Kureshi Abdul Kadir and  Mohd. Hasan,  Analysis of CNT Bundle and its Comparison with Copper for FPGAs Interconnects.   journal   = {International Journal of Electronics and Communication Engineering}, [online]. World Academy of Science, Engineering and Technology.
    September 2009, vol. 33(9). 1763 - 1768
    [viewed 18 April 2021]. Available from: https://publications.waset.org/pdf/8162.