Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 8

Search results for: thermal management

8 Comparison of the Thermal Characteristics of Induction Motor, Switched Reluctance Motor and Inset Permanent Magnet Motor for Electric Vehicle Application

Authors: Sadeep Sasidharan, T. B. Isha

Abstract:

Modern day electric vehicles require compact high torque/power density motors for electric propulsion. This necessitates proper thermal management of the electric motors. The main focus of this paper is to compare the steady state thermal analysis of a conventional 20 kW 8/6 Switched Reluctance Motor (SRM) with that of an Induction Motor and Inset Permanent Magnet (IPM) motor of the same rating. The goal is to develop a proper thermal model of the three types of models for Finite Element Thermal Analysis. JMAG software is used for the development and simulation of the thermal models. The results show that the induction motor is subjected to more heating when used for electric vehicle application constantly, compared to the SRM and IPM.

Keywords: SRM, induction motor, IPM, thermal analysis, loss models, electric vehicles.

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7 Thermal Evaluation of Printed Circuit Board Design Options and Voids in Solder Interface by a Simulation Tool

Authors: B. Arzhanov, A. Correia, P. Delgado, J. Meireles

Abstract:

Quad Flat No-Lead (QFN) packages have become very popular for turners, converters and audio amplifiers, among others applications, needing efficient power dissipation in small footprints. Since semiconductor junction temperature (TJ) is a critical parameter in the product quality. And to ensure that die temperature does not exceed the maximum allowable TJ, a thermal analysis conducted in an earlier development phase is essential to avoid repeated re-designs process with huge losses in cost and time. A simulation tool capable to estimate die temperature of components with QFN package was developed. Allow establish a non-empirical way to define an acceptance criterion for amount of voids in solder interface between its exposed pad and Printed Circuit Board (PCB) to be applied during industrialization process, and evaluate the impact of PCB designs parameters. Targeting PCB layout designer as an end user for the application, a user-friendly interface (GUI) was implemented allowing user to introduce design parameters in a convenient and secure way and hiding all the complexity of finite element simulation process. This cost effective tool turns transparent a simulating process and provides useful outputs after acceptable time, which can be adopted by PCB designers, preventing potential risks during the design stage and make product economically efficient by not oversizing it. This article gathers relevant information related to the design and implementation of the developed tool, presenting a parametric study conducted with it. The simulation tool was experimentally validated using a Thermal-Test-Chip (TTC) in a QFN open-cavity, in order to measure junction temperature (TJ) directly on the die under controlled and knowing conditions. Providing a short overview about standard thermal solutions and impacts in exposed pad packages (i.e. QFN), accurately describe the methods and techniques that the system designer should use to achieve optimum thermal performance, and demonstrate the effect of system-level constraints on the thermal performance of the design.

Keywords: Quad Flat No-Lead packages, exposed pads, junction temperature, thermal management and measurements.

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6 Monitorization of Junction Temperature Using a Thermal-Test-Device

Authors: B. Arzhanov, A. Correia, P. Delgado, J. Meireles

Abstract:

Due to the higher power loss levels in electronic components, the thermal design of PCBs (Printed Circuit Boards) of an assembled device becomes one of the most important quality factors in electronics. Nonetheless, some of leading causes of the microelectronic component failures are due to higher temperatures, the leakages or thermal-mechanical stress, which is a concern, is the reliability of microelectronic packages. This article presents an experimental approach to measure the junction temperature of exposed pad packages. The implemented solution is in a prototype phase, using a temperature-sensitive parameter (TSP) to measure temperature directly on the die, validating the numeric results provided by the Mechanical APDL (Ansys Parametric Design Language) under same conditions. The physical device-under-test is composed by a Thermal Test Chip (TTC-1002) and assembly in a QFN cavity, soldered to a test-board according to JEDEC Standards. Monitoring the voltage drop across a forward-biased diode, is an indirectly method but accurate to obtain the junction temperature of QFN component with an applied power range between 0,3W to 1.5W. The temperature distributions on the PCB test-board and QFN cavity surface were monitored by an infra-red thermal camera (Goby-384) controlled and images processed by the Xeneth software. The article provides a set-up to monitorize in real-time the junction temperature of ICs, namely devices with the exposed pad package (i.e. QFN). Presenting the PCB layout parameters that the designer should use to improve thermal performance, and evaluate the impact of voids in solder interface in the device junction temperature.

Keywords: Quad Flat No-Lead packages, exposed pads, junction temperature, thermal management, measurements.

