Search results for: System on Chip (SoC).

Authors: Panagiotis Kyratsis, Dr. Ing. Nikolaos Bilalis, Dr. Ing. Aristomenis Antoniadis

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Twist drills are geometrical complex tools and thus various researchers have adopted different mathematical and experimental approaches for their simulation. The present paper acknowledges the increasing use of modern CAD systems and using the API (Application Programming Interface) of a CAD system, drilling simulations are carried out. The developed DRILL3D software routine, creates parametrically controlled tool geometries and using different cutting conditions, achieves the generation of solid models for all the relevant data involved (drilling tool, cut workpiece, undeformed chip). The final data derived, consist a platform for further direct simulations regarding the determination of cutting forces, tool wear, drilling optimizations etc.

Keywords: Drilling, CAD based simulation, 3D-modelling.

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Authors: Alexandru Epureanu, Virgil Teodor

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One of the main research directions in CAD/CAM machining area is the reducing of machining time. The feedrate scheduling is one of the advanced techniques that allows keeping constant the uncut chip area and as sequel to keep constant the main cutting force. They are two main ways for feedrate optimization. The first consists in the cutting force monitoring, which presumes to use complex equipment for the force measurement and after this, to set the feedrate regarding the cutting force variation. The second way is to optimize the feedrate by keeping constant the material removal rate regarding the cutting conditions. In this paper there is proposed a new approach using an extended database that replaces the system model. The feedrate scheduling is determined based on the identification of the reconfigurable machine tool, and the feed value determination regarding the uncut chip section area, the contact length between tool and blank and also regarding the geometrical roughness. The first stage consists in the blank and tool monitoring for the determination of actual profiles. The next stage is the determination of programmed tool path that allows obtaining the piece target profile. The graphic representation environment models the tool and blank regions and, after this, the tool model is positioned regarding the blank model according to the programmed tool path. For each of these positions the geometrical roughness value, the uncut chip area and the contact length between tool and blank are calculated. Each of these parameters are compared with the admissible values and according to the result the feed value is established. We can consider that this approach has the following advantages: in case of complex cutting processes the prediction of cutting force is possible; there is considered the real cutting profile which has deviations from the theoretical profile; the blank-tool contact length limitation is possible; it is possible to correct the programmed tool path so that the target profile can be obtained. Applying this method, there are obtained data sets which allow the feedrate scheduling so that the uncut chip area is constant and, as a result, the cutting force is constant, which allows to use more efficiently the machine tool and to obtain the reduction of machining time.

Keywords: Reconfigurable machine tool, system identification, uncut chip area, cutting conditions scheduling.

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Authors: Mohammad Ali Jabraeil Jamali, Ahmad Khademzadeh

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The success of an electronic system in a System-on- Chip is highly dependent on the efficiency of its interconnection network, which is constructed from routers and channels (the routers move data across the channels between nodes). Since neither classical bus based nor point to point architectures can provide scalable solutions and satisfy the tight power and performance requirements of future applications, the Network-on-Chip (NoC) approach has recently been proposed as a promising solution. Indeed, in contrast to the traditional solutions, the NoC approach can provide large bandwidth with moderate area overhead. The selected topology of the components interconnects plays prime rule in the performance of NoC architecture as well as routing and switching techniques that can be used. In this paper, we present two generic NoC architectures that can be customized to the specific communication needs of an application in order to reduce the area with minimal degradation of the latency of the system. An experimental study is performed to compare these structures with basic NoC topologies represented by 2D mesh, Butterfly-Fat Tree (BFT) and SPIN. It is shown that Cluster mesh (CMesh) and MinRoot schemes achieves significant improvements in network latency and energy consumption with only negligible area overhead and complexity over existing architectures. In fact, in the case of basic NoC topologies, CMesh and MinRoot schemes provides substantial savings in area as well, because they requires fewer routers. The simulation results show that CMesh and MinRoot networks outperforms MESH, BFT and SPIN in main performance metrics.

