Search results for: equivalent thermal circuit.
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 2142

Search results for: equivalent thermal circuit.

2052 Finite Element Modeling of Stockbridge Damper and Vibration Analysis: Equivalent Cable Stiffness

Authors: Nitish Kumar Vaja, Oumar Barry, Brian DeJong

Abstract:

Aeolian vibrations are the major cause for the failure of conductor cables. Using a Stockbridge damper reduces these vibrations and increases the life span of the conductor cable. Designing an efficient Stockbridge damper that suits the conductor cable requires a robust mathematical model with minimum assumptions. However it is not easy to analytically model the complex geometry of the messenger. Therefore an equivalent stiffness must be determined so that it can be used in the analytical model. This paper examines the bending stiffness of the cable and discusses the effect of this stiffness on the natural frequencies. The obtained equivalent stiffness compensates for the assumption of modeling the messenger as a rod. The results from the free vibration analysis of the analytical model with the equivalent stiffness is validated using the full scale finite element model of the Stockbridge damper.

Keywords: Equivalent stiffness, finite element model, free vibration response, Stockbridge damper.

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2051 Control of Thermal Flow in Machine Tools Using Shape Memory Alloys

Authors: Reimund Neugebauer, Welf-Guntram Drossel, Andre Bucht, Christoph Ohsenbrügge

Abstract:

In this paper the authors propose and verify an approach to control heat flow in machine tool components. Thermal deformations are a main aspect that affects the accuracy of machining. Due to goals of energy efficiency, thermal basic loads should be reduced. This leads to inhomogeneous and time variant temperature profiles. To counteract these negative consequences, material with high melting enthalpy is used as a method for thermal stabilization. The increased thermal capacity slows down the transient thermal behavior. To account for the delayed thermal equilibrium, a control mechanism for thermal flow is introduced. By varying a gap in a heat flow path the thermal resistance of an assembly can be controlled. This mechanism is evaluated in two experimental setups. First to validate the ability to control the thermal resistance and second to prove the possibility of a self-sufficient option based on the selfsensing abilities of thermal shape memory alloys.

Keywords: energy-efficiency, heat transfer path, MT thermal stability, thermal shape memory alloy

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2050 An Optimization Tool-Based Design Strategy Applied to Divide-by-2 Circuits with Unbalanced Loads

Authors: Agord M. Pinto Jr., Yuzo Iano, Leandro T. Manera, Raphael R. N. Souza

Abstract:

This paper describes an optimization tool-based design strategy for a Current Mode Logic CML divide-by-2 circuit. Representing a building block for output frequency generation in a RFID protocol based-frequency synthesizer, the circuit was designed to minimize the power consumption for driving of multiple loads with unbalancing (at transceiver level). Implemented with XFAB XC08 180 nm technology, the circuit was optimized through MunEDA WiCkeD tool at Cadence Virtuoso Analog Design Environment ADE.

Keywords: Divide-by-2 circuit, CMOS technology, PLL phase locked-loop, optimization tool, CML current mode logic, RF transceiver.

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2049 Design and Implementation of 4 Bit Multiplier Using Fault Tolerant Hybrid Full Adder

Authors: C. Kalamani, V. Abishek Karthick, S. Anitha, K. Kavin Kumar

Abstract:

The fault tolerant system plays a crucial role in the critical applications which are being used in the present scenario. A fault may change the functionality of circuits. Aim of this paper is to design multiplier using fault tolerant hybrid full adder. Fault tolerant hybrid full adder is designed to check and repair any fault in the circuit using self-checking circuit and the self-repairing circuit. Further, the use of conventional logic circuits may result in more area, delay as well as power consumption. In order to reduce these parameters of the circuit, GDI (Gate Diffusion Input) techniques with less number of transistors are used compared to conventional full adder circuit. This reduces the area, delay and power consumption. The proposed method solves the major problems occurring in the most crucial and critical applications.

Keywords: Gate diffusion input, hybrid full adder, self-checking, fault tolerant.

