Wafer Fab Operational Cost Monitoring and Controlling with Cost per Equivalent Wafer Out

Authors: Ian Kree, Davina Chin Lee Yien

Abstract:

This paper presents Cost per Equivalent Wafer Out, which we find useful in wafer fab operational cost monitoring and controlling. It removes the loading and product mix effect in the cost variance analysis. The operation heads, therefore, could immediately focus on identifying areas for cost improvement. Without this, they would have to measure the impact of the loading variance and product mix variance between actual and budgeted prior to make any decision on cost improvement. Cost per Equivalent Wafer Out, thereby, increases efficiency in wafer fab operational cost monitoring and controlling.

Keywords: Cost Control, Cost Variance, Operational Expenditure, Semiconductor.

Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1327913

References:

[1] Chris Mack, "Semiconductor Lithography - The Basic Process." (Online). Available: http://www.lithoguru.com/scientist/lithobasics.html
[2] Ian Kree and Davina Chin, "Interactive operations cost monitoring and analysing tool," presented at the AEC/APC Symp. Asia 2009, Tokyo, Japan, November 9, 2009. (Online). Available: http://www.semiconportal.com/AECAPC/vabstract/DM-P-008.pdf
[3] Chih-Yuan Yu and Han-Pang Huang, "Priority-Based Tool Capacity Allocation in the Foundry Fab," Proc. 2001 IEEE International Conference on Robotics & Automation, Seoul, Korea, May 21-26, 2001. (Online). Available: http://www.ent.mrt.ac.lk/iml/paperbase/ICRA_CDs/ICRA2001/PDFFIL ES/PAPERS/ICRA_PAPERS/U0367.pdf
[4] Scotten W. Jones (IC Knowledge, Georgetown, Mass.), "300 mm Perceptions and Realities," Semiconductor International, 10/1/2003. (Online). Available: http://www.semiconductor.net/article/203681-300_mm_Perceptions_and _Realities.php