Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 21

Search results for: Interconnects

21 Bode Stability Analysis for Single Wall Carbon Nanotube Interconnects Used in 3D-VLSI Circuits

Authors: Saeed H. Nasiri, Rahim Faez, Bita Davoodi, Maryam Farrokhi

Abstract:

Bode stability analysis based on transmission line modeling (TLM) for single wall carbon nanotube (SWCNT) interconnects used in 3D-VLSI circuits is investigated for the first time. In this analysis, the dependence of the degree of relative stability for SWCNT interconnects on the geometry of each tube has been acquired. It is shown that, increasing the length and diameter of each tube, SWCNT interconnects become more stable.

Keywords: Bode stability criterion, Interconnects, Interlayer via, Single wall carbon nanotubes, Transmission line method, Time domain analysis

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20 High Temperature Oxidation of Cr-Steel Interconnects in Solid Oxide Fuel Cells

Authors: Saeed Ghali, Azza Ahmed, Taha Mattar

Abstract:

Solid Oxide Fuel Cell (SOFC) is a promising solution for the energy resources leakage. Ferritic stainless steel becomes a suitable candidate for the SOFCs interconnects due to the recent advancements. Different steel alloys were designed to satisfy the needed characteristics in SOFCs interconnect as conductivity, thermal expansion and corrosion resistance. Refractory elements were used as alloying elements to satisfy the needed properties. The oxidation behaviour of the developed alloys was studied where the samples were heated for long time period at the maximum operating temperature to simulate the real working conditions. The formed scale and oxidized surface were investigated by SEM. Microstructure examination was carried out for some selected steel grades. The effect of alloying elements on the behaviour of the proposed interconnects material and the performance during the working conditions of the cells are explored and discussed. Refractory metals alloying of chromium steel seems to satisfy the needed characteristics in metallic interconnects.

Keywords: SOFCs, Cr-steel, interconnects, oxidation.

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19 Graphene/h-BN Heterostructure Interconnects

Authors: Nikhil Jain, Yang Xu, Bin Yu

Abstract:

The material behavior of graphene, a single layer of carbon lattice, is extremely sensitive to its dielectric environment. We demonstrate improvement in electronic performance of graphene nanowire interconnects with full encapsulation by lattice-matching, chemically inert, 2D layered insulator hexagonal boron nitride (h- BN). A novel layer-based transfer technique is developed to construct the h-BN/MLG/h-BN heterostructures. The encapsulated graphene wires are characterized and compared with that on SiO2 or h-BN substrate without passivating h-BN layer. Significant improvements in maximum current-carrying density, breakdown threshold, and power density in encapsulated graphene wires are observed. These critical improvements are achieved without compromising the carrier transport characteristics in graphene. Furthermore, graphene wires exhibit electrical behavior less insensitive to ambient conditions, as compared with the non-passivated ones. Overall, h-BN/graphene/h- BN heterostructure presents a robust material platform towards the implementation of high-speed carbon-based interconnects.

Keywords: Two-dimensional nanosheet, graphene, hexagonal boron nitride, heterostructure, interconnects.

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18 Analysis of CNT Bundle and its Comparison with Copper for FPGAs Interconnects

Authors: Kureshi Abdul Kadir, Mohd. Hasan

Abstract:

Each new semiconductor technology node brings smaller transistors and wires. Although this makes transistors faster, wires get slower. In nano-scale regime, the standard copper (Cu) interconnect will become a major hurdle for FPGA interconnect due to their high resistivity and electromigration. This paper presents the comprehensive evaluation of mixed CNT bundle interconnects and investigates their prospects as energy efficient and high speed interconnect for future FPGA routing architecture. All HSPICE simulations are carried out at operating frequency of 1GHz and it is found that mixed CNT bundle implemented in FPGAs as interconnect can potentially provide a substantial delay and energy reduction over traditional interconnects at 32nm process technology.

Keywords: CMOS, Copper Interconnect, Mixed CNT Bundle Interconnect, FPGAs.