Keywords: MinRoot, CMesh, NoC, Topology, Performance Evaluation

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Authors: T. Brettschneider, C. Dorrer, H. Suy, T. Braun, E. Jung, R. Hoofman, M. Bründel, R. Zengerle, F. Lärmer

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We present an integration approach of a CMOS biosensor into a polymer based microfluidic environment suitable for mass production. It consists of a wafer-level-package for the silicon die and laser bonding process promoted by an intermediate hot melt foil to attach the sensor package to the microfluidic chip, without the need for dispensing of glues or underfiller. A very good condition of the sensing area was obtained after introducing a protection layer during packaging. A microfluidic flow cell was fabricated and shown to withstand pressures up to Δp = 780 kPa without leakage. The employed biosensors were electrically characterized in a dry environment.

Keywords: CMOS biosensor, laser bonding, silicon polymer integration, wafer level packaging.

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Authors: F. Majeed, D. V. Thiel, M. Shahpari

Abstract:

An electrically small meander line antenna is designed for impedance matching with RF transceiver chip CC1101. The design provides the flexibility of tuning the reactance of the antenna over a wide range of values: highly capacitive to highly inductive. The antenna was printed with silver ink on FR4 substrate using the screen printing design process. The antenna impedance was perfectly matched to CC1101 at 433 MHz. The measured radiation efficiency of the antenna was 81.3% at resonance. The 3 dB and 10 dB fractional bandwidth of the antenna was 14.5% and 4.78%, respectively. The read range of the antenna was compared with a copper wire monopole antenna over a distance of five meters. The antenna, with a perfect impedance match with RF transceiver chip CC1101, shows improvement in the read range compared to a monopole antenna over the specified distance.

Keywords: Meander line antenna, RFID, Silver ink printing, Impedance matching.

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Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar

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Fast delay estimation methods, as opposed to simulation techniques, are needed for incremental performance driven layout synthesis. On-chip inductive effects are becoming predominant in deep submicron interconnects due to increasing clock speed and circuit complexity. Inductance causes noise in signal waveforms, which can adversely affect the performance of the circuit and signal integrity. Several approaches have been put forward which consider the inductance for on-chip interconnect modelling. But for even much higher frequency, of the order of few GHz, the shunt dielectric lossy component has become comparable to that of other electrical parameters for high speed VLSI design. In order to cope up with this effect, on-chip interconnect has to be modelled as distributed RLCG line. Elmore delay based methods, although efficient, cannot accurately estimate the delay for RLCG interconnect line. In this paper, an accurate analytical delay model has been derived, based on first and second moments of RLCG interconnection lines. The proposed model considers both the effect of inductance and conductance matrices. We have performed the simulation in 0.18μm technology node and an error of as low as less as 5% has been achieved with the proposed model when compared to SPICE. The importance of the conductance matrices in interconnect modelling has also been discussed and it is shown that if G is neglected for interconnect line modelling, then it will result an delay error of as high as 6% when compared to SPICE.

Keywords: Delay Modelling; On-Chip Interconnect; RLCGInterconnect; Ramp Input; Damping; VLSI

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Authors: M. Bagheri, P. Mottaghizadeh

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Reliable information about tool temperature distribution is of central importance in metal cutting. In this study, tool-chip interface temperature was determined in cutting of ST37 steel workpiece by applying HSS as the cutting tool in dry turning. Two different approaches were implemented for temperature measuring: an embedded thermocouple (RTD) in to the cutting tool and infrared (IR) camera. Comparisons are made between experimental data and results of MSC.SuperForm and FLUENT software. An investigation of heat generation in cutting tool was performed by varying cutting parameters at the stable cutting tool geometry and results were saved in a computer; then the diagrams of tool temperature vs. various cutting parameters were obtained. The experimental results reveal that the main factors of the increasing cutting temperature are cutting speed (V ), feed rate ( S ) and depth of cut ( h ), respectively. It was also determined that simultaneously change in cutting speed and feed rate has the maximum effect on increasing cutting temperature.

Keywords: Cutting parameters, Finite element modeling, Temperature measurement, Tool-chip interface temperature.

