Search results for: Alloy semiconductor nanocrystals

Authors: Nassier A. Nassir, Robert Birch, D. Rico Sierra, S. P. Edwardson, G. Dearden, Zhongwei Guan

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The effect of laser surface treatment parameters on the residual strength of titanium alloy has been investigated. The influence of the laser surface treatment on the bonding strength between the titanium and poly-ether-ketone-ketone (PEKK) surfaces was also evaluated and compared to those offered by titanium foils without surface treatment to optimize the laser parameters. Material characterization using an optical microscope was carried out to study the microstructure and to measure the mean roughness value of the titanium surface. The results showed that the surface roughness shows a significant dependency on the laser power parameters in which surface roughness increases with the laser power increment. Moreover, the results of the tensile tests have shown that there is no significant dropping in tensile strength for the treated samples comparing to the virgin ones. In order to optimize the laser parameter as well as the corresponding surface roughness, single-lap shear tests were conducted on pairs of the laser treated titanium stripes. The results showed that the bonding shear strength between titanium alloy and PEKK film increased with the surface roughness increment to a specific limit. After this point, it is interesting to note that there was no significant effect for the laser parameter on the bonding strength. This evidence suggests that it is not necessary to use very high power of laser to treat titanium surface to achieve a good bonding strength between titanium alloy and the PEKK film.

Keywords: Bonding strength, laser surface treatment, PEKK, titanium alloy.

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Authors: N. Benachour, A. Hadjoui, M. Benachour, M. Benguediab

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This study reports an empirical investigation of fatigue crack initiation and propagation in 2024 T351 aluminium alloy using constant amplitude loading. In initiation stage, local strain approach at the notch was used and in stable propagation stage NASGRO model was applied. In this investigation, the flat plate of double through crack at hole is used. Based on experimental results (AFGROW Database), effect of stress ratio, R, is highlights on fatigue initiation life (FIL) and fatigue crack growth rate (FCGR). The increasing of dimension of hole characterizing the notch effect decrease the fatigue life.

Keywords: Fatigue crack growth, initiation life, Al-Alloy, stressratio, notch effect

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Authors: Loai Ben Naji, Osama M. Ibrahim, Khaled J. Al-Fadhalah

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The objective of this paper is to investigate the formation and adhesion of a protective aluminum-oxide (Al₂O₃, alumina) layer on the surface of Iron-Chromium-Aluminum Alloy (Fe-Cr-Al) sintered-metal-fibers. The oxide-scale layer was developed via multi-stage thermal oxidation at 930 ^oC for 1 hour, followed by 1 hour at 960 ^oC, and finally at 990 ^oC for 2 hours. Scanning Electron Microscope (SEM) images show that the multi-stage thermal oxidation resulted in the formation of predominantly Al₂O₃ platelets-like and whiskers. SEM images also reveal non-uniform oxide-scale growth on the surface of the fibers. Furthermore, peeling/spalling of the alumina protective layer occurred after minimum handling, which indicates weak adhesion forces between the protective layer and the base metal alloy.  Energy Dispersive Spectroscopy (EDS) analysis of the heat-treated Fe-Cr-Al sintered-metal-fibers confirmed the high aluminum content on the surface of the protective layer, and the low aluminum content on the exposed base metal alloy surface. In conclusion, the failure of the oxide-scale protective layer exposes the base metal alloy to further oxidation, and the fragile non-uniform oxide-scale is not suitable as a support for catalysts.

Keywords: High-temperature oxidation, alumina protective layer, iron-chromium-aluminum alloy, sintered-metal-fibers.

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Authors: Ridvan Yamanoglu, Erdinc Efendi, Ismail Daoud

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In this study, Ti-5Al-2.5Fe alloy was prepared by powder metallurgy. The elemental titanium, aluminum, and iron powders were mechanically alloyed for 10 h in a vacuum atmosphere. A stainless steel jar and stainless steel balls were used for mechanical alloying. The alloyed powders were then sintered by vacuum hot pressing at 950 °C for a soaking time of 30 minutes. Pure titanium was also sintered at the same conditions for comparison of mechanical properties and microstructural behavior. The samples were investigated by scanning electron microscopy, XRD analysis, and optical microscopy. Results showed that, after mechanical alloying, a homogeneous distribution of the elements was obtained, and desired a-b structure was determined. Ti-5Al-2.5Fe alloy was successfully produced, and the alloy showed enhanced mechanical properties compared to the commercial pure titanium.

