Search results for: DNA chip data

Authors: Faizal A. Samman, Thomas Hollstein, Manfred Glesner

Abstract:

A synchronous network-on-chip using wormhole packet switching and supporting guaranteed-completion best-effort with low-priority (LP) and high-priority (HP) wormhole packet delivery service is presented in this paper. Both our proposed LP and HP message services deliver a good quality of service in term of lossless packet completion and in-order message data delivery. However, the LP message service does not guarantee minimal completion bound. The HP packets will absolutely use 100% bandwidth of their reserved links if the HP packets are injected from the source node with maximum injection. Hence, the service are suitable for small size messages (less than hundred bytes). Otherwise the other HP and LP messages, which require also the links, will experience relatively high latency depending on the size of the HP message. The LP packets are routed using a minimal adaptive routing, while the HP packets are routed using a non-minimal adaptive routing algorithm. Therefore, an additional 3-bit field, identifying the packet type, is introduced in their packet headers to classify and to determine the type of service committed to the packet. Our NoC prototypes have been also synthesized using a 180-nm CMOS standard-cell technology to evaluate the cost of implementing the combination of both services.

Keywords: Network-on-Chip, Parallel Pipeline Router Architecture, Wormhole Switching, Two-Level Priority Service.

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Authors: SreehariRao Patri, K. S. R. KrishnaPrasad

Abstract:

An on chip low drop out voltage regulator that employs elegant compensation scheme is presented in this paper. The novelty in this design is that the device parasitic capacitances are exploited for compensation at different loads. The proposed LDO is designed to provide a constant voltage of 1.2V and is implemented in UMC 180 nano meter CMOS technology. The voltage regulator presented improves stability even at lighter loads and enhances line and load regulation.

Keywords: Analog, LDO, SOC.

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Authors: Nawang Chhunid, Gagnesh Kumar

Abstract:

On-chip memories consume a significant portion of the overall die space and power in modern microprocessors. On-chip caches depend on Static Random-Access Memory (SRAM) cells and scaling of technology occurring as per Moore’s law. Unfortunately, the scaling is affecting stability, performance, and leakage power which will become major problems for future SRAMs in aggressive nanoscale technologies due to increasing device mismatch and variations. 3T1D Dynamic Random-Access Memory (DRAM) cell is a non-destructive read DRAM cell with three transistors and a gated diode. In 3T1D DRAM cell gated diode (D1) acts as a storage device and also as an amplifier, which leads to fast read access. Due to its high tolerance to process variation, high density, and low cost of memory as compared to 6T SRAM cell, it is universally used by the advanced microprocessor for on chip data and program memory. In the present paper, it has been shown that 3T1D DRAM cell can perform better in terms of fast read access as compared to 6T, 4T, 3T SRAM cells, respectively.

Keywords: DRAM cell, read access time, tanner EDA tool write access time and retention time, average power dissipation.

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Authors: F. Majeed, D. V. Thiel, M. Shahpari

Abstract:

An electrically small meander line antenna is designed for impedance matching with RF transceiver chip CC1101. The design provides the flexibility of tuning the reactance of the antenna over a wide range of values: highly capacitive to highly inductive. The antenna was printed with silver ink on FR4 substrate using the screen printing design process. The antenna impedance was perfectly matched to CC1101 at 433 MHz. The measured radiation efficiency of the antenna was 81.3% at resonance. The 3 dB and 10 dB fractional bandwidth of the antenna was 14.5% and 4.78%, respectively. The read range of the antenna was compared with a copper wire monopole antenna over a distance of five meters. The antenna, with a perfect impedance match with RF transceiver chip CC1101, shows improvement in the read range compared to a monopole antenna over the specified distance.

Keywords: Meander line antenna, RFID, Silver ink printing, Impedance matching.

