Search results for: Solder Joint Reliability

Authors: S.O. Shazlin, M.S. Nurulakmal

Abstract:

Studies have shown that the SnAgCu solder family has been widely used as a replacement for conventional Sn-Pb solders. An attractive approach is by introducing alloying additives (rare earth elements (RE), Zn, Co, Fe, Ni, Sb) into the SnAgCu solder, which helps in refining the microstructure also improving the mechanical and wetting properties of the solder. The present work focuses on the effect of additions of 0.5% Ce and Fe into Sn-3.0Ag-0.5Cu solder, in attempt to reduce the intermetallic compound (IMC) growth and reflow properties of the solder on Cu and Ni (P) surface finish, as well as effects thermal aging on the formation of intermetallic compound (IMC) on different surface finish. Excessive intermetallic compound growth may effect the interface and solder joint due to the brittle nature of the intermetallic compounds. Thus, by introducing alloying elements, IMC layer thickness can be decrease, resulting in better joint and solder reliability.

Keywords: Alloying Elements, Cu and Ni (P) Substrate, Intermetallic Compound (IMC), Reflow, Thermal Aging.

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Authors: Mohd Azman Abdul Latif, Erwan Basiron

Abstract:

A flaw or drift from expected operational performance in one component (NAND, PMIC, controller, DRAM, etc.) may affect the reliability of the entire Solid State Drive (SSD) system. Therefore, it is important to ensure the required quality of each individual component through qualification testing specified using standards or user requirements. Qualification testing is time-consuming and comes at a substantial cost for product manufacturers. A highly technical team, from all the eminent stakeholders is embarking on reliability prediction from beginning of new product development, identify critical to reliability parameters, perform full-blown characterization to embed margin into product reliability and establish control to ensure the product reliability is sustainable in the mass production. The paper will discuss a comprehensive development framework, comprehending SSD end to end from design to assembly, in-line inspection, in-line testing and will be able to predict and to validate the product reliability at the early stage of new product development. During the design stage, the SSD will go through intense reliability margin investigation with focus on assembly process attributes, process equipment control, in-process metrology and also comprehending forward looking product roadmap. Once these pillars are completed, the next step is to perform process characterization and build up reliability prediction modeling. Next, for the design validation process, the reliability prediction specifically solder joint simulator will be established. The SSD will be stratified into Non-Operating and Operating tests with focus on solder joint reliability and connectivity/component latent failures by prevention through design intervention and containment through Temperature Cycle Test (TCT). Some of the SSDs will be subjected to the physical solder joint analysis called Dye and Pry (DP) and Cross Section analysis. The result will be feedbacked to the simulation team for any corrective actions required to further improve the design. Once the SSD is validated and is proven working, it will be subjected to implementation of the monitor phase whereby Design for Assembly (DFA) rules will be updated. At this stage, the design change, process and equipment parameters are in control. Predictable product reliability at early product development will enable on-time sample qualification delivery to customer and will optimize product development validation, effective development resource and will avoid forced late investment to bandage the end-of-life product failures. Understanding the critical to reliability parameters earlier will allow focus on increasing the product margin that will increase customer confidence to product reliability.

Keywords: e2e reliability prediction, SSD, TCT, Solder Joint Reliability, NUDD, connectivity issues, qualifications, characterization and control.

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Authors: Y. Li, Q. S. Zhang, H. Z. Huang, B. Y. Wu

Abstract:

The mechanism behind the electromigration and thermomigration failure in flip-chip solder joints with Cu-pillar bumps was investigated in this paper through using finite element method. Hot spot and the current crowding occurrs in the upper corner of copper column instead of solders of the common solder ball. The simulation results show that the change in thermal gradient is noticeable, which might greatly affect the reliability of solder joints with Cu-pillar bumps under current stressing. When the average applied current density is increased from 1×104 A/cm2 to 3×104 A/cm2 in solders, the thermal gradient would increase from 74 K/cm to 901 K/cm at an ambient temperature of 25°C. The force from thermal gradient of 901 K/cm can nearly induce thermomigration by itself. With the increase in applied current, the thermal gradient is growing. It is proposed that thermomigration likely causes a serious reliability issue for Cu column based interconnects.