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2048 Design of 900 MHz High Gain SiGe Power Amplifier with Linearity Improved Bias Circuit

Authors: Guiheng Zhang, Wei Zhang, Jun Fu, Yudong Wang

Abstract:

A 900 MHz three-stage SiGe power amplifier (PA) with high power gain is presented in this paper. Volterra Series is applied to analyze nonlinearity sources of SiGe HBT device model clearly. Meanwhile, the influence of operating current to IMD3 is discussed. Then a β-helper current mirror bias circuit is applied to improve linearity, since the β-helper current mirror bias circuit can offer stable base biasing voltage. Meanwhile, it can also work as predistortion circuit when biasing voltages of three bias circuits are fine-tuned, by this way, the power gain and operating current of PA are optimized for best linearity. The three power stages which fabricated by 0.18 μm SiGe technology are bonded to the printed circuit board (PCB) to obtain impedances by Load-Pull system, then matching networks are done for best linearity with discrete passive components on PCB. The final measured three-stage PA exhibits 21.1 dBm of output power at 1 dB compression point (OP1dB) with power added efficiency (PAE) of 20.6% and 33 dB power gain under 3.3 V power supply voltage.

Keywords: High gain power amplifier, linearization bias circuit, SiGe HBT model, Volterra Series.

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2047 Thermal Properties of the Ground in Cyprus and Their Correlations and Effect on the Efficiency of Ground Heat Exchangers

Authors: G. A. Florides, E. Theofanous, I. Iosif-Stylianou, P. Christodoulides, S. Kalogirou, V. Messarites, Z. Zomeni, E. Tsiolakis, P. D. Pouloupatis, G. P. Panayiotou

Abstract:

Ground Coupled Heat Pumps (GCHPs) exploit effectively the heat capacity of the ground, with the use of Ground Heat Exchangers (GHE). Depending on the mode of operation of the GCHPs, GHEs dissipate or absorb heat from the ground. For sizing the GHE the thermal properties of the ground need to be known. This paper gives information about the density, thermal conductivity, specific heat and thermal diffusivity of various lithologies encountered in Cyprus with various relations between these properties being examined through comparison and modeling. The results show that the most important correlation is the one encountered between thermal conductivity and thermal diffusivity with both properties showing similar response to the inlet and outlet flow temperature of vertical and horizontal heat exchangers.

Keywords: Ground heat exchangers, ground thermal conductivity, ground thermal diffusivity, ground thermal properties.

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2046 Thermal Fatigue Behavior of 400 Series Ferritic Stainless Steels

Authors: Seok Hong Min, Tae Kwon Ha

Abstract:

In this study, thermal fatigue properties of 400 series ferritic stainless steels have been evaluated in the temperature ranges of 200-800oC and 200-900oC. Systematic methods for control of temperatures within the predetermined range and measurement of load applied to specimens as a function of temperature during thermal cycles have been established. Thermal fatigue tests were conducted under fully constrained condition, where both ends of specimens were completely fixed. It has been revealed that load relaxation behavior at the temperatures of thermal cycle was closely related with the thermal fatigue property. Thermal fatigue resistance of 430J1L stainless steel is found to be superior to the other steels.

Keywords: Ferritic stainless steel, automotive exhaust, thermal fatigue, microstructure, load relaxation.

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2045 Transient Voltage Distribution on the Single Phase Transmission Line under Short Circuit Fault Effect

Authors: A. Kojah, A. Nacaroğlu

Abstract:

Single phase transmission lines are used to transfer data or energy between two users. Transient conditions such as switching operations and short circuit faults cause the generation of the fluctuation on the waveform to be transmitted. Spatial voltage distribution on the single phase transmission line may change owing to the position and duration of the short circuit fault in the system. In this paper, the state space representation of the single phase transmission line for short circuit fault and for various types of terminations is given. Since the transmission line is modeled in time domain using distributed parametric elements, the mathematical representation of the event is given in state space (time domain) differential equation form. It also makes easy to solve the problem because of the time and space dependent characteristics of the voltage variations on the distributed parametrically modeled transmission line.

Keywords: Energy transmission, transient effects, transmission line, transient voltage, RLC short circuit, single phase.