Keywords: Ti5Al2.5Fe, mechanical alloying, hot pressing, sintering.

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Authors: Syahril Ridzuan Ab Rahim, Ibrahim Ahmad, Mohd Azizi Chik, Ahmad Zafir Md. Rejab, and U. Hashim

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This research presents the development of simulation modeling for WIP management in semiconductor fabrication. Manufacturing simulation modeling is needed for productivity optimization analysis due to the complex process flows involved more than 35 percent re-entrance processing steps more than 15 times at same equipment. Furthermore, semiconductor fabrication required to produce high product mixed with total processing steps varies from 300 to 800 steps and cycle time between 30 to 70 days. Besides the complexity, expansive wafer cost that potentially impact the company profits margin once miss due date is another motivation to explore options to experiment any analysis using simulation modeling. In this paper, the simulation model is developed using existing commercial software platform AutoSched AP, with customized integration with Manufacturing Execution Systems (MES) and Advanced Productivity Family (APF) for data collections used to configure the model parameters and data source. Model parameters such as processing steps cycle time, equipment performance, handling time, efficiency of operator are collected through this customization. Once the parameters are validated, few customizations are made to ensure the prior model is executed. The accuracy for the simulation model is validated with the actual output per day for all equipments. The comparison analysis from result of the simulation model compared to actual for achieved 95 percent accuracy for 30 days. This model later was used to perform various what if analysis to understand impacts on cycle time and overall output. By using this simulation model, complex manufacturing environment like semiconductor fabrication (fab) now have alternative source of validation for any new requirements impact analysis.

Keywords: Advanced Productivity Family (APF), Complementary Metal Oxide Semiconductor (CMOS), Manufacturing Execution Systems (MES), Work In Progress (WIP).

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Authors: Pham Ngoc Thang, Le Thai Hung, Nguyen Quang Bau

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The influence of confined acoustic phonons on the Shubnikov – de Haas magnetoresistance oscillations in a doped semiconductor superlattice (DSSL), subjected in a magnetic field, DC electric field, and a laser radiation, has been theoretically studied based on quantum kinetic equation method. The analytical expression for the magnetoresistance in a DSSL has been obtained as a function of external fields, DSSL parameters, and especially the quantum number m characterizing the effect of confined acoustic phonons. When m goes to zero, the results for bulk phonons in a DSSL could be achieved. Numerical calculations are also achieved for the GaAs:Si/GaAs:Be DSSL and compared with other studies. Results show that the Shubnikov – de Haas magnetoresistance oscillations amplitude decrease as the increasing of phonon confinement effect.

Keywords: Shubnikov–de Haas magnetoresistance oscillations, quantum kinetic equation, confined acoustic phonons, laser radiation, doped semiconductor superlattices.

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Authors: P. Vaculik

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The newest semiconductor devices on the market are MOSFET transistors based on the silicon carbide – SiC. This material has exclusive features thanks to which it becomes a better switch than Si – silicon semiconductor switch. There are some special features that need to be understood to enable the device’s use to its full potential. The advantages and differences of SiC MOSFETs in comparison with Si IGBT transistors have been described in first part of this article. Second part describes driver for SiC MOSFET transistor and last part of article represents SiC MOSFET in the application of buck converter (step-down) and design of simple RC snubber. 

Keywords: SiC, Si, MOSFET, IGBT, SBD, RC snubber.