Keywords: Simulation, Cu-pillar bumps, Electromigration, Thermomigration.

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Authors: I. Siti Rabiatull Aisha, A. Ourdjini, O. Saliza Azlina

Abstract:

The aim of this paper is to study the effectiveness of bismuth addition in the solder alloy to retard the intermetallic compound formation and growth. In this study, three categories of solders such as Sn-4Ag-xCu (x = 0.5, 0.7, 1.0) and Sn-4Ag-0.5Cu-xBi (x = 0.1, 0.2, 0.4) were used. Ni/Au surface finish substrates were dipped into the molten solder at a temperature of 180-190 ^oC and allowed to cool at room temperature. The intermetallic compound (IMCs) were subjected to the characterization in terms of composition and morphology. The IMC phases were identified by energy dispersive x-ray (EDX), whereas the optical microscope and scanning electron microscopy (SEM) were used to observe microstructure evolution of the solder joint. The results clearly showed that copper concentration dependency was high during the reflow stage. Besides, only Ni₃Sn₄ and Ni₃Sn₂ were detected for all copper concentrations. The addition of Bi was found to have no significant effect on the type of IMCs formed, but yet the grain became further refined.

Keywords: Bismuth addition, intermetallic compound, composition, morphology.

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Authors: Pradeep Bhagawath, K.N. Prabhu, Satyanarayan

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Wetting characteristics of reactive (Sn–0.7Cu solder) and non– reactive (castor oil) wetting of liquids on Cu and Ag plated Al substrates have been investigated. Solder spreading exhibited capillary, gravity and viscous regimes. Oils did not exhibit noticeable spreading regimes. Solder alloy showed better wettability on Ag coated Al substrate compared to Cu plating. In the case of castor oil, Cu coated Al substrate exhibited good wettability as compared to Ag coated Al substrates. The difference in wettability during reactive wetting of solder and non–reactive wetting of oils is attributed to the change in the surface energies of Al substrates brought about by the formation of intermetallic compounds (IMCs).

Keywords: Wettability, contact angle, solder, castor oil, IMCs.

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Authors: Satyanarayana, K.N. Prabhu

Abstract:

Microstructure, wetting behavior and interfacial reactions between Sn–0.7Cu and Sn–0.3Ag–0.7Cu (SAC0307) solders solidified on Ni coated Al substrates were compared and investigated. Microstructure of Sn–0.7Cu alloy exhibited a eutectic matrix composed of primary β-Sn dendrites with a fine dispersion of Cu6Sn5 intermetallics whereas microstructure of SAC0307 alloy exhibited coarser Cu6Sn5 and finer Ag3Sn precipitates of IMCs with decreased tin dendrites. Contact angles ranging from 22° to 26° were obtained for Sn–0.7Cu solder solidified on substrate surface whereas for SAC0307 solder alloy contact angles were found to be in the range of 20° to 22°. Sn–0.7Cu solder/substrate interfacial region exhibited faceted (Cu, Ni)6Sn5 IMCs protruding into the solder matrix and a small amount of (Cu, Ni)3Sn4 intermetallics at the interface. SAC0307 solder/substrate interfacial region showed mainly (Cu, Ni)3Sn4 intermetallics adjacent to the coating layer and (Cu, Ni)6Sn5 IMCs in the solder matrix. The improvement in the wettability of SAC0307 solder alloy on substrate surface is attributed to the formation of cylindrical shape (Cu,Ni)6Sn5 and a layer of (Cu, Ni)3Sn4 IMCs at the interface.

Keywords: Lead-free solder, wetting, contact angle, intermetallics.

