Zainudin Kornain and  Azman Jalar and  Rozaidi Rasid and  Fong Chee Seng,  Effect of Curing Profile to Eliminate the Voids / Black Dots Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging.   journal   = {International Journal of Electronics and Communication Engineering}, [online]. World Academy of Science, Engineering and Technology.
    November 2009, vol. 35(11). 2162 - 2167
    [viewed 22 October 2019]. Available from: https://publications.waset.org/pdf/5181.