Search results for: Chip Micro-Hardness

Authors: Eshwara K. Prasad, Raman R. Goud, Swadesh Kumar Singh, N. Sateesh

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In the present work, forming limit diagrams and strain distribution profile diagrams for extra deep drawing steel at room and elevated temperatures have been determined experimentally by conducting stretch forming experiments by using designed and fabricated warm stretchforming tooling setup. With the help of forming Limit Diagrams (FLDs) and strain, distribution profile diagrams the formability of Extra Deep Drawing steel has been analyzed and co-related with mechanical properties like strain hardening COEFFICIENT (n) and normal anisotropy (r−). Mechanical properties of EDD steel from room temperature to 4500C were determined and discussed the impact of temperature on the properties like work hardening exponent (n) anisotropy (r-) and strength coefficient of the material. In addition, the fractured surfaces after stretching have undergone the some metallurgical investigations and attempt has been made to co-relate with the formability of EDD steel sheets. They are co-related and good agreement with FLDs at various temperatures.

Keywords: FLD, microhardness, strain distribution profile, stretch forming.

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Authors: Esther T. Akinlabi, Stephen A. Akinlabi

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The purpose of this research study is to investigate the manner in which various loads affect the mechanical properties of the formed mild steel plates. The investigation focuses on examining the cross-sectional area of the metal plate at the centre of the formed mild steel plate. Six mild steel plates were deformed with different loads. The loads applied on the plates had a magnitude of 5 kg, 10 kg, 15 kg, 20 kg, 25 kg and 30 kg. The radius of the punching die was 120 mm and the loads were applied at room temperature. The investigations established that the applied load causes the Vickers microhardness at the cross-sectional area of the plate to increase due to strain hardening. Hence, the percentage increase of the hardness due to the load was found to be directly proportional to the increase in the load. Furthermore, the tensile test results for the parent material showed that the average Ultimate Tensile Strength (UTS) for the three samples was 308 MPa while the average Yield Strength and Percentage Elongation were 227 MPa and 38 % respectively. Similarly, the UTS of the formed components increased after the deformation of the plate, as such it can be concluded that the forming loads alter the mechanical properties of the materials by improving and strengthening the material properties.

Keywords: Applied load, forming and Mechanical Properties.

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Authors: Hanane Ondella, Pierre Ladet, David Ferrand, Pat Sloan

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In the micro and nano-technology industry, the «clean-rooms» dedicated to manufacturing chip, are equipped with the most sophisticated equipment-tools. There use a large number of resources in according to strict specifications for an optimum working and result. The distribution of «utilities» to the production is assured by teams who use a supervision tool. The studies show the interest to control the various parameters of production or/and distribution, in real time, through a reliable and effective supervision tool. This document looks at a large part of the functions that the supervisor must assure, with complementary functionalities to help the diagnosis and simulation that prove very useful in our case where the supervised installations are complexed and in constant evolution.

Keywords: Control-Command, evolution, non regression, performances, real time, simulation, supervision.

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Authors: Seong-Ho Song, Ki-Seob Kim, Seon-Woo Lee, Seop-Hyeong Park

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Based on a theoretical erbium-doped fiber amplifier (EDFA) model, we have proposed an application of disturbance observer(DOB) with proportional/integral/differential(PID) controller to EDFA for minimizing gain-transient time of wavelength -division-multiplexing (WDM) multi channels in optical amplifier in channel add/drop networks. We have dramatically reduced the gain-transient time to less than 30μsec by applying DOB with PID controller to the control of amplifier gain. The proposed DOB-based gain control algorithm for EDFA was implemented as a digital control system using TI's DSP(TMS320C28346) chip and experimental results of the system verify the excellent performance of the proposed gain control methodology.

Keywords: EDFA, Disturbance observer, gain control, WDM.

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Authors: Y. Li, K. Buddharaju, N. Singh, G. Q. Lo, S. J. Lee

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Silicon nanowire (SiNW) based thermoelectric device (TED) has potential applications in areas such as chip level cooling/ energy harvesting. It is a great challenge however, to assemble an efficient device with these SiNW. The presence of parasitic in the form of interfacial electrical resistance will have a significant impact on the performance of the TED. In this work, we explore the effect of the electrical contact resistance on the performance of a TED. Numerical simulations are performed on SiNW to investigate such effects on its cooling performance. Intrinsically, SiNW individually without the unwanted parasitic effect has excellent cooling power density. However, the cooling effect is undermined with the contribution of the electrical contact resistance.