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Authors: Rehan Waheed, Hasan Aftab Saeed, Wasim Tarar, Khalid Mahmood, Sajid Ullah Butt

Abstract:

Electromagnetic Interference (EMI) shielded doors made from brass extruded channels need to be welded with shielded enclosures to attain optimum shielding performance. Control of welding induced distortion is a problem in welding dissimilar metals like steel and brass. In this research, soldering of the steel-brass joint has been proposed to avoid weld distortion. The material used for brass channel is UNS C36000. The thickness of brass is defined by the manufacturing process, i.e. extrusion. The thickness of shielded enclosure material (ASTM A36) can be varied to produce joint between the dissimilar metals. Steel sections of different gauges are soldered using (91% tin, 9% zinc) solder to the brass, and strength of joint is measured by standard test procedures. It is observed that thin steel sheets produce a stronger bond with brass. The steel sections further require to be welded with shielded enclosure steel sheets through TIG welding process. Stresses and deformation in the vicinity of soldered portion is calculated through FE simulation. Crack formation in soldered area is also studied through experimental work. It has been found that in thin sheets deformation produced due to applied force is localized and has no effect on soldered joint area whereas in thick sheets profound cracks have been observed in soldered joint. The shielding effectiveness of EMI shielded door is compromised due to these cracks. The shielding effectiveness of the specimens is tested and results are compared.

Keywords: Dissimilar metals, soldering, joint strength, EMI shielding.

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Authors: Chia-Chen Wei, Pack Hsieh, Jeffrey Chen

Abstract:

Surface Mount Technology (SMT) is widely used in the area of the electronic assembly in which the electronic components are mounted to the surface of the printed circuit board (PCB). Most of the defects in the SMT process are mainly related to the quality of solder paste printing. These defects lead to considerable manufacturing costs in the electronics assembly industry. Therefore, the solder paste inspection (SPI) machine for controlling and monitoring the amount of solder paste printing has become an important part of the production process. So far, the setting of the SPI threshold is based on statistical analysis and experts’ experiences to determine the appropriate threshold settings. Because the production data are not normal distribution and there are various variations in the production processes, defects related to solder paste printing still occur. In order to solve this problem, this paper proposes an online machine learning algorithm, called the automatic threshold adjustment (ATA) algorithm, and closed-loop architecture in the SMT process to determine the best threshold settings. Simulation experiments prove that our proposed threshold settings improve the accuracy from 99.85% to 100%.

Keywords: Big data analytics, Industry 4.0, SPI threshold setting, surface mount technology.

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Authors: Raed A. Amro

Abstract:

Standard packaging and interconnection technologies of power devices have difficulties meeting the increasing thermal demands of new application fields of power electronics devices. Main restrictions are the decreasing reliability of bond-wires and solder layers with increasing junction temperature. In the last few years intensive efforts have been invested in developing new packaging and interconnection solutions which may open a path to future application of power devices. In this paper, the main failure mechanisms of power devices are described and principle of new packaging and interconnection concepts and their power cycling reliability are presented.

Keywords: Power electronics devices, Reliability, Power Cycling, Low-temperature joining technique (LTJT)

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Authors: Arijit Roy

Abstract:

Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.

Keywords: Instrumentation, Popcorn, Real-time, Solder Reflow, Strain Gauge.

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Authors: Radim Cajka, Pavlina Mateckova, Martina Janulikova, Marie Stara

Abstract:

Use of a sliding joint is an effective method to decrease the stress in foundation structure where there is a horizontal deformation of subsoil (areas afflicted with underground mining) or horizontal deformation of a foundation structure (pre-stressed foundations, creep, shrinkage, temperature deformation). A convenient material for a sliding joint is a bitumen asphalt belt. Experiments for different types of bitumen belts were undertaken at the Faculty of Civil Engineering - VSB Technical University of Ostrava in 2008. This year an extension of the 2008 experiments is in progress and the shear resistance of a slide joint is being tested as a function of temperature in a temperature controlled room. In this paper experimental results of temperature dependant shear resistance are presented. The result of the experiments should be the sliding joint shear resistance as a function of deformation velocity and temperature. This relationship is used for numerical analysis of stress/strain relation between foundation structure and subsoil. Using a rheological slide joint could lead to a decrease of the reinforcement amount, and contribute to higher reliability of foundation structure and thus enable design of more durable and sustainable building structures.

