, and microbial conditions were analysed before packaging and in the 1st, 3rd , 5th, 8th, 11th and 15th weeks of storage.

Keywords: Active packaging, marmalade candies, shelf life

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Authors: Youngji Yoo, Seung Hwan Park, Daewoong An, Sung-Shick Kim, Jun-Geol Baek

Abstract:

The yield management system is very important to produce high-quality semiconductor chips in the semiconductor manufacturing process. In order to improve quality of semiconductors, various tests are conducted in the post fabrication (FAB) process. During the test process, large amount of data are collected and the data includes a lot of information about defect. In general, the defect on the wafer is the main causes of yield loss. Therefore, analyzing the defect data is necessary to improve performance of yield prediction. The wafer bin map (WBM) is one of the data collected in the test process and includes defect information such as the fail bit patterns. The fail bit has characteristics of spatial point patterns. Therefore, this paper proposes the feature extraction method using the spatial point pattern analysis. Actual data obtained from the semiconductor process is used for experiments and the experimental result shows that the proposed method is more accurately recognize the fail bit patterns.

Keywords: Semiconductor, wafer bin map (WBM), feature extraction, spatial point patterns, contour map.

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Authors: I. Krasnova, L. Dukalska, D. Seglina, K. Juhnevica, E. Sne, D. Karklina

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Experiments were carried out at the Latvia State Institute of Fruit-Growing in 2011. Fresh-cut minimally processed apple and pear mixed salad were packed by passive modified atmosphere (MAP) in PP containers, which were hermetically sealed by breathable conventional BOPP PropafreshTM P2GAF, and Amcor Agrifresh films. Biodegradable NatureFlexTM NVS INNOVIA Films and VC999 BioPack PLA films coated with a barrier of pure silicon oxide (SiOx) were used to compare the fresh-cut produce quality with this packed in conventional packaging films. Samples were cold stored at temperature +4.0±0.5 °C up to 10 days. The quality of salad was evaluated by physicochemical properties – weight losses, moisture, firmness, the effect of packaging modes on the colour, dynamics in headspace atmosphere concentration (CO2 and O2), titratable acidity values, as well as by microbiological contamination (yeasts, moulds and total bacteria count) of salads, analyzing before packaging and after 2, 4, 6, 8, and 10 storage days.

Keywords: Biodegradable packaging, conventional, fresh-cut fruit salad

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Authors: Sandra Muizniece-Brasava, Aija Ruzaike, Lija Dukalska, Ilze Stokmane, Liene Strauta

Abstract:

Experiments have been carried out at the Latvia University of Agriculture Department of Food Technology. The aim of this work was to assess the effect of thermal treatment in flexible retort pouch packaging on the quality of potatoes’ produce during the storage time. Samples were evaluated immediately after retort thermal treatment; and following 1; 2; 3 and 4 storage months at the ambient temperature of +18±2ºC in vacuum packaging from polyamide/polyethylene (PA/PE) and aluminum/polyethylene (Al/PE) film pouches with barrier properties. Experimentally the quality of the potatoes’ produce in dry butter and mushroom dressings was characterized by measuring pH, hardness, color, microbiological properties and sensory evaluation. The sterilization was effective in protecting the produce from physical, chemical, and microbial quality degradation. According to the study of obtained data, it can be argued that the selected product processing technology and packaging materials could be applied to provide the safety and security during four-month storage period.

Keywords: Potatoes’ produce, shelf life, retort thermal treatment and packaging.

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Authors: Vita Levkane, Sandra Muizniece-Brasava, Lija Dukalska

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Experiments have been carried out at the Latvia University of Agriculture Department of Food Technology. The aim of this work was to assess the effect of sous vide packaging during the storage time of salad with meat in mayonnaise at different storage temperature. Samples were evaluated at 0, 1, 3, 7, 10, 15, 18, 25, 29, 42, and 52 storage days at the storage temperature of +4±0.5 ºC and +10±0.5 ºC. Experimentally the quality of the salad with meat in mayonnaise was characterized by measuring colour, pH and microbiological properties. The sous vide packaging was effective in protecting the product from physical, chemical, and microbial quality degradation. The sous vide packaging significantly reduces microbial growth at storage temperature of +4±0.5 ºC and +10±0.5 ºC. Moreover, it is possible to extend the product shelf life to 52 days even when stored at +10±0.5 ºC.

Keywords: salad with meat in mayonnaise, shelf life, sous videpackaging.

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Authors: A. M. Metak, T. T. Ajaal

Abstract:

Commercial nanocomposite food packaging type nano-silver containers were characterised using scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDX). The presence of nanoparticles consistent with the incorporation of 1% nano-silver (Ag) and 0.1% titanium dioxide (TiO₂) nanoparticle into polymeric materials formed into food containers was confirmed. Both nanomaterials used in this type of packaging appear to be embedded in a layered configuration within the bulk polymer. The dimensions of the incorporated nanoparticles were investigated using X-ray diffraction (XRD) and determined by calculation using the Scherrer Formula; these were consistent with Ag and TiO₂ nanoparticles in the size range 20-70nm both were spherical shape nanoparticles. Antimicrobial assessment of the nanocomposite container has also been performed and the results confirm the antimicrobial activity of Ag and TiO₂ nanoparticles in food packaging containers. Migration assessments were performed in a wide range of food matrices to determine the migration of nanoparticles from the packages. The analysis was based upon the relevant European safety Directives and involved the application of inductively coupled plasma mass spectrometry (ICP-MS) to identify the range of migration risk. The data pertain to insignificance levels of migration of Ag and TiO₂ nanoparticles into the selected food matrices.

