Search results for: 3D microfluidic chip

Authors: Ssu-Han Chen, Der-Baau Perng

Abstract:

Molding process in IC manufacturing secures chips against the harms done by hot, moisture or other external forces. While a chip was being molded,defects like cracks, dilapidation, or voids may be embedding on the molding surface. The molding surfaces the study poises to treat and the ones on the market, though, differ in the surface where texture similar to defects is everywhere. Manual inspection usually passes over low-contrast cracks or voids; hence an automatic optical inspection system for molding surface is necessary. The proposed system is consisted of a CCD, a coaxial light, a back light as well as a motion control unit. Based on the property of statistical textures of the molding surface, a series of digital image processing and classification procedure is carried out. After training of the parameter associated with above algorithm, result of the experiment suggests that the accuracy rate is up to 93.75%, contributing to the inspection quality of IC molding surface.

Keywords: Molding surface, machine vision, statistical texture, discrete Fourier transformation.

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Authors: Nor Maniha Abdul Ghani, Faradila Naim, Tan Piow Yon

Abstract:

This project focuses on the development of a line follower algorithm for a Two Wheels Balancing Robot. In this project, ATMEGA32 is chosen as the brain board controller to react towards the data received from Balance Processor Chip on the balance board to monitor the changes of the environment through two infra-red distance sensor to solve the inclination angle problem. Hence, the system will immediately restore to the set point (balance position) through the implementation of internal PID algorithms at the balance board. Application of infra-red light sensors with the PID control is vital, in order to develop a smooth line follower robot. As a result of combination between line follower program and internal self balancing algorithms, we are able to develop a dynamically stabilized balancing robot with line follower function.

Keywords: infra-red sensor, PID algorithms, line followerBalancing robot

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Authors: Bahram Talebjedi, Emily Earl, Mina Hoorfar

Abstract:

One of the issues that arises with microscale lab-on-a-chip technology is that the laminar flow within the microchannels limits the mixing of fluids. To combat this, micromixers have been introduced as a means to try and incorporate turbulence into the flow to better aid the mixing process. This study presents an electroosmotic micromixer that balances vortex generation and degeneration with the inlet flow velocity to greatly increase the mixing efficiency. A comprehensive parametric study was performed to evaluate the role of the relevant parameters on the mixing efficiency. It was observed that the suggested micromixer is perfectly suited for biological applications due to its low pressure drop (below 10 Pa) and low shear rate. The proposed micromixer with optimized working parameters is able to attain a mixing efficiency of 95% in a span of 0.5 seconds using a frequency of 10 Hz, a voltage of 0.7 V, and an inlet velocity of 0.366 mm/s.

Keywords: Microfluidics, active mixer, pulsed AC electroosmosis flow, micromixer.

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Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar

Abstract:

The resistive-inductive-capacitive behavior of long interconnects which are driven by CMOS gates are presented in this paper. The analysis is based on the ¤Ç-model of a RLC load and is developed for submicron devices. Accurate and analytical expressions for the output load voltage, the propagation delay and the short circuit power dissipation have been proposed after solving a system of differential equations which accurately describe the behavior of the circuit. The effect of coupling capacitance between input and output and the short circuit current on these performance parameters are also incorporated in the proposed model. The estimated proposed delay and short circuit power dissipation are in very good agreement with the SPICE simulation with average relative error less than 6%.

Keywords: Delay, Inverter, Short Circuit Power, ¤Ç-Model, RLCInterconnect, VLSI

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Authors: Massoud Masoumi, Hosseyn Mahdizadeh

Abstract:

A new and highly efficient architecture for elliptic curve scalar point multiplication which is optimized for a binary field recommended by NIST and is well-suited for elliptic curve cryptographic (ECC) applications is presented. To achieve the maximum architectural and timing improvements we have reorganized and reordered the critical path of the Lopez-Dahab scalar point multiplication architecture such that logic structures are implemented in parallel and operations in the critical path are diverted to noncritical paths. With G=41, the proposed design is capable of performing a field multiplication over the extension field with degree 163 in 11.92 s with the maximum achievable frequency of 251 MHz on Xilinx Virtex-4 (XC4VLX200) while 22% of the chip area is occupied, where G is the digit size of the underlying digit-serial finite field multiplier.

Keywords: Elliptic curve cryptography, FPGA implementation, scalar point multiplication.

