%0 Journal Article
	%A Z. W. Zhong and  C. Xu and  W. K. Choi
	%D 2018
	%J International Journal of Electronics and Communication Engineering
	%B World Academy of Science, Engineering and Technology
	%I Open Science Index 135, 2018
	%T The Grinding Influence on the Strength of Fan-Out Wafer-Level Packages
	%U https://publications.waset.org/pdf/10008773
	%V 135
	%X To build a thin fan-out wafer-level package, the package had to be ground to a thin level. In this work, the influence of the grinding processes on the strength of the fan-out wafer-level packages was investigated. After different grinding processes, all specimens were placed on a three-point-bending fixture installed on a universal tester for three-point-bending testing, and the strength of the fan-out wafer-level packages was measured. The experiments revealed that the average flexure strength increased with the decreasing surface roughness height of the fan-out wafer-level package tested. The grinding processes had a significant influence on the strength of the fan-out wafer-level packages investigated.
	%P 213 - 216