Search results for: chip multiprocessor.
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 180

Search results for: chip multiprocessor.

90 Design of Low-Area HEVC Core Transform Architecture

Authors: Seung-Mok Han, Woo-Jin Nam, Seongsoo Lee

Abstract:

This paper proposes and implements an core transform architecture, which is one of the major processes in HEVC video compression standard. The proposed core transform architecture is implemented with only adders and shifters instead of area-consuming multipliers. Shifters in the proposed core transform architecture are implemented in wires and multiplexers, which significantly reduces chip area. Also, it can process from 4×4 to 16×16 blocks with common hardware by reusing processing elements. Designed core transform architecture in 0.13um technology can process a 16×16 block with 2-D transform in 130 cycles, and its gate count is 101,015 gates.

Keywords: HEVC, Core transform, Low area, Shift-and-add, PE reuse

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89 A High-Crosstalk Silicon Photonic Arrayed Waveguide Grating

Authors: Qing Fang, Lianxi Jia, Junfeng Song, Chao Li, Xianshu Luo, Mingbin Yu, Guoqiang Lo

Abstract:

In this paper, we demonstrated a 1 × 4 silicon photonic cascaded arrayed waveguide grating, which is fabricated on a SOI wafer with a 220 nm top Si layer and a 2µm buried oxide layer. The measured on-chip transmission loss of this cascaded arrayed waveguide grating is ~ 5.6 dB, including the fiber-to-waveguide coupling loss. The adjacent crosstalk is 33.2 dB. Compared to the normal single silicon photonic arrayed waveguide grating with a crosstalk of ~ 12.5 dB, the crosstalk of this device has been dramatically increased.

Keywords: Silicon photonic, arrayed waveguide grating, high-crosstalk, cascaded structure.

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88 Real-Time Digital Oscilloscope Implementation in 90nm CMOS Technology FPGA

Authors: Nasir Mehmood, Jens Ogniewski, Vinodh Ravinath

Abstract:

This paper describes the design of a real-time audiorange digital oscilloscope and its implementation in 90nm CMOS FPGA platform. The design consists of sample and hold circuits, A/D conversion, audio and video processing, on-chip RAM, clock generation and control logic. The design of internal blocks and modules in 90nm devices in an FPGA is elaborated. Also the key features and their implementation algorithms are presented. Finally, the timing waveforms and simulation results are put forward.

Keywords: CMOS, VLSI, Oscilloscope, Field Programmable Gate Array (FPGA), VHDL, Video Graphics Array (VGA)

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87 A Low-Area Fully-Reconfigurable Hardware Design of Fast Fourier Transform System for 3GPP-LTE Standard

Authors: Xin-Yu Shih, Yue-Qu Liu, Hong-Ru Chou

Abstract:

This paper presents a low-area and fully-reconfigurable Fast Fourier Transform (FFT) hardware design for 3GPP-LTE communication standard. It can fully support 32 different FFT sizes, up to 2048 FFT points. Besides, a special processing element is developed for making reconfigurable computing characteristics possible, while first-in first-out (FIFO) scheduling scheme design technique is proposed for hardware-friendly FIFO resource arranging. In a synthesis chip realization via TSMC 40 nm CMOS technology, the hardware circuit only occupies core area of 0.2325 mm2 and dissipates 233.5 mW at maximal operating frequency of 250 MHz.

Keywords: Reconfigurable, fast Fourier transform, single-path delay feedback, 3GPP-LTE.

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86 Speedup of Data Vortex Network Architecture

Authors: Qimin Yang

Abstract:

In this paper, 3X3 routing nodes are proposed to provide speedup and parallel processing capability in Data Vortex network architectures. The new design not only significantly improves network throughput and latency, but also eliminates the need for distributive traffic control mechanism originally embedded among nodes and the need for nodal buffering. The cost effectiveness is studied by a comparison study with the previously proposed 2- input buffered networks, and considerable performance enhancement can be achieved with similar or lower cost of hardware. Unlike previous implementation, the network leaves small probability of contention, therefore, the packet drop rate must be kept low for such implementation to be feasible and attractive, and it can be achieved with proper choice of operation conditions.

Keywords: Data Vortex, Packet Switch, Interconnection network, deflection, Network-on-chip

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85 Reduction of Peak Input Currents during Charge Pump Boosting in Monolithically Integrated High-Voltage Generators

Authors: Jan Doutreloigne

Abstract:

This paper describes two methods for the reduction of the peak input current during the boosting of Dickson charge pumps. Both methods are implemented in the fully integrated Dickson charge pumps of a high-voltage display driver chip for smart-card applications. Experimental results reveal good correspondence with Spice simulations and show a reduction of the peak input current by a factor of 6 during boosting.