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Authors: Ching-Feng Chen, Ching-Chih Tsai

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With the size of the transistor gradually approaching the physical limit, it challenges the persistence of Moore’s Law due to such issues of the short channel effect and the development of the high numerical aperture (NA) lithography equipment. In the context of the ever-increasing technical requirements of portable devices and high-performance computing (HPC), relying on the law continuation to enhance the chip density will no longer support the prospects of the electronics industry. Weighing the chip’s power consumption-performance-area-cost-cycle time to market (PPACC) is an updated benchmark to drive the evolution of the advanced wafer nanometer (nm). The advent of two and half- and three-dimensional (2.5 and 3D)- Very-Large-Scale Integration (VLSI) packaging based on Through Silicon Via (TSV) technology has updated the traditional die assembly methods and provided the solution. This overview investigates the up-to-date and cutting-edge packaging technologies for 2.5D and 3D integrated circuits (IC) based on the updated transistor structure and technology nodes. We conclude that multi-chip solutions for 2.5D and 3D IC packaging can prolong Moore’s Law.

Keywords: Moore’s Law, High Numerical Aperture, Power Consumption-Performance-Area-Cost-Cycle Time to Market, PPACC, 2.5 and 3D-Very-Large-Scale Integration Packaging, Through Silicon Vi.

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Authors: M. S. Kaiser, S. Reaz Ahmed

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Chip formation characteristics are investigated during surface finishing of high density polyethylene (HDPE) samples using a shaper machine. Both the cutting speed and depth of cut are varied continually to enable observations under various machining conditions. The generated chips are analyzed in terms of their shape, size, and deformation. Their physical appearances are also observed using digital camera and optical microscope. The investigation shows that continuous chips are obtained for all the cutting conditions. It is observed that cutting speed is more influential than depth of cut to cause dimensional changes of chips. Chips curl radius is also found to increase gradually with the increase of cutting speed. The length of continuous chips remains always smaller than the job length, and the corresponding discrepancies are found to be more prominent at lower cutting speed. Microstructures of the chips reveal that cracks are formed at higher cutting speeds and depth of cuts, which is not that significant at low depth of cut.

Keywords: HDPE, surface-finishing, chip formation, deformation, roughness.

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Authors: Moorthi S., Meganathan D., Janarthanan D., Praveen Kumar P., J. Raja paul perinbam

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An efficient architecture for low jitter All Digital Phase Locked Loop (ADPLL) suitable for high speed SoC applications is presented in this paper. The ADPLL is designed using standard cells and described by Hardware Description Language (HDL). The ADPLL implemented in a 90 nm CMOS process can operate from 10 to 200 MHz and achieve worst case frequency acquisition in 14 reference clock cycles. The simulation result shows that PLL has cycle to cycle jitter of 164 ps and period jitter of 100 ps at 100MHz. Since the digitally controlled oscillator (DCO) can achieve both high resolution and wide frequency range, it can meet the demands of system-level integration. The proposed ADPLL can easily be ported to different processes in a short time. Thus, it can reduce the design time and design complexity of the ADPLL, making it very suitable for System-on-Chip (SoC) applications.

Keywords: All Digital Phase Locked Loop (ADPLL), Systemon-Chip (SoC), Phase Locked Loop (PLL), Very High speedIntegrated Circuit (VHSIC) Hardware Description Language(VHDL), Digitally Controlled Oscillator (DCO), Phase frequencydetector (PFD) and Voltage Controlled Oscillator (VCO).

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Authors: Abdelkrim Zitouni, Mounir Zid, Sami Badrouchi, Rached Tourki

Abstract:

The Globally Asynchronous Locally Synchronous Network on Chip (GALS NoC) is the most efficient solution that provides low latency transfers and power efficient System on Chip (SoC) interconnect. This study presents a GALS and generic NoC architecture based on a configurable router. This router integrates a sophisticated dynamic arbiter, the wormhole routing technique and can be configured in a manner that allows it to be used in many possible NoC topologies such as Mesh 2-D, Tree and Polygon architectures. This makes it possible to improve the quality of service (QoS) required by the proposed NoC. A comparative performances study of the proposed NoC architecture, Tore architecture and of the most used Mesh 2D architecture is performed. This study shows that Spidergon architecture is characterised by the lower latency and the later saturation. It is also shown that no matter what the number of used links is raised; the Links×Diameter product permitted by the Spidergon architecture remains always the lower. The only limitation of this architecture comes from it-s over cost in term of silicon area.

Keywords: Dynamic arbiter, Generic router, Spidergon NoC, SoC.