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Authors: Ziba Omidi, Min-Ki Kim

Abstract:

This research presents the design, fabrication and application of a flavor sensor for an integrated electronic tongue and electronic nose that can allow rapid characterization of multi-component mixtures in a solution. The odor gas and liquid are separated using hydrophobic porous membrane in micro fluidic channel. The sensor uses an array composed of microbeads in micromachined cavities localized on silicon wafer. Sensing occurs via colorimetric and fluorescence changes to receptors and indicator molecules that are attached to termination sites on the polymeric microbeads. As a result, the sensor array system enables simultaneous and near-real-time analyses using small samples and reagent volumes with the capacity to incorporate significant redundancies. One of the key parts of the system is a passive pump driven only by capillary force. The hydrophilic surface of the fluidic structure draws the sample into the sensor array without any moving mechanical parts. Since there is no moving mechanical component in the structure, the size of the fluidic structure can be compact and the fabrication becomes simple when compared to the device including active microfluidic components. These factors should make the proposed system inexpensive to mass-produce, portable and compatible with biomedical applications.

Keywords: Optical Sensor, Semiconductor manufacturing, Smell sensor, Taste sensor.

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Authors: Yu Chen, Weiwei Ren, Xiaojing Mu, Feng Zhang, Yi Xu

Abstract:

The superhydrophobic surface is widely used to reduce friction for the flow inside micro-channel and can be used to control/manipulate fluid, cells and even proteins in lab-on-chip. Fabricating micro grooves on hydrophobic surfaces is a common method to obtain such superhydrophobic surface. This study utilized the numerical method to investigate the effect of eccentric micro-grooves on the friction of flow inside micro-channel. A detailed parametric study was conducted to reveal how the eccentricity of micro-grooves affects the micro-channel flow under different grooves sizes, channel heights, Reynolds number. The results showed that the superhydrophobic surface with eccentric micro-grooves induces less friction than the counter part with aligning micro-grooves, which means requiring less power for pumps.

Keywords: Superhydrophobic, transverse grooves, heat transfer, slip length, microfluidics.

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Authors: L. Lancaster, M. H. Lung, D. Sujan

Abstract:

The application of agro-industrial waste in Aluminum Metal Matrix Composites has been getting more attention as they can reinforce particles in metal matrix which enhance the strength properties of the composites. In addition, by applying these agroindustrial wastes in useful way not only save the manufacturing cost of products but also reduce the pollutions on environment. This paper represents a literature review on a range of industrial wastes and their utilization in metal matrix composites. The paper describes the synthesis methods of agro-industrial waste filled metal matrix composite materials and their mechanical, wear, corrosion, and physical properties. It also highlights the current application and future potential of agro-industrial waste reinforced composites in aerospace, automotive and other construction industries.

Keywords: Bond layer, Interfacial shear stress, Bi-layered assembly, Thermal mismatch, Flip Chip Ball Grid Array.

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Authors: Tsunwai Gary Yip

Abstract:

Phase locked loops for data links operating at 10 Gb/s or faster are low phase noise devices designed to operate with a low jitter reference clock. Characterization of their jitter transfer function is difficult because the intrinsic noise of the device is comparable to the random noise level in the reference clock signal. A linear model is proposed to account for the intrinsic noise of a PLL. The intrinsic noise data of a PLL for 10 Gb/s links is presented. The jitter transfer function of a PLL in a test chip for 12.8 Gb/s data links was determined in experiments using the 400 MHz reference clock as the source of simultaneous excitations over a wide range of frequency. The result shows that the PLL jitter transfer function can be approximated by a second order linear model.

Keywords: Intrinsic phase noise, jitter in data link, PLL jitter transfer function, high speed clocking in electronic circuit

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Authors: Jihyung Kim, Taejin Kim, Sungho Park, Jun-Dong Cho

Abstract:

In this paper, we address the problem of reducing the switching activity (SA) in on-chip buses through the use of a bus binding technique in high-level synthesis. While many binding techniques to reduce the SA exist, we present yet another technique for further reducing the switching activity. Our proposed method combines bus binding and data sequence reordering to explore a wider solution space. The problem is formulated as a multiple traveling salesman problem and solved using simulated annealing technique. The experimental results revealed that a binding solution obtained with the proposed method reduces 5.6-27.2% (18.0% on average) and 2.6-12.7% (6.8% on average) of the switching activity when compared with conventional binding-only and hybrid binding-encoding methods, respectively.