Keywords: Bi-stable display driver, Dickson charge pump, highvoltage generator, peak current reduction, sub-pump boosting, variable frequency boosting.

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84 Implementing Authentication Protocol for Exchanging Encrypted Messages via an Authentication Server Based on Elliptic Curve Cryptography with the ElGamal-s Algorithm

Authors: Konstantinos Chalkias, George Filiadis, George Stephanides

Abstract:

In this paper the authors propose a protocol, which uses Elliptic Curve Cryptography (ECC) based on the ElGamal-s algorithm, for sending small amounts of data via an authentication server. The innovation of this approach is that there is no need for a symmetric algorithm or a safe communication channel such as SSL. The reason that ECC has been chosen instead of RSA is that it provides a methodology for obtaining high-speed implementations of authentication protocols and encrypted mail techniques while using fewer bits for the keys. This means that ECC systems require smaller chip size and less power consumption. The proposed protocol has been implemented in Java to analyse its features and vulnerabilities in the real world.

Keywords: Elliptic Curve Cryptography, ElGamal, authentication protocol.

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83 Low Power Low Voltage Current Mode Pipelined A/D Converters

Authors: Krzysztof Wawryn, Robert Suszyński, Bogdan Strzeszewski

Abstract:

This paper presents two prototypes of low power low voltage current mode 9 bit pipelined a/d converters. The first and the second converters are configured of 1.5 bit and 2.5 bit stages, respectively. The a/d converter structures are composed of current mode building blocks and final comparator block which converts the analog current signal into digital voltage signal. All building blocks have been designed in CMOS AMS 0.35μm technology, then simulated to verify proposed concept. The performances of both converters are compared to performances of known current mode and voltage mode switched capacitance converter structures. Low power consumption and small chip area are advantages of the proposed converters.

Keywords: Pipelined converter, a/d converter, low power, lowvoltage, current mode.

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82 On-Chip Aging Sensor Circuit Based on Phase Locked Loop Circuit

Authors: Ararat Khachatryan, Davit Mirzoyan

Abstract:

In sub micrometer technology, the aging phenomenon starts to have a significant impact on the reliability of integrated circuits by bringing performance degradation. For that reason, it is important to have a capability to evaluate the aging effects accurately. This paper presents an accurate aging measurement approach based on phase-locked loop (PLL) and voltage-controlled oscillator (VCO) circuit. The architecture is rejecting the circuit self-aging effect from the characteristics of PLL, which is generating the frequency without any aging phenomena affects. The aging monitor is implemented in low power 32 nm CMOS technology, and occupies a pretty small area. Aging simulation results show that the proposed aging measurement circuit improves accuracy by about 2.8% at high temperature and 19.6% at high voltage.

Keywords: Nanoscale, aging, effect, NBTI, HCI.

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81 Methodology of Realization for Supervisor and Simulator Dedicated to a Semiconductor Research and Production Factory

Authors: Hanane Ondella, Pierre Ladet, David Ferrand, Pat Sloan

Abstract:

In the micro and nano-technology industry, the «clean-rooms» dedicated to manufacturing chip, are equipped with the most sophisticated equipment-tools. There use a large number of resources in according to strict specifications for an optimum working and result. The distribution of «utilities» to the production is assured by teams who use a supervision tool. The studies show the interest to control the various parameters of production or/and distribution, in real time, through a reliable and effective supervision tool. This document looks at a large part of the functions that the supervisor must assure, with complementary functionalities to help the diagnosis and simulation that prove very useful in our case where the supervised installations are complexed and in constant evolution.

Keywords: Control-Command, evolution, non regression, performances, real time, simulation, supervision.

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80 Design of EDFA Gain Controller based on Disturbance Observer Technique

Authors: Seong-Ho Song, Ki-Seob Kim, Seon-Woo Lee, Seop-Hyeong Park

Abstract:

Based on a theoretical erbium-doped fiber amplifier (EDFA) model, we have proposed an application of disturbance observer(DOB) with proportional/integral/differential(PID) controller to EDFA for minimizing gain-transient time of wavelength -division-multiplexing (WDM) multi channels in optical amplifier in channel add/drop networks. We have dramatically reduced the gain-transient time to less than 30μsec by applying DOB with PID controller to the control of amplifier gain. The proposed DOB-based gain control algorithm for EDFA was implemented as a digital control system using TI's DSP(TMS320C28346) chip and experimental results of the system verify the excellent performance of the proposed gain control methodology.