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Authors: S. Sadegzadeh, A. Mousavi

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Temperature-dependent tunable photonic crystals have attracted widespread interest in recent years. In this research, transmission characteristics of a one-dimensional photonic crystal structure with a single defect have been studied. Here, we assume two different defect layers: InSb as a semiconducting layer and HgBa₂Ca₂Cu₃O₁₀ as a high-temperature superconducting layer. Both the defect layers have temperature-dependent refractive indexes. Two different types of dielectric materials (Si as a high-refractive index dielectric and MgF₂ as a low-refractive index dielectric) are used to construct the asymmetric structures (Si/MgF₂)^NInSb(Si/MgF₂)^N named S.I, and (Si/MgF₂)^NHgBa₂Ca₂Cu₃O₁₀(Si/MgF₂)^N named S.II. It is found that in response to the temperature changes, transmission peaks within the photonic band gap of the S.II structure, in contrast to S.I, show a small wavelength shift. Furthermore, the results show that under the same conditions, S.I structure generates an extra defect mode in the transmission spectra. Besides high efficiency transmission property of S.II structure, it can be concluded that the semiconductor-dielectric photonic crystals are more sensitive to temperature variation than superconductor types.

Keywords: Defect modes, photonic crystals, semiconductor, superconductor, transmission.

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Authors: Mohamed Yousef, Magdy Samuel, Maha El-Meligy, Taher El-Bitar

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The present work is dealing with 2% Si-steel alloy. The alloy contains 0.05% C as well as 0.85% Al. The alloy under investigation would be used for electrical transformation purposes. A heating (expansion) - cooling (contraction) dilation investigation was executed to detect the a, a+g, and g transformation temperatures at the inflection points of the dilation curve. On heating, primary a  was detected at a temperature range between room temperature and 687 ^oC. The domain of a+g was detected in the range between 687 ^oC and 746 ^oC. g phase exists in the closed g region at the range between 746 ^oC and 1043 ^oC. The domain of a phase appears again at a temperature range between 1043 and 1105 ^oC, and followed by secondary a at temperature higher than 1105 ^oC. A physical simulation of thermo-mechanical processing on the as-cast alloy was carried out. The simulation process took into consideration the hot flat rolling pilot plant parameters. The process was executed on the thermo-mechanical simulator (Gleeble 3500). The process was designed to include seven consecutive passes. The 1^st pass represents the roughing stage, while the remaining six passes represent finish rolling stage. The whole process was executed at the temperature range from 1100 ^oC to 900 ^oC. The amount of strain starts with 23.5% at the roughing pass and decreases continuously to reach 7.5 % at the last finishing pass. The flow curve of the alloy can be abstracted from the stress-strain curves representing simulated passes. It shows alloy hardening from a pass to the other up to pass no. 6, as a result of decreasing the deformation temperature and increasing of cumulative strain. After pass no. 6, the deformation process enhances the dynamic recrystallization phenomena to appear, where the z-parameter would be high.

Keywords: Si-steel, hot deformability, critical transformation temperature, physical simulation, thermo-mechanical processing, flow curve, dynamic softening.

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Authors: Samiul Kaiser, M. S. Kaiser

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The influence of Mg and Zr addition on mechanical properties such as hardness, tensile strength and impact energy of commercially pure Al are investigated. The microstructure and fracture behavior are also studied by using Optical and Scanning Electron Microscopy. It is observed that magnesium addition improves the mechanical properties of commercially pure Al at the expense of ductility due to formation of β″ (Al₃Mg) and β′ (Al₃Mg₂) phase into the alloy. Zr addition also plays a positive role through grain refinement effect and the formation of metastable L1₂ Al₃Zr precipitates. In addition, it is observed that the fractured surface of Mg added alloy is brittle and higher numbers of dimples are observed in case of Zr added alloy.

Keywords: Al-alloys, hardness, tensile strength, impact energy, microstructure.

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Authors: M. Benachour, M. Benguediab, A. Hadjoui, N. Benachour

Abstract:

In this paper fatigue crack growth behavior of aeronautical aluminum alloy 2024 T351 was studied. Effects of various loading and geometrical parameters are studied such as stress ratio, amplitude loading, etc. The fatigue crack growth with constant amplitude is studied using the AFGROW code when NASGRO model is used. The effect of the stress ratio is highlighted, where one notices a shift of the curves of crack growth. The comparative study between two orientations L-T and T-L on fatigue behavior are presented and shows the variation on the fatigue life. L-T orientation presents a good fatigue crack growth resistance. Effects of crack closure are shown in Paris domain and that no crack closure phenomenons are present at high stress intensity factor.

Keywords: Fatigue crack, orientation effect, crack closure, aluminum alloy.