Keywords: Pre-stressed foundations, sliding joint, soil-structure interaction, subsoil horizontal deformation.

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Authors: Shaher Bano, Samia Fida, Asif Israr

Abstract:

The synergistic effect of properties of metals and fibers reinforced laminates has diverted attention of the world towards use of robust composite materials known as fiber-metal laminates in many high performance applications. In this study, modification of an adhesively bonded joint as a single lap joint of carbon fibers based CARALL FML has done to increase interlaminar shear strength of the joint. The effect of different configurations of joint designs such as spews, stepped and modification in adhesive by addition of nano-fillers was studied. Both experimental and simulation results showed that modified joint design have superior properties as maximum force experienced stepped joint was 1.5 times more than the simple lap joint. Addition of carbon nano-tubes as nano-fillers in the adhesive joint increased the maximum force due to crack deflection mechanism.

Keywords: Adhesive joint, carbon reinforced aluminium laminate, CARALL, fiber metal laminates, spews.

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Authors: Xinjian Kou, Linlin Li, Yongju Zhou, Jimian Song

Abstract:

We introduce the redundancy matrix that expresses clearly the geometrical/topological configuration of the structure. With the matrix, the redundancy of the structure is resolved into redundant components and assigned to each member or rigid joint. The values of the diagonal elements in the matrix indicates the importance of the corresponding members or rigid joints, and the geometrically correlations can be shown with the non-diagonal elements. If a member or rigid joint failures, reassignment of the redundant components can be calculated with the recursive method given in the paper. By combining the indexes of reliability and redundancy components, we define an index concerning the structural robustness. To further explain the properties of the redundancy matrix, we cited several examples of statically indeterminate structures, including two trusses and a rigid frame. With the examples, some simple results and the properties of the matrix are discussed. The examples also illustrate that the redundancy matrix and the relevant concepts are valuable in structural safety analysis.

Keywords: Structural robustness, structural reliability, redundancy component, redundancy matrix.

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Authors: S. Thirumurugan, D. R. Prince Williams

Abstract:

Software Reliability is one of the key factors in the software development process. Software Reliability is estimated using reliability models based on Non Homogenous Poisson Process. In most of the literature the Software Reliability is predicted only in testing phase. So it leads to wrong decision-making concept. In this paper, two Software Reliability concepts, testing and operational phase are studied in detail. Using S-Shaped Software Reliability Growth Model (SRGM) and Exponential SRGM, the testing and operational reliability values are obtained. Finally two reliability values are compared and optimal release time is investigated.

Keywords: Error Detection Rate, Estimation of Parameters, Instantaneous Failure Rate, Mean Value Function, Non Homogenous Poisson Process (NHPP), Software Reliability.

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Authors: T. Lantharthong, N. Phanthuna

Abstract:

This paper presents reliability evaluation techniques which are applied in distribution system planning studies and operation. Reliability of distribution systems is an important issue in power engineering for both utilities and customers. Reliability is a key issue in the design and operation of electric power distribution systems and load. Reliability evaluation of distribution systems has been the subject of many recent papers and the modeling and evaluation techniques have improved considerably.

Keywords: Reliability Evaluation, Optimization Technique, Reliability Indices

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Authors: Hasan Keshavarzian, Tayebeh Nesari

Abstract:

Bolted rail joint is one of the most vulnerable areas in railway track. A comprehensive approach was developed for studying the reliability of fatigue crack initiation of railroad bolt hole under random axle loads and random material properties. The operation condition was also considered as stochastic variables. In order to obtain the comprehensive probability model of fatigue crack initiation life prediction in railroad bolt hole, we used FEM, response surface method (RSM), and reliability analysis. Combined energy-density based and critical plane based fatigue concept is used for the fatigue crack prediction. The dynamic loads were calculated according to the axle load, speed, and track properties. The results show that axle load is most sensitive parameter compared to Poisson’s ratio in fatigue crack initiation life. Also, the reliability index decreases slowly due to high cycle fatigue regime in this area.

