Search results for: Delay Modelling; On-Chip Interconnect; RLCGInterconnect; Ramp Input; Damping; VLSI
2667 Closed form Delay Model for on-Chip VLSIRLCG Interconnects for Ramp Input for Different Damping Conditions
Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar
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Fast delay estimation methods, as opposed to simulation techniques, are needed for incremental performance driven layout synthesis. On-chip inductive effects are becoming predominant in deep submicron interconnects due to increasing clock speed and circuit complexity. Inductance causes noise in signal waveforms, which can adversely affect the performance of the circuit and signal integrity. Several approaches have been put forward which consider the inductance for on-chip interconnect modelling. But for even much higher frequency, of the order of few GHz, the shunt dielectric lossy component has become comparable to that of other electrical parameters for high speed VLSI design. In order to cope up with this effect, on-chip interconnect has to be modelled as distributed RLCG line. Elmore delay based methods, although efficient, cannot accurately estimate the delay for RLCG interconnect line. In this paper, an accurate analytical delay model has been derived, based on first and second moments of RLCG interconnection lines. The proposed model considers both the effect of inductance and conductance matrices. We have performed the simulation in 0.18μm technology node and an error of as low as less as 5% has been achieved with the proposed model when compared to SPICE. The importance of the conductance matrices in interconnect modelling has also been discussed and it is shown that if G is neglected for interconnect line modelling, then it will result an delay error of as high as 6% when compared to SPICE.Keywords: Delay Modelling; On-Chip Interconnect; RLCGInterconnect; Ramp Input; Damping; VLSI
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 19912666 A Superior Delay Estimation Model for VLSI Interconnect in Current Mode Signaling
Authors: Sunil Jadav, Rajeevan Chandel Munish Vashishath
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Today’s VLSI networks demands for high speed. And in this work the compact form mathematical model for current mode signalling in VLSI interconnects is presented.RLC interconnect line is modelled using characteristic impedance of transmission line and inductive effect. The on-chip inductance effect is dominant at lower technology node is emulated into an equivalent resistance. First order transfer function is designed using finite difference equation, Laplace transform and by applying the boundary conditions at the source and load termination. It has been observed that the dominant pole determines system response and delay in the proposed model. The novel proposed current mode model shows superior performance as compared to voltage mode signalling. Analysis shows that current mode signalling in VLSI interconnects provides 2.8 times better delay performance than voltage mode. Secondly the damping factor of a lumped RLC circuit is shown to be a useful figure of merit.
Keywords: Current Mode, Voltage Mode, VLSI Interconnect.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 24102665 Skin Effect: A Natural Phenomenon for Minimization of Ground Bounce in VLSI RC Interconnect
Authors: Shilpi Lavania
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As the frequency of operation has attained a range of GHz and signal rise time continues to increase interconnect technology is suffering due to various high frequency effects as well as ground bounce problem. In some recent studies a high frequency effect i.e. skin effect has been modeled and its drawbacks have been discussed. This paper strives to make an impression on the advantage side of modeling skin effect for interconnect line. The proposed method has considered a CMOS with RC interconnect. Delay and noise considering ground bounce problem and with skin effect are discussed. The simulation results reveal an advantage of considering skin effect for minimization of ground bounce problem during the working of the model. Noise and delay variations with temperature are also presented.