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Authors: Mogeeb A. Ahmed, Mona F. Taher, Sayed M. Metwalli

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Shape memory alloy (SMA) actuators have found a wide range of applications due to their unique properties such as high force, small size, lightweight and silent operation. This paper presents the development of compact (SMA) actuator and cooling system in one unit. This actuator is developed for multi-fingered hand. It consists of nickel-titanium (Nitinol) SMA wires in compact forming. The new arrangement insulates SMA wires from the human body by housing it in a heat sink and uses a thermoelectric device for rejecting heat to improve the actuator performance. The study uses optimization methods for selecting the SMA wires geometrical parameters and the material of a heat sink. The experimental work implements the actuator prototype and measures its response.

Keywords: Optimization, Prosthetic hand, Shape memory alloy, Thermoelectric device, Actuator system

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Authors: Suchi Barua, Narottam Das, Sven Nordholm, Mohammad Razaghi

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This paper presents nonlinear pulse propagation characteristics for different input optical pulse shapes with various input pulse energy levels in semiconductor optical amplifiers. For simulation of nonlinear pulse propagation, finite-difference beam propagation method is used to solve the nonlinear Schrödinger equation. In this equation, gain spectrum dynamics, gain saturation are taken into account which depends on carrier depletion, carrier heating, spectral-hole burning, group velocity dispersion, self-phase modulation and two photon absorption. From this analysis, we obtained the output waveforms and spectra for different input pulse shapes as well as for different input energies. It shows clearly that the peak position of the output waveforms are shifted toward the leading edge which due to the gain saturation of the SOA for higher input pulse energies. We also analyzed and compared the normalized difference of full-width at half maximum for different input pulse shapes in the SOA.

Keywords: Finite-difference beam propagation method, pulse shape, pulse propagation, semiconductor optical amplifier.

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Authors: Nripjit, Anand K Tyagi, Nirmal Singh

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The present work consecutively on synthesis and characterization of composites, Al/Al alloy A 384.1 as matrix in which the main ingredient as Al/Al-5% MgO alloy based metal matrix composite. As practical implications the low cost processing route for the fabrication of Al alloy A 384.1 and operational difficulties of presently available manufacturing processes based in liquid manipulation methods. As all new developments, complete understanding of the influence of processing variables upon the final quality of the product. And the composite is applied comprehensively to the acquaintance for achieving superiority of information concerning the specific heat measurement of a material through the aid of thermographs. Products are evaluated concerning relative particle size and mechanical behavior under tensile strength. Furthermore, Taguchi technique was employed to examine the experimental optimum results are achieved, owing to effectiveness of this approach.

Keywords: MMC, Thermographs, Tensile strength, Taguchi technique, Optimal parameters

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Authors: Ahmed A.D. Sarhan, Lim Siew Fen, Mum Wai Yip, M. Sayuti

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Ti6Al4V alloy is highly used in the automotive and aerospace industry due to its good machining characteristics. Micro EDM drilling is commonly used to drill micro hole on extremely hard material with very high depth to diameter ratio. In this study, the parameters of micro-electrical discharge machining (EDM) in drilling of Ti6Al4V alloy is optimized for higher machining accuracy with less hole-dilation and hole taper ratio. The micro-EDM machining parameters includes, peak current and pulse on time. Fuzzy analysis was developed to evaluate the machining accuracy. The analysis shows that hole-dilation and hole-taper ratio are increased with the increasing of peak current and pulse on time. However, the surface quality deteriorates as the peak current and pulse on time increase. The combination that gives the optimum result for hole dilation is medium peak current and short pulse on time. Meanwhile, the optimum result for hole taper ratio is low peak current and short pulse on time.

Keywords: Micro EDM, Ti-6Al-4V alloy, fuzzy logic based analysis, optimization, machining accuracy.