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Authors: Faizal A. Samman, Thomas Hollstein, Manfred Glesner

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This paper presents design trade-off and performance impacts of the amount of pipeline phase of control path signals in a wormhole-switched network-on-chip (NoC). The numbers of the pipeline phase of the control path vary between two- and one-cycle pipeline phase. The control paths consist of the routing request paths for output selection and the arbitration paths for input selection. Data communications between on-chip routers are implemented synchronously and for quality of service, the inter-router data transports are controlled by using a link-level congestion control to avoid lose of data because of an overflow. The trade-off between the area (logic cell area) and the performance (bandwidth gain) of two proposed NoC router microarchitectures are presented in this paper. The performance evaluation is made by using a traffic scenario with different number of workloads under 2D mesh NoC topology using a static routing algorithm. By using a 130-nm CMOS standard-cell technology, our NoC routers can be clocked at 1 GHz, resulting in a high speed network link and high router bandwidth capacity of about 320 Gbit/s. Based on our experiments, the amount of control path pipeline stages gives more significant impact on the NoC performance than the impact on the logic area of the NoC router.

Keywords: Network-on-Chip, Synchronous Parallel Pipeline, Router Architecture, Wormhole Switching

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Authors: J. S. Kim

Abstract:

This paper presents a 0.13-µm Complementary Metal-Oxide Semiconductor (CMOS) vector modulator for beamforming system. The vector modulator features a 360° phase and gain range of -10 dB to 10 dB with a root mean square phase and amplitude error of only 2.2° and 0.45 dB, respectively. These features make it a suitable for wireless backhaul system in the 5 GHz industrial, scientific, and medical (ISM) bands. It draws a current of 20.4 mA from a 1.2 V supply. The total chip size is 1.87x1.34 mm².

Keywords: CMOS, vector modulator, beamforming, wireless backhaul, ISM.

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Authors: Md. Anayet U. Patwari, Mohammad Ahsan Habib, Md. Tanzib Ehsan, Md Golam Ahnaf, Md. S. I. Chowdhury

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Surface roughness is one of the key quality parameters of the finished product. During any machining operation, high temperatures are generated at the tool-chip interface impairing surface quality and dimensional accuracy of products. Cutting fluids are generally applied during machining to reduce temperature at the tool-chip interface. However, usages of cutting fluids give rise to problems such as waste disposal, pollution, high cost, and human health hazard. Researchers, now-a-days, are opting towards dry machining and other cooling techniques to minimize use of coolants during machining while keeping surface roughness of products within desirable limits. In this paper, a concept of using peltier cooling effects during aluminium milling operation has been presented and adopted with an aim to improve surface roughness of the machined surface. Experimental evidence shows that peltier cooling effect provides better surface roughness of the machined surface compared to dry machining.

Keywords: Aluminium, surface roughness, Peltier cooling effect, milling operation.

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Authors: Zainudin Kornain, Azman Jalar, Rozaidi Rasid, Fong Chee Seng

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Void formation in underfill is considered as failure in flip chip manufacturing process. Void formation possibly caused by several factors such as poor soldering and flux residue during die attach process, void entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the comparison of single step and two steps curing profile towards the void and black dots formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). Statistic analysis was conducted to analyze how different factors such as wafer lot, sawing technique, underfill fillet height and curing profile recipe were affected the formation of voids and black dots. A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids and black dots. It was shown that the 2 steps curing profile provided solution for void elimination and black dots in underfill after curing process.

Keywords: black dots formation, curing profile, FC-CBGA, underfill, void formation,

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Authors: M. K. Benhaoua, A. K. Singh, A. E. H. Benyamina, A. Kumar, P. Boulet

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In this paper, we propose a new packing strategy to find a free resource for run-time mapping of application tasks to NoC-based Heterogeneous MPSoC. The proposed strategy minimizes the task mapping time in addition to placing the communicating tasks close to each other. To evaluate our approach, a comparative study is carried out for a platform containing single task supported PEs. Experiments show that our strategy provides better results when compared to latest dynamic mapping strategies reported in the literature.

Keywords: Multi-Processor Systems-on-Chip (MPSoCs), Network-on-Chip (NoC), Heterogeneous architectures, Dynamic mapping heuristics.

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Authors: Y. Ni, K. Sebri

Abstract:

The practical implementation of audio-video coupled speech recognition systems is mainly limited by the hardware complexity to integrate two radically different information capturing devices with good temporal synchronisation. In this paper, we propose a solution based on a smart CMOS image sensor in order to simplify the hardware integration difficulties. By using on-chip image processing, this smart sensor can calculate in real time the X/Y projections of the captured image. This on-chip projection reduces considerably the volume of the output data. This data-volume reduction permits a transmission of the condensed visual information via the same audio channel by using a stereophonic input available on most of the standard computation devices such as PC, PDA and mobile phones. A prototype called VMIKE (Visio-Microphone) has been designed and realised by using standard 0.35um CMOS technology. A preliminary experiment gives encouraged results. Its efficiency will be further investigated in a large variety of applications such as biometrics, speech recognition in noisy environments, and vocal control for military or disabled persons, etc.

Keywords: Audio-Visual Speech recognition, CMOS Smartsensor, On-Chip image processing.

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Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar

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This work proposes an accurate crosstalk noise estimation method in the presence of multiple RLC lines for the use in design automation tools. This method correctly models the loading effects of non switching aggressors and aggressor tree branches using resistive shielding effect and realistic exponential input waveforms. Noise peak and width expressions have been derived. The results obtained are at good agreement with SPICE results. Results show that average error for noise peak is 4.7% and for the width is 6.15% while allowing a very fast analysis.

Keywords: Crosstalk, distributed RLC segments, On-Chip interconnect, output response, VLSI, noise peak, noise width.

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Authors: Shiyang Zhu, G. Q. Lo, D. L. Kwong

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Silicon photonics is merging as a unified platform for driving photonic based telecommunications and for local photonic based interconnect but it suffers from large footprint as compared with the nanoelectronics. Plasmonics is an attractive alternative for nanophotonics. In this work, two CMOS compatible plasmonic waveguide platforms are compared. One is the horizontal metal-insulator-Si-insulator-metal nanoplasmonic waveguide and the other is metal-insulator-Si hybrid plasmonic waveguide. Various passive and active photonic devices have been experimentally demonstrated based on these two plasmonic waveguide platforms.

Keywords: Plasmonics, on-chip integration, Silicon photonics.

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Authors: Yuanyuan Zhang, Guang Sun, Li Su, Depeng Jin, Lieguang Zeng

Abstract:

Since Network-on-Chip (NoC) uses network interfaces (NIs) to improve the design productivity, by now, there have been a few papers addressing the design and implementation of a NI module. However, none of them considered the difference of address encoding methods between NoC and the traditional bus-shared architecture. On the basis of this difference, in the paper, we introduce a transmit mechanism to solve such a problem for global asynchronous locally synchronous (GALS) NoC. Furthermore, we give the concrete implementation of the NI module in this transmit mechanism. Finally, we evaluate its performance and area overhead by a VHDL-based cycle-accurate RTL model and simulation results confirm the validity of this address-oriented transmit mechanism.

Keywords: Network-on-Chip, Network Interface, Open CoreProtocol, Address.

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Authors: Jin-Ho Bae, Yong-Tae Kim, S K Deb Nath, Seo-Ik Kang, Sung-Gaun Kim

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Reno-pin contact test is a method that is controlled by DC motor used to characterize electronic chips. This method is used in electronic and telecommunication devices. A new electric performance testing system is developed in which the testing method is controlled by using Piezoelectric Transducer (PZT) instead of DC motor which reduces vibration and noise. The vertical displacement of the Reno-pin is very short in the Reno-pin contact testing system. Now using a flexible guide in the new Reno-pin contact system, the vertical movement of the Reno-pin is increased many times of the existing Reno-pin contact testing method using DC motor. Using the present electric performance testing system with a flexible hinge and PZT instead of DC motor, manufacturing of electronic chips are able to characterize chips with low cost and high speed.