Keywords: Interconnect, Skin effect, Ground Bounce, Delay, Noise.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 30832664 Interconnect Analysis of a Novel Multiplexer Based Full-Adder Cell for Power and Propagation Delay Optimizations
Authors: G.Ramana Murthy, C.Senthilpari, P.Velrajkumar, Lim Tien Sze
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The proposed multiplexer-based novel 1-bit full adder cell is schematized by using DSCH2 and its layout is generated by using microwind VLSI CAD tool. The adder cell layout interconnect analysis is performed by using BSIM4 layout analyzer. The adder circuit is compared with other six existing adder circuits for parametric analysis. The proposed adder cell gives better performance than the other existing six adder circuits in terms of power, propagation delay and PDP. The proposed adder circuit is further analyzed for interconnect analysis, which gives better performance than other adder circuits in terms of layout thickness, width and height.Keywords: Full Adder, Interconnect Analysis, Low-Power, Multiplexer, Propagation Delay, Parametric Analysis.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 15082663 Accurate Crosstalk Analysis for RLC On-Chip VLSI Interconnect
Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar
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This work proposes an accurate crosstalk noise estimation method in the presence of multiple RLC lines for the use in design automation tools. This method correctly models the loading effects of non switching aggressors and aggressor tree branches using resistive shielding effect and realistic exponential input waveforms. Noise peak and width expressions have been derived. The results obtained are at good agreement with SPICE results. Results show that average error for noise peak is 4.7% and for the width is 6.15% while allowing a very fast analysis.
Keywords: Crosstalk, distributed RLC segments, On-Chip interconnect, output response, VLSI, noise peak, noise width.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 15992662 Explicit Delay and Power Estimation Method for CMOS Inverter Driving on-Chip RLC Interconnect Load
Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar
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The resistive-inductive-capacitive behavior of long interconnects which are driven by CMOS gates are presented in this paper. The analysis is based on the ¤Ç-model of a RLC load and is developed for submicron devices. Accurate and analytical expressions for the output load voltage, the propagation delay and the short circuit power dissipation have been proposed after solving a system of differential equations which accurately describe the behavior of the circuit. The effect of coupling capacitance between input and output and the short circuit current on these performance parameters are also incorporated in the proposed model. The estimated proposed delay and short circuit power dissipation are in very good agreement with the SPICE simulation with average relative error less than 6%.Keywords: Delay, Inverter, Short Circuit Power, ¤Ç-Model, RLCInterconnect, VLSI
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 16482661 Analysis of CNT Bundle and its Comparison with Copper for FPGAs Interconnects
Authors: Kureshi Abdul Kadir, Mohd. Hasan
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Each new semiconductor technology node brings smaller transistors and wires. Although this makes transistors faster, wires get slower. In nano-scale regime, the standard copper (Cu) interconnect will become a major hurdle for FPGA interconnect due to their high resistivity and electromigration. This paper presents the comprehensive evaluation of mixed CNT bundle interconnects and investigates their prospects as energy efficient and high speed interconnect for future FPGA routing architecture. All HSPICE simulations are carried out at operating frequency of 1GHz and it is found that mixed CNT bundle implemented in FPGAs as interconnect can potentially provide a substantial delay and energy reduction over traditional interconnects at 32nm process technology.Keywords: CMOS, Copper Interconnect, Mixed CNT Bundle Interconnect, FPGAs.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 16012660 Fast and Efficient On-Chip Interconnection Modeling for High Speed VLSI Systems
Authors: A.R. Aswatha, T. Basavaraju, S. Sandeep Kumar
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Timing driven physical design, synthesis, and optimization tools need efficient closed-form delay models for estimating the delay associated with each net in an integrated circuit (IC) design. The total number of nets in a modern IC design has increased dramatically and exceeded millions. Therefore efficient modeling of interconnection is needed for high speed IC-s. This paper presents closed–form expressions for RC and RLC interconnection trees in current mode signaling, which can be implemented in VLSI design tool. These analytical model expressions can be used for accurate calculation of delay after the design clock tree has been laid out and the design is fully routed. Evaluation of these analytical models is several orders of magnitude faster than simulation using SPICE.Keywords: IC design, RC/RLC Interconnection, VLSI Systems.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 14532659 Self-tuned LMS Algorithm for Sinusoidal Time Delay Tracking
Authors: Jonah Gamba
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In this paper the problem of estimating the time delay between two spatially separated noisy sinusoidal signals by system identification modeling is addressed. The system is assumed to be perturbed by both input and output additive white Gaussian noise. The presence of input noise introduces bias in the time delay estimates. Normally the solution requires a priori knowledge of the input-output noise variance ratio. We utilize the cascade of a self-tuned filter with the time delay estimator, thus making the delay estimates robust to input noise. Simulation results are presented to confirm the superiority of the proposed approach at low input signal-to-noise ratios.Keywords: LMS algorithm, Self-tuned filter, Systemidentification, Time delay estimation, .