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Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar

Abstract:

Fast delay estimation methods, as opposed to simulation techniques, are needed for incremental performance driven layout synthesis. On-chip inductive effects are becoming predominant in deep submicron interconnects due to increasing clock speed and circuit complexity. Inductance causes noise in signal waveforms, which can adversely affect the performance of the circuit and signal integrity. Several approaches have been put forward which consider the inductance for on-chip interconnect modelling. But for even much higher frequency, of the order of few GHz, the shunt dielectric lossy component has become comparable to that of other electrical parameters for high speed VLSI design. In order to cope up with this effect, on-chip interconnect has to be modelled as distributed RLCG line. Elmore delay based methods, although efficient, cannot accurately estimate the delay for RLCG interconnect line. In this paper, an accurate analytical delay model has been derived, based on first and second moments of RLCG interconnection lines. The proposed model considers both the effect of inductance and conductance matrices. We have performed the simulation in 0.18μm technology node and an error of as low as less as 5% has been achieved with the proposed model when compared to SPICE. The importance of the conductance matrices in interconnect modelling has also been discussed and it is shown that if G is neglected for interconnect line modelling, then it will result an delay error of as high as 6% when compared to SPICE.

Keywords: Delay Modelling; On-Chip Interconnect; RLCGInterconnect; Ramp Input; Damping; VLSI

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Authors: Vedat Coskun, Fahri Soylemezgiller, Busra Ozdenizci, Kerem Ok

Abstract:

In recent years, several smart card solutions for transportation services of cities with different technical infrastructures and business models has emerged considerably, which triggers new business and technical opportunities. In order to create a unique system, we present a novel, promising system called Multifunctional City Smart Card System to be used in all cities that provides transportation and loyalty services based on the MasterCard M/Chip Advance standards. The proposed system provides a unique solution for transportation services of large cities over the world, aiming to answer all transportation needs of citizens. In this paper, development of the Multifunctional City Smart Card system and system requirements are briefly described. Moreover, performance analysis results of M/Chip Advance Compatible Validators which is the system's most important component are presented.

Keywords: Smart Card, M/Chip Advance Standard, City Transportation, Performance Analysis.

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Authors: Alexandru Epureanu, Virgil Teodor

Abstract:

One of the main research directions in CAD/CAM machining area is the reducing of machining time. The feedrate scheduling is one of the advanced techniques that allows keeping constant the uncut chip area and as sequel to keep constant the main cutting force. They are two main ways for feedrate optimization. The first consists in the cutting force monitoring, which presumes to use complex equipment for the force measurement and after this, to set the feedrate regarding the cutting force variation. The second way is to optimize the feedrate by keeping constant the material removal rate regarding the cutting conditions. In this paper there is proposed a new approach using an extended database that replaces the system model. The feedrate scheduling is determined based on the identification of the reconfigurable machine tool, and the feed value determination regarding the uncut chip section area, the contact length between tool and blank and also regarding the geometrical roughness. The first stage consists in the blank and tool monitoring for the determination of actual profiles. The next stage is the determination of programmed tool path that allows obtaining the piece target profile. The graphic representation environment models the tool and blank regions and, after this, the tool model is positioned regarding the blank model according to the programmed tool path. For each of these positions the geometrical roughness value, the uncut chip area and the contact length between tool and blank are calculated. Each of these parameters are compared with the admissible values and according to the result the feed value is established. We can consider that this approach has the following advantages: in case of complex cutting processes the prediction of cutting force is possible; there is considered the real cutting profile which has deviations from the theoretical profile; the blank-tool contact length limitation is possible; it is possible to correct the programmed tool path so that the target profile can be obtained. Applying this method, there are obtained data sets which allow the feedrate scheduling so that the uncut chip area is constant and, as a result, the cutting force is constant, which allows to use more efficiently the machine tool and to obtain the reduction of machining time.

Keywords: Reconfigurable machine tool, system identification, uncut chip area, cutting conditions scheduling.

