@article{(Open Science Index):https://publications.waset.org/pdf/9996639,
	  title     = {Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow},
	  author    = {Arijit Roy},
	  country	= {},
	  institution	= {},
	  abstract     = {Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
},
	    journal   = {International Journal of Electronics and Communication Engineering},
	  volume    = {7},
	  number    = {8},
	  year      = {2013},
	  pages     = {1122 - 1126},
	  ee        = {https://publications.waset.org/pdf/9996639},
	  url   	= {https://publications.waset.org/vol/80},
	  bibsource = {https://publications.waset.org/},
	  issn  	= {eISSN: 1307-6892},
	  publisher = {World Academy of Science, Engineering and Technology},
	  index 	= {Open Science Index 80, 2013},
	}