Shazlin, S. , Nurulakmal, M. (2011). 'Evaluation of Alloying Additions on the Microstructure and IMC Formation of Sn-Ag-Cu Solder on Cu and Ni (P) Substrates'. World Academy of Science, Engineering and Technology, Open Science Index 60, International Journal of Materials and Metallurgical Engineering, 5(12), 1091 - 1095.