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Authors: Ching-Feng Chen, Ching-Chih Tsai

Abstract:

With the size of the transistor gradually approaching the physical limit, it challenges the persistence of Moore’s Law due to such issues of the short channel effect and the development of the high numerical aperture (NA) lithography equipment. In the context of the ever-increasing technical requirements of portable devices and high-performance computing (HPC), relying on the law continuation to enhance the chip density will no longer support the prospects of the electronics industry. Weighing the chip’s power consumption-performance-area-cost-cycle time to market (PPACC) is an updated benchmark to drive the evolution of the advanced wafer nanometer (nm). The advent of two and half- and three-dimensional (2.5 and 3D)- Very-Large-Scale Integration (VLSI) packaging based on Through Silicon Via (TSV) technology has updated the traditional die assembly methods and provided the solution. This overview investigates the up-to-date and cutting-edge packaging technologies for 2.5D and 3D integrated circuits (IC) based on the updated transistor structure and technology nodes. We conclude that multi-chip solutions for 2.5D and 3D IC packaging can prolong Moore’s Law.

Keywords: Moore’s Law, High Numerical Aperture, Power Consumption-Performance-Area-Cost-Cycle Time to Market, PPACC, 2.5 and 3D-Very-Large-Scale Integration Packaging, Through Silicon Vi.

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Authors: M. S. Kaiser, S. Reaz Ahmed

Abstract:

Chip formation characteristics are investigated during surface finishing of high density polyethylene (HDPE) samples using a shaper machine. Both the cutting speed and depth of cut are varied continually to enable observations under various machining conditions. The generated chips are analyzed in terms of their shape, size, and deformation. Their physical appearances are also observed using digital camera and optical microscope. The investigation shows that continuous chips are obtained for all the cutting conditions. It is observed that cutting speed is more influential than depth of cut to cause dimensional changes of chips. Chips curl radius is also found to increase gradually with the increase of cutting speed. The length of continuous chips remains always smaller than the job length, and the corresponding discrepancies are found to be more prominent at lower cutting speed. Microstructures of the chips reveal that cracks are formed at higher cutting speeds and depth of cuts, which is not that significant at low depth of cut.

Keywords: HDPE, surface-finishing, chip formation, deformation, roughness.

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Authors: Md. Anayet U. Patwari, Mohammad Ahsan Habib, Md. Tanzib Ehsan, Md Golam Ahnaf, Md. S. I. Chowdhury

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Surface roughness is one of the key quality parameters of the finished product. During any machining operation, high temperatures are generated at the tool-chip interface impairing surface quality and dimensional accuracy of products. Cutting fluids are generally applied during machining to reduce temperature at the tool-chip interface. However, usages of cutting fluids give rise to problems such as waste disposal, pollution, high cost, and human health hazard. Researchers, now-a-days, are opting towards dry machining and other cooling techniques to minimize use of coolants during machining while keeping surface roughness of products within desirable limits. In this paper, a concept of using peltier cooling effects during aluminium milling operation has been presented and adopted with an aim to improve surface roughness of the machined surface. Experimental evidence shows that peltier cooling effect provides better surface roughness of the machined surface compared to dry machining.

Keywords: Aluminium, surface roughness, Peltier cooling effect, milling operation.

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Authors: S. Karabulut, A. Güllü, A. Güldas, R. Gürbüz

Abstract:

This study investigates the effects of the lead angle and chip thickness variation on surface roughness during the machining of compacted graphite iron using ceramic cutting tools under dry cutting conditions. Analytical models were developed for predicting the surface roughness values of the specimens after the face milling process. Experimental data was collected and imported to the artificial neural network model. A multilayer perceptron model was used with the back propagation algorithm employing the input parameters of lead angle, cutting speed and feed rate in connection with chip thickness. Furthermore, analysis of variance was employed to determine the effects of the cutting parameters on surface roughness. Artificial neural network and regression analysis were used to predict surface roughness. The values thus predicted were compared with the collected experimental data, and the corresponding percentage error was computed. Analysis results revealed that the lead angle is the dominant factor affecting surface roughness. Experimental results indicated an improvement in the surface roughness value with decreasing lead angle value from 88° to 45°.

Keywords: CGI, milling, surface roughness, ANN, regression, modeling, analysis.