Keywords: EDFA, Disturbance observer, gain control, WDM.

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79 Silicon Nanowire for Thermoelectric Applications: Effects of Contact Resistance

Authors: Y. Li, K. Buddharaju, N. Singh, G. Q. Lo, S. J. Lee

Abstract:

Silicon nanowire (SiNW) based thermoelectric device (TED) has potential applications in areas such as chip level cooling/ energy harvesting. It is a great challenge however, to assemble an efficient device with these SiNW. The presence of parasitic in the form of interfacial electrical resistance will have a significant impact on the performance of the TED. In this work, we explore the effect of the electrical contact resistance on the performance of a TED. Numerical simulations are performed on SiNW to investigate such effects on its cooling performance. Intrinsically, SiNW individually without the unwanted parasitic effect has excellent cooling power density. However, the cooling effect is undermined with the contribution of the electrical contact resistance.

Keywords: Thermoelectric, silicon, nanowire, electrical contact resistance, parasitics.

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78 Low Power Bus Binding Based on Dynamic Bit Reordering

Authors: Jihyung Kim, Taejin Kim, Sungho Park, Jun-Dong Cho

Abstract:

In this paper, the problem of reducing switching activity in on-chip buses at the stage of high-level synthesis is considered, and a high-level low power bus binding based on dynamic bit reordering is proposed. Whereas conventional methods use a fixed bit ordering between variables within a bus, the proposed method switches a bit ordering dynamically to obtain a switching activity reduction. As a result, the proposed method finds a binding solution with a smaller value of total switching activity (TSA). Experimental result shows that the proposed method obtains a binding solution having 12.0-34.9% smaller TSA compared with the conventional methods.

Keywords: bit reordering, bus binding, low power, switching activity matrix

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77 Fast and Efficient On-Chip Interconnection Modeling for High Speed VLSI Systems

Authors: A.R. Aswatha, T. Basavaraju, S. Sandeep Kumar

Abstract:

Timing driven physical design, synthesis, and optimization tools need efficient closed-form delay models for estimating the delay associated with each net in an integrated circuit (IC) design. The total number of nets in a modern IC design has increased dramatically and exceeded millions. Therefore efficient modeling of interconnection is needed for high speed IC-s. This paper presents closed–form expressions for RC and RLC interconnection trees in current mode signaling, which can be implemented in VLSI design tool. These analytical model expressions can be used for accurate calculation of delay after the design clock tree has been laid out and the design is fully routed. Evaluation of these analytical models is several orders of magnitude faster than simulation using SPICE.

Keywords: IC design, RC/RLC Interconnection, VLSI Systems.

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76 Test Data Compression Using a Hybrid of Bitmask Dictionary and 2n Pattern Runlength Coding Methods

Authors: C. Kalamani, K. Paramasivam

Abstract:

In VLSI, testing plays an important role. Major problem in testing are test data volume and test power. The important solution to reduce test data volume and test time is test data compression. The Proposed technique combines the bit maskdictionary and 2n pattern run length-coding method and provides a substantial improvement in the compression efficiency without introducing any additional decompression penalty. This method has been implemented using Mat lab and HDL Language to reduce test data volume and memory requirements. This method is applied on various benchmark test sets and compared the results with other existing methods. The proposed technique can achieve a compression ratio up to 86%.

Keywords: Bit Mask dictionary, 2n pattern run length code, system-on-chip, SOC, test data compression.

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75 A 5-V to 30-V Current-Mode Boost Converter with Integrated Current Sensor and Power-on Protection

Authors: Jun Yu, Yat-Hei Lam, Boris Grinberg, Kevin Chai Tshun Chuan

Abstract:

This paper presents a 5-V to 30-V current-mode boost converter for powering the drive circuit of a micro-electro-mechanical sensor. The design of a transconductance amplifier and an integrated current sensing circuit are presented. In addition, essential building blocks for power-on protection such as a soft-start and clamp block and supply and clock ready block are discussed in details. The chip is fabricated in a 0.18-μm CMOS process. Measurement results show that the soft-start and clamp block can effectively limit the inrush current during startup and protect the boost converter from startup failure.

Keywords: Boost Converter, Current Sensing, Power-on protection, Step-up Converter, Soft-start.