Keywords: low power, bus binding, switching activity, multiple traveling salesman problem, data sequence reordering

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Authors: Shiyang Zhu, G. Q. Lo, D. L. Kwong

Abstract:

Silicon photonics has generated an increasing interest in recent years mainly for optical communications optical interconnects in microelectronic circuits or bio-sensing applications. The development of elementary passive and active components (including detectors and modulators), which are mainly fabricated on the silicon on insulator platform for CMOS-compatible fabrication, has reached such a performance level that the integration challenge of silicon photonics with microelectronic circuits should be addressed. Since crystalline silicon can only be grown from another silicon crystal, making it impossible to deposit in this state, the optical devices are typically limited to a single layer. An alternative approach is to integrate a photonic layer above the CMOS chip using back-end CMOS fabrication process. In this paper, various materials, including silicon nitride, amorphous silicon, and polycrystalline silicon, for this purpose are addressed.

Keywords: Silicon photonics, CMOS, Integration.

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Authors: Kamaraju.M, Lal Kishore.K, Tilak.A.V.N

Abstract:

The general purpose processors that are used in embedded systems must support constraints like execution time, power consumption, code size and so on. On the other hand an Application Specific Instruction-set Processor (ASIP) has advantages in terms of power consumption, performance and flexibility. In this paper, a 16-bit Application Specific Instruction-set processor for the sensor data transfer is proposed. The designed processor architecture consists of on-chip transmitter and receiver modules along with the processing and controlling units to enable the data transmission and reception on a single die. The data transfer is accomplished with less number of instructions as compared with the general purpose processor. The ASIP core operates at a maximum clock frequency of 1.132GHz with a delay of 0.883ns and consumes 569.63mW power at an operating voltage of 1.2V. The ASIP is implemented in Verilog HDL using the Xilinx platform on Virtex4.

Keywords: ASIP, Data transfer, Instruction set, Processor

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Authors: Jin-Ho Bae, Yong-Tae Kim, S K Deb Nath, Seo-Ik Kang, Sung-Gaun Kim

Abstract:

Reno-pin contact test is a method that is controlled by DC motor used to characterize electronic chips. This method is used in electronic and telecommunication devices. A new electric performance testing system is developed in which the testing method is controlled by using Piezoelectric Transducer (PZT) instead of DC motor which reduces vibration and noise. The vertical displacement of the Reno-pin is very short in the Reno-pin contact testing system. Now using a flexible guide in the new Reno-pin contact system, the vertical movement of the Reno-pin is increased many times of the existing Reno-pin contact testing method using DC motor. Using the present electric performance testing system with a flexible hinge and PZT instead of DC motor, manufacturing of electronic chips are able to characterize chips with low cost and high speed.

Keywords: PZT Actuator, Chip test, Mechanical amplifier

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Authors: Kah-Hyong Chang, Xin Liu, Jia Hao Cheong, Saisundar Sankaranarayanan, Dexing Pang, Hongzhao Zheng

Abstract:

A digital baseband Application-Specific Integrated Circuit (ASIC) (yclic Redundancy Checkis developed for a microchip transponder to transmit signals and temperature levels from biomedical monitoring devices. The transmission protocol is adapted from the ISO/IEC 11784/85 standard. The module has a decimation filter that employs only a single adder-subtractor in its datapath. The filtered output is coded with cyclic redundancy check and transmitted through backscattering Load Shift Keying (LSK) modulation to a reader. Fabricated using the 0.18-μm CMOS technology, the module occupies 0.116 mm² in chip area (digital baseband: 0.060 mm², decimation filter: 0.056 mm²), and consumes a total of less than 0.9 μW of power (digital baseband: 0.75 μW, decimation filter: 0.14 μW).

Keywords: Biomedical sensor, decimation filter, Radio Frequency Integrated Circuit (RFIC) baseband, temperature sensor.

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Authors: Abhijit Chandra, Sudipta Chattopadhyay

Abstract:

In this communication, we have made an attempt to design multiplier-less low-pass finite impulse response (FIR) filter with the aid of various mutation strategies of Differential Evolution (DE) algorithm. Impulse response coefficient of the designed FIR filter has been represented as sums or differences of powers of two. Performance of the proposed filter has been evaluated in terms of its frequency response and associated hardware cost. Supremacy of our approach has been substantiated by comparing our result with many of the existing multiplier-less filter design algorithms of recent interest. It has also been demonstrated that DE-optimized filter outperforms Genetic Algorithm (GA) based design by a large margin.  Hardware efficiency of our algorithm has further been validated by implementing those filters on a Field Programmable Gate Array (FPGA) chip.

Keywords: Convergence speed, Differential Evolution (DE), error histogram, finite impulse response (FIR) filter, total power of two (TPT), zero-valued filter coefficient (ZFC).