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Authors: Zainudin Kornain, Azman Jalar, Rozaidi Rasid, Fong Chee Seng

Abstract:

Void formation in underfill is considered as failure in flip chip manufacturing process. Void formation possibly caused by several factors such as poor soldering and flux residue during die attach process, void entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the comparison of single step and two steps curing profile towards the void and black dots formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). Statistic analysis was conducted to analyze how different factors such as wafer lot, sawing technique, underfill fillet height and curing profile recipe were affected the formation of voids and black dots. A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids and black dots. It was shown that the 2 steps curing profile provided solution for void elimination and black dots in underfill after curing process.

Keywords: black dots formation, curing profile, FC-CBGA, underfill, void formation,

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Authors: M. K. Benhaoua, A. K. Singh, A. E. H. Benyamina, A. Kumar, P. Boulet

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In this paper, we propose a new packing strategy to find a free resource for run-time mapping of application tasks to NoC-based Heterogeneous MPSoC. The proposed strategy minimizes the task mapping time in addition to placing the communicating tasks close to each other. To evaluate our approach, a comparative study is carried out for a platform containing single task supported PEs. Experiments show that our strategy provides better results when compared to latest dynamic mapping strategies reported in the literature.

Keywords: Multi-Processor Systems-on-Chip (MPSoCs), Network-on-Chip (NoC), Heterogeneous architectures, Dynamic mapping heuristics.

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Authors: Mohammad Ali Jabraeil Jamali, Ahmad Khademzadeh

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The success of an electronic system in a System-on- Chip is highly dependent on the efficiency of its interconnection network, which is constructed from routers and channels (the routers move data across the channels between nodes). Since neither classical bus based nor point to point architectures can provide scalable solutions and satisfy the tight power and performance requirements of future applications, the Network-on-Chip (NoC) approach has recently been proposed as a promising solution. Indeed, in contrast to the traditional solutions, the NoC approach can provide large bandwidth with moderate area overhead. The selected topology of the components interconnects plays prime rule in the performance of NoC architecture as well as routing and switching techniques that can be used. In this paper, we present two generic NoC architectures that can be customized to the specific communication needs of an application in order to reduce the area with minimal degradation of the latency of the system. An experimental study is performed to compare these structures with basic NoC topologies represented by 2D mesh, Butterfly-Fat Tree (BFT) and SPIN. It is shown that Cluster mesh (CMesh) and MinRoot schemes achieves significant improvements in network latency and energy consumption with only negligible area overhead and complexity over existing architectures. In fact, in the case of basic NoC topologies, CMesh and MinRoot schemes provides substantial savings in area as well, because they requires fewer routers. The simulation results show that CMesh and MinRoot networks outperforms MESH, BFT and SPIN in main performance metrics.

Keywords: MinRoot, CMesh, NoC, Topology, Performance Evaluation

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Authors: C. Kalamani, K. Paramasivam

Abstract:

In VLSI, testing plays an important role. Major problem in testing are test data volume and test power. The important solution to reduce test data volume and test time is test data compression. The Proposed technique combines the bit maskdictionary and 2n pattern run length-coding method and provides a substantial improvement in the compression efficiency without introducing any additional decompression penalty. This method has been implemented using Mat lab and HDL Language to reduce test data volume and memory requirements. This method is applied on various benchmark test sets and compared the results with other existing methods. The proposed technique can achieve a compression ratio up to 86%.

Keywords: Bit Mask dictionary, 2n pattern run length code, system-on-chip, SOC, test data compression.

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Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar

Abstract:

This work proposes an accurate crosstalk noise estimation method in the presence of multiple RLC lines for the use in design automation tools. This method correctly models the loading effects of non switching aggressors and aggressor tree branches using resistive shielding effect and realistic exponential input waveforms. Noise peak and width expressions have been derived. The results obtained are at good agreement with SPICE results. Results show that average error for noise peak is 4.7% and for the width is 6.15% while allowing a very fast analysis.

Keywords: Crosstalk, distributed RLC segments, On-Chip interconnect, output response, VLSI, noise peak, noise width.