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2044 Modeling and Simulation of Two-Phase Interleaved Boost Converter Using Open-Source Software Scilab/Xcos

Authors: Yin Yin Phyo, Tun Lin Naing

Abstract:

This paper investigated the simulation of two-phase interleaved boost converter (IBC) with free and open-source software Scilab/Xcos. By using interleaved method, it can reduce current stress on components, components size, input current ripple and output voltage ripple. The required mathematical model is obtained from the equivalent circuit of its different four modes of operation for simulation. The equivalent circuits are considered in continuous conduction mode (CCM). The average values of the system variables are derived from the state-space equation to find the equilibrium point. Scilab is now becoming more and more popular among students, engineers and scientists because it is open-source software and free of charge. It gives a great convenience because it has powerful computation and simulation function. The waveforms of output voltage, input current and inductors current are obtained by using Scilab/Xcos.

Keywords: Two-phase boost converter, continuous conduction mode, free and open-source, interleaved method, dynamic simulation.

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2043 Temperature-dependent Structural Perturbation of Tuna Myoglobin

Authors: Yoshihiro Ochiai

Abstract:

To unveil the mechanism of fast autooxidation of fish myoglobins, the effect of temperature on the structural change of tuna myoglobin was investigated. Purified myoglobin was subjected to preincubation at 5, 20, 50 and 40oC. Overall helical structural decay through thermal treatment up to 95oC was monitored by circular dichroism spectrometry, while the structural changes around the heme pocket was measured by ultraviolet/visible absorption spectrophotometry. As a result, no essential structural change of myoglobin was observed under 30oC, roughly equivalent to their body temperature, but the structure was clearly damaged at 40oC. The Soret band absorption hardly differed irrespective of preincubation temperature, suggesting that the structure around the heme pocket was not perturbed even after thermal treatment.

Keywords: denaturation, myoglobin, stability, tuna.

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2042 Contribution to the Study of Thermal Conductivity of Porous Silicon Used In Thermal Sensors

Authors: A. Ould-Abbas, M. Bouchaour, , M. Madani, D. Trari, O. Zeggai, M. Boukais, N.-E.Chabane-Sari

Abstract:

The porous silicon (PS), formed from the anodization of a p+ type substrate silicon, consists of a network organized in a pseudo-column as structure of multiple side ramifications. Structural micro-topology can be interpreted as the fraction of the interconnected solid phase contributing to thermal transport. The reduction of dimensions of silicon of each nanocristallite during the oxidation induced a reduction in thermal conductivity. Integration of thermal sensors in the Microsystems silicon requires an effective insulation of the sensor element. Indeed, the low thermal conductivity of PS consists in a very promising way in the fabrication of integrated thermal Microsystems.In this work we are interesting in the measurements of thermal conductivity (on the surface and in depth) of PS by the micro-Raman spectroscopy. The thermal conductivity is studied according to the parameters of anodization (initial doping and current density. We also, determine porosity of samples by spectroellipsometry.

Keywords: micro-Raman spectroscopy, mono-crysatl silicon, porous silicon, thermal conductivity

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2041 Bridgeless Boost Power Factor Correction Rectifier with Hold-Up Time Extension Circuit

Authors: Chih-Chiang Hua, Yi-Hsiung Fang, Yuan-Jhen Siao

Abstract:

A bridgeless boost (BLB) power factor correction (PFC) rectifier with hold-up time extension circuit is proposed in this paper. A full bridge rectifier is widely used in the front end of the ac/dc converter. Since the shortcomings of the full bridge rectifier, the bridgeless rectifier is developed. A BLB rectifier topology is utilized with the hold-up time extension circuit. Unlike the traditional hold-up time extension circuit, the proposed extension scheme uses fewer active switches to achieve a longer hold-up time. Simulation results are presented to verify the converter performance.

Keywords: Bridgeless boost, boost converter, power factor correction, hold-up time.

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2040 A Processor with Dynamically Reconfigurable Circuit for Floating-Point Arithmetic

Authors: Yukinari Minagi , Akinori Kanasugi

Abstract:

This paper describes about dynamic reconfiguration to miniaturize arithmetic circuits in general-purpose processor. Dynamic reconfiguration is a technique to realize required functions by changing hardware construction during operation. The proposed arithmetic circuit performs floating-point arithmetic which is frequently used in science and technology. The data format is floating-point based on IEEE754. The proposed circuit is designed using VHDL, and verified the correct operation by simulations and experiments.