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Authors: A. Nassef, S. Samy, W. H. El Garaihy

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Equal channel angular pressing (ECAP) of commercial Al-Mg-Si alloy was conducted using two strain rates. The ECAP processing was conducted at room temperature and at 250°C. Route A was adopted up to a total number of four passes in the present work. Structural evolution of the aluminum alloy discs was investigated before and after ECAP processing using optical microscopy (OM). Following ECAP, simple compression tests and Vicker’s hardness were performed. OM micrographs showed that, the average grain size of the as-received Al-Mg-Si disc tends to be larger than the size of the ECAP processed discs. Moreover, significant difference in the grain morphologies of the as-received and processed discs was observed. Intensity of deformation was observed via the alignment of the Al-Mg-Si consolidated particles (grains) in the direction of shear, which increased with increasing the number of passes via ECAP. Increasing the number of passes up to 4 resulted in increasing the grains aspect ratio up to ~5. It was found that the pressing temperature has a significant influence on the microstructure, Hv-values, and compressive strength of the processed discs. Hardness measurements demonstrated that 1-pass resulted in increase of Hv-value by 42% compared to that of the as-received alloy. 4-passes of ECAP processing resulted in additional increase in the Hv-value. A similar trend was observed for the yield and compressive strength. Experimental data of the Hv-values demonstrated that there is a lack of any significant dependence on the processing strain rate.

Keywords: Al-Mg-Si alloy, Equal channel angular pressing, Grain refinement, Severe plastic deformation.

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Authors: Dil Nawaz Khan, M. H. Sayyad, Muhammad Yaseen, Munawar Ali Munawar, Mukhtar Ali

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Effect of temperature and light was investigated on a thin film of organic semiconductor formyl-TIPPCu(II) deposited on a glass substrate with preliminary evaporated gold electrodes. The electrical capacitance and resistance of the fabricated device were evaluated under the effect of temperature and light. The relative capacitance of the fabricated sensor increased by 4.3 times by rising temperature from 27 to 1870C, while under illumination up to 25000 lx, the capacitance of the Au/formyl-TIPPCu(II)/Au photo capacitive sensor increased continuously by 13.2 times as compared to dark conditions.

Keywords: formyl-TIPPCu(II), Organic semiconductor, Photocapacitance, Polarizability.

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Authors: Muhammad Naveed, Richard Stechow, Sebastian Bolz, Katharina Hobusch, Sabine Weiß

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Solid particle erosion has been identified as a critical wear phenomenon which takes place during operation of aeroengines in dusty environment. The present work discusses the erosion behavior of Ti-44.5Al-6.25Nb-0.8Mo-0.1B alloy (TNB-V4) which finds its application in low pressure gas turbines and can be used for high pressure compressors too. Prior to the erosion tests, the alloy was heat treated to improve the mechanical properties. Afterwards, specimens were eroded at impact angles of 30° and 90° at room and high temperatures (100 °C-400 °C). Volume loss and erosion behavior are studied through gravimetric analysis, whereas erosion mechanisms are characterized through scanning electron microscopy. The results indicate a clear difference in the erosion mechanism for different impact angles. The influence of the test temperature on the erosion behavior of the alloy is also discussed in the present contribution.

Keywords: Solid particle erosion, gamma TiAl, TNB-V4, high temperature erosion.

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Authors: Satyanarayana, K.N. Prabhu

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Microstructure, wetting behavior and interfacial reactions between Sn–0.7Cu and Sn–0.3Ag–0.7Cu (SAC0307) solders solidified on Ni coated Al substrates were compared and investigated. Microstructure of Sn–0.7Cu alloy exhibited a eutectic matrix composed of primary β-Sn dendrites with a fine dispersion of Cu6Sn5 intermetallics whereas microstructure of SAC0307 alloy exhibited coarser Cu6Sn5 and finer Ag3Sn precipitates of IMCs with decreased tin dendrites. Contact angles ranging from 22° to 26° were obtained for Sn–0.7Cu solder solidified on substrate surface whereas for SAC0307 solder alloy contact angles were found to be in the range of 20° to 22°. Sn–0.7Cu solder/substrate interfacial region exhibited faceted (Cu, Ni)6Sn5 IMCs protruding into the solder matrix and a small amount of (Cu, Ni)3Sn4 intermetallics at the interface. SAC0307 solder/substrate interfacial region showed mainly (Cu, Ni)3Sn4 intermetallics adjacent to the coating layer and (Cu, Ni)6Sn5 IMCs in the solder matrix. The improvement in the wettability of SAC0307 solder alloy on substrate surface is attributed to the formation of cylindrical shape (Cu,Ni)6Sn5 and a layer of (Cu, Ni)3Sn4 IMCs at the interface.