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Authors: Guowei Hou, Lixin Yu, Wei Zhuang, Hui Qin, Xue Yang

Abstract:

Formal verification is proposed to ensure the correctness of the design and make functional verification more efficient. As cache plays a vital role in the design of System on Chip (SoC), and cache with Memory Management Unit (MMU) and cache memory unit makes the state space too large for simulation to verify, then a formal verification is presented for such system design. In the paper, a formal model checking verification flow is suggested and a new cache memory model which is called “exhaustive search model” is proposed. Instead of using large size ram to denote the whole cache memory, exhaustive search model employs just two cache blocks. For cache system contains data cache (Dcache) and instruction cache (Icache), Dcache memory model and Icache memory model are established separately using the same mechanism. At last, the novel model is employed to the verification of a cache which is module of a custom-built SoC system that has been applied in practical, and the result shows that the cache system is verified correctly using the exhaustive search model, and it makes the verification much more manageable and flexible.

Keywords: Cache system, formal verification, novel model, System on Chip (SoC).

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Authors: Shiyang Zhu, G. Q. Lo, D. L. Kwong

Abstract:

Silicon photonics is merging as a unified platform for driving photonic based telecommunications and for local photonic based interconnect but it suffers from large footprint as compared with the nanoelectronics. Plasmonics is an attractive alternative for nanophotonics. In this work, two CMOS compatible plasmonic waveguide platforms are compared. One is the horizontal metal-insulator-Si-insulator-metal nanoplasmonic waveguide and the other is metal-insulator-Si hybrid plasmonic waveguide. Various passive and active photonic devices have been experimentally demonstrated based on these two plasmonic waveguide platforms.

Keywords: Plasmonics, on-chip integration, Silicon photonics.

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Authors: Yuanyuan Zhang, Guang Sun, Li Su, Depeng Jin, Lieguang Zeng

Abstract:

Since Network-on-Chip (NoC) uses network interfaces (NIs) to improve the design productivity, by now, there have been a few papers addressing the design and implementation of a NI module. However, none of them considered the difference of address encoding methods between NoC and the traditional bus-shared architecture. On the basis of this difference, in the paper, we introduce a transmit mechanism to solve such a problem for global asynchronous locally synchronous (GALS) NoC. Furthermore, we give the concrete implementation of the NI module in this transmit mechanism. Finally, we evaluate its performance and area overhead by a VHDL-based cycle-accurate RTL model and simulation results confirm the validity of this address-oriented transmit mechanism.

Keywords: Network-on-Chip, Network Interface, Open CoreProtocol, Address.

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Authors: T. Brettschneider, C. Dorrer, H. Suy, T. Braun, E. Jung, R. Hoofman, M. Bründel, R. Zengerle, F. Lärmer

Abstract:

We present an integration approach of a CMOS biosensor into a polymer based microfluidic environment suitable for mass production. It consists of a wafer-level-package for the silicon die and laser bonding process promoted by an intermediate hot melt foil to attach the sensor package to the microfluidic chip, without the need for dispensing of glues or underfiller. A very good condition of the sensing area was obtained after introducing a protection layer during packaging. A microfluidic flow cell was fabricated and shown to withstand pressures up to Δp = 780 kPa without leakage. The employed biosensors were electrically characterized in a dry environment.

Keywords: CMOS biosensor, laser bonding, silicon polymer integration, wafer level packaging.

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Authors: Tsunwai Gary Yip

Abstract:

Phase locked loops for data links operating at 10 Gb/s or faster are low phase noise devices designed to operate with a low jitter reference clock. Characterization of their jitter transfer function is difficult because the intrinsic noise of the device is comparable to the random noise level in the reference clock signal. A linear model is proposed to account for the intrinsic noise of a PLL. The intrinsic noise data of a PLL for 10 Gb/s links is presented. The jitter transfer function of a PLL in a test chip for 12.8 Gb/s data links was determined in experiments using the 400 MHz reference clock as the source of simultaneous excitations over a wide range of frequency. The result shows that the PLL jitter transfer function can be approximated by a second order linear model.