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5 Performance of Flat Plate Loop Heat Pipe for Thermal Management of Lithium-Ion Battery in Electric Vehicle Application

Authors: Bambang Ariantara, Nandy Putra, Rangga Aji Pamungkas

Abstract:

The development of electric vehicle batteries have resulted in very high energy density lithium-ion batteries. However, this progress is accompanied by the risk of thermal runaway, which can result in serious accidents. Heat pipes are heat exchangers that are suitable to be applied in electric vehicle battery thermal management for their lightweight, compact size and do not require external power supply. This paper aims to examine experimentally a Flat Plate Loop Heat Pipe (FPLHP) performance as a heat exchanger in thermal management system of lithium-ion battery for electric vehicle application. The heat generation of the battery was simulated using a cartridge heater. Stainless steel screen mesh was used as the capillary wick. Distilled water, alcohol and acetone were used as working fluids with a filling ratio of 60%. It was found that acetone gives the best performance that produces thermal resistance of 0.22 W/°C with 50°C evaporator temperature at heat flux load of 1.61 W/cm2.

Keywords: Electric vehicle, flat plate loop heat pipe, lithium-ion battery, thermal management system.

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4 Thermal Assessment of Outer Rotor Direct Drive Gearless Small-Scale Wind Turbines

Authors: Yusuf Yasa, Erkan Mese

Abstract:

This paper investigates the thermal issue of permanent magnet synchronous generator which is frequently used in direct drive gearless small-scale wind turbine applications. Permanent Magnet Synchronous Generator (PMSG) is designed with 2.5 kW continuous and 6 kW peak power. Then considering generator geometry, mechanical design of wind turbine is performed. Thermal analysis and optimization is carried out considering all wind turbine components to reach realistic results. This issue is extremely important in research and development (R&D) process for wind turbine applications.

Keywords: Direct drive, gearless wind turbine, permanent magnet synchronous generator (PMSG), small-scale wind turbine, thermal management.

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3 Heat Generation Rate and Computational Simulation for Li-Ion Battery Module

Authors: Ravichandra R., Srithar Rajoo, Tan Lit Wen

Abstract:

In recent years Li-Ion batteries getting more attention among the Electrical Vehicles (EV) and Hybrid Electrical Vehicles (HEV) energy storage. Li-Ion has shown extended power density and light weight compared to other batteries readily available in the market. One of the major drawbacks in Li-Ion batteries is their sensitivity to the temperature. If the working temperature is beyond the limit, that could affect seriously on the durability and performance of Li-Ion battery. Thus Battery Thermal Management (BTM) is the most essential in adapting Li-Ion battery to the EVs and HEVs.

Keywords: Li-Ion battery, HEV/EV, battery thermal management, heat generation rate.

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2 Thermal Management of Space Power Electronics using TLM-3D

Authors: R. Hocine, K. Belkacemi, A. Boukortt, A. Boudjemai

Abstract:

When designing satellites, one of the major issues aside for designing its primary subsystems is to devise its thermal. The thermal management of satellites requires solving different sets of issues with regards to modelling. If the satellite is well conditioned all other parts of the satellite will have higher temperature no matter what. The main issue of thermal modelling for satellite design is really making sure that all the other points of the satellite will be within the temperature limits they are designed. The insertion of power electronics in aerospace technologies is becoming widespread and the modern electronic systems used in space must be reliable and efficient with thermal management unaffected by outer space constraints. Many advanced thermal management techniques have been developed in recent years that have application in high power electronic systems. This paper presents a Three-Dimensional Modal Transmission Line Matrix (3D-TLM) implementation of transient heat flow in space power electronics. In such kind of components heat dissipation and good thermal management are essential. Simulation provides the cheapest tool to investigate all aspects of power handling. The 3DTLM has been successful in modeling heat diffusion problems and has proven to be efficient in terms of stability and complex geometry. The results show a three-dimensional visualisation of self-heating phenomena in the device affected by outer space constraints, and will presents possible approaches for increasing the heat dissipation capability of the power modules.

Keywords: Thermal management, conduction, heat dissipation, CTE, ceramic, heat spreader, nodes, 3D-TLM.

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1 Influence of IMV on Space Station

Authors: Fu Shiming, Pei Yifei

Abstract:

To study the impact of the inter-module ventilation (IMV) on the space station, the Computational Fluid Dynamic (CFD) model under the influence of IMV, the mathematical model, boundary conditions and calculation method are established and determined to analyze the influence of IMV on cabin air flow characteristics and velocity distribution firstly; and then an integrated overall thermal mathematical model of the space station is used to consider the impact of IMV on thermal management. The results show that: the IMV has a significant influence on the cabin air flow, the flowrate of IMV within a certain range can effectively improve the air velocity distribution in cabin, if too much may lead to its deterioration; IMV can affect the heat deployment of the different modules in space station, thus affecting its thermal management, the use of IMV can effectively maintain the temperature levels of the different modules and help the space station to dissipate the waste heat.

Keywords: CFD, Environment control and life support, Space station, Thermal management, Thermal mathematical model.

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