Keywords: Thermoelectric, silicon, nanowire, electrical contact resistance, parasitics.

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Authors: Jihyung Kim, Taejin Kim, Sungho Park, Jun-Dong Cho

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In this paper, the problem of reducing switching activity in on-chip buses at the stage of high-level synthesis is considered, and a high-level low power bus binding based on dynamic bit reordering is proposed. Whereas conventional methods use a fixed bit ordering between variables within a bus, the proposed method switches a bit ordering dynamically to obtain a switching activity reduction. As a result, the proposed method finds a binding solution with a smaller value of total switching activity (TSA). Experimental result shows that the proposed method obtains a binding solution having 12.0-34.9% smaller TSA compared with the conventional methods.

Keywords: bit reordering, bus binding, low power, switching activity matrix

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Authors: A.R. Aswatha, T. Basavaraju, S. Sandeep Kumar

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Timing driven physical design, synthesis, and optimization tools need efficient closed-form delay models for estimating the delay associated with each net in an integrated circuit (IC) design. The total number of nets in a modern IC design has increased dramatically and exceeded millions. Therefore efficient modeling of interconnection is needed for high speed IC-s. This paper presents closed–form expressions for RC and RLC interconnection trees in current mode signaling, which can be implemented in VLSI design tool. These analytical model expressions can be used for accurate calculation of delay after the design clock tree has been laid out and the design is fully routed. Evaluation of these analytical models is several orders of magnitude faster than simulation using SPICE.

Keywords: IC design, RC/RLC Interconnection, VLSI Systems.

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Authors: M. J. Shivaram, Shashi Bhushan Arya, Jagannath Nayak, Bharat Bhooshan Panigrahi

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Titanium and its alloys have become more significant implant materials due to their mechanical properties, excellent biocompatibility and high corrosion resistance. Biomaterials can be produce by using the powder metallurgy (PM) methods and required properties can tailored by varying the processing parameters, such as ball milling time, space holder particles, and sintering temperature. The desired properties such as, structural and mechanical properties can be obtained by powder metallurgy method.  In the present study, deals with fabrication of solid and porous Ti-20Nb-5Ag alloy using high energy ball milling for different times (5 and 20 h). The resultant powder particles were used to fabricate solid and porous Ti-20Nb-5Ag alloy by adding space holder particles (NH₄HCO₃). The resultant powder particles, fabricated solid and porous samples were characterized by scanning electron microscopy (SEM). The compressive strength, elastic modulus and microhardness properties were investigated. Solid and porous Ti-20Nb-5Ag alloy samples showed good mechanical properties for 20 h ball milling time as compare to 5 h ball milling.

Keywords: Ball Milling, compressive strengths, microstructure, porous Titanium alloy.

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Authors: C. Kalamani, K. Paramasivam

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In VLSI, testing plays an important role. Major problem in testing are test data volume and test power. The important solution to reduce test data volume and test time is test data compression. The Proposed technique combines the bit maskdictionary and 2n pattern run length-coding method and provides a substantial improvement in the compression efficiency without introducing any additional decompression penalty. This method has been implemented using Mat lab and HDL Language to reduce test data volume and memory requirements. This method is applied on various benchmark test sets and compared the results with other existing methods. The proposed technique can achieve a compression ratio up to 86%.

Keywords: Bit Mask dictionary, 2n pattern run length code, system-on-chip, SOC, test data compression.

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Authors: Jun Yu, Yat-Hei Lam, Boris Grinberg, Kevin Chai Tshun Chuan

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This paper presents a 5-V to 30-V current-mode boost converter for powering the drive circuit of a micro-electro-mechanical sensor. The design of a transconductance amplifier and an integrated current sensing circuit are presented. In addition, essential building blocks for power-on protection such as a soft-start and clamp block and supply and clock ready block are discussed in details. The chip is fabricated in a 0.18-μm CMOS process. Measurement results show that the soft-start and clamp block can effectively limit the inrush current during startup and protect the boost converter from startup failure.

Keywords: Boost Converter, Current Sensing, Power-on protection, Step-up Converter, Soft-start.