Keywords: Nano-silver, antimicrobial food packaging, migration, titanium dioxide.

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Authors: Ingy A. El-Khouly, Khaled S. El-Kilany, Aziz E. El-Sayed

Abstract:

The process of wafer fabrication is arguably the most technologically complex and capital intensive stage in semiconductor manufacturing. This large-scale discrete-event process is highly reentrant, and involves hundreds of machines, restrictions, and processing steps. Therefore, production control of wafer fabrication facilities (fab), specifically scheduling, is one of the most challenging problems that this industry faces. Dispatching rules have been extensively applied to the scheduling problems in semiconductor manufacturing. Moreover, lot release policies are commonly used in this manufacturing setting to further improve the performance of such systems and reduce its inherent variability. In this work, simulation is used in the scheduling of re-entrant flow shop manufacturing systems with an application in semiconductor wafer fabrication; where, a simulation model has been developed for the Intel Five-Machine Six Step Mini-Fab using the ExtendTM simulation environment. The Mini-Fab has been selected as it captures the challenges involved in scheduling the highly re-entrant semiconductor manufacturing lines. A number of scenarios have been developed and have been used to evaluate the effect of different dispatching rules and lot release policies on the selected performance measures. Results of simulation showed that the performance of the Mini-Fab can be drastically improved using a combination of dispatching rules and lot release policy.

Keywords: Dispatching rules, lot release policy, re-entrant flowshop, semiconductor manufacturing.

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Authors: M. Javanmard

Abstract:

This study was aimed at analyzing the effects of packaging (MAP) and preservation conditions on the packaged fresh walnut kernel quality. The central composite plan was used for evaluating the effect of oxygen (0–10%), carbon dioxide (0-10%), and temperature (4-26 °C) on qualitative characteristics of walnut kernels. Also, the response level technique was used to find the optimal conditions for interactive effects of factors, as well as estimating the best conditions of process using least amount of testing. Measured qualitative parameters were: peroxide index, color, decreased weight, mould and yeast counting test, and sensory evaluation. The results showed that the defined model for peroxide index, color, weight loss, and sensory evaluation is significant (p < 0.001), so that increase of temperature causes the peroxide value, color variation, and weight loss to increase and it reduces the overall acceptability of walnut kernels. An increase in oxygen percentage caused the color variation level and peroxide value to increase and resulted in lower overall acceptability of the walnuts. An increase in CO₂ percentage caused the peroxide value to decrease, but did not significantly affect other indices (p ≥ 0.05). Mould and yeast were not found in any samples. Optimal packaging conditions to achieve maximum quality of walnuts include: 1.46% oxygen, 10% carbon dioxide, and temperature of 4 °C.

Keywords: Shelled walnut, MAP, quality, storage temperature.

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Authors: Vladimir M. Tomović, Branislav V. Šojić, Predrag M. Ikonić, Ljiljana S. Petrović, Anamarija I. Mandić, Natalija R. Džinić, Snežana B. Škaljac, Tatjana A. Tasić, Marija R. Jokanović

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In this paper influence of packaging method (vacuum and modified atmosphere packaging) on lipid oxidative stability and sensory properties of odor and taste of the traditional sausage Petrovská klobása were examined. These parameters were examined during storage period (7 months). In the end of storage period, vacuum packed sausage showed better oxidative stability. Propanal content was significantly lower (P<0.05) in vacuum packed sausage compared to these values in unpacked and modified atmosphere packaging sausage. Hexanal content in vacuum packed sausage was 1.85 μg/g, in MAP sausage 2.98 μg/g and in unpacked sausage 4.94 μg/g. After 2 and 7 months of storage, sausages packed in vacuum had the highest grades for sensory properties of odor and taste.

Keywords: Lipid oxidation, MAP, sensory properties, traditional sausage, vacuum.

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Authors: Sheng-Shu Cheng, Fong-Jung Yu

Abstract:

C-control chart assumes that process nonconformities follow a Poisson distribution. In actuality, however, this Poisson distribution does not always occur. A process control for semiconductor based on a Poisson distribution always underestimates the true average amount of nonconformities and the process variance. Quality is described more accurately if a compound Poisson process is used for process control at this time. A cumulative sum (CUSUM) control chart is much better than a C control chart when a small shift will be detected. This study calculates one-sided CUSUM ARLs using a Markov chain approach to construct a CUSUM control chart with an underlying Poisson-Gamma compound distribution for the failure mechanism. Moreover, an actual data set from a wafer plant is used to demonstrate the operation of the proposed model. The results show that a CUSUM control chart realizes significantly better performance than EWMA.

Keywords: Nonconformities, Compound Poisson distribution, CUSUM control chart.

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Authors: Somsri Binraman, Boonliang Kaewnapan, Krittika Tanprasert

Abstract:

In the package design industry, there are a lot of tacit knowledge resided within each designer. The objectives are to capture them and compile it to be used as a teaching resource and to create a video clip of package design process as well as to evaluate its quality and learning effectiveness. Interview were used as a technique for capturing knowledge in brand design concept, differentiation, recognition, rank of recognition factor, consumer survey, knowledge about marketing, research, graphic design, the effect of color, and law and regulation. Video clip about package design were created. The clip consisted of both the speech and clip of actual process. The quality of the video in term of media was ranked as good while the content was ranked as excellent. The students- score on post-test was significantly greater than that of pretest (p>0.001).

Keywords: Tacit knowledge, interview, video, packaging, design.

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