Keywords: dynamic reconfiguration, floating-point arithmetic, double precision, FPGA

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2039 A Study on Brushless DC Motor for High Torque Density

Authors: Jung-Moo Seo, Jung-Hwan Kim, Se-Hyun Rhyu, Jun-Hyuk Choi, In-Soung Jung,

Abstract:

Brushless DC motor with high torque density and slim topology for easy loading for robot system is proposed and manufactured. Electromagnetic design is executed by equivalent magnetic circuit model and numerical analysis. Manufactured motor is tested and verified characteristics comparing with conventional BLDC motor.

Keywords: Brushless DC motor, Robot joint module, Torque density, Pole/slot ratio

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2038 Application of MoM-GEC Method for Electromagnetic Study of Planar Microwave Structures: Shielding Application

Authors: Ahmed Nouainia, Mohamed Hajji, Taoufik Aguili

Abstract:

In this paper, an electromagnetic analysis is presented for describing the influence of shielding in a rectangular waveguide. A hybridization based on the method of moments combined to the generalized equivalent circuit MoM-GEC is used to model the problem. This is validated by applying the MoM-GEC hybridization to investigate a diffraction structure. It consists of electromagnetic diffraction by an iris in a rectangular waveguide. Numerical results are shown and discussed and a comparison with FEM and Marcuvitz methods is achieved.

Keywords: Inductive irises, MoM-GEC, waveguide, shielding.

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2037 Numerical Investigation of Thermal-Hydraulic Performance of a Flat Tube in Cross-Flow of Air

Authors: Hamidreza Bayat, Arash Mirabdolah Lavasani, Meysam Bolhasani, Sajad Moosavi

Abstract:

Heat transfer from flat tube is studied numerically. Reynolds number is defined base on equivalent circular tube which is varied in range of 100 to 300. In these range of Reynolds number flow is considered to be laminar, unsteady, and incompressible. Equations are solved by using finite volume method. Results show that increasing l/D from 1 to 2 has insignificant effect on heat transfer and Nusselt number of flat tube is slightly lower than circular tube. However, thermal-hydraulic performance of flat tube is up to 2.7 times greater than circular tube.

Keywords: Laminar flow, flat tube, convective heat transfer, heat exchanger.

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2036 Design and Simulation of Low Noise Amplifier Circuit for 5 GHz to 6 GHz

Authors: Hossein Sahoolizadeh, Alishir Moradi Kordalivand, Zargham Heidari

Abstract:

In first stage of each microwave receiver there is Low Noise Amplifier (LNA) circuit, and this stage has important rule in quality factor of the receiver. The design of a LNA in Radio Frequency (RF) circuit requires the trade-off many importance characteristics such as gain, Noise Figure (NF), stability, power consumption and complexity. This situation Forces desingners to make choices in the desing of RF circuits. In this paper the aim is to design and simulate a single stage LNA circuit with high gain and low noise using MESFET for frequency range of 5 GHz to 6 GHz. The desing simulation process is down using Advance Design System (ADS). A single stage LNA has successfully designed with 15.83 dB forward gain and 1.26 dB noise figure in frequency of 5.3 GHz. Also the designed LNA should be working stably In a frequency range of 5 GHz to 6 GHz.

Keywords: Advance Design System, Low Noise Amplifier, Radio Frequency, Noise Figure.

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2035 Thermal Diffusivity Measurement of Cadmium Sulphide Nanoparticles Prepared by γ-Radiation Technique

Authors: Azmi Zakaria, Reza Zamiri, Parisa Vaziri, Elias Saion, M. Shahril Husin

Abstract:

In this study we applied thermal lens (TL) technique to study the effect of size on thermal diffusivity of cadmium sulphide (CdS) nanofluid prepared by using γ-radiation method containing particles with different sizes. In TL experimental set up a diode laser of wavelength 514 nm and intensity stabilized He-Ne laser were used as the excitation source and the probe beam respectively, respectively. The experimental results showed that the thermal diffusivity value of CdS nanofluid increases when the of particle size increased.