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Authors: Jingjing Lan, Jun Zhou, Xin Liu

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In this paper, a low-power digital controller for DC-DC power conversion was presented. The controller generates the pulse-width modulated (PWM) signal from digital inputs provided by analog-to-digital converter (ADC). An efficient and simple design scheme to develop the control unit was discussed. This method allows minimization of the consumed resources of the chip and it is based on direct digital design approach. In this application, with the proposed scheme, nearly half area and two-third of the power consumption was saved compared to the conventional schemes. This work illustrates the possibility of implementing low-power and area-efficient power management circuit using direct digital design based approach. 

Keywords: Buck converter, DC-DC power conversion, digital control, proportional-integral (PI) controller.

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Authors: Andrew Randles, Ilker Ocak, Cheam Daw Don, Navab Singh, Alex Gu

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Nine Degrees of Freedom (9 DOF) systems are already in development in many areas. In this paper, an integrated pressure sensor is proposed that will make use of an already existing monolithic 9 DOF inertial MEMS platform. Capacitive pressure sensors can suffer from limited sensitivity for a given size of membrane. This novel pressure sensor design increases the sensitivity by over 5 times compared to a traditional array of square diaphragms while still fitting within a 2 mm x 2 mm chip and maintaining a fixed static capacitance. The improved design uses one large diaphragm supported by pillars with fixed electrodes placed above the areas of maximum deflection. The design optimization increases the sensitivity from 0.22 fF/kPa to 1.16 fF/kPa. Temperature sensitivity was also examined through simulation.

Keywords: Capacitive pressure sensor, 9 DOF, 10 DOF, sensor, capacitive, inertial measurement unit, IMU, inertial navigation system, INS.

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Authors: Ssu-Han Chen, Der-Baau Perng

Abstract:

Molding process in IC manufacturing secures chips against the harms done by hot, moisture or other external forces. While a chip was being molded,defects like cracks, dilapidation, or voids may be embedding on the molding surface. The molding surfaces the study poises to treat and the ones on the market, though, differ in the surface where texture similar to defects is everywhere. Manual inspection usually passes over low-contrast cracks or voids; hence an automatic optical inspection system for molding surface is necessary. The proposed system is consisted of a CCD, a coaxial light, a back light as well as a motion control unit. Based on the property of statistical textures of the molding surface, a series of digital image processing and classification procedure is carried out. After training of the parameter associated with above algorithm, result of the experiment suggests that the accuracy rate is up to 93.75%, contributing to the inspection quality of IC molding surface.

Keywords: Molding surface, machine vision, statistical texture, discrete Fourier transformation.

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Authors: Nor Maniha Abdul Ghani, Faradila Naim, Tan Piow Yon

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This project focuses on the development of a line follower algorithm for a Two Wheels Balancing Robot. In this project, ATMEGA32 is chosen as the brain board controller to react towards the data received from Balance Processor Chip on the balance board to monitor the changes of the environment through two infra-red distance sensor to solve the inclination angle problem. Hence, the system will immediately restore to the set point (balance position) through the implementation of internal PID algorithms at the balance board. Application of infra-red light sensors with the PID control is vital, in order to develop a smooth line follower robot. As a result of combination between line follower program and internal self balancing algorithms, we are able to develop a dynamically stabilized balancing robot with line follower function.

Keywords: infra-red sensor, PID algorithms, line followerBalancing robot

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Authors: Bahram Talebjedi, Emily Earl, Mina Hoorfar

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One of the issues that arises with microscale lab-on-a-chip technology is that the laminar flow within the microchannels limits the mixing of fluids. To combat this, micromixers have been introduced as a means to try and incorporate turbulence into the flow to better aid the mixing process. This study presents an electroosmotic micromixer that balances vortex generation and degeneration with the inlet flow velocity to greatly increase the mixing efficiency. A comprehensive parametric study was performed to evaluate the role of the relevant parameters on the mixing efficiency. It was observed that the suggested micromixer is perfectly suited for biological applications due to its low pressure drop (below 10 Pa) and low shear rate. The proposed micromixer with optimized working parameters is able to attain a mixing efficiency of 95% in a span of 0.5 seconds using a frequency of 10 Hz, a voltage of 0.7 V, and an inlet velocity of 0.366 mm/s.

Keywords: Microfluidics, active mixer, pulsed AC electroosmosis flow, micromixer.