Keywords: Rail-wheel tribology, rolling contact mechanic, finite element modeling, reliability analysis.

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Authors: M. S. Nourbakhsh, M. E. Khosroshahi

Abstract:

Laser soldering is based on applying some soldering material (albumin) onto the approximated edges of the cut and heating the solder (and the underlying tissues) by a laser beam. Endogenous and exogenous materials such as indocyanine green (ICG) are often added to solders to enhance light absorption. Gold nanoshells are new materials which have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes, allowing nanoshells to be tailored for particular applications. The purposes of this study was use combination of ICG and different concentration of gold nanoshells for skin tissue soldering and also to examine the effect of laser soldering parameters on the properties of repaired skin. Two mixtures of albumin solder and different combinations of ICG and gold nanoshells were prepared. A full thickness incision of 2×20 mm2 was made on the surface and after addition of mixtures it was irradiated by an 810nm diode laser at different power densities. The changes of tensile strength σt due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. The results showed at constant laser power density (I), σt of repaired incisions increases by increasing the concentration of gold nanoshells in solder, Ns and decreasing Vs. It is therefore important to consider the tradeoff between the scan velocity and the surface temperature for achieving an optimum operating condition. In our case this corresponds to σt =1800 gr/cm2 at I~ 47 Wcm-2, T ~ 85ºC, Ns =10 and Vs=0.3mms-1.

Keywords: Tissue soldering, gold nanoshells, indocyanine green, combination, tensile strength.

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Authors: H. Zare Amadabadi, S. Soltani Gerdefaramarzi

Abstract:

In recent years, strategic alliances have taken increasing importance as a means to control competitive forces and to enter into new markets. Joint ventures are one of the most frequently used contractual forms in strategic alliances. There are various motivations for cooperation between two or more firms e.g., accessing to technical know-how, accessing to financial resources and managing risks. The firms must know about these motivations to encourage for establishing joint venture. So, it is important for managers to understand about these motives. On the other hand, the cooperation section is one of the most effective parts in each country. In this way, our study identifies goals of joint venture between cooperative manufacturing firms, and prioritizes those using TOPSIS1. The results show that the most important of joint venture goals are: accessing to managerial know-how, sharing total capital investment.

Keywords: Cooperative, Joint Venture, TOPSIS

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Authors: G. S. Mahapatra, T. K. Roy

Abstract:

In general fuzzy sets are used to analyze the fuzzy system reliability. Here intuitionistic fuzzy set theory for analyzing the fuzzy system reliability has been used. To analyze the fuzzy system reliability, the reliability of each component of the system as a triangular intuitionistic fuzzy number is considered. Triangular intuitionistic fuzzy number and their arithmetic operations are introduced. Expressions for computing the fuzzy reliability of a series system and a parallel system following triangular intuitionistic fuzzy numbers have been described. Here an imprecise reliability model of an electric network model of dark room is taken. To compute the imprecise reliability of the above said system, reliability of each component of the systems is represented by triangular intuitionistic fuzzy numbers. Respective numerical example is presented.

Keywords: Fuzzy set, Intuitionistic fuzzy number, Systemreliability, Triangular intuitionistic fuzzy number.

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Authors: A.R Alesaadi, M. Nafar, A.H. Gheisari

Abstract:

In this paper sensitivity analysis is performed for reliability evaluation of power systems. When examining the reliability of a system, it is useful to recognize how results change as component parameters are varied. This knowledge helps engineers to understand the impact of poor data, and gives insight on how reliability can be improved. For these reasons, a sensitivity analysis can be performed. Finally, a real network was used for testing the presented method.

Keywords: sensitivity analysis, reliability evaluation, powersystems.