Keywords: Thermal diffusivity, nanofluids, thermal lens

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2034 A Single-chip Proportional to Absolute Temperature Sensor Using CMOS Technology

Authors: AL.AL, M. B. I. Reaz, S. M. A. Motakabber, Mohd Alauddin Mohd Ali

Abstract:

Nowadays it is a trend for electronic circuit designers to integrate all system components on a single-chip. This paper proposed the design of a single-chip proportional to absolute temperature (PTAT) sensor including a voltage reference circuit using CEDEC 0.18m CMOS Technology. It is a challenge to design asingle-chip wide range linear response temperature sensor for many applications. The channel widths between the compensation transistor and the reference transistor are critical to design the PTAT temperature sensor circuit. The designed temperature sensor shows excellent linearity between -100°C to 200° and the sensitivity is about 0.05mV/°C. The chip is designed to operate with a single voltage source of 1.6V.

Keywords: PTAT, single-chip circuit, linear temperature sensor, CMOS technology.

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2033 Field Study for Evaluating Winter Thermal Performance of Auckland School Buildings

Authors: Bin Su

Abstract:

Auckland has a temperate climate with comfortable warm, dry summers and mild, wet winters. An Auckland school normally does not need air conditioning for cooling during the summer and only needs heating during the winter. The Auckland school building thermal design should more focus on winter thermal performance and indoor thermal comfort for energy efficiency. This field study of testing indoor and outdoor air temperatures, relative humidity and indoor surface temperatures of three classrooms with different envelopes were carried out in the Avondale College during the winter months in 2013. According to the field study data, this study is to compare and evaluate winter thermal performance and indoor thermal conditions of school buildings with different envelopes.

Keywords: Building envelope, Building mass effect, Building thermal comfort, Building thermal performance, School building.

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2032 Analysis and Circuit Modeling of APDs

Authors: A. Ahadpour Shal, A. Ghadimi, A. Azadbar

Abstract:

In this paper a new method for increasing the speed of SAGCM-APD is proposed. Utilizing carrier rate equations in different regions of the structure, a circuit model for the structure is obtained. In this research, in addition to frequency response, the effect of added new charge layer on some transient parameters like slew-rate, rising and falling times have been considered. Finally, by trading-off among some physical parameters such as different layers widths and droppings, a noticeable decrease in breakdown voltage has been achieved. The results of simulation, illustrate some features of proposed structure improvement in comparison with conventional SAGCM-APD structures.

Keywords: Optical communication systems (OCS), Circuit modeling, breakdown voltage, SAGCM APD

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2031 Anomalous Thermal Behavior of CuxMg1-xNb2O6 (x=0,0.4,0.6,1) for LTCC Substrate

Authors: Jyotirmayee Satapathy, M. V. Ramana Reddy

Abstract:

LTCC (Low Temperature Co-fired Ceramics) being the most advantageous technology towards the multilayer substrates for various applications, demands an extensive study of its raw materials. In the present work, a series of CuxMg1-xNb2O6 (x=0,0.4,0.6,1) has been prepared using sol-gel synthesis route and sintered at a temperature of 900°C to study its applicability for LTCC technology as the firing temperature is 900°C in this technology. The phase formation has been confirmed using X-ray Diffraction. Thermal properties like thermal conductivity and thermal expansion being very important aspect as the former defines the heat flow to avoid thermal instability in layers and the later provides the dimensional congruency of the dielectric material and the conductors, are studied here over high temperature up to the firing temperature. Although the values are quite satisfactory from substrate requirement point view, results have shown anomaly over temperature. The anomalous thermal behavior has been further analyzed using TG-DTA.

Keywords: Niobates, LTCC, Thermal conductivity, Thermal expansion, TG-DTA.

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2030 Thermal Securing of Electrical Contacts inside Oil Power Transformers

Authors: Ioan Rusu

Abstract:

In the operation of power transformers of 110 kV/MV from substations, these are traveled by fault current resulting from MV line damage. Defect electrical contacts are heated when they are travelled from fault currents. In the case of high temperatures when 135 °C is reached, the electrical insulating oil in the vicinity of the electrical faults comes into contact with these contacts releases gases, and activates the electrical protection. To avoid auto-flammability of electro-insulating oil, we designed a security system thermal of electrical contact defects by pouring fire-resistant polyurethane foam, mastic or mortar fire inside a cardboard electro-insulating cylinder. From practical experience, in the exploitation of power transformers of 110 kV/MT in oil electro-insulating were recorded some passing disconnecting commanded by the gas protection at internal defects. In normal operation and in the optimal load, nominal currents do not require thermal secure contacts inside electrical transformers, contacts are made at the fabrication according to the projects or to repair by solder. In the case of external short circuits close to the substation, the contacts inside electrical transformers, even if they are well made in sizes of Rcontact = 10‑6 Ω, are subjected to short-circuit currents of the order of 10 kA-20 kA which lead to the dissipation of some significant second-order electric powers, 100 W-400 W, on contact. At some internal or external factors which action on electrical contacts, including electrodynamic efforts at short-circuits, these factors could be degraded over time to values in the range of 10-4 Ω to 10-5 Ω and if the action time of protection is great, on the order of seconds, power dissipation on electrical contacts achieve high values of 1,0 kW to 40,0 kW. This power leads to strong local heating, hundreds of degrees Celsius and can initiate self-ignition and burning oil in the vicinity of electro-insulating contacts with action the gas relay. Degradation of electrical contacts inside power transformers may not be limited for the duration of their operation. In order to avoid oil burn with gas release near electrical contacts, at short-circuit currents 10 kA-20 kA, we have outlined the following solutions: covering electrical contacts in fireproof materials that would avoid direct burn oil at short circuit and transmission of heat from electrical contact along the conductors with heat dissipation gradually over time, in a large volume of cooling. Flame retardant materials are: polyurethane foam, mastic, cement (concrete). In the normal condition of operation of transformer, insulating of conductors coils is with paper and insulating oil. Ignition points of its two components respectively are approximated: 135 °C heat for oil and 200 0C for paper. In the case of a faulty electrical contact, about 10-3 Ω, at short-circuit; the temperature can reach for a short time, a value of 300 °C-400 °C, which ignite the paper and also the oil. By burning oil, there are local gases that disconnect the power transformer. Securing thermal electrical contacts inside the transformer, in cardboard tube with polyurethane foams, mastik or cement, ensures avoiding gas release and also gas protection working.

Keywords: Power transformer, oil insulatation, electric contacts, gases, gas relay.

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2029 Thermal Fatigue Behavior of Austenitic Stainless Steels

Authors: Jung-Ho Moon, Tae Kwon Ha

Abstract:

Continually increasing working temperature and growing need for greater efficiency and reliability of automotive exhaust require systematic investigation into the thermal fatigue properties especially of high temperature stainless steels. In this study, thermal fatigue properties of 300 series austenitic stainless steels have been evaluated in the temperature ranges of 200-800oC and 200-900oC. Systematic methods for control of temperatures within the predetermined range and measurement of load applied to specimens as a function of temperature during thermal cycles have been established. Thermal fatigue tests were conducted under fully constrained condition, where both ends of specimens were completely fixed. Load relaxation behavior at the temperatures of thermal cycle was closely related with the thermal fatigue property.

Keywords: Austenitic stainless steel, automotive exhaust, thermal fatigue, microstructure, load relaxation.

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2028 The Effects of 2wt% Cu Addition on the Corrosion Behavior of Heat Treated Al-6Si-0.5Mg-2Ni Alloy

Authors: A. Hossain, M. A. Gafur, F. Gulshan, A. S. W. Kurny

Abstract:

Al-Si-Mg-Ni(-Cu) alloys are widely used in the automotive industry. They have the advantage of low weight associated with low coefficient of thermal expansion and excellent mechanical properties – mainly at high temperatures. The corrosion resistance of these alloys in coastal area, particularly sea water, however is not yet known. In this investigation, electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization have been used to evaluate the corrosion resistance of Al-6Si-0.5Mg-2Ni (-2Cu) alloys in simulated sea water environments. The potentiodynamic polarization curves reveal that 2 wt% Cu content alloy (Alloy-2) is more prone to corrosion than the Cu free alloy (Alloy-1). But the EIS test results showed that corrosion resistance or charge transfer resistance (Rct) increases with the addition of Cu. Due to addition of Cu and thermal treatment, the magnitude of open circuit potential (OCP), corrosion potential (Ecorr) and pitting corrosion potential (Epit) of Al-6Si-0.5Mg-2Ni alloy in NaCl solution were shifted to the more noble direction.

Keywords: Al-Si alloy, potentiodynamic polarization, EIS, SEM.