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Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar

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The resistive-inductive-capacitive behavior of long interconnects which are driven by CMOS gates are presented in this paper. The analysis is based on the ¤Ç-model of a RLC load and is developed for submicron devices. Accurate and analytical expressions for the output load voltage, the propagation delay and the short circuit power dissipation have been proposed after solving a system of differential equations which accurately describe the behavior of the circuit. The effect of coupling capacitance between input and output and the short circuit current on these performance parameters are also incorporated in the proposed model. The estimated proposed delay and short circuit power dissipation are in very good agreement with the SPICE simulation with average relative error less than 6%.

Keywords: Delay, Inverter, Short Circuit Power, ¤Ç-Model, RLCInterconnect, VLSI

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Authors: Massoud Masoumi, Hosseyn Mahdizadeh

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A new and highly efficient architecture for elliptic curve scalar point multiplication which is optimized for a binary field recommended by NIST and is well-suited for elliptic curve cryptographic (ECC) applications is presented. To achieve the maximum architectural and timing improvements we have reorganized and reordered the critical path of the Lopez-Dahab scalar point multiplication architecture such that logic structures are implemented in parallel and operations in the critical path are diverted to noncritical paths. With G=41, the proposed design is capable of performing a field multiplication over the extension field with degree 163 in 11.92 s with the maximum achievable frequency of 251 MHz on Xilinx Virtex-4 (XC4VLX200) while 22% of the chip area is occupied, where G is the digit size of the underlying digit-serial finite field multiplier.

Keywords: Elliptic curve cryptography, FPGA implementation, scalar point multiplication.

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Authors: Yu Chen, Weiwei Ren, Xiaojing Mu, Feng Zhang, Yi Xu

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The superhydrophobic surface is widely used to reduce friction for the flow inside micro-channel and can be used to control/manipulate fluid, cells and even proteins in lab-on-chip. Fabricating micro grooves on hydrophobic surfaces is a common method to obtain such superhydrophobic surface. This study utilized the numerical method to investigate the effect of eccentric micro-grooves on the friction of flow inside micro-channel. A detailed parametric study was conducted to reveal how the eccentricity of micro-grooves affects the micro-channel flow under different grooves sizes, channel heights, Reynolds number. The results showed that the superhydrophobic surface with eccentric micro-grooves induces less friction than the counter part with aligning micro-grooves, which means requiring less power for pumps.

Keywords: Superhydrophobic, transverse grooves, heat transfer, slip length, microfluidics.

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Authors: L. Lancaster, M. H. Lung, D. Sujan

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The application of agro-industrial waste in Aluminum Metal Matrix Composites has been getting more attention as they can reinforce particles in metal matrix which enhance the strength properties of the composites. In addition, by applying these agroindustrial wastes in useful way not only save the manufacturing cost of products but also reduce the pollutions on environment. This paper represents a literature review on a range of industrial wastes and their utilization in metal matrix composites. The paper describes the synthesis methods of agro-industrial waste filled metal matrix composite materials and their mechanical, wear, corrosion, and physical properties. It also highlights the current application and future potential of agro-industrial waste reinforced composites in aerospace, automotive and other construction industries.

Keywords: Bond layer, Interfacial shear stress, Bi-layered assembly, Thermal mismatch, Flip Chip Ball Grid Array.

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Authors: Tsunwai Gary Yip

Abstract:

Phase locked loops for data links operating at 10 Gb/s or faster are low phase noise devices designed to operate with a low jitter reference clock. Characterization of their jitter transfer function is difficult because the intrinsic noise of the device is comparable to the random noise level in the reference clock signal. A linear model is proposed to account for the intrinsic noise of a PLL. The intrinsic noise data of a PLL for 10 Gb/s links is presented. The jitter transfer function of a PLL in a test chip for 12.8 Gb/s data links was determined in experiments using the 400 MHz reference clock as the source of simultaneous excitations over a wide range of frequency. The result shows that the PLL jitter transfer function can be approximated by a second order linear model.

Keywords: Intrinsic phase noise, jitter in data link, PLL jitter transfer function, high speed clocking in electronic circuit

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Authors: Jihyung Kim, Taejin Kim, Sungho Park, Jun-Dong Cho

Abstract:

In this paper, we address the problem of reducing the switching activity (SA) in on-chip buses through the use of a bus binding technique in high-level synthesis. While many binding techniques to reduce the SA exist, we present yet another technique for further reducing the switching activity. Our proposed method combines bus binding and data sequence reordering to explore a wider solution space. The problem is formulated as a multiple traveling salesman problem and solved using simulated annealing technique. The experimental results revealed that a binding solution obtained with the proposed method reduces 5.6-27.2% (18.0% on average) and 2.6-12.7% (6.8% on average) of the switching activity when compared with conventional binding-only and hybrid binding-encoding methods, respectively.

Keywords: low power, bus binding, switching activity, multiple traveling salesman problem, data sequence reordering

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Authors: Shiyang Zhu, G. Q. Lo, D. L. Kwong

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Silicon photonics has generated an increasing interest in recent years mainly for optical communications optical interconnects in microelectronic circuits or bio-sensing applications. The development of elementary passive and active components (including detectors and modulators), which are mainly fabricated on the silicon on insulator platform for CMOS-compatible fabrication, has reached such a performance level that the integration challenge of silicon photonics with microelectronic circuits should be addressed. Since crystalline silicon can only be grown from another silicon crystal, making it impossible to deposit in this state, the optical devices are typically limited to a single layer. An alternative approach is to integrate a photonic layer above the CMOS chip using back-end CMOS fabrication process. In this paper, various materials, including silicon nitride, amorphous silicon, and polycrystalline silicon, for this purpose are addressed.

Keywords: Silicon photonics, CMOS, Integration.

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Authors: Kamaraju.M, Lal Kishore.K, Tilak.A.V.N

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The general purpose processors that are used in embedded systems must support constraints like execution time, power consumption, code size and so on. On the other hand an Application Specific Instruction-set Processor (ASIP) has advantages in terms of power consumption, performance and flexibility. In this paper, a 16-bit Application Specific Instruction-set processor for the sensor data transfer is proposed. The designed processor architecture consists of on-chip transmitter and receiver modules along with the processing and controlling units to enable the data transmission and reception on a single die. The data transfer is accomplished with less number of instructions as compared with the general purpose processor. The ASIP core operates at a maximum clock frequency of 1.132GHz with a delay of 0.883ns and consumes 569.63mW power at an operating voltage of 1.2V. The ASIP is implemented in Verilog HDL using the Xilinx platform on Virtex4.

Keywords: ASIP, Data transfer, Instruction set, Processor

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Authors: Jin-Ho Bae, Yong-Tae Kim, S K Deb Nath, Seo-Ik Kang, Sung-Gaun Kim

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Reno-pin contact test is a method that is controlled by DC motor used to characterize electronic chips. This method is used in electronic and telecommunication devices. A new electric performance testing system is developed in which the testing method is controlled by using Piezoelectric Transducer (PZT) instead of DC motor which reduces vibration and noise. The vertical displacement of the Reno-pin is very short in the Reno-pin contact testing system. Now using a flexible guide in the new Reno-pin contact system, the vertical movement of the Reno-pin is increased many times of the existing Reno-pin contact testing method using DC motor. Using the present electric performance testing system with a flexible hinge and PZT instead of DC motor, manufacturing of electronic chips are able to characterize chips with low cost and high speed.

Keywords: PZT Actuator, Chip test, Mechanical amplifier

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Authors: Kah-Hyong Chang, Xin Liu, Jia Hao Cheong, Saisundar Sankaranarayanan, Dexing Pang, Hongzhao Zheng

Abstract:

A digital baseband Application-Specific Integrated Circuit (ASIC) (yclic Redundancy Checkis developed for a microchip transponder to transmit signals and temperature levels from biomedical monitoring devices. The transmission protocol is adapted from the ISO/IEC 11784/85 standard. The module has a decimation filter that employs only a single adder-subtractor in its datapath. The filtered output is coded with cyclic redundancy check and transmitted through backscattering Load Shift Keying (LSK) modulation to a reader. Fabricated using the 0.18-μm CMOS technology, the module occupies 0.116 mm² in chip area (digital baseband: 0.060 mm², decimation filter: 0.056 mm²), and consumes a total of less than 0.9 μW of power (digital baseband: 0.75 μW, decimation filter: 0.14 μW).

Keywords: Biomedical sensor, decimation filter, Radio Frequency Integrated Circuit (RFIC) baseband, temperature sensor.

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Authors: Abhijit Chandra, Sudipta Chattopadhyay

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In this communication, we have made an attempt to design multiplier-less low-pass finite impulse response (FIR) filter with the aid of various mutation strategies of Differential Evolution (DE) algorithm. Impulse response coefficient of the designed FIR filter has been represented as sums or differences of powers of two. Performance of the proposed filter has been evaluated in terms of its frequency response and associated hardware cost. Supremacy of our approach has been substantiated by comparing our result with many of the existing multiplier-less filter design algorithms of recent interest. It has also been demonstrated that DE-optimized filter outperforms Genetic Algorithm (GA) based design by a large margin.  Hardware efficiency of our algorithm has further been validated by implementing those filters on a Field Programmable Gate Array (FPGA) chip.