Keywords: PZT Actuator, Chip test, Mechanical amplifier

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Authors: Nawang Chhunid, Gagnesh Kumar

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On-chip memories consume a significant portion of the overall die space and power in modern microprocessors. On-chip caches depend on Static Random-Access Memory (SRAM) cells and scaling of technology occurring as per Moore’s law. Unfortunately, the scaling is affecting stability, performance, and leakage power which will become major problems for future SRAMs in aggressive nanoscale technologies due to increasing device mismatch and variations. 3T1D Dynamic Random-Access Memory (DRAM) cell is a non-destructive read DRAM cell with three transistors and a gated diode. In 3T1D DRAM cell gated diode (D1) acts as a storage device and also as an amplifier, which leads to fast read access. Due to its high tolerance to process variation, high density, and low cost of memory as compared to 6T SRAM cell, it is universally used by the advanced microprocessor for on chip data and program memory. In the present paper, it has been shown that 3T1D DRAM cell can perform better in terms of fast read access as compared to 6T, 4T, 3T SRAM cells, respectively.

Keywords: DRAM cell, read access time, tanner EDA tool write access time and retention time, average power dissipation.

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Authors: Sorore Benabid

Abstract:

The Q-enhanced LC filters are the most used architecture in the Bandpass (BP) Continuous-Time (CT) Delta-Sigma (ΣΔ) modulators, due to their: high frequencies operation, high linearity than the active filters and a high quality factor obtained by Q-enhanced technique. This technique consists of the use of a negative resistance that compensate the ohmic losses in the on-chip inductor. However, this technique introduces a zero in the filter transfer function which will affect the modulator performances in term of Dynamic Range (DR), stability and in-band noise (Signal-to-Noise Ratio (SNR)). In this paper, we study the effect of this zero and we demonstrate that a calibration of the excess loop delay (ELD) is required to ensure the best performances of the modulator. System level simulations are done for a 2ndorder BP CT (ΣΔ) modulator at a center frequency of 300MHz. Simulation results indicate that the optimal ELD should be reduced by 13% to achieve the maximum SNR and DR compared to the ideal LC-based ΣΔ modulator.

Keywords: Continuous-time bandpass delta-sigma modulators, excess loop delay, on-chip inductor, Q-enhanced LC filter.

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Authors: Mohammad Ali Jabraeil Jamali, Ahmad Khademzadeh, Hasan Asil, Amir Asil

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This method decrease usage power (expenditure) in networks on chips (NOC). This method data coding for data transferring in order to reduces expenditure. This method uses data compression reduces the size. Expenditure calculation in NOC occurs inside of NOC based on grown models and transitive activities in entry ports. The goal of simulating is to weigh expenditure for encoding, decoding and compressing in Baseline networks and reduction of switches in this type of networks. KeywordsNetworks on chip, Compression, Encoding, Baseline networks, Banyan networks.

Keywords: Networks on chip, Compression, Encoding, Baseline networks, Banyan networks

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Authors: Haridas Kuruveettil, Dongning Zhao, Cheong Jia Hao, Minkyu Je

Abstract:

We present the design of Analog front end (AFE) low noise pre-amplifier implemented in a high voltage 0.18-µm CMOS technology for  a three dimensional ultrasound  bio microscope (3D UBM) application. The fabricated chip has 4X16 pre-amplifiers implemented to interface   a 2-D array of    high frequency capacitive micro-machined ultrasound transducers (CMUT). Core AFE cell consists of a high-voltage pulser in the transmit path, and a low-noise transimpedance amplifier in the receive path. Proposed system offers a high image resolution by the use of high frequency CMUTs with associated high performance imaging electronics integrated together.  Performance requirements and the design methods of the high bandwidth transimpedance amplifier are described in the paper. A single cell of transimpedance (TIA) amplifier and the bias circuit occupies a silicon area of 250X380 µm² and the full chip occupies a total silicon area of 10x6.8 mm².

Keywords: Ultrasound, analog front end, medical imaging, beam forming, biomicroscope, transimpedance gain.

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Authors: J. S. Kim, N. P. Hong

Abstract:

In this paper, a CMOS vector modulator designed for wireless backhaul system based on 802.11ac is presented. A poly phase filter and sign select switches yield two orthogonal signal paths. Two variable gain amplifiers with strongly reduced phase shift of only ±5 ° are used to weight these paths. It has a phase control range of 360 ° and a gain range of -10 dB to 10 dB. The current drawn from a 1.2 V supply amounts 20.4 mA. Using a 0.13 mm technology, the chip die area amounts 1.47x0.75 mm².