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2027 Wafer Fab Operational Cost Monitoring and Controlling with Cost per Equivalent Wafer Out

Authors: Ian Kree, Davina Chin Lee Yien

Abstract:

This paper presents Cost per Equivalent Wafer Out, which we find useful in wafer fab operational cost monitoring and controlling. It removes the loading and product mix effect in the cost variance analysis. The operation heads, therefore, could immediately focus on identifying areas for cost improvement. Without this, they would have to measure the impact of the loading variance and product mix variance between actual and budgeted prior to make any decision on cost improvement. Cost per Equivalent Wafer Out, thereby, increases efficiency in wafer fab operational cost monitoring and controlling.

Keywords: Cost Control, Cost Variance, Operational Expenditure, Semiconductor.

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2026 The Application of Homotopy Method In Solving Electrical Circuit Design Problem

Authors: Talib Hashim Hasan

Abstract:

This paper describes simple implementation of homotopy (also called continuation) algorithm for determining the proper resistance of the resistor to dissipate energy at a specified rate of an electric circuit. Homotopy algorithm can be considered as a developing of the classical methods in numerical computing such as Newton-Raphson and fixed point methods. In homoptopy methods, an embedding parameter is used to control the convergence. The method purposed in this work utilizes a special homotopy called Newton homotopy. Numerical example solved in MATLAB is given to show the effectiveness of the purposed method

Keywords: electrical circuit homotopy, methods, MATLAB, Newton homotopy

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2025 Comparison of Full Graph Methods of Switched Circuits Solution

Authors: Zdeňka Dostálová, David Matoušek, Bohumil Brtnik

Abstract:

As there are also graph methods of circuit analysis in addition to algebraic methods, it is, in theory, clearly possible to carry out an analysis of a whole switched circuit in two-phase switching exclusively by the graph method as well. This article deals with two methods of full-graph solving of switched circuits: by transformation graphs and by two-graphs. It deals with the circuit switched capacitors and the switched current, too. All methods are presented in an equally detailed steps to be able to compare.

Keywords: Switched capacitors of two phases, switched currents of two phases, transformation graph, two-graph, Mason's formula, voltage transfer, summary graph.

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2024 Analysis and Design of a Novel Active Soft Switched Phase-Shifted Full Bridge Converter

Authors: Naga Brahmendra Yadav Gorla, Dr. Lakshmi Narasamma N

Abstract:

This paper proposes an active soft-switching circuit for bridge converters aiming to improve the power conversion efficiency. The proposed circuit achieves loss-less switching for both main and auxiliary switches without increasing the main switch current/voltage rating. A winding coupled to the primary of power transformer ensures ZCS for the auxiliary switches during their turn-off. A 350 W, 100 kHz phase shifted full bridge (PSFB) converter is built to validate the analysis and design. Theoretical loss calculations for proposed circuit is presented. The proposed circuit is compared with passive soft switched PSFB in terms of efficiency and loss in duty cycle.

Keywords: soft switching, passive soft switching, ZVS, ZCS, PSFB.

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2023 Experimental Investigation the Effectiveness of Using Heat Pipe on the Spacecraft Mockup Panel

Authors: M. Abdou, M. K. Khalil

Abstract:

The heat pipe is a thermal device which allows efficient transport of thermal energy. The experimental work of this research was split into two phases; phase 1 is the development of the facilities, material and test rig preparation. Phase 2 is the actual experiments and measurements of the thermal control mockup inside the modified vacuum chamber (MVC). Due to limited funds, the development on the thermal control subsystem was delayed and the experimental facilities such as suitable thermal vacuum chamber with space standard specifications were not available from the beginning of the research and had to be procured over a period of time. In all, these delays extended the project by one and a half year. Thermal control subsystem needs a special facility and equipment to be tested. The available vacuum chamber is not suitable for the thermal tests. Consequently, the modification of the chamber was a must. A vacuum chamber has been modified to be used as a Thermal Vaccum Chamber (TVC). A MVC is a vacuum chamber modified by using a stainless mirror box with perfect reflectability and the infrared lamp connected with the voltage regulator to vary the lamp intensity as it will be illustrated through the paper.

Keywords: Heat pipe, thermal control, thermal vacuum chamber, satellite.

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