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Evaluation of Alloying Additions on the Microstructure and IMC Formation of Sn-Ag-Cu Solder on Cu and Ni (P) Substrates

Authors: S.O. Shazlin, M.S. Nurulakmal

Abstract:

Studies have shown that the SnAgCu solder family has been widely used as a replacement for conventional Sn-Pb solders. An attractive approach is by introducing alloying additives (rare earth elements (RE), Zn, Co, Fe, Ni, Sb) into the SnAgCu solder, which helps in refining the microstructure also improving the mechanical and wetting properties of the solder. The present work focuses on the effect of additions of 0.5% Ce and Fe into Sn-3.0Ag-0.5Cu solder, in attempt to reduce the intermetallic compound (IMC) growth and reflow properties of the solder on Cu and Ni (P) surface finish, as well as effects thermal aging on the formation of intermetallic compound (IMC) on different surface finish. Excessive intermetallic compound growth may effect the interface and solder joint due to the brittle nature of the intermetallic compounds. Thus, by introducing alloying elements, IMC layer thickness can be decrease, resulting in better joint and solder reliability.

Keywords: alloying elements, reflow, thermal aging, Cu and Ni (P) Substrate, Intermetallic Compound (IMC)

Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1077896

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