Keywords: Lead-free solder, wetting, contact angle, intermetallics.

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Authors: Youngji Yoo, Cheong-Sool Park, Jun Seok Kim, Young-Hak Lee, Sung-Shick Kim, Jun-Geol Baek

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In the semiconductor manufacturing process, large amounts of data are collected from various sensors of multiple facilities. The collected data from sensors have several different characteristics due to variables such as types of products, former processes and recipes. In general, Statistical Quality Control (SQC) methods assume the normality of the data to detect out-of-control states of processes. Although the collected data have different characteristics, using the data as inputs of SQC will increase variations of data, require wide control limits, and decrease performance to detect outof- control. Therefore, it is necessary to separate similar data groups from mixed data for more accurate process control. In the paper, we propose a regression tree using split algorithm based on Pearson distribution to handle non-normal distribution in parametric method. The regression tree finds similar properties of data from different variables. The experiments using real semiconductor manufacturing process data show improved performance in fault detecting ability.

Keywords: Semiconductor, non-normal mixed process data, clustering, Statistical Quality Control (SQC), regression tree, Pearson distribution system.

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Authors: Aynur Aker, Hasan Kaya

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In recent years, the use of the aluminum based alloys in the industry and technology are increasing. Alloying elements in aluminum have further been improving the strength and stiffness properties that provide superior compared to other metals. In this study, investigation of physical properties (microstructure, microhardness, tensile strength, electrical conductivity and thermal properties) in the Al-12.6wt.%Si-%2wt.Ni ternary alloy were investigated. Al-Si-Ni alloy was prepared in vacuum atmosphere. The samples were directionally solidified upwards with different growth rate V (8.3−165.45 μm/s) at constant temperature gradient G (7.73 K/mm). The flake spacings (λ), microhardness (HV), ultimate tensile strength (σ), electrical resistivity (ρ) and thermal properties (H, Cp, Tm) of the samples were measured. Influence of the growth rate and spacings on microhardness, ultimate tensile strength and electrical resistivity were investigated and relationships between them were obtained. According to results, λ values decrease with increasing V, but HV, σ and ρ values increase with increasing V. Variations of electrical resistivity (ρ) of solidified samples were also measured. The enthalpy of fusion (H) and specific heat (Cp) for the alloy was also determined by differential scanning calorimeter (DSC) from heating trace during the transformation from liquid to solid. The results in this work were compared with the previous similar experimental results.

Keywords: Electrical resistivity, enthalpy, microhardness, solidification, tensile stress.

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Authors: N. K. Paul, S. Saha

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An innovative three dimensional finite element model has beed developed and tested under two point loading system to examine the structural behavior of the longitudinal reinforced concrete Tee-beam bridge girder, reinforcing with steel and shape memory alloy bars respectively. 25% of steel bars are replaced with superelastic Shape Memory Alloy bars in this study. Finite element analysis is performed using ANSYS 11.0 program. Experimentally a model of steel reinforced girder has been casted and its load deflection responses are checked with ANSYS analysis. A comparison of load carrying capacity for the model between steel RC girder and the girder combined reinforcement with SMA and steel are also performed.

Keywords: Shape memory alloy, bridge girder, ANSYS, load-deflection.

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Authors: A. Hossain, A. S. W. Kurny, M. A. Gafur

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Effect of 2wt% Cu addition on tensile properties and fracture behavior of Al-6Si-0.5Mg-2Ni alloy at various strain rates were studied. The solution treated Al-6Si-0.5Mg-2Ni (-2Cu) alloys, were aged isochronally for 1 hour at temperatures up to 300oC. The uniaxial tension test was carried out at strain rate ranging from 10-4s-1 to 10-2s-1 in order to investigate the strain rate dependence of tensile properties. Tensile strengths were found to increase with ageing temperature and the maximum being attained ageing for 1 hr at 225oC (peak aged condition). Addition of 2wt% Cu resulted in an increase in tensile properties at all strain rates. Evaluation of tensile properties at three different strain rates (10-4, 10-3 and 10-2 s-1) showed that strain rates affected the tensile properties significantly. At higher strain rates the strength was better but ductility was poor. Microstructures of broken specimens showed that both the void coalescence and the interface debonding affect the fracture behavior of the alloys

Keywords: Al-Si-Mg-Ni-Cu alloy, tensile properties, strain rate, SEM.

