TY - JFULL AU - Zainudin Kornain and Azman Jalar and Rozaidi Rasid and Fong Chee Seng PY - 2009/12/ TI - Effect of Curing Profile to Eliminate the Voids / Black Dots Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging T2 - International Journal of Electronics and Communication Engineering SP - 2161 EP - 2167 VL - 3 SN - 1307-6892 UR - https://publications.waset.org/pdf/5181 PU - World Academy of Science, Engineering and Technology NX - Open Science Index 35, 2009 N2 - Void formation in underfill is considered as failure in flip chip manufacturing process. Void formation possibly caused by several factors such as poor soldering and flux residue during die attach process, void entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the comparison of single step and two steps curing profile towards the void and black dots formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). Statistic analysis was conducted to analyze how different factors such as wafer lot, sawing technique, underfill fillet height and curing profile recipe were affected the formation of voids and black dots. A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids and black dots. It was shown that the 2 steps curing profile provided solution for void elimination and black dots in underfill after curing process. ER -