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Authors: Y. Li, Q. S. Zhang, H. Z. Huang, B. Y. Wu

Abstract:

The mechanism behind the electromigration and thermomigration failure in flip-chip solder joints with Cu-pillar bumps was investigated in this paper through using finite element method. Hot spot and the current crowding occurrs in the upper corner of copper column instead of solders of the common solder ball. The simulation results show that the change in thermal gradient is noticeable, which might greatly affect the reliability of solder joints with Cu-pillar bumps under current stressing. When the average applied current density is increased from 1×104 A/cm2 to 3×104 A/cm2 in solders, the thermal gradient would increase from 74 K/cm to 901 K/cm at an ambient temperature of 25°C. The force from thermal gradient of 901 K/cm can nearly induce thermomigration by itself. With the increase in applied current, the thermal gradient is growing. It is proposed that thermomigration likely causes a serious reliability issue for Cu column based interconnects.

Keywords: Simulation, Cu-pillar bumps, Electromigration, Thermomigration.

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Authors: S. Saraç, F. Kara, C.Vural

Abstract:

High-frequency (HF) communications have been used by military organizations for more than 90 years. The opportunity of very long range communications without the need for advanced equipment makes HF a convenient and inexpensive alternative of satellite communications. Besides the advantages, voice and data transmission over HF is a challenging task, because the HF channel generally suffers from Doppler shift and spread, multi-path, cochannel interference, and many other sources of noise. In constructing an HF data modem, all these effects must be taken into account. STANAG 4539 is a NATO standard for high-speed data transmission over HF. It allows data rates up to 12800 bps over an HF channel of 3 kHz. In this work, an efficient implementation of STANAG 4539 on a single Texas Instruments- TMS320C6747 DSP chip is described. The state-of-the-art algorithms used in the receiver and the efficiency of the implementation enables real-time high-speed data / digitized voice transmission over poor HF channels.

Keywords: High frequency, modem, STANAG 4539.

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Authors: Sadi Vural, Hiromi Tomii, Hironori Yamauchi

Abstract:

As the development of digital technology is increasing, Digital cinema is getting more spread. However, content copy and attack against the digital cinema becomes a serious problem. To solve the above security problem, we propose “Additional Watermarking" for digital cinema delivery system. With this proposed “Additional watermarking" method, we protect content copyrights at encoder and user side information at decoder. It realizes the traceability of the watermark embedded at encoder. The watermark is embedded into the random-selected frames using Hash function. Using it, the embedding position is distributed by Hash Function so that third parties do not break off the watermarking algorithm. Finally, our experimental results show that proposed method is much better than the convenient watermarking techniques in terms of robustness, image quality and its simple but unbreakable algorithm.

Keywords: Decoder, Digital content, JPEG2000 Frame, System-On-Chip and additional watermark.

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Authors: Sadi Vural, Hiromi Tomii, Hironori Yamauchi

Abstract:

As far as the latest technological improvements are concerned, digital systems more become popular than the past. Despite this growing demand to the digital systems, content copy and attack against the digital cinema contents becomes a serious problem. To solve the above security problem, we propose “traceable watermarking using Hash functions for digital cinema system. Digital Cinema is a great application for traceable watermarking since it uses watermarking technology during content play as well as content transmission. The watermark is embedded into the randomly selected movie frames using CRC-32 techniques. CRC-32 is a Hash function. Using it, the embedding position is distributed by Hash Function so that any party cannot break off the watermarking or will not be able to change. Finally, our experimental results show that proposed DWT watermarking method using CRC-32 is much better than the convenient watermarking techniques in terms of robustness, image quality and its simple but unbreakable algorithm.

Keywords: Decoder, Digital content, JPEG2000 Frame, System-On-Chip, traceable watermark, Hash Function, CRC-32.

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Authors: M. Mottaghi, F. Ghalichi, H. Badri Ghavifekr, H. Niroomand Oskui

Abstract:

This paper presents design and characterization of a microaccelerometer designated for integration into cataract surgical probe to detect hardness of different eye tissues during cataract surgery. Soft posterior lens capsule of eye can be easily damaged in comparison with hard opaque lens since the surgeon can not see directly behind cutting needle during the surgery. Presence of microsensor helps the surgeon to avoid rupturing posterior lens capsule which if occurs leads to severe complications such as glaucoma, infection, or even blindness. The microsensor having overall dimensions of 480 μm x 395 μm is able to deliver significant capacitance variations during encountered vibration situations which makes it capable to distinguish between different types of tissue. Integration of electronic components on chip ensures high level of reliability and noise immunity while minimizes space and power requirements. Physical characteristics and results on performance testing, proves integration of microsensor as an effective tool to aid the surgeon during this procedure.

