Search results for: Reflow

Authors: Arijit Roy

Abstract:

Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.

Keywords: Instrumentation, Popcorn, Real-time, Solder Reflow, Strain Gauge.

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Authors: A. Zahra, G. de Cesare, D. Caputo, A. Nascetti

Abstract:

PDMS (Polydimethylsiloxane) polymer is a suitable material for biological and MEMS (Microelectromechanical systems) designers, because of its biocompatibility, transparency and high resistance under plasma treatment. PDMS round channel is always been of great interest due to its ability to confine the liquid with membrane type micro valves. In this paper we are presenting a very simple way to form round shapemicrofluidic channel, which is based on reflow of positive photoresist AZ® 40 XT. With this method, it is possible to obtain channel of different height simply by varying the spin coating parameters of photoresist.

Keywords: Lab-on-Chip, PDMS, Reflow, Round microfluidic channel.

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Authors: S.O. Shazlin, M.S. Nurulakmal

Abstract:

Studies have shown that the SnAgCu solder family has been widely used as a replacement for conventional Sn-Pb solders. An attractive approach is by introducing alloying additives (rare earth elements (RE), Zn, Co, Fe, Ni, Sb) into the SnAgCu solder, which helps in refining the microstructure also improving the mechanical and wetting properties of the solder. The present work focuses on the effect of additions of 0.5% Ce and Fe into Sn-3.0Ag-0.5Cu solder, in attempt to reduce the intermetallic compound (IMC) growth and reflow properties of the solder on Cu and Ni (P) surface finish, as well as effects thermal aging on the formation of intermetallic compound (IMC) on different surface finish. Excessive intermetallic compound growth may effect the interface and solder joint due to the brittle nature of the intermetallic compounds. Thus, by introducing alloying elements, IMC layer thickness can be decrease, resulting in better joint and solder reliability.

Keywords: Alloying Elements, Cu and Ni (P) Substrate, Intermetallic Compound (IMC), Reflow, Thermal Aging.

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Authors: I. Siti Rabiatull Aisha, A. Ourdjini, O. Saliza Azlina

Abstract:

The aim of this paper is to study the effectiveness of bismuth addition in the solder alloy to retard the intermetallic compound formation and growth. In this study, three categories of solders such as Sn-4Ag-xCu (x = 0.5, 0.7, 1.0) and Sn-4Ag-0.5Cu-xBi (x = 0.1, 0.2, 0.4) were used. Ni/Au surface finish substrates were dipped into the molten solder at a temperature of 180-190 ^oC and allowed to cool at room temperature. The intermetallic compound (IMCs) were subjected to the characterization in terms of composition and morphology. The IMC phases were identified by energy dispersive x-ray (EDX), whereas the optical microscope and scanning electron microscopy (SEM) were used to observe microstructure evolution of the solder joint. The results clearly showed that copper concentration dependency was high during the reflow stage. Besides, only Ni₃Sn₄ and Ni₃Sn₂ were detected for all copper concentrations. The addition of Bi was found to have no significant effect on the type of IMCs formed, but yet the grain became further refined.

Keywords: Bismuth addition, intermetallic compound, composition, morphology.

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Authors: Mihai Brânzei, Ioan Plotog, Ion Pencea

Abstract:

The Pads have unique values of thermophysical properties (THP) having important contribution over heat transfer into the PCB structure. Materials with high thermal diffusivity (TD) rapidly adjust their temperature to that of their surroundings, because the HT is quick in compare to their volumetric heat capacity (VHC). In the paper is presenting the diffusivity tests (ASTM E1461 flash method) for PCBs with different core materials. In the experiments, the multilayer structure of PCBA was taken into consideration, an equivalent property referring to each of experimental structure be practically measured. Concerning to entire structure, the THP emphasize the major contribution of substrate in establishing of reflow soldering process (RSP) heat transfer necessities. This conclusion offer practical solution for heat transfer time constant calculation as function of thickness and substrate material diffusivity with an acceptable error estimation.

Keywords: heat transfer time constant, packaging, reflowsoldering process, thermal diffusivity.

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Authors: Syed Dawood Md. Taimur, Md. Hasanur Rahman, Syeda Fahmida Afrin, Farzana Islam

Abstract:

The concept of myocardial injury, although first recognized from animal studies, is now recognized as a clinical phenomenon that may result in microvascular damage, no-reflow phenomenon, myocardial stunning, myocardial hibernation and ischemic preconditioning. The final consequence of this event is left ventricular (LV) systolic dysfunction leading to increased morbidity and mortality. The typical clinical case of reperfusion injury occurs in acute myocardial infarction (MI) with ST segment elevation in which an occlusion of a major epicardial coronary artery is followed by recanalization of the artery. This may occur spontaneously or by means of thrombolysis and/or by primary percutaneous coronary intervention (PCI) with efficient platelet inhibition by aspirin (acetylsalicylic acid), clopidogrel and glycoprotein IIb/IIIa inhibitors. In recent years, percutaneous coronary intervention (PCI) has become a well-established technique for the treatment of coronary artery disease. PCI improves symptoms in patients with coronary artery disease and it has been increasing safety of procedures. However, peri- and post-procedural myocardial injury, including angiographical slow coronary flow, microvascular embolization, and elevated levels of cardiac enzyme, such as creatine kinase and troponin-T and -I, has also been reported even in elective cases. Furthermore, myocardial reperfusion injury at the beginning of myocardial reperfusion, which causes tissue damage and cardiac dysfunction, may occur in cases of acute coronary syndrome. Because patients with myocardial injury is related to larger myocardial infarction and have a worse long-term prognosis than those without myocardial injury, it is important to prevent myocardial injury during and/or after PCI in patients with coronary artery disease. To date, many studies have demonstrated that adjunctive pharmacological treatment suppresses myocardial injury and increases coronary blood flow during PCI procedures. In this review, we highlight the usefulness of pharmacological treatment in combination with PCI in attenuating myocardial injury in patients with coronary artery disease.

Keywords: Coronary artery disease, Percutaneous coronary intervention, Myocardial injury, Pharmacology.

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