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Authors: Jobin Varghese, V. M. Akhil, P. K. Rajendrakumar, K. S. Sivanandan

Abstract:

The major contributor to the human locomotion is the knee flexion and extension. During heel strike, a huge amount of energy is transmitted through the leg towards knee joint, which in fact is damped at heel and leg muscles. During high shocks, although it is damped to a certain extent, the balance force transmits towards knee joint which could damage the knee. Due to the vital function of the knee joint, it should be protected against damage due to additional load acting on it. This work concentrates on the development of spring mass damper system which exactly replicates the stiffness at the heel and muscles and the objective function is optimized to minimize the force acting at the knee joint. Further, the data collected using force plate are put into the model to verify its integrity and are found to be in good agreement.

Keywords: Spring, mass, damper, impact, knee joint.

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Authors: L. Mirtskhulava, M. Khunjgurua, N. Lomineishvili, K. Bakuria

Abstract:

Software reliability prediction gives a great opportunity to measure the software failure rate at any point throughout system test. A software reliability prediction model provides with the technique for improving reliability. Software reliability is very important factor for estimating overall system reliability, which depends on the individual component reliabilities. It differs from hardware reliability in that it reflects the design perfection. Main reason of software reliability problems is high complexity of software. Various approaches can be used to improve the reliability of software. We focus on software reliability model in this article, assuming that there is a time redundancy, the value of which (the number of repeated transmission of basic blocks) can be an optimization parameter. We consider given mathematical model in the assumption that in the system may occur not only irreversible failures, but also a failure that can be taken as self-repairing failures that significantly affect the reliability and accuracy of information transfer. Main task of the given paper is to find a time distribution function (DF) of instructions sequence transmission, which consists of random number of basic blocks. We consider the system software unreliable; the time between adjacent failures has exponential distribution.

Keywords: Exponential distribution, conditional mean time to failure, distribution function, mathematical model, software reliability.

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Authors: Pham Thanh Trung, Huynh Quyet Thang

Abstract:

Reliability is one of the most important quality attributes of software. Based on the approach of Reussner and the approach of Cheung, we proposed the reliability prediction model of component-based software architectures. Also, the value of the model is shown through the experimental evaluation on a web server system.

Keywords: component-based architecture, reliability prediction model, software reliability engineering.

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Authors: S. Hirokawa, M. Fukunaga, M. Mawatari

Abstract:

Knee joint forces are available by in vivo measurement using an instrumented knee prosthesis for small to moderate knee flexion but not for high flexion yet. We created a 2D mathematical model of the lower limb incorporating several new features such as a patello-femoral mechanism, a thigh-calf contact at high knee flexion and co-contracting muscles' force ratio, then used it to determine knee joint forces arising from high knee flexions in four kneeling conditions: rising with legs in parallel, with one foot forward, with or without arm use. With arms used, the maximum values of knee joint force decreased to about 60% of those with arms not used. When rising with one foot forward, if arms are not used, the forward leg sustains a force as large as that sustained when rising with legs parallel.

Keywords: Knee joint force, kneeling, mathematical model, biomechanics.

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Authors: Y. Shpungin

Abstract:

Estimating the reliability of a computer network has been a subject of great interest. It is a well known fact that this problem is NP-hard. In this paper we present a very efficient combinatorial approach for Monte Carlo reliability estimation of a network with unreliable nodes and unreliable edges. Its core is the computation of some network combinatorial invariants. These invariants, once computed, directly provide pure and simple framework for computation of network reliability. As a specific case of this approach we obtain tight lower and upper bounds for distributed network reliability (the so called residual connectedness reliability). We also present some simulation results.

Keywords: Combinatorial invariants, Monte Carlo simulation, reliability, unreliable nodes and unreliable edges.

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Authors: N. H. Hamid, N. D. Hadi, K. D. Ghani

Abstract:

This paper presents the retrofitting of beam-column joint using CFRP (Carbon Fiber Reinforced Polymer) and steel plate. This specimen was tested until failure up to 1.0% drift. This joint suffered severe damages and diagonal cracks at upper crack at upper column before retrofitted. CFRP were wrapped at corbel, bottom and top of the column. Steel plates with bonding were attached to the two beams and the jointing system. This retrofitted specimen is tested again under lateral cyclic loading up 1.75% drift. Visual observations show that the cracks started at joint when 0.5% drift applied at top of column. Damage of retrofitted beam-column joint occurred inside the CFRP and it cannot be seen from outside. Analysis of elastic stiffness, lateral strength, ductility, hysteresis loops and equivalent viscous damping shows that these values are higher than before retrofitting. Therefore, it is recommended to use this type of retrofitting method for beam-column joint with corbel which suffers severe damage after the earthquake.