Keywords: Cataract surgery, MEMS, Microsensor, Phacoemulsification.

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Authors: Hyun-Young Kim, Chung-Kwang Lee, Han-Hee Cho, Sang-Woon Cho, Yong-Seo Koo

Abstract:

In this paper, we proposed a novel SCR (Silicon Controlled Rectifier) - based ESD (Electrostatic Discharge) protection device for I/O and power clamp. The proposed device has a higher holding voltage characteristic than conventional SCR. These characteristics enable to have latch-up immunity under normal operating conditions as well as superior full chip ESD protection. The proposed device was analyzed to figure out electrical characteristics and tolerance robustness in term of individual design parameters (D1, D2, D3). They are investigated by using the Synopsys TCAD simulator. As a result of simulation, holding voltage increased with different design parameters. The holding voltage of the proposed device changes from 3.3V to 7.9V. Also, N-Stack structure ESD device with the high holding voltage is proposed. In the simulation results, 2-stack has holding voltage of 6.8V and 3-stack has holding voltage of 10.5V. The simulation results show that holding voltage of stacking structure can be larger than the operation voltage of high-voltage application.

Keywords: ESD, SCR, holding voltage, stack, power clamp.

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Authors: Luc Conti, Dimitry Dumont-Fillon, Harald van Lintel, Eric Chappel

Abstract:

Flow control valves comprise a silicon flexible membrane that deflects against a substrate, usually made of glass, containing pillars, an outlet hole, and anti-stiction features. However, there is a strong interest in using silicon instead of glass as substrate material, as it would simplify the process flow by allowing the use of well controlled anisotropic etching. Moreover, specific devices demanding a bending of the substrate would also benefit from the inherent outstanding mechanical strength of monocrystalline silicon. Unfortunately, direct Si-Si bonding is not easily achieved with highly structured wafers since residual stress may prevent the good adhesion between wafers. Using a thermoplastic polymer, such as parylene, as intermediate layer is not well adapted to this design as the wafer-to-wafer alignment is critical. An alternative anodic bonding method using an intermediate borosilicate layer has been successfully tested. This layer has been deposited onto the silicon substrate. The bonding recipe has been adapted to account for the presence of the SOI buried oxide and intermediate glass layer in order not to exceed the breakdown voltage. Flow control valves dedicated to infusion of viscous fluids at very high pressure have been made and characterized. The results are compared to previous data obtained using the standard anodic bonding method.

Keywords: Anodic bonding, evaporated glass, microfluidic valve, drug delivery.

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Authors: Sadílek M., Čep R.

Abstract:

This work deals with problems of tool axis inclination angles in ball-end milling. Tool axis inclination angle contributes to improvement of functional surface properties (surface integrity - surface roughness, residual stress, micro hardness, etc.), decreasing cutting forces and improving production. By milling with ball-end milling tool, using standard way of cutting, when work piece and cutting tool contain right angle, we have zero cutting speed on edge. At this point cutting tool only pushes material into the work piece. Here we can observe the following undesirable effects - chip contraction, increasing of cutting temperature, increasing vibrations or creation of built-up edge. These effects have negative results – low quality of surface and decreasing of tool life (in the worse case even it is pinching out). These effects can be eliminated with the tilt of cutting tool or tilt of work piece.

Keywords: CAD/CAM system, tool axis inclination angle, ballend milling, surface roughness, cutting forces.

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Authors: M. M. Abutaleb, A. Hamdy, M. E. Abuelwafa, E. M. Saad

Abstract:

Optical flow is a research topic of interest for many years. It has, until recently, been largely inapplicable to real-time applications due to its computationally expensive nature. This paper presents a new reliable flow technique which is combined with a motion detection algorithm, from stationary camera image streams, to allow flow-based analyses of moving entities, such as rigidity, in real-time. The combination of the optical flow analysis with motion detection technique greatly reduces the expensive computation of flow vectors as compared with standard approaches, rendering the method to be applicable in real-time implementation. This paper describes also the hardware implementation of a proposed pipelined system to estimate the flow vectors from image sequences in real time. This design can process 768 x 576 images at a very high frame rate that reaches to 156 fps in a single low cost FPGA chip, which is adequate for most real-time vision applications.