Keywords: Intrinsic phase noise, jitter in data link, PLL jitter transfer function, high speed clocking in electronic circuit

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Authors: Imron Rosyadi, Ridha A. Djemal, Saleh A. Alshebeili

Abstract:

Design and implementation of a novel B-ACOSD CFAR algorithm is presented in this paper. It is proposed for detecting radar target in log-normal distribution environment. The BACOSD detector is capable to detect automatically the number interference target in the reference cells and detect the real target by an adaptive threshold. The detector is implemented as a System on Chip on FPGA Altera Stratix II using parallelism and pipelining technique. For a reference window of length 16 cells, the experimental results showed that the processor works properly with a processing speed up to 115.13MHz and processing time0.29 ┬Ás, thus meets real-time requirement for a typical radar system.

Keywords: CFAR, FPGA, radar.

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Authors: Lv Xiaopeng, Bian Qiang, Yue Suge

Abstract:

A fully on-chip low drop-out (LDO) voltage regulator with 100pF output load capacitor is presented. A novel frequency compensation scheme using current buffer is adopted to realize single dominant pole within the unit gain frequency of the regulation loop, the phase margin (PM) is at least 50 degree under the full range of the load current, and the power supply rejection (PSR) character is improved compared with conventional Miller compensation. Besides, the differentiator provides a high speed path during the load current transient. Implemented in 0.18μm CMOS technology, the LDO voltage regulator provides 100mA load current with a stable 1.8V output voltage consuming 80μA quiescent current.

Keywords: capacitor-less LDO, frequency compensation, transient response, power supply rejection

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Authors: Cheng-Hsuan Huang, Eric Lee

Abstract:

Electrophoretic motion of a liquid droplet within an uncharged cylindrical pore is investigated theoretically in this study. It is found that the boundary effect in terms of the reduction of droplet mobility (droplet velocity per unit strength of the applied electric field) is very significant when the double layer surrounding the droplet is thick, and diminishes as it gets very thin. Moreover, the viscosity ratio of the ambient fluid to the internal one, σ, is a crucial factor in determining its electrophoretic behavior. The boundary effect is less significant as the viscosity ratio gets high. Up to 70% mobility reduction is observed when this ratio is low (σ = 0.01), whereas only 40% reduction when it is high (σ = 100). The results of this study can be utilized in various fields of biotechnology, such as a biosensor or a lab-on-a-chip device.

Keywords: Cylindrical pore, Electrophoresis, Lab-on-a-chip, Liquid droplet

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Authors: Maria E. Manioudaki, Panayiota Poirazi

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Yeast cells live in a constantly changing environment that requires the continuous adaptation of their genomic program in order to sustain their homeostasis, survive and proliferate. Due to the advancement of high throughput technologies, there is currently a large amount of data such as gene expression, gene deletion and protein-protein interactions for S. Cerevisiae under various environmental conditions. Mining these datasets requires efficient computational methods capable of integrating different types of data, identifying inter-relations between different components and inferring functional groups or 'modules' that shape intracellular processes. This study uses computational methods to delineate some of the mechanisms used by yeast cells to respond to environmental changes. The GRAM algorithm is first used to integrate gene expression data and ChIP-chip data in order to find modules of coexpressed and co-regulated genes as well as the transcription factors (TFs) that regulate these modules. Since transcription factors are themselves transcriptionally regulated, a three-layer regulatory cascade consisting of the TF-regulators, the TFs and the regulated modules is subsequently considered. This three-layer cascade is then modeled quantitatively using artificial neural networks (ANNs) where the input layer corresponds to the expression of the up-stream transcription factors (TF-regulators) and the output layer corresponds to the expression of genes within each module. This work shows that (a) the expression of at least 33 genes over time and for different stress conditions is well predicted by the expression of the top layer transcription factors, including cases in which the effect of up-stream regulators is shifted in time and (b) identifies at least 6 novel regulatory interactions that were not previously associated with stress-induced changes in gene expression. These findings suggest that the combination of gene expression and protein-DNA interaction data with artificial neural networks can successfully model biological pathways and capture quantitative dependencies between distant regulators and downstream genes.