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17 Model Order Reduction of Linear Time Variant High Speed VLSI Interconnects using Frequency Shift Technique

Authors: J.V.R.Ravindra, M.B.Srinivas,

Abstract:

Accurate modeling of high speed RLC interconnects has become a necessity to address signal integrity issues in current VLSI design. To accurately model a dispersive system of interconnects at higher frequencies; a full-wave analysis is required. However, conventional circuit simulation of interconnects with full wave models is extremely CPU expensive. We present an algorithm for reducing large VLSI circuits to much smaller ones with similar input-output behavior. A key feature of our method, called Frequency Shift Technique, is that it is capable of reducing linear time-varying systems. This enables it to capture frequency-translation and sampling behavior, important in communication subsystems such as mixers, RF components and switched-capacitor filters. Reduction is obtained by projecting the original system described by linear differential equations into a lower dimension. Experiments have been carried out using Cadence Design Simulator cwhich indicates that the proposed technique achieves more % reduction with less CPU time than the other model order reduction techniques existing in literature. We also present applications to RF circuit subsystems, obtaining size reductions and evaluation speedups of orders of magnitude with insignificant loss of accuracy.

Keywords: Model order Reduction, RLC, crosstalk

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16 Transceiver for Differential Wave Pipe-Lined Serial Interconnect with Surfing

Authors: Bhaskar M., Venkataramani B.

Abstract:

In the literature, surfing technique has been proposed for single ended wave-pipelined serial interconnects to increase the data transfer rate. In this paper a novel surfing technique is proposed for differential wave-pipelined serial interconnects, which uses a 'Controllable inverter pair' for surfing. To evaluate the efficiency of this technique, a transceiver with transmitter, receiver, delay locked loop (DLL) along with 40mm metal 4 interconnects using the proposed surfing technique is implemented in UMC 180nm technology and their performances are studied through post layout simulations. From the study, it is observed that the proposed scheme permits 1.875 times higher data transmission rate compared to the single ended scheme whose maximum data transfer rate is 1.33 GB/s. The proposed scheme has the ability to receive the correct data even with stuck-at-faults in the complementary line.

Keywords: Controllable inverter pair, differential interconnect, serial link, surfing, wave pipelining.

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15 Average Current Estimation Technique for Reliability Analysis of Multiple Semiconductor Interconnects

Authors: Ki-Young Kim, Jae-Ho Lim, Deok-Min Kim, Seok-Yoon Kim

Abstract:

Average current analysis checking the impact of current flow is very important to guarantee the reliability of semiconductor systems. As semiconductor process technologies improve, the coupling capacitance often become bigger than self capacitances. In this paper, we propose an analytic technique for analyzing average current on interconnects in multi-conductor structures. The proposed technique has shown to yield the acceptable errors compared to HSPICE results while providing computational efficiency.

Keywords: current moment, interconnect modeling, reliability analysis, worst-case switching

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14 Physical Parameter Based Compact Expression for Propagation Constant of SWCNT Interconnects

Authors: Kollarama Subramanyam, Nisha Kuruvilla, J. P. Raina

Abstract:

Novel compact expressions for propagation constant (γ) of SWCNT and bundled SWCNTs interconnect, in terms of physical parameters such as length, operating frequency and diameter of CNTs is proposed in this work. These simplified expressions enable physical insight and accurate estimation of signal attenuation level and its phase change at any length for a particular frequency. The proposed expressions are validated against SPICE simulated results of lumped as well as distributed equivalent electrical RLC nets of CNT interconnect. These expressions also help us to evaluate the cut off frequencies of SWCNTs for different interconnect lengths.

Keywords: Attenuation constant, Bundled SWCNT, CNT interconnects, Propagation Constant.