Keywords: Optical flow, motion detection, real-time systems, FPGA.

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Authors: A. Pedram, M. R. Jamali, T. Pedram, S. M. Fakhraie, C. Lucas

Abstract:

Local Linear Neuro-Fuzzy Models (LLNFM) like other neuro- fuzzy systems are adaptive networks and provide robust learning capabilities and are widely utilized in various applications such as pattern recognition, system identification, image processing and prediction. Local linear model tree (LOLIMOT) is a type of Takagi-Sugeno-Kang neuro fuzzy algorithm which has proven its efficiency compared with other neuro fuzzy networks in learning the nonlinear systems and pattern recognition. In this paper, a dedicated reconfigurable and parallel processing hardware for LOLIMOT algorithm and its applications are presented. This hardware realizes on-chip learning which gives it the capability to work as a standalone device in a system. The synthesis results on FPGA platforms show its potential to improve the speed at least 250 of times faster than software implemented algorithms.

Keywords: LOLIMOT, hardware, neurofuzzy systems, reconfigurable, parallel.

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Authors: Zhenhuan Zhu, David Mulvaney, Vassilios Chouliaras

Abstract:

A new genetic algorithm, termed the 'optimum individual monogenetic genetic algorithm' (OIMGA), is presented whose properties have been deliberately designed to be well suited to hardware implementation. Specific design criteria were to ensure fast access to the individuals in the population, to keep the required silicon area for hardware implementation to a minimum and to incorporate flexibility in the structure for the targeting of a range of applications. The first two criteria are met by retaining only the current optimum individual, thereby guaranteeing a small memory requirement that can easily be stored in fast on-chip memory. Also, OIMGA can be easily reconfigured to allow the investigation of problems that normally warrant either large GA populations or individuals many genes in length. Local convergence is achieved in OIMGA by retaining elite individuals, while population diversity is ensured by continually searching for the best individuals in fresh regions of the search space. The results given in this paper demonstrate that both the performance of OIMGA and its convergence time are superior to those of a range of existing hardware GA implementations.

Keywords: Genetic algorithms, genetic hardware, machinelearning.

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Authors: Ionel Zagan, Vasile Gheorghita Gaitan

Abstract:

The development of CPUs and of real-time systems based on them made it possible to use time at increasingly low resolutions. Together with the scheduling methods and algorithms, time organizing has been improved so as to respond positively to the need for optimization and to the way in which the CPU is used. This presentation contains both a detailed theoretical description and the results obtained from research on improving the performances of the nMPRA (Multi Pipeline Register Architecture) processor by implementing specific functions in hardware. The proposed CPU architecture has been developed, simulated and validated by using the FPGA Virtex-7 circuit, via a SoC project. Although the nMPRA processor hardware structure with five pipeline stages is very complex, the present paper presents and analyzes the tests dedicated to the implementation of the CPU and of the memory on-chip for instructions and data. In order to practically implement and test the entire SoC project, various tests have been performed. These tests have been performed in order to verify the drivers for peripherals and the boot module named Bootloader.

Keywords: Hardware scheduler, nMPRA processor, real-time systems, scheduling methods.

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Authors: Michalis D. Galanis, Gregory Dimitroulakos, Costas E. Goutis

Abstract:

Speedups from mapping four real-life DSP applications on an embedded system-on-chip that couples coarsegrained reconfigurable logic with an instruction-set processor are presented. The reconfigurable logic is realized by a 2-Dimensional Array of Processing Elements. A design flow for improving application-s performance is proposed. Critical software parts, called kernels, are accelerated on the Coarse-Grained Reconfigurable Array. The kernels are detected by profiling the source code. For mapping the detected kernels on the reconfigurable logic a prioritybased mapping algorithm has been developed. Two 4x4 array architectures, which differ in their interconnection structure among the Processing Elements, are considered. The experiments for eight different instances of a generic system show that important overall application speedups have been reported for the four applications. The performance improvements range from 1.86 to 3.67, with an average value of 2.53, compared with an all-software execution. These speedups are quite close to the maximum theoretical speedups imposed by Amdahl-s law.

Keywords: Reconfigurable computing, Coarse-grained reconfigurable array, Embedded systems, DSP, Performance

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Authors: Wei Yi Lim, M. Annamalai Arasu, M. Kumarasamy Raja, Minkyu Je

Abstract:

In this paper, the design of wide-swing constant transconductance (g_m) bias circuit that generates bias voltage for low-noise amplifier (LNA) circuit design by using an off-chip resistor is demonstