%0 Journal Article
	%A Y. Li and  Q. S. Zhang and  H. Z. Huang and  B. Y. Wu
	%D 2010
	%J International Journal of Mechanical and Mechatronics Engineering
	%B World Academy of Science, Engineering and Technology
	%I Open Science Index 37, 2010
	%T Simulation of Effect of Current Stressing on Reliability of Solder Joints with Cu-Pillar Bumps
	%U https://publications.waset.org/pdf/6733
	%V 37
	%X The mechanism behind the electromigration and
thermomigration failure in flip-chip solder joints with Cu-pillar bumps
was investigated in this paper through using finite element method.
Hot spot and the current crowding occurrs in the upper corner of
copper column instead of solders of the common solder ball. The
simulation results show that the change in thermal gradient is
noticeable, which might greatly affect the reliability of solder joints
with Cu-pillar bumps under current stressing. When the average
applied current density is increased from 1×104 A/cm2 to 3×104 A/cm2
in solders, the thermal gradient would increase from 74 K/cm to 901
K/cm at an ambient temperature of 25°C. The force from thermal
gradient of 901 K/cm can nearly induce thermomigration by itself.
With the increase in applied current, the thermal gradient is growing. It
is proposed that thermomigration likely causes a serious reliability
issue for Cu column based interconnects.
	%P 68 - 72