Keywords: Convergence speed, Differential Evolution (DE), error histogram, finite impulse response (FIR) filter, total power of two (TPT), zero-valued filter coefficient (ZFC).

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Authors: Y. Li, Q. S. Zhang, H. Z. Huang, B. Y. Wu

Abstract:

The mechanism behind the electromigration and thermomigration failure in flip-chip solder joints with Cu-pillar bumps was investigated in this paper through using finite element method. Hot spot and the current crowding occurrs in the upper corner of copper column instead of solders of the common solder ball. The simulation results show that the change in thermal gradient is noticeable, which might greatly affect the reliability of solder joints with Cu-pillar bumps under current stressing. When the average applied current density is increased from 1×104 A/cm2 to 3×104 A/cm2 in solders, the thermal gradient would increase from 74 K/cm to 901 K/cm at an ambient temperature of 25°C. The force from thermal gradient of 901 K/cm can nearly induce thermomigration by itself. With the increase in applied current, the thermal gradient is growing. It is proposed that thermomigration likely causes a serious reliability issue for Cu column based interconnects.

Keywords: Simulation, Cu-pillar bumps, Electromigration, Thermomigration.

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Authors: A. A. Ugla

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The present paper aims to investigate the effects of the welding process parameters and cooling state on the weld bead geometry, mechanical properties and microstructure characteristics for weldments of AISI 304L stainless steel. The welding process was carried out using TIG welding with pulsed/non-pulsed current techniques. The cooling state was introduced as an input parameter to investigate the main effects on the structure morphology and thereby the mechanical property. This paper clarifies microstructure- mechanical property relationship of the welded specimens. In this work, the selected pulse frequency levels were 5-500 Hz in order to study the effect of low and high frequencies on the weldment characteristics using filler metal of ER 308LSi. The key findings of this work clarified that the pulse frequency has a significant effect on the breaking of the dendrite arms during the welding process and so strongly influences on the tensile strength and microhardness. The cooling state also significantly affects on the microstructure texture and thereby, the mechanical properties. The most important factor affects the bead geometry and aspect ratio is the travel speed and pulse frequency.

Keywords: Microstructure, mechanical properties, pulse frequency, high pulse frequency, austenitic stainless steel, TIG welding.

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Authors: S. Saraç, F. Kara, C.Vural

Abstract:

High-frequency (HF) communications have been used by military organizations for more than 90 years. The opportunity of very long range communications without the need for advanced equipment makes HF a convenient and inexpensive alternative of satellite communications. Besides the advantages, voice and data transmission over HF is a challenging task, because the HF channel generally suffers from Doppler shift and spread, multi-path, cochannel interference, and many other sources of noise. In constructing an HF data modem, all these effects must be taken into account. STANAG 4539 is a NATO standard for high-speed data transmission over HF. It allows data rates up to 12800 bps over an HF channel of 3 kHz. In this work, an efficient implementation of STANAG 4539 on a single Texas Instruments- TMS320C6747 DSP chip is described. The state-of-the-art algorithms used in the receiver and the efficiency of the implementation enables real-time high-speed data / digitized voice transmission over poor HF channels.

Keywords: High frequency, modem, STANAG 4539.

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Authors: Sadi Vural, Hiromi Tomii, Hironori Yamauchi

Abstract:

As the development of digital technology is increasing, Digital cinema is getting more spread. However, content copy and attack against the digital cinema becomes a serious problem. To solve the above security problem, we propose “Additional Watermarking" for digital cinema delivery system. With this proposed “Additional watermarking" method, we protect content copyrights at encoder and user side information at decoder. It realizes the traceability of the watermark embedded at encoder. The watermark is embedded into the random-selected frames using Hash function. Using it, the embedding position is distributed by Hash Function so that third parties do not break off the watermarking algorithm. Finally, our experimental results show that proposed method is much better than the convenient watermarking techniques in terms of robustness, image quality and its simple but unbreakable algorithm.

Keywords: Decoder, Digital content, JPEG2000 Frame, System-On-Chip and additional watermark.

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