{"title":"A High Thermal Dissipation Performance Polyethyleneterephthalate Heat Pipe","authors":"Chih-Chieh Chen, Chih-Hao Chen, Guan-Wei Wu, Sih-Li Chen","volume":82,"journal":"International Journal of Mechanical and Mechatronics Engineering","pagesStart":1967,"pagesEnd":1973,"ISSN":"1307-6892","URL":"https:\/\/publications.waset.org\/pdf\/17049","abstract":"
A high thermal dissipation performance polyethylene terephthalate heat pipe has been fabricated and tested in this research. Polyethylene terephthalate (PET) is used as the container material instead of copper. Copper mesh and methanol are sealed in the middle of two PET films as the wick structure and working fluid. Although the thermal conductivity of PET (0.15-0.24 W\/m·K) is much smaller than copper (401 W\/m·K), the experiment results reveal that the PET heat pipe can reach a minimum thermal resistance of 0.146 (o<\/sup>C\/W) and maximum effective thermal conductivity of 18,310 (W\/m·K) with 36.9 vol% at 26 W input power. However, when the input power is larger than 30 W, the laminated PET will debond due to the high vapor pressure of methanol.<\/p>\r\n","references":"[1] X. L. Xie, Y. L. He, W. Q. Tao, H. W. Yang, \u201c An experimental \r\ninvestigation on a novel high-performance integrated heat pipe-heat sink \r\nfor high-flux chip cooling,\u201d Appl. Therm. 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