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 15382658 Assessing and Improving Ramp-Up Capability
Authors: Sebastian Tschöpe, Konja Knüppel, Peter Nyhuis
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In times when product life cycles are decreasing, while market demands are increasing, manufacturing enterprises are confronted with the challenge of more frequent and more complex ramp-ups. Thus it becomes obvious that ramp-up management is going to be a topic enterprises have to focus on in the future. Since each ramp-up is unique concerning the product, the process, the technology, the circumstances and the coaction of these four factors, the knowledge of the ramp-up situation and the current ramp-up capability of the enterprise are fundamental requirements for the subsequent improvement of the ramp-up capability of the production system.
In this article a methodology is going to be presented which can be used to define typical production ramp-up situations, to identify the current ramp-up capability of a production system and to improve it with respect to a specific situation. Additionally there will be a description of the functionality of a software-tool developed based on this methodology.
Keywords: Assessment methodology, ramp-up, ramp-up capability, software-tool.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 19592657 An Active Rectifier with Time-Domain Delay Compensation to Enhance the Power Conversion Efficiency
Authors: Shao-Ku Kao
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This paper presents an active rectifier with time-domain delay compensation to enhance the efficiency. A delay calibration circuit is designed to convert delay time to voltage and adaptive control on/off delay in variable input voltage. This circuit is designed in 0.18 mm CMOS process. The input voltage range is from 2 V to 3.6 V with the output voltage from 1.8 V to 3.4 V. The efficiency can maintain more than 85% when the load from 50 Ω ~ 1500 Ω for 3.6 V input voltage. The maximum efficiency is 92.4 % at output power to be 38.6 mW for 3.6 V input voltage.Keywords: Wireless power transfer, active diode, delay compensation, time to voltage converter, PCE.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 7142656 The Harada Method – A Method for Employee Development during Production Ramp Up
Authors: M. Goerke, J. Gehrmann
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Caused by shorter product life cycles and higher product variety the importance of production ramp ups is increasing. Even though companies are aware of that fact, up to 40% of the ramp up projects still miss technical and economical requirements. The success of a ramp up depends on the planning of human factors, organizational aspects and technological solutions. Since only partly considered in scientific literature, this paper lays its focus on the human factor during production ramp up. There are only incoherent methods which address the problems in this area. A systematic and holistic method to improve the capabilities of the employees during ramp up is missing. The Harada Method is a relatively young approach for developing highly-skilled workers. It consists of different worksheets which help employees to set guidelines and reach overall objectives. This approach is going to be transferred into a tool for ramp up management.
Keywords: Employee Development, Harada, Production Ramp Up.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 22222655 Efficient Power-Delay Product Modulo 2n+1 Adder Design
Authors: Yavar Safaei Mehrabani, Mehdi Hosseinzadeh
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As embedded and portable systems were emerged power consumption of circuits had been major challenge. On the other hand latency as determines frequency of circuits is also vital task. Therefore, trade off between both of them will be desirable. Modulo 2n+1 adders are important part of the residue number system (RNS) based arithmetic units with the interesting moduli set (2n-1,2n, 2n+1). In this manuscript we have introduced novel binary representation to the design of modulo 2n+1 adder. VLSI realization of proposed architecture under 180 nm full static CMOS technology reveals its superiority in terms of area, power consumption and power-delay product (PDP) against several peer existing structures.
Keywords: Computer arithmetic, modulo 2n+1 adders, Residue Number System (RNS), VLSI.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 17542654 3D Network-on-Chip with on-Chip DRAM: An Empirical Analysis for Future Chip Multiprocessor
Authors: Thomas Canhao Xu, Bo Yang, Alexander Wei Yin, Pasi Liljeberg, Hannu Tenhunen
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With the increasing number of on-chip components and the critical requirement for processing power, Chip Multiprocessor (CMP) has gained wide acceptance in both academia and industry during the last decade. However, the conventional bus-based onchip communication schemes suffer from very high communication delay and low scalability in large scale systems. Network-on-Chip (NoC) has been proposed to solve the bottleneck of parallel onchip communications by applying different network topologies which separate the communication phase from the computation phase. Observing that the memory bandwidth of the communication between on-chip components and off-chip memory has become a critical problem even in NoC based systems, in this paper, we propose a novel 3D NoC with on-chip Dynamic Random Access Memory (DRAM) in which different layers are dedicated to different functionalities such as processors, cache or memory. Results show that, by using our proposed architecture, average link utilization has reduced by 10.25% for SPLASH-2 workloads. Our proposed design costs 1.12% less execution cycles than the traditional design on average.
Keywords: 3D integration, network-on-chip, memory-on-chip, DRAM, chip multiprocessor.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 23892653 A Survey of Various Algorithms for Vlsi Physical Design
Authors: Rajine Swetha R, B. Shekar Babu, Sumithra Devi K.A
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Electronic Systems are the core of everyday lives. They form an integral part in financial networks, mass transit, telephone systems, power plants and personal computers. Electronic systems are increasingly based on complex VLSI (Very Large Scale Integration) integrated circuits. Initial electronic design automation is concerned with the design and production of VLSI systems. The next important step in creating a VLSI circuit is Physical Design. The input to the physical design is a logical representation of the system under design. The output of this step is the layout of a physical package that optimally or near optimally realizes the logical representation. Physical design problems are combinatorial in nature and of large problem sizes. Darwin observed that, as variations are introduced into a population with each new generation, the less-fit individuals tend to extinct in the competition of basic necessities. This survival of fittest principle leads to evolution in species. The objective of the Genetic Algorithms (GA) is to find an optimal solution to a problem .Since GA-s are heuristic procedures that can function as optimizers, they are not guaranteed to find the optimum, but are able to find acceptable solutions for a wide range of problems. This survey paper aims at a study on Efficient Algorithms for VLSI Physical design and observes the common traits of the superior contributions.Keywords: Genetic Algorithms, Physical Design, VLSI.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 16912652 Fast Complex Valued Time Delay Neural Networks
Authors: Hazem M. El-Bakry, Qiangfu Zhao
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Here, a new idea to speed up the operation of complex valued time delay neural networks is presented. The whole data are collected together in a long vector and then tested as a one input pattern. The proposed fast complex valued time delay neural networks uses cross correlation in the frequency domain between the tested data and the input weights of neural networks. It is proved mathematically that the number of computation steps required for the presented fast complex valued time delay neural networks is less than that needed by classical time delay neural networks. Simulation results using MATLAB confirm the theoretical computations.Keywords: Fast Complex Valued Time Delay Neural Networks, Cross Correlation, Frequency Domain
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 17792651 Finite Element Modelling of Ground Vibrations Due to Tunnelling Activities
Authors: Muhammad E. Rahman, Trevor Orr
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This paper presents the use of three-dimensional finite elements coupled with infinite elements to investigate the ground vibrations at the surface in terms of the peak particle velocity (PPV) due to construction of the first bore of the Dublin Port Tunnel. This situation is analysed using a commercially available general-purpose finite element package ABAQUS. A series of parametric studies is carried out to examine the sensitivity of the predicted vibrations to variations in the various input parameters required by finite element method, including the stiffness and the damping of ground. The results of this study show that stiffness has a more significant effect on the PPV rather than the damping of the ground.Keywords: Finite Elements, PPV, Tunnelling, Vibration
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 31982650 Oscillation Theorems for Second-order Nonlinear Neutral Dynamic Equations with Variable Delays and Damping
Authors: Da-Xue Chen, Guang-Hui Liu
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In this paper, we study the oscillation of a class of second-order nonlinear neutral damped variable delay dynamic equations on time scales. By using a generalized Riccati transformation technique, we obtain some sufficient conditions for the oscillation of the equations. The results of this paper improve and extend some known results. We also illustrate our main results with some examples.