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74 An Area-Efficient and Low-Power Digital Pulse-Width Modulation Controller for DC-DC Switching Power Converter

Authors: Jingjing Lan, Jun Zhou, Xin Liu

Abstract:

In this paper, a low-power digital controller for DC-DC power conversion was presented. The controller generates the pulse-width modulated (PWM) signal from digital inputs provided by analog-to-digital converter (ADC). An efficient and simple design scheme to develop the control unit was discussed. This method allows minimization of the consumed resources of the chip and it is based on direct digital design approach. In this application, with the proposed scheme, nearly half area and two-third of the power consumption was saved compared to the conventional schemes. This work illustrates the possibility of implementing low-power and area-efficient power management circuit using direct digital design based approach. 

Keywords: Buck converter, DC-DC power conversion, digital control, proportional-integral (PI) controller.

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73 The Design, Development, and Optimization of a Capacitive Pressure Sensor Utilizing an Existing 9 DOF Platform

Authors: Andrew Randles, Ilker Ocak, Cheam Daw Don, Navab Singh, Alex Gu

Abstract:

Nine Degrees of Freedom (9 DOF) systems are already in development in many areas. In this paper, an integrated pressure sensor is proposed that will make use of an already existing monolithic 9 DOF inertial MEMS platform. Capacitive pressure sensors can suffer from limited sensitivity for a given size of membrane. This novel pressure sensor design increases the sensitivity by over 5 times compared to a traditional array of square diaphragms while still fitting within a 2 mm x 2 mm chip and maintaining a fixed static capacitance. The improved design uses one large diaphragm supported by pillars with fixed electrodes placed above the areas of maximum deflection. The design optimization increases the sensitivity from 0.22 fF/kPa to 1.16 fF/kPa. Temperature sensitivity was also examined through simulation.

Keywords: Capacitive pressure sensor, 9 DOF, 10 DOF, sensor, capacitive, inertial measurement unit, IMU, inertial navigation system, INS.

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72 A Molding Surface Auto-Inspection System

Authors: Ssu-Han Chen, Der-Baau Perng

Abstract:

Molding process in IC manufacturing secures chips against the harms done by hot, moisture or other external forces. While a chip was being molded,defects like cracks, dilapidation, or voids may be embedding on the molding surface. The molding surfaces the study poises to treat and the ones on the market, though, differ in the surface where texture similar to defects is everywhere. Manual inspection usually passes over low-contrast cracks or voids; hence an automatic optical inspection system for molding surface is necessary. The proposed system is consisted of a CCD, a coaxial light, a back light as well as a motion control unit. Based on the property of statistical textures of the molding surface, a series of digital image processing and classification procedure is carried out. After training of the parameter associated with above algorithm, result of the experiment suggests that the accuracy rate is up to 93.75%, contributing to the inspection quality of IC molding surface.

Keywords: Molding surface, machine vision, statistical texture, discrete Fourier transformation.

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71 Two Wheels Balancing Robot with Line Following Capability

Authors: Nor Maniha Abdul Ghani, Faradila Naim, Tan Piow Yon

Abstract:

This project focuses on the development of a line follower algorithm for a Two Wheels Balancing Robot. In this project, ATMEGA32 is chosen as the brain board controller to react towards the data received from Balance Processor Chip on the balance board to monitor the changes of the environment through two infra-red distance sensor to solve the inclination angle problem. Hence, the system will immediately restore to the set point (balance position) through the implementation of internal PID algorithms at the balance board. Application of infra-red light sensors with the PID control is vital, in order to develop a smooth line follower robot. As a result of combination between line follower program and internal self balancing algorithms, we are able to develop a dynamically stabilized balancing robot with line follower function.

Keywords: infra-red sensor, PID algorithms, line followerBalancing robot

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70 Robust Design of Electroosmosis Driven Self-Circulating Micromixer for Biological Applications

Authors: Bahram Talebjedi, Emily Earl, Mina Hoorfar

Abstract:

One of the issues that arises with microscale lab-on-a-chip technology is that the laminar flow within the microchannels limits the mixing of fluids. To combat this, micromixers have been introduced as a means to try and incorporate turbulence into the flow to better aid the mixing process. This study presents an electroosmotic micromixer that balances vortex generation and degeneration with the inlet flow velocity to greatly increase the mixing efficiency. A comprehensive parametric study was performed to evaluate the role of the relevant parameters on the mixing efficiency. It was observed that the suggested micromixer is perfectly suited for biological applications due to its low pressure drop (below 10 Pa) and low shear rate. The proposed micromixer with optimized working parameters is able to attain a mixing efficiency of 95% in a span of 0.5 seconds using a frequency of 10 Hz, a voltage of 0.7 V, and an inlet velocity of 0.366 mm/s.

