Search results for: IMCs.

Authors: Satyanarayana, K.N. Prabhu

Abstract:

Microstructure, wetting behavior and interfacial reactions between Sn–0.7Cu and Sn–0.3Ag–0.7Cu (SAC0307) solders solidified on Ni coated Al substrates were compared and investigated. Microstructure of Sn–0.7Cu alloy exhibited a eutectic matrix composed of primary β-Sn dendrites with a fine dispersion of Cu6Sn5 intermetallics whereas microstructure of SAC0307 alloy exhibited coarser Cu6Sn5 and finer Ag3Sn precipitates of IMCs with decreased tin dendrites. Contact angles ranging from 22° to 26° were obtained for Sn–0.7Cu solder solidified on substrate surface whereas for SAC0307 solder alloy contact angles were found to be in the range of 20° to 22°. Sn–0.7Cu solder/substrate interfacial region exhibited faceted (Cu, Ni)6Sn5 IMCs protruding into the solder matrix and a small amount of (Cu, Ni)3Sn4 intermetallics at the interface. SAC0307 solder/substrate interfacial region showed mainly (Cu, Ni)3Sn4 intermetallics adjacent to the coating layer and (Cu, Ni)6Sn5 IMCs in the solder matrix. The improvement in the wettability of SAC0307 solder alloy on substrate surface is attributed to the formation of cylindrical shape (Cu,Ni)6Sn5 and a layer of (Cu, Ni)3Sn4 IMCs at the interface.

Keywords: Lead-free solder, wetting, contact angle, intermetallics.

Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 2549

Authors: Pradeep Bhagawath, K.N. Prabhu, Satyanarayan

Abstract:

Wetting characteristics of reactive (Sn–0.7Cu solder) and non– reactive (castor oil) wetting of liquids on Cu and Ag plated Al substrates have been investigated. Solder spreading exhibited capillary, gravity and viscous regimes. Oils did not exhibit noticeable spreading regimes. Solder alloy showed better wettability on Ag coated Al substrate compared to Cu plating. In the case of castor oil, Cu coated Al substrate exhibited good wettability as compared to Ag coated Al substrates. The difference in wettability during reactive wetting of solder and non–reactive wetting of oils is attributed to the change in the surface energies of Al substrates brought about by the formation of intermetallic compounds (IMCs).

Keywords: Wettability, contact angle, solder, castor oil, IMCs.

Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 2495

Authors: I. Siti Rabiatull Aisha, A. Ourdjini, O. Saliza Azlina

Abstract:

The aim of this paper is to study the effectiveness of bismuth addition in the solder alloy to retard the intermetallic compound formation and growth. In this study, three categories of solders such as Sn-4Ag-xCu (x = 0.5, 0.7, 1.0) and Sn-4Ag-0.5Cu-xBi (x = 0.1, 0.2, 0.4) were used. Ni/Au surface finish substrates were dipped into the molten solder at a temperature of 180-190 ^oC and allowed to cool at room temperature. The intermetallic compound (IMCs) were subjected to the characterization in terms of composition and morphology. The IMC phases were identified by energy dispersive x-ray (EDX), whereas the optical microscope and scanning electron microscopy (SEM) were used to observe microstructure evolution of the solder joint. The results clearly showed that copper concentration dependency was high during the reflow stage. Besides, only Ni₃Sn₄ and Ni₃Sn₂ were detected for all copper concentrations. The addition of Bi was found to have no significant effect on the type of IMCs formed, but yet the grain became further refined.

Keywords: Bismuth addition, intermetallic compound, composition, morphology.

Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1312

Authors: Youkyung Park, SeungYup Kang, SungHo Kim, SimKyun Yook

Abstract:

IMCS is Integrated Monitoring and Control System for thermal power plant. This system consists of mainly two parts; controllers and OIS (Operator Interface System). These two parts are connected by Ethernet-based communication. The controller side of communication is managed by CNet module and OIS side is managed by data server of OIS. CNet module sends the data of controller to data server and receives commend data from data server. To minimizes or balance the load of data server, this module buffers data created by controller at every cycle and send buffered data to data server on request of data server. For multiple data server, this module manages the connection line with each data server and response for each request from multiple data server. CNet module is included in each controller of redundant system. When controller fail-over happens on redundant system, this module can provide data of controller to data sever without loss. This paper presents three main features – separation of get task, usage of ring buffer and monitoring communication status –of CNet module to carry out these functions.

Keywords: Ethernet communication, DCS, power plant, ring buffer, data integrity

Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1563