Keywords: Oscillation theorem, second-order nonlinear neutral dynamic equation, variable delay, damping, Riccati transformation.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 13212649 Unified Power Flow Controller Placement to Improve Damping of Power Oscillations
Authors: M. Salehi, A. A. Motie Birjandi, F. Namdari
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Weak damping of low frequency oscillations is a frequent phenomenon in electrical power systems. These frequencies can be damped by power system stabilizers. Unified power flow controller (UPFC), as one of the most important FACTS devices, can be applied to increase the damping of power system oscillations and the more effect of this controller on increasing the damping of oscillations depends on its proper placement in power systems. In this paper, a technique based on controllability is proposed to select proper location of UPFC and the best input control signal in order to enhance damping of power oscillations. The effectiveness of the proposed technique is demonstrated in IEEE 9 bus power system.
Keywords: Unified power flow controller (UPFC), controllability, small signal analysis, eigenvalues.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 18552648 An Agent-Based Modelling Simulation Approach to Calculate Processing Delay of GEO Satellite Payload
Authors: V. Vicente E. Mujica, Gustavo Gonzalez
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The global coverage of broadband multimedia and internet-based services in terrestrial-satellite networks demand particular interests for satellite providers in order to enhance services with low latencies and high signal quality to diverse users. In particular, the delay of on-board processing is an inherent source of latency in a satellite communication that sometimes is discarded for the end-to-end delay of the satellite link. The frame work for this paper includes modelling of an on-orbit satellite payload using an agent model that can reproduce the properties of processing delays. In essence, a comparison of different spatial interpolation methods is carried out to evaluate physical data obtained by an GEO satellite in order to define a discretization function for determining that delay. Furthermore, the performance of the proposed agent and the development of a delay discretization function are together validated by simulating an hybrid satellite and terrestrial network. Simulation results show high accuracy according to the characteristics of initial data points of processing delay for Ku bands.Keywords: Terrestrial-satellite networks, latency, on-orbit satellite payload, simulation.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 8422647 VLSI Design of 2-D Discrete Wavelet Transform for Area-Efficient and High-Speed Image Computing
Authors: Mountassar Maamoun, Mehdi Neggazi, Abdelhamid Meraghni, Daoud Berkani
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This paper presents a VLSI design approach of a highspeed and real-time 2-D Discrete Wavelet Transform computing. The proposed architecture, based on new and fast convolution approach, reduces the hardware complexity in addition to reduce the critical path to the multiplier delay. Furthermore, an advanced twodimensional (2-D) discrete wavelet transform (DWT) implementation, with an efficient memory area, is designed to produce one output in every clock cycle. As a result, a very highspeed is attained. The system is verified, using JPEG2000 coefficients filters, on Xilinx Virtex-II Field Programmable Gate Array (FPGA) device without accessing any external memory. The resulting computing rate is up to 270 M samples/s and the (9,7) 2-D wavelet filter uses only 18 kb of memory (16 kb of first-in-first-out memory) with 256×256 image size. In this way, the developed design requests reduced memory and provide very high-speed processing as well as high PSNR quality.Keywords: Discrete Wavelet Transform (DWT), Fast Convolution, FPGA, VLSI.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 19202646 Dual-Link Hierarchical Cluster-Based Interconnect Architecture for 3D Network on Chip
Authors: Guang Sun, Yong Li, Yuanyuan Zhang, Shijun Lin, Li Su, Depeng Jin, Lieguang zeng
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Network on Chip (NoC) has emerged as a promising on chip communication infrastructure. Three Dimensional Integrate Circuit (3D IC) provides small interconnection length between layers and the interconnect scalability in the third dimension, which can further improve the performance of NoC. Therefore, in this paper, a hierarchical cluster-based interconnect architecture is merged with the 3D IC. This interconnect architecture significantly reduces the number of long wires. Since this architecture only has approximately a quarter of routers in 3D mesh-based architecture, the average number of hops is smaller, which leads to lower latency and higher throughput. Moreover, smaller number of routers decreases the area overhead. Meanwhile, some dual links are inserted into the bottlenecks of communication to improve the performance of NoC. Simulation results demonstrate our theoretical analysis and show the advantages of our proposed architecture in latency, throughput and area, when compared with 3D mesh-based architecture.Keywords: Network on Chip (NoC), interconnect architecture, performance, area, Three Dimensional Integrate Circuit (3D IC).