Keywords: Microfluidics, active mixer, pulsed AC electroosmosis flow, micromixer.

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69 Explicit Delay and Power Estimation Method for CMOS Inverter Driving on-Chip RLC Interconnect Load

Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar

Abstract:

The resistive-inductive-capacitive behavior of long interconnects which are driven by CMOS gates are presented in this paper. The analysis is based on the ¤Ç-model of a RLC load and is developed for submicron devices. Accurate and analytical expressions for the output load voltage, the propagation delay and the short circuit power dissipation have been proposed after solving a system of differential equations which accurately describe the behavior of the circuit. The effect of coupling capacitance between input and output and the short circuit current on these performance parameters are also incorporated in the proposed model. The estimated proposed delay and short circuit power dissipation are in very good agreement with the SPICE simulation with average relative error less than 6%.

Keywords: Delay, Inverter, Short Circuit Power, ¤Ç-Model, RLCInterconnect, VLSI

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68 Efficient Hardware Implementation of an Elliptic Curve Cryptographic Processor Over GF (2 163)

Authors: Massoud Masoumi, Hosseyn Mahdizadeh

Abstract:

A new and highly efficient architecture for elliptic curve scalar point multiplication which is optimized for a binary field recommended by NIST and is well-suited for elliptic curve cryptographic (ECC) applications is presented. To achieve the maximum architectural and timing improvements we have reorganized and reordered the critical path of the Lopez-Dahab scalar point multiplication architecture such that logic structures are implemented in parallel and operations in the critical path are diverted to noncritical paths. With G=41, the proposed design is capable of performing a field multiplication over the extension field with degree 163 in 11.92 s with the maximum achievable frequency of 251 MHz on Xilinx Virtex-4 (XC4VLX200) while 22% of the chip area is occupied, where G is the digit size of the underlying digit-serial finite field multiplier.

Keywords: Elliptic curve cryptography, FPGA implementation, scalar point multiplication.

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67 Flow inside Micro-Channel Bounded by Superhydrophobic Surface with Eccentric Micro-Grooves

Authors: Yu Chen, Weiwei Ren, Xiaojing Mu, Feng Zhang, Yi Xu

Abstract:

The superhydrophobic surface is widely used to reduce friction for the flow inside micro-channel and can be used to control/manipulate fluid, cells and even proteins in lab-on-chip. Fabricating micro grooves on hydrophobic surfaces is a common method to obtain such superhydrophobic surface. This study utilized the numerical method to investigate the effect of eccentric micro-grooves on the friction of flow inside micro-channel. A detailed parametric study was conducted to reveal how the eccentricity of micro-grooves affects the micro-channel flow under different grooves sizes, channel heights, Reynolds number. The results showed that the superhydrophobic surface with eccentric micro-grooves induces less friction than the counter part with aligning micro-grooves, which means requiring less power for pumps.

Keywords: Superhydrophobic, transverse grooves, heat transfer, slip length, microfluidics.

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66 Utilization of Agro-Industrial Waste in Metal Matrix Composites: Towards Sustainability

Authors: L. Lancaster, M. H. Lung, D. Sujan

Abstract:

The application of agro-industrial waste in Aluminum Metal Matrix Composites has been getting more attention as they can reinforce particles in metal matrix which enhance the strength properties of the composites. In addition, by applying these agroindustrial wastes in useful way not only save the manufacturing cost of products but also reduce the pollutions on environment. This paper represents a literature review on a range of industrial wastes and their utilization in metal matrix composites. The paper describes the synthesis methods of agro-industrial waste filled metal matrix composite materials and their mechanical, wear, corrosion, and physical properties. It also highlights the current application and future potential of agro-industrial waste reinforced composites in aerospace, automotive and other construction industries.

Keywords: Bond layer, Interfacial shear stress, Bi-layered assembly, Thermal mismatch, Flip Chip Ball Grid Array.