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13 The Significance of the Radiography Technique in the Non-Destructive Evaluation of the Integrity and Reliability of Cast Interconnects

Authors: Keshav Pujeri, Pranesh Jain, Krutibas Panda

Abstract:

Significant changes in oil and gas drilling have emphasized the need to verify the integrity and reliability of drill stem components. Defects are inevitable in cast components, regardless of application; but if these defects go undetected, any severe defect could cause down-hole failure. One such defect is shrinkage porosity. Castings with lower level shrinkage porosity (CB levels 1 and 2) have scattered pores and do not occupy large volumes; so pressure testing and helium leak testing (HLT) are sufficient for qualifying the castings. However, castings with shrinkage porosity of CB level 3 and higher, behave erratically under pressure testing and HLT making these techniques insufficient for evaluating the castings- integrity. This paper presents a case study to highlight how the radiography technique is much more effective than pressure testing and HLT.

Keywords: Casting Defects, Interconnects, Leak Check, Pressure Test, Radiography.

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12 A Superior Delay Estimation Model for VLSI Interconnect in Current Mode Signaling

Authors: Sunil Jadav, Rajeevan Chandel Munish Vashishath

Abstract:

Today’s VLSI networks demands for high speed. And in this work the compact form mathematical model for current mode signalling in VLSI interconnects is presented.RLC interconnect line is modelled using characteristic impedance of transmission line and inductive effect. The on-chip inductance effect is dominant at lower technology node is emulated into an equivalent resistance. First order transfer function is designed using finite difference equation, Laplace transform and by applying the boundary conditions at the source and load termination. It has been observed that the dominant pole determines system response and delay in the proposed model. The novel proposed current mode model shows superior performance as compared to voltage mode signalling. Analysis shows that current mode signalling in VLSI interconnects provides 2.8 times better delay performance than voltage mode. Secondly the damping factor of a lumped RLC circuit is shown to be a useful figure of merit.

Keywords: Current Mode, Voltage Mode, VLSI Interconnect.

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11 Closed form Delay Model for on-Chip VLSIRLCG Interconnects for Ramp Input for Different Damping Conditions

Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar

Abstract:

Fast delay estimation methods, as opposed to simulation techniques, are needed for incremental performance driven layout synthesis. On-chip inductive effects are becoming predominant in deep submicron interconnects due to increasing clock speed and circuit complexity. Inductance causes noise in signal waveforms, which can adversely affect the performance of the circuit and signal integrity. Several approaches have been put forward which consider the inductance for on-chip interconnect modelling. But for even much higher frequency, of the order of few GHz, the shunt dielectric lossy component has become comparable to that of other electrical parameters for high speed VLSI design. In order to cope up with this effect, on-chip interconnect has to be modelled as distributed RLCG line. Elmore delay based methods, although efficient, cannot accurately estimate the delay for RLCG interconnect line. In this paper, an accurate analytical delay model has been derived, based on first and second moments of RLCG interconnection lines. The proposed model considers both the effect of inductance and conductance matrices. We have performed the simulation in 0.18μm technology node and an error of as low as less as 5% has been achieved with the proposed model when compared to SPICE. The importance of the conductance matrices in interconnect modelling has also been discussed and it is shown that if G is neglected for interconnect line modelling, then it will result an delay error of as high as 6% when compared to SPICE.

Keywords: Delay Modelling; On-Chip Interconnect; RLCGInterconnect; Ramp Input; Damping; VLSI

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10 Assessment of Drama Courses from the Preschoolers' Point of View

Authors: Ayse Okvuran

Abstract:

Creative drama which interconnects with the concepts of play, theatre, animation and role playing is a field which can only be learnt and expressed through experiencing. This study about assessment of the drama teaching in preschools by children was conducted in 3 preschools in Ankara with participation of 12 children of 6 ages who had taken drama learning courses. Qualitative research approach and semi-structured interviewing technique were employed. The results of the study indicated that all of 12 children defined drama as a game and entertainment.

Keywords: Creative drama, preschoolers, drama courses

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9 Comparative Analysis of Transient-Fault Tolerant Schemes for Network on Chips

Authors: Muhammad Ali, Awais Adnan

Abstract:

Network on a chip (NoC) has been proposed as a viable solution to counter the inefficiency of buses in the current VLSI on-chip interconnects. However, as the silicon chip accommodates more transistors, the probability of transient faults is increasing, making fault tolerance a key concern in scaling chips. In packet based communication on a chip, transient failures can corrupt the data packet and hence, undermine the accuracy of data communication. In this paper, we present a comparative analysis of transient fault tolerant techniques including end-to-end, node-by-node, and stochastic communication based on flooding principle.

Keywords: NoC, fault-tolerance, transient faults.

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8 Explicit Delay and Power Estimation Method for CMOS Inverter Driving on-Chip RLC Interconnect Load

Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar

Abstract:

The resistive-inductive-capacitive behavior of long interconnects which are driven by CMOS gates are presented in this paper. The analysis is based on the ¤Ç-model of a RLC load and is developed for submicron devices. Accurate and analytical expressions for the output load voltage, the propagation delay and the short circuit power dissipation have been proposed after solving a system of differential equations which accurately describe the behavior of the circuit. The effect of coupling capacitance between input and output and the short circuit current on these performance parameters are also incorporated in the proposed model. The estimated proposed delay and short circuit power dissipation are in very good agreement with the SPICE simulation with average relative error less than 6%.

Keywords: Delay, Inverter, Short Circuit Power, ¤Ç-Model, RLCInterconnect, VLSI

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7 CMOS-Compatible Deposited Materials for Photonic Layers Integrated above Electronic Integrated Circuit

Authors: Shiyang Zhu, G. Q. Lo, D. L. Kwong

Abstract:

Silicon photonics has generated an increasing interest in recent years mainly for optical communications optical interconnects in microelectronic circuits or bio-sensing applications. The development of elementary passive and active components (including detectors and modulators), which are mainly fabricated on the silicon on insulator platform for CMOS-compatible fabrication, has reached such a performance level that the integration challenge of silicon photonics with microelectronic circuits should be addressed. Since crystalline silicon can only be grown from another silicon crystal, making it impossible to deposit in this state, the optical devices are typically limited to a single layer. An alternative approach is to integrate a photonic layer above the CMOS chip using back-end CMOS fabrication process. In this paper, various materials, including silicon nitride, amorphous silicon, and polycrystalline silicon, for this purpose are addressed.

Keywords: Silicon photonics, CMOS, Integration.

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6 Time-Domain Analysis of Pulse Parameters Effects on Crosstalk (In High Speed Circuits)

Authors: L. Tani, N. El Ouzzani

Abstract:

Crosstalk among interconnects and printed-circuit board (PCB) traces is a major limiting factor of signal quality in highspeed digital and communication equipments especially when fast data buses are involved. Such a bus is considered as a planar multiconductor transmission line. This paper will demonstrate how the finite difference time domain (FDTD) method provides an exact solution of the transmission-line equations to analyze the near end and the far end crosstalk. In addition, this study makes it possible to analyze the rise time effect on the near and far end voltages of the victim conductor. The paper also discusses a statistical analysis, based upon a set of several simulations. Such analysis leads to a better understanding of the phenomenon and yields useful information.

Keywords: Multiconductor transmission line, Crosstalk, Finite difference time domain (FDTD), printed-circuit board (PCB), Rise time, Statistical analysis.

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5 Simulation of Effect of Current Stressing on Reliability of Solder Joints with Cu-Pillar Bumps

Authors: Y. Li, Q. S. Zhang, H. Z. Huang, B. Y. Wu

Abstract:

The mechanism behind the electromigration and thermomigration failure in flip-chip solder joints with Cu-pillar bumps was investigated in this paper through using finite element method. Hot spot and the current crowding occurrs in the upper corner of copper column instead of solders of the common solder ball. The simulation results show that the change in thermal gradient is noticeable, which might greatly affect the reliability of solder joints with Cu-pillar bumps under current stressing. When the average applied current density is increased from 1×104 A/cm2 to 3×104 A/cm2 in solders, the thermal gradient would increase from 74 K/cm to 901 K/cm at an ambient temperature of 25°C. The force from thermal gradient of 901 K/cm can nearly induce thermomigration by itself. With the increase in applied current, the thermal gradient is growing. It is proposed that thermomigration likely causes a serious reliability issue for Cu column based interconnects.

Keywords: Simulation, Cu-pillar bumps, Electromigration, Thermomigration.

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4 Light Confinement in Low Index Nanometer Areas

Authors: N. Aravantinos-Zafiris, M. M. Sigalas

Abstract:

In this work we numerically examine structures which could confine light in nanometer areas. A system consisting of two silicon disks with in plane separation of a few tens of nanometers has been studied first. The normalized unitless effective mode volume, Veff, has been calculated for the two lowest whispering gallery mode resonances. The effective mode volume is reduced significantly as the gap between the disks decreases. In addition, the effect of the substrate is also studied. In that case, Veff of approximately the same value as the non-substrate case for a similar two disk system can be obtained by using disks almost twice as thick. We also numerically examine a structure consisting of a circular slot waveguide which is formed into a silicon disk resonator. We show that the proposed structure could have high Q resonances thus raising the belief that it is a very promising candidate for optical interconnects applications. The study includes several numerical calculations for all the geometric parameters of the structure. It also includes numerical simulations of the coupling between a waveguide and the proposed disk resonator leading to a very promising conclusion about its applicability.

Keywords: Disk resonators, field enhancement, optical interconnect, slot waveguides.

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3 MinRoot and CMesh: Interconnection Architectures for Network-on-Chip Systems

Authors: Mohammad Ali Jabraeil Jamali, Ahmad Khademzadeh

Abstract:

The success of an electronic system in a System-on- Chip is highly dependent on the efficiency of its interconnection network, which is constructed from routers and channels (the routers move data across the channels between nodes). Since neither classical bus based nor point to point architectures can provide scalable solutions and satisfy the tight power and performance requirements of future applications, the Network-on-Chip (NoC) approach has recently been proposed as a promising solution. Indeed, in contrast to the traditional solutions, the NoC approach can provide large bandwidth with moderate area overhead. The selected topology of the components interconnects plays prime rule in the performance of NoC architecture as well as routing and switching techniques that can be used. In this paper, we present two generic NoC architectures that can be customized to the specific communication needs of an application in order to reduce the area with minimal degradation of the latency of the system. An experimental study is performed to compare these structures with basic NoC topologies represented by 2D mesh, Butterfly-Fat Tree (BFT) and SPIN. It is shown that Cluster mesh (CMesh) and MinRoot schemes achieves significant improvements in network latency and energy consumption with only negligible area overhead and complexity over existing architectures. In fact, in the case of basic NoC topologies, CMesh and MinRoot schemes provides substantial savings in area as well, because they requires fewer routers. The simulation results show that CMesh and MinRoot networks outperforms MESH, BFT and SPIN in main performance metrics.

Keywords: MinRoot, CMesh, NoC, Topology, Performance Evaluation

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2 Spatial Structure of First-Order Voronoi for the Future of Roundabout Cairo since 1867

Authors: Ali Essam El Shazly

Abstract:

The Haussmannization plan of Cairo in 1867 formed a regular network of roundabout spaces, though deteriorated at present. The method of identifying the spatial structure of roundabout Cairo for conservation matches the voronoi diagram with the space syntax through their geometrical property of spatial convexity. In this initiative, the primary convex hull of first-order voronoi adopts the integral and control measurements of space syntax on Cairo’s roundabout generators. The functional essence of royal palaces optimizes the roundabout structure in terms of spatial measurements and the symbolic voronoi projection of 'Tahrir Roundabout' over the Giza Nile and Pyramids. Some roundabouts of major public and commercial landmarks surround the pole of 'Ezbekia Garden' with a higher control than integral measurements, which filter the new spatial structure from the adjacent traditional town. Nevertheless, the least integral and control measures correspond to the voronoi contents of pollutant workshops and the plateau of old Cairo Citadel with the visual compensation of new royal landmarks on top. Meanwhile, the extended suburbs of infinite voronoi polygons arrange high control generators of chateaux housing in 'garden city' environs. The point pattern of roundabouts determines the geometrical characteristics of voronoi polygons. The measured lengths of voronoi edges alternate between the zoned short range at the new poles of Cairo and the distributed structure of longer range. Nevertheless, the shortest range of generator-vertex geometry concentrates at 'Ezbekia Garden' where the crossways of vast Cairo intersect, which maximizes the variety of choice at different spatial resolutions. However, the symbolic 'Hippodrome' which is the largest public landmark forms exclusive geometrical measurements, while structuring a most integrative roundabout to parallel the royal syntax. Overview of the symbolic convex hull of voronoi with space syntax interconnects Parisian Cairo with the spatial chronology of scattered monuments to conceive one universal Cairo structure. Accordingly, the approached methodology of 'voronoi-syntax' prospects the future conservation of roundabout Cairo at the inferred city-level concept.

Keywords: Roundabout Cairo, first-order Voronoi, space syntax, spatial structure.

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1 A Web and Cloud-Based Measurement System Analysis Tool for the Automotive Industry

Authors: C. A. Barros, Ana P. Barroso

Abstract:

Any industrial company needs to determine the amount of variation that exists within its measurement process and guarantee the reliability of their data, studying the performance of their measurement system, in terms of linearity, bias, repeatability and reproducibility and stability. This issue is critical for automotive industry suppliers, who are required to be certified by the 16949:2016 standard (replaces the ISO/TS 16949) of International Automotive Task Force, defining the requirements of a quality management system for companies in the automotive industry. Measurement System Analysis (MSA) is one of the mandatory tools. Frequently, the measurement system in companies is not connected to the equipment and do not incorporate the methods proposed by the Automotive Industry Action Group (AIAG). To address these constraints, an R&D project is in progress, whose objective is to develop a web and cloud-based MSA tool. This MSA tool incorporates Industry 4.0 concepts, such as, Internet of Things (IoT) protocols to assure the connection with the measuring equipment, cloud computing, artificial intelligence, statistical tools, and advanced mathematical algorithms. This paper presents the preliminary findings of the project. The web and cloud-based MSA tool is innovative because it implements all statistical tests proposed in the MSA-4 reference manual from AIAG as well as other emerging methods and techniques. As it is integrated with the measuring devices, it reduces the manual input of data and therefore the errors. The tool ensures traceability of all performed tests and can be used in quality laboratories and in the production lines. Besides, it monitors MSAs over time, allowing both the analysis of deviations from the variation of the measurements performed and the management of measurement equipment and calibrations. To develop the MSA tool a ten-step approach was implemented. Firstly, it was performed a benchmarking analysis of the current competitors and commercial solutions linked to MSA, concerning Industry 4.0 paradigm. Next, an analysis of the size of the target market for the MSA tool was done. Afterwards, data flow and traceability requirements were analysed in order to implement an IoT data network that interconnects with the equipment, preferably via wireless. The MSA web solution was designed under UI/UX principles and an API in python language was developed to perform the algorithms and the statistical analysis. Continuous validation of the tool by companies is being performed to assure real time management of the ‘big data’. The main results of this R&D project are: MSA Tool, web and cloud-based; Python API; New Algorithms to the market; and Style Guide of UI/UX of the tool. The MSA tool proposed adds value to the state of the art as it ensures an effective response to the new challenges of measurement systems, which are increasingly critical in production processes. Although the automotive industry has triggered the development of this innovative MSA tool, other industries would also benefit from it. Currently, companies from molds and plastics, chemical and food industry are already validating it.

Keywords: Automotive industry, Industry 4.0, internet of things, IATF 16949:2016, measurement system analysis.

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