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 14752645 Design of Local Interconnect Network Controller for Automotive Applications
Authors: Jong-Bae Lee, Seongsoo Lee
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Local interconnect network (LIN) is a communication protocol that combines sensors, actuators, and processors to a functional module in automotive applications. In this paper, a LIN ver. 2.2A controller was designed in Verilog hardware description language (Verilog HDL) and implemented in field-programmable gate array (FPGA). Its operation was verified by making full-scale LIN network with the presented FPGA-implemented LIN controller, commercial LIN transceivers, and commercial processors. When described in Verilog HDL and synthesized in 0.18 μm technology, its gate size was about 2,300 gates.
Keywords: Local interconnect network, controller, transceiver, processor.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 15202644 Selection of Rayleigh Damping Coefficients for Seismic Response Analysis of Soil Layers
Authors: Huai-Feng Wang, Meng-Lin Lou, Ru-Lin Zhang
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One good analysis method in seismic response analysis is direct time integration, which widely adopts Rayleigh damping. An approach is presented for selection of Rayleigh damping coefficients to be used in seismic analyses to produce a response that is consistent with Modal damping response. In the presented approach, the expression of the error of peak response, acquired through complete quadratic combination method, and Rayleigh damping coefficients was set up and then the coefficients were produced by minimizing the error. Two finite element modes of soil layers, excited by 28 seismic waves, were used to demonstrate the feasibility and validity.Keywords: Rayleigh damping, modal damping, damping coefficients, seismic response analysis.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 28512643 Estimation of Attenuation and Phase Delay in Driving Voltage Waveform of an Ultra-High-Speed Image Sensor by Dimensional Analysis
Authors: V. T. S. Dao, T. G. Etoh, C. Vo Le, H. D. Nguyen, K. Takehara, T. Akino, K. Nishi
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We present an explicit expression to estimate driving voltage attenuation through RC networks representation of an ultrahigh- speed image sensor. Elmore delay metric for a fundamental RC chain is employed as the first-order approximation. By application of dimensional analysis to SPICE simulation data, we found a simple expression that significantly improves the accuracy of the approximation. Estimation error of the resultant expression for uniform RC networks is less than 2%. Similarly, another simple closed-form model to estimate 50 % delay through fundamental RC networks is also derived with sufficient accuracy. The framework of this analysis can be extended to address delay or attenuation issues of other VLSI structures.
Keywords: Dimensional Analysis, Elmore model, RC network, Signal Attenuation, Ultra-High-Speed Image Sensor.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 13782642 Design of a CMOS Differential Operational Transresistance Amplifier in 90 nm CMOS Technology
Authors: Hafiz Muhammad Obaid, Umais Tayyab, Shabbir Majeed Ch.