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65 Jitter Transfer in High Speed Data Links

Authors: Tsunwai Gary Yip

Abstract:

Phase locked loops for data links operating at 10 Gb/s or faster are low phase noise devices designed to operate with a low jitter reference clock. Characterization of their jitter transfer function is difficult because the intrinsic noise of the device is comparable to the random noise level in the reference clock signal. A linear model is proposed to account for the intrinsic noise of a PLL. The intrinsic noise data of a PLL for 10 Gb/s links is presented. The jitter transfer function of a PLL in a test chip for 12.8 Gb/s data links was determined in experiments using the 400 MHz reference clock as the source of simultaneous excitations over a wide range of frequency. The result shows that the PLL jitter transfer function can be approximated by a second order linear model.

Keywords: Intrinsic phase noise, jitter in data link, PLL jitter transfer function, high speed clocking in electronic circuit

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64 Extended Low Power Bus Binding Combined with Data Sequence Reordering

Authors: Jihyung Kim, Taejin Kim, Sungho Park, Jun-Dong Cho

Abstract:

In this paper, we address the problem of reducing the switching activity (SA) in on-chip buses through the use of a bus binding technique in high-level synthesis. While many binding techniques to reduce the SA exist, we present yet another technique for further reducing the switching activity. Our proposed method combines bus binding and data sequence reordering to explore a wider solution space. The problem is formulated as a multiple traveling salesman problem and solved using simulated annealing technique. The experimental results revealed that a binding solution obtained with the proposed method reduces 5.6-27.2% (18.0% on average) and 2.6-12.7% (6.8% on average) of the switching activity when compared with conventional binding-only and hybrid binding-encoding methods, respectively.

Keywords: low power, bus binding, switching activity, multiple traveling salesman problem, data sequence reordering

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63 CMOS-Compatible Deposited Materials for Photonic Layers Integrated above Electronic Integrated Circuit

Authors: Shiyang Zhu, G. Q. Lo, D. L. Kwong

Abstract:

Silicon photonics has generated an increasing interest in recent years mainly for optical communications optical interconnects in microelectronic circuits or bio-sensing applications. The development of elementary passive and active components (including detectors and modulators), which are mainly fabricated on the silicon on insulator platform for CMOS-compatible fabrication, has reached such a performance level that the integration challenge of silicon photonics with microelectronic circuits should be addressed. Since crystalline silicon can only be grown from another silicon crystal, making it impossible to deposit in this state, the optical devices are typically limited to a single layer. An alternative approach is to integrate a photonic layer above the CMOS chip using back-end CMOS fabrication process. In this paper, various materials, including silicon nitride, amorphous silicon, and polycrystalline silicon, for this purpose are addressed.

Keywords: Silicon photonics, CMOS, Integration.

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62 A Novel Implementation of Application Specific Instruction-set Processor (ASIP) using Verilog

Authors: Kamaraju.M, Lal Kishore.K, Tilak.A.V.N

Abstract:

The general purpose processors that are used in embedded systems must support constraints like execution time, power consumption, code size and so on. On the other hand an Application Specific Instruction-set Processor (ASIP) has advantages in terms of power consumption, performance and flexibility. In this paper, a 16-bit Application Specific Instruction-set processor for the sensor data transfer is proposed. The designed processor architecture consists of on-chip transmitter and receiver modules along with the processing and controlling units to enable the data transmission and reception on a single die. The data transfer is accomplished with less number of instructions as compared with the general purpose processor. The ASIP core operates at a maximum clock frequency of 1.132GHz with a delay of 0.883ns and consumes 569.63mW power at an operating voltage of 1.2V. The ASIP is implemented in Verilog HDL using the Xilinx platform on Virtex4.

Keywords: ASIP, Data transfer, Instruction set, Processor

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61 Development of Electric Performance Testing System for Ceramic Chips using PZT Actuator

Authors: Jin-Ho Bae, Yong-Tae Kim, S K Deb Nath, Seo-Ik Kang, Sung-Gaun Kim

Abstract:

Reno-pin contact test is a method that is controlled by DC motor used to characterize electronic chips. This method is used in electronic and telecommunication devices. A new electric performance testing system is developed in which the testing method is controlled by using Piezoelectric Transducer (PZT) instead of DC motor which reduces vibration and noise. The vertical displacement of the Reno-pin is very short in the Reno-pin contact testing system. Now using a flexible guide in the new Reno-pin contact system, the vertical movement of the Reno-pin is increased many times of the existing Reno-pin contact testing method using DC motor. Using the present electric performance testing system with a flexible hinge and PZT instead of DC motor, manufacturing of electronic chips are able to characterize chips with low cost and high speed.

Keywords: PZT Actuator, Chip test, Mechanical amplifier

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