Packaging and Interconnection Technologies of Power Devices, Challenges and Future Trends

Authors: Raed A. Amro

Abstract:

Standard packaging and interconnection technologies of power devices have difficulties meeting the increasing thermal demands of new application fields of power electronics devices. Main restrictions are the decreasing reliability of bond-wires and solder layers with increasing junction temperature. In the last few years intensive efforts have been invested in developing new packaging and interconnection solutions which may open a path to future application of power devices. In this paper, the main failure mechanisms of power devices are described and principle of new packaging and interconnection concepts and their power cycling reliability are presented.

Keywords: Power electronics devices, Reliability, Power Cycling, Low-temperature joining technique (LTJT)

Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1058195

References:

[1] M. HELD; P. JACOB; G. NICOLETTI; P. SCACCO; M.H. POECH: Fast Power Cycling Test for IGBT Modules in Traction Application. Proc. Power Conversion and Drive Systems 1997, pp.425-430.
[2] AUERBACH; SCHWARZBAUER; LAMMERS; LENNIGER: Zuverlässigkeit von Al-Dickdraht-Bondverbindungen. ISHM Konferenz, München 1996.
[3] M. RODRIGUES; N. SHAMMAS; N. PLUMPTON; D. NEWCOMBE; D. CREES: Static and Dynamic Finite Element Modelling of Thermal Fatigue Effects in IGBT Modules. Microelectronics Reliability 40(2000), pp. 455-463. B. Smith, "An approach to graphs of linear forms (Unpublished work style)," unpublished.
[4] M.-H. POECH: Sch├ñdigungsmechanismen in Lötverbindungen bei erhöhter Temperatur. VTE 14 (2002), Heft1, S. 12-18.
[5] H. SCHWARZBAUER; R. KUHNERT: Novel Large Area Joining Technique for Improved Power Device Performance. IEEE Transactions on Industry Applications, Vol.27, pp. 93-95, 1991.
[6] C. PANZER; T. PASSE; T. STOLZE; Z. LIANG: Clamping Technique improves IGBT Installation. PET magazine, Oct. Issue 56(2002).