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Authors: A. Chandrashekar, H. N. Reddappa, B. S. Ajaykumar

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A Friction stir welding tool is a critical component to the success of the process. The tool typically consists of a rotating round shoulder and a threaded cylindrical pin that heats the work piece, mostly by friction, and moves the softened alloy around it to form the joint. In this research work, an attempt has been made to investigate the relationship between FSW variables mainly tool profile, rotating speed, welding speed and the mechanical properties (tensile strength, yield strength, percentage elongation, and micro hardness) of friction stir welded aluminum alloy 5083 joints. From the experimental details, it can be assessed that the joint produced by using Triflute profile tool has contribute superior mechanical and structural properties as compared to Tapered unthreaded & Threaded tool for 1000rpm.

Keywords: Friction stir welding, Tool profile, Rotating speed, Strength, Speed ratio.

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Authors: Q. Zafar, R. Akram, Kh.S. Karimov, T.A. Khan, M. Farooq, M.M. Tahir

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In this study we present the effect of elevated temperatures from 300K to 400K on the electrical properties of copper Phthalocyanine (CuPc) based organic field effect transistors (OFET). Thin films of organic semiconductor CuPc (40nm) and semitransparent Al (20nm) were deposited in sequence, by vacuum evaporation on a glass substrate with previously deposited Ag source and drain electrodes with a gap of 40 μm. Under resistive mode of operation, where gate was suspended it was observed that drain current of this organic field effect transistor (OFET) show an increase with temperature. While in grounded gate condition metal (aluminum) – semiconductor (Copper Phthalocyanine) Schottky junction dominated the output characteristics and device showed switching effect from low to high conduction states like Zener diode at higher bias voltages. This threshold voltage for switching effect has been found to be inversely proportional to temperature and shows an abrupt decrease after knee temperature of 360K. Change in dynamic resistance (Rd = dV/dI) with respect to temperature was observed to be -1%/K.

Keywords: Copper Phthalocyanine, Metal-Semiconductor Schottky Junction, Organic Field Effect Transistor, Switching effect, Temperature Sensor

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Authors: Josef Sepitka, Petr Vlcak, Tomas Horazdovsky, Vratislav Perina

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An ion implantation technique was used for designing the surface area of a titanium alloy and for irradiation-enhanced hardening of the surface. The Ti6Al4V alloy was treated by nitrogen ion implantation at fluences of 2·10¹⁷ and 4·10¹⁷ cm^-2 and at ion energy 90 keV. The depth distribution of the nitrogen was investigated by Rutherford Backscattering Spectroscopy. The gradient of mechanical properties was investigated by nanoindentation. The continuous measurement mode was used to obtain depth profiles of the indentation hardness and the reduced storage modulus of the modified surface area. The reduced storage modulus and the hardness increase with increasing fluence. Increased fluence shifts the peak of the mechanical properties as well as the peak of nitrogen concentration towards to the surface. This effect suggests a direct relationship between mechanical properties and nitrogen distribution.

Keywords: Nitrogen ion implantation, titanium-based nanolayer, storage modulus, hardness, microstructure.

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Authors: F. Brunke, L. Waalkes, C. Siemers

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Due to reduced stiffness, research on second generation titanium alloys for implant applications, like the metastable β-titanium alloy Ti-15Mo, become more and more important in the recent years. The machinability of these alloys is generally poor leading to problems during implant production and comparably large production costs. Therefore, in the present study, Ti-15Mo was alloyed with 0.8 wt.-% of the rare earth metals lanthanum (Ti-15Mo+0.8La) and neodymium (Ti-15Mo+0.8Nd) to improve its machinability. Their microstructure consisted of a titanium matrix and micrometer-size particles of the rare earth metals and two of their oxides. The particles stabilized the microstructure as grain growth was minimized. As especially the ductility might be affected by the precipitates, the behavior of Ti-15Mo+0.8La and Ti- 15Mo+0.8Nd was investigated during static and dynamic deformation at elevated temperature to develop a processing route. The resulting mechanical properties (static strength and ductility) were similar in all investigated alloys.

