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Development and Optimization of Automated Dry-Wafer Separation

Authors: Tim Giesen, Christian Fischmann, Fabian Böttinger, Alexander Ehm, Alexander Verl

Abstract:

In a state-of-the-art industrial production line of photovoltaic products the handling and automation processes are of particular importance and implication. While processing a fully functional crystalline solar cell an as-cut photovoltaic wafer is subject to numerous repeated handling steps. With respect to stronger requirements in productivity and decreasing rejections due to defects the mechanical stress on the thin wafers has to be reduced to a minimum as the fragility increases by decreasing wafer thicknesses. In relation to the increasing wafer fragility, researches at the Fraunhofer Institutes IPA and CSP showed a negative correlation between multiple handling processes and the wafer integrity. Recent work therefore focused on the analysis and optimization of the dry wafer stack separation process with compressed air. The achievement of a wafer sensitive process capability and a high production throughput rate is the basic motivation in this research.

Keywords: Automation, material handling, Photovoltaic Manufacturing, Thin Wafer

Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1332084

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References:


[1] EPIA-European Photovoltaic Industry Association, PhotoVoltaic- Technology Platform: "Solar Europe Industry Initiative, Implementation Plan 2010-2012", May 2010.
[2] K. Reddig, "Overview of automation in the photovoltaic industry". In Photovoltaics International, no. 4, pp. 18-29, 2009.
[3] CTM Group (Crystalline Cell Technology and Manufacturing): CTM Group: "PV Roadmap for Crystalline Silicon". March, 2010.
[4] P. A.Wang, "Industrial challenges for thin wafer manufacturing" in: Fourth World Conference on Photovoltaic Energy Conversion (1), vol. 1, pp. 1179-1182, 2006.
[5] C. Fischmann et al., "Analysis and Evaluation of Thin-Wafer Handling Methods" in: Proceedings of the 24th European Photovoltaic Solar Energy Conference 2009, pp. 1352 - 1355.
[6] X. F Brun, "Analysis of stresses and breakage of crystalline silicon wafers during handling and transport." In: Solar Energy Materials & Solar Cells, pp. 1238-1247, 2009.
[7] R. Koepge, S. Schoenfelder, T. Giesen, C. Fischmann, A. Verl and J. Bagdahn, "The Influence of Transport Operations on the Wafer Strength and Breakage Rate", in Proceedings of the 26th European Photovoltaic Solar Energy Conference 2011, submitted for publication.