Microstructure, Mechanical, Electrical and Thermal Properties of the Al-Si-Ni Ternary Alloy

Authors: Aynur Aker, Hasan Kaya

Abstract:

In recent years, the use of the aluminum based alloys in the industry and technology are increasing. Alloying elements in aluminum have further been improving the strength and stiffness properties that provide superior compared to other metals. In this study, investigation of physical properties (microstructure, microhardness, tensile strength, electrical conductivity and thermal properties) in the Al-12.6wt.%Si-%2wt.Ni ternary alloy were investigated. Al-Si-Ni alloy was prepared in vacuum atmosphere. The samples were directionally solidified upwards with different growth rate V (8.3−165.45 μm/s) at constant temperature gradient G (7.73 K/mm). The flake spacings (λ), microhardness (HV), ultimate tensile strength (σ), electrical resistivity (ρ) and thermal properties (H, Cp, Tm) of the samples were measured. Influence of the growth rate and spacings on microhardness, ultimate tensile strength and electrical resistivity were investigated and relationships between them were obtained. According to results, λ values decrease with increasing V, but HV, σ and ρ values increase with increasing V. Variations of electrical resistivity (ρ) of solidified samples were also measured. The enthalpy of fusion (H) and specific heat (Cp) for the alloy was also determined by differential scanning calorimeter (DSC) from heating trace during the transformation from liquid to solid. The results in this work were compared with the previous similar experimental results.

Keywords: Electrical resistivity, enthalpy, microhardness, solidification, tensile stress.

Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1108675

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