Keywords: Beam-Column joint, ductility, stiffness, retrofitting.

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Authors: Ranjan Kumar Dash, Chita Ranjan Tripathy

Abstract:

The evaluation of residual reliability of large sized parallel computer interconnection systems is not practicable with the existing methods. Under such conditions, one must go for approximation techniques which provide the upper bound and lower bound on this reliability. In this context, a new approximation method for providing bounds on residual reliability is proposed here. The proposed method is well supported by two algorithms for simulation purpose. The bounds on residual reliability of three different categories of interconnection topologies are efficiently found by using the proposed method

Keywords: Parallel computer network, reliability, probabilisticgraph, interconnection networks.

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Authors: Z. Sakka, I. Assakkaf, T. Al-Yaqoub, J. Parol

Abstract:

reliability-based methodology for the assessment and evaluation of reinforced concrete (R/C) structural elements of concrete structures is presented herein. The results of the reliability analysis and assessment for R/C structural elements were verified by the results obtained through deterministic methods. The outcomes of the reliability-based analysis were compared against currently adopted safety limits that are incorporated in the reliability indices β’s, according to international standards and codes. The methodology is based on probabilistic analysis using reliability concepts and statistics of the main random variables that are relevant to the subject matter, and for which they are to be used in the performance-function equation(s) associated with the structural elements under study. These methodology techniques can result in reliability index β, which is commonly known as the reliability index or reliability measure value that can be utilized to assess and evaluate the safety, human risk, and functionality of the structural component. Also, these methods can result in revised partial safety factor values for certain target reliability indices that can be used for the purpose of redesigning the R/C elements of the building and in which they could assist in considering some other remedial actions to improve the safety and functionality of the member.

Keywords: Concrete Structures, FORM, Monte Carlo Simulation, Structural Reliability.

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Authors: Stephen V. Crowder, Jonathan W. Lane

Abstract:

With short production development times, there is an increased need to demonstrate product reliability relatively quickly with minimal testing. In such cases there may be few if any observed failures. Thus it may be difficult to assess reliability using the traditional reliability test plans that measure only time (or cycles) to failure. For many components, degradation measures will contain important information about performance and reliability. These measures can be used to design a minimal test plan, in terms of number of units placed on test and duration of the test, necessary to demonstrate a reliability goal. In this work we present a case study involving an electronic component subject to degradation. The data, consisting of 42 degradation paths of cycles to failure, are first used to estimate a reliability function. Bootstrapping techniques are then used to perform power studies and develop a minimal reliability test plan for future production of this component. 

Keywords: Degradation Measure, Time to Failure Distribution, Bootstrap.

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Authors: R. Doubrava, R. Růžek

Abstract:

Nonstandard tests are necessary for analyses and verification of new developed structural and technological solutions with application of composite materials. One of the most critical primary structural parts of a typical aerospace structure is T-joint. This structural element is loaded mainly in shear, bending, peel and tension. The paper is focused on the shear loading simulations. The aim of the work is to obtain a representative uniform distribution of shear loads along T-joint during the mechanical testing. A new design of T-joint test procedure, numerical simulation and optimization of representative boundary conditions are presented. The different conditions and inaccuracies both in simulations and experiments are discussed. The influence of different parameters on stress and strain distributions is demonstrated on T-joint made of CFRP (carbon fibre reinforced plastic). A special test rig designed by VZLU (Aerospace Research and Test Establishment) for T-shear test procedure is presented.

Keywords: T-joint, shear, composite, mechanical testing, Finite Element analysis, methodology.

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