Y. Li and  Q. S. Zhang and  H. Z. Huang and  B. Y. Wu,  Simulation of Effect of Current Stressing on Reliability of Solder Joints with Cu-Pillar Bumps.   journal   = {International Journal of Mechanical and Mechatronics Engineering}, [online]. World Academy of Science, Engineering and Technology.
    January 2010, vol. 37(1). 68 - 72
    [viewed 24 October 2019]. Available from: https://publications.waset.org/pdf/6733.