Arijit Roy,  Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow.   journal   = {International Journal of Electronics and Communication Engineering}, [online]. World Academy of Science, Engineering and Technology.
    November 2013, vol. 80(8). 1122 - 1126
    [viewed 11 May 2024]. Available from: https://publications.waset.org/pdf/9996639.