Keywords: Ti-15Mo, Titanium alloys, Rare earth metals, Free-machining alloy.

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Authors: P. Acosta-Santamaría, A. Ibatá-Soto, A. López-Vásquez

Abstract:

Organic compounds in wastewaters coming from textile and pharmaceutical industry generated multiple harmful effects on the environment and the human health. One of them is the methyl orange (MeO), an azoic dye considered to be a recalcitrant compound. The heterogeneous photocatalysis emerges as an alternative for treating this type of hazardous compounds, through the generation of OH radicals using radiation and a semiconductor oxide. According to the author’s knowledge, catalysts such as TiO₂ doped with metals show high efficiency in degrading MeO; however, this presents economic limitations on industrial scale. Black sand can be considered as a naturally doped catalyst because in its structure is common to find compounds such as titanium, iron and aluminum oxides, also elements such as zircon, cadmium, manganese, etc. This study reports the photocatalytic activity of the mineral black sand used as semiconductor in the discoloration of MeO by oxidation and reduction photocatalytic techniques. For this, magnetic composites from the mineral were prepared (RM, M1, M2 and NM) and their activity were tested through MeO discoloration while TiO₂ was used as reference. For the fractions, chemical, morphological and structural characterizations were performed using Scanning Electron Microscopy with Energy Dispersive X-Ray (SEM-EDX), X-Ray Diffraction (XRD) and X-Ray Fluorescence (XRF) analysis. M2 fraction showed higher MeO discoloration (93%) in oxidation conditions at pH 2 and it could be due to the presence of ferric oxides. However, the best result to reduction process was using M1 fraction (20%) at pH 2, which contains a higher titanium percentage. In the first process, hydrogen peroxide (H₂O₂) was used as electron donor agent. According to the results, black sand mineral can be used as natural semiconductor in photocatalytic process. It could be considered as a photocatalyst precursor in such processes, due to its low cost and easy access.

Keywords: Black sand mineral, methyl orange, oxidation, photocatalysis, reduction.

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Authors: S. O. Adeosun, O. I. Sekunowo, O. P. Gbenebor, W. A. Ayoola, A. O. Odunade, T. A. Idowu

Abstract:

Sand cast samples of the as-received 66/34Mg-Al alloy were first homogenized at 4900C and then divided into three groups on which annealing, normalising and artificial ageing were respectively carried out. Thermal ageing of the samples involved treatment at 5000C, soaked for 4 hours and quenched in water at ambient temperature followed by tempering at 2000C for 2 hours. Test specimens were subjected to microstructure and mechanical analyses and the results compared. Precipitation of significant volume of stable Mg17Al12 crystals in the aged specimen’s matrix conferred superior mechanical characteristics compared with the annealed, normalized and as-cast specimens. The ultimate tensile strength was 93.4MPa with micro-hardness of 64.9HRC and impact energy (toughness) of 4.05J. In particular, its Young modulus was 10.4GPa which compared well with that of cortical (trabecule) bone’s modulus that varies from 12-17GPa.

Keywords: Mg-Al alloy, artificial ageing, medical implant, cortical bone, mechanical properties.

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Authors: Seok Hong Min, Tae Kwon Ha

Abstract:

High strength Fe-36Ni-base Invar alloys containing Al contents up to 0.3 weight percent were cast into ingots and thermodynamic equilibrium during solidification has been investigated in this study. From the thermodynamic simulation using Thermo-Calc®, it has been revealed that equilibrium phases which can be formed are two kinds of MC-type precipitates, MoC, and M₂C carbides. The mu phase was also expected to form by addition of aluminum. Microstructure observation revealed the coarse precipitates in the as-cast ingots, which was non-equilibrium phase and could be resolved by the successive heat treatment. With increasing Al contents up to 0.3 wt.%, tensile strength of Invar alloy increased as 1400MPa after cold rolling and thermal expansion coefficient increased significantly. Cold rolling appeared to dramatically decrease thermal expansion coefficient.

Keywords: Invar alloy, Aluminum, Phase equilibrium, thermal expansion coefficient, microstructure, tensile properties.

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