Keywords: gene modules, artificial neural networks, yeast, stress

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Authors: S. Saraç, F. Kara, C.Vural

Abstract:

High-frequency (HF) communications have been used by military organizations for more than 90 years. The opportunity of very long range communications without the need for advanced equipment makes HF a convenient and inexpensive alternative of satellite communications. Besides the advantages, voice and data transmission over HF is a challenging task, because the HF channel generally suffers from Doppler shift and spread, multi-path, cochannel interference, and many other sources of noise. In constructing an HF data modem, all these effects must be taken into account. STANAG 4539 is a NATO standard for high-speed data transmission over HF. It allows data rates up to 12800 bps over an HF channel of 3 kHz. In this work, an efficient implementation of STANAG 4539 on a single Texas Instruments- TMS320C6747 DSP chip is described. The state-of-the-art algorithms used in the receiver and the efficiency of the implementation enables real-time high-speed data / digitized voice transmission over poor HF channels.

Keywords: High frequency, modem, STANAG 4539.

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Authors: Qimin Yang

Abstract:

In this paper, 3X3 routing nodes are proposed to provide speedup and parallel processing capability in Data Vortex network architectures. The new design not only significantly improves network throughput and latency, but also eliminates the need for distributive traffic control mechanism originally embedded among nodes and the need for nodal buffering. The cost effectiveness is studied by a comparison study with the previously proposed 2- input buffered networks, and considerable performance enhancement can be achieved with similar or lower cost of hardware. Unlike previous implementation, the network leaves small probability of contention, therefore, the packet drop rate must be kept low for such implementation to be feasible and attractive, and it can be achieved with proper choice of operation conditions.

Keywords: Data Vortex, Packet Switch, Interconnection network, deflection, Network-on-chip

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Authors: Kamaraju.M, Lal Kishore.K, Tilak.A.V.N

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The general purpose processors that are used in embedded systems must support constraints like execution time, power consumption, code size and so on. On the other hand an Application Specific Instruction-set Processor (ASIP) has advantages in terms of power consumption, performance and flexibility. In this paper, a 16-bit Application Specific Instruction-set processor for the sensor data transfer is proposed. The designed processor architecture consists of on-chip transmitter and receiver modules along with the processing and controlling units to enable the data transmission and reception on a single die. The data transfer is accomplished with less number of instructions as compared with the general purpose processor. The ASIP core operates at a maximum clock frequency of 1.132GHz with a delay of 0.883ns and consumes 569.63mW power at an operating voltage of 1.2V. The ASIP is implemented in Verilog HDL using the Xilinx platform on Virtex4.

Keywords: ASIP, Data transfer, Instruction set, Processor

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Authors: Dmytro Ostroushko, Karel Saksl, Carsten Siemers, Zuzana Rihova

Abstract:

Titanium alloys like Ti-6Al-2Sn-4Zr-6Mo (Ti- 6246) are widely used in aerospace applications. Component manufacturing, however, is difficult and expensive as their machinability is extremely poor. A thorough understanding of the chip formation process is needed to improve related metal cutting operations.In the current study, orthogonal cutting experiments have been performed and theresulting chips were analyzed by optical microscopy and scanning electron microscopy.Chips from aTi- 6246ingot were produced at different cutting speeds and cutting depths. During the experiments, depending of the cutting conditions, continuous or segmented chips were formed. Narrow, highly deformed and grain oriented zones, the so-called shear zone, separated individual segments. Different material properties have been measured in the shear zones and the segments.

Keywords: Titanium alloy, Ti-6246, chip formation, machining, shear zone, microstructure

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Authors: Sherif K. El Dyasti, Esam A. Hagras, Adel E. El-Hennawy

Abstract:

This paper addresses the performance of antenna array beamforming on Chip-Interleaved Code Division Multiple Access (CI_CDMA) system based on Minimum Mean Square Error (MMSE) detector in aeronautical mobile radio channel. Multipath fading, Doppler shifts caused by the speed of the aircraft, and Multiple Access Interference (MAI) are the most important reasons that affect and reduce the performance of aeronautical system. In this paper we suggested the CI-CDMA with antenna array to combat this fading and improve the bit error rate (BER) performance. We further evaluate the performance of the proposed system in the four standard scenarios in aeronautical mobile radio channel.

Keywords: Aeronautical Channel, CI-CDMA, Beamforming.

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