Keywords: CMOS, vector modulator, backhaul, 802.11ac.

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Authors: Faizal A. Samman, Thomas Hollstein, Manfred Glesner

Abstract:

A synchronous network-on-chip using wormhole packet switching and supporting guaranteed-completion best-effort with low-priority (LP) and high-priority (HP) wormhole packet delivery service is presented in this paper. Both our proposed LP and HP message services deliver a good quality of service in term of lossless packet completion and in-order message data delivery. However, the LP message service does not guarantee minimal completion bound. The HP packets will absolutely use 100% bandwidth of their reserved links if the HP packets are injected from the source node with maximum injection. Hence, the service are suitable for small size messages (less than hundred bytes). Otherwise the other HP and LP messages, which require also the links, will experience relatively high latency depending on the size of the HP message. The LP packets are routed using a minimal adaptive routing, while the HP packets are routed using a non-minimal adaptive routing algorithm. Therefore, an additional 3-bit field, identifying the packet type, is introduced in their packet headers to classify and to determine the type of service committed to the packet. Our NoC prototypes have been also synthesized using a 180-nm CMOS standard-cell technology to evaluate the cost of implementing the combination of both services.

Keywords: Network-on-Chip, Parallel Pipeline Router Architecture, Wormhole Switching, Two-Level Priority Service.

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Authors: Lv Xiaopeng, Bian Qiang, Yue Suge

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A fully on-chip low drop-out (LDO) voltage regulator with 100pF output load capacitor is presented. A novel frequency compensation scheme using current buffer is adopted to realize single dominant pole within the unit gain frequency of the regulation loop, the phase margin (PM) is at least 50 degree under the full range of the load current, and the power supply rejection (PSR) character is improved compared with conventional Miller compensation. Besides, the differentiator provides a high speed path during the load current transient. Implemented in 0.18μm CMOS technology, the LDO voltage regulator provides 100mA load current with a stable 1.8V output voltage consuming 80μA quiescent current.

Keywords: capacitor-less LDO, frequency compensation, transient response, power supply rejection

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Authors: Cheng-Hsuan Huang, Eric Lee

Abstract:

Electrophoretic motion of a liquid droplet within an uncharged cylindrical pore is investigated theoretically in this study. It is found that the boundary effect in terms of the reduction of droplet mobility (droplet velocity per unit strength of the applied electric field) is very significant when the double layer surrounding the droplet is thick, and diminishes as it gets very thin. Moreover, the viscosity ratio of the ambient fluid to the internal one, σ, is a crucial factor in determining its electrophoretic behavior. The boundary effect is less significant as the viscosity ratio gets high. Up to 70% mobility reduction is observed when this ratio is low (σ = 0.01), whereas only 40% reduction when it is high (σ = 100). The results of this study can be utilized in various fields of biotechnology, such as a biosensor or a lab-on-a-chip device.

Keywords: Cylindrical pore, Electrophoresis, Lab-on-a-chip, Liquid droplet

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Authors: Yahia Salah, Med Lassaad Kaddachi, Rached Tourki

Abstract:

This paper presents the design, implementation and evaluation of a micro-network, or Network-on-Chip (NoC), based on a generic pipeline router architecture. The router is designed to efficiently support traffic generated by multimedia applications on embedded multi-core systems. It employs a simplest routing mechanism and implements the round-robin scheduling strategy to resolve output port contentions and minimize latency. A virtual channel flow control is applied to avoid the head-of-line blocking problem and enhance performance in the NoC. The hardware design of the router architecture has been implemented at the register transfer level; its functionality is evaluated in the case of the two dimensional Mesh/Torus topology, and performance results are derived from ModelSim simulator and Xilinx ISE 9.2i synthesis tool. An example of a multi-core image processing system utilizing the NoC structure has been implemented and validated to demonstrate the capability of the proposed micro-network architecture. To reduce complexity of the image compression and decompression architecture, the system use image processing algorithm based on classical discrete cosine transform with an efficient zonal processing approach. The experimental results have confirmed that both the proposed image compression scheme and NoC architecture can achieve a reasonable image quality with lower processing time.

Keywords: Generic Pipeline Network-on-Chip Router Architecture, JPEG Image Compression, FPGA Hardware Implementation, Performance Evaluation.

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