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In this paper, a CMOS differential operational transresistance amplifier (OTRA) is presented. The amplifier is designed and implemented in a standard umc90-nm CMOS technology. The differential OTRA provides wider bandwidth at high gain. It also shows much better rise and fall time and exhibits a very good input current dynamic range of 50 to 50 μA. The OTRA can be used in many analog VLSI applications. The presented amplifier has high gain bandwidth product of 617.6 THz Ω. The total power dissipation of the presented amplifier is also very low and it is 0.21 mW.
Keywords: CMOS, differential, operational transresistance amplifier, OTRA, 90 nm, VLSI.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 10922641 Power System Damping Using Hierarchical Fuzzy Multi- Input PSS and Communication Lines Active Power Deviations Input and SVC
Authors: Mohammad Hasan Raouf, Ahmad Rouhani, Mohammad Abedini, Ebrahim Rasooli Anarmarzi
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In this paper the application of a hierarchical fuzzy system (HFS) based on MPSS and SVC in multi-machine environment is studied. Also the effect of communication lines active power variance signal between two ΔPTie-line regions, as one of the inputs of hierarchical fuzzy multi-input PSS and SVC (HFMPSS & SVC), on the increase of low frequency oscillation damping is examined. In the MPSS, to have better efficiency an auxiliary signal of reactive power deviation (ΔQ) is added with ΔP+ Δω input type PSS. The number of rules grows exponentially with the number of variables in a classic fuzzy system. To reduce the number of rules the HFS consists of a number of low-dimensional fuzzy systems in a hierarchical structure. Phasor model of SVC is described and used in this paper. The performances of MPSS and ΔPTie-line based HFMPSS and also the proposed method in damping inter-area mode of oscillation are examined in response to disturbances. The efficiency of the proposed model is examined by simulating a four-machine power system. Results show that the proposed method is performing satisfactorily within the whole range of disturbances and reduces the cost of system.
Keywords: Communication lines active power variance signal, Hierarchical fuzzy system (HFS), Multi-input power system stabilizer (MPSS), Static VAR compensator (SVC).
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 16272640 Fast Forecasting of Stock Market Prices by using New High Speed Time Delay Neural Networks
Authors: Hazem M. El-Bakry, Nikos Mastorakis
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Fast forecasting of stock market prices is very important for strategic planning. In this paper, a new approach for fast forecasting of stock market prices is presented. Such algorithm uses new high speed time delay neural networks (HSTDNNs). The operation of these networks relies on performing cross correlation in the frequency domain between the input data and the input weights of neural networks. It is proved mathematically and practically that the number of computation steps required for the presented HSTDNNs is less than that needed by traditional time delay neural networks (TTDNNs). Simulation results using MATLAB confirm the theoretical computations.Keywords: Fast Forecasting, Stock Market Prices, Time Delay NeuralNetworks, Cross Correlation, Frequency Domain.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 20132639 Mapping Complex, Large – Scale Spiking Networks on Neural VLSI
Authors: Christian Mayr, Matthias Ehrlich, Stephan Henker, Karsten Wendt, René Schüffny
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Traditionally, VLSI implementations of spiking neural nets have featured large neuron counts for fixed computations or small exploratory, configurable nets. This paper presents the system architecture of a large configurable neural net system employing a dedicated mapping algorithm for projecting the targeted biology-analog nets and dynamics onto the hardware with its attendant constraints.Keywords: Large scale VLSI neural net, topology mapping, complex pulse communication.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 16382638 Number of Parametrization of Discrete-Time Systems without Unit-Delay Element: Single-Input Single-Output Case
Authors: Kazuyoshi Mori
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In this paper, we consider the parametrization of the discrete-time systems without the unit-delay element within the framework of the factorization approach. In the parametrization, we investigate the number of required parameters. We consider single-input single-output systems in this paper. By the investigation, we find, on the discrete-time systems without the unit-delay element, three cases that are (1) there exist plants which require only one parameter and (2) two parameters, and (3) the number of parameters is at most three.Keywords: Linear systems, parametrization, Coprime Factorization, number of parameters.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 763