Satyanarayana and  K.N. Prabhu,  Study of Reactive Wetting of Sn–0.7Cu and Sn–0.3Ag–0.7Cu Lead Free Solders during Solidification on Nickel Coated Al Substrates.   journal   = {International Journal of Materials and Metallurgical Engineering}, [online]. World Academy of Science, Engineering and Technology.
    January 2013, vol. 73(1). 25 - 28
    [viewed 26 April 2024]. Available from: https://publications.waset.org/pdf/9580.