%0 Journal Article
	%A Kureshi Abdul Kadir and  Mohd. Hasan
	%D 2009
	%J International Journal of Electronics and Communication Engineering
	%B World Academy of Science, Engineering and Technology
	%I Open Science Index 33, 2009
	%T Analysis of CNT Bundle and its Comparison with Copper for FPGAs Interconnects
	%U https://publications.waset.org/pdf/8162
	%V 33
	%X Each new semiconductor technology node
brings smaller transistors and wires. Although this makes
transistors faster, wires get slower. In nano-scale regime, the
standard copper (Cu) interconnect will become a major hurdle
for FPGA interconnect due to their high resistivity and
electromigration. This paper presents the comprehensive
evaluation of mixed CNT bundle interconnects and
investigates their prospects as energy efficient and high speed
interconnect for future FPGA routing architecture. All
HSPICE simulations are carried out at operating frequency of
1GHz and it is found that mixed CNT bundle implemented in
FPGAs as interconnect can potentially provide a substantial
delay and energy reduction over traditional interconnects at
32nm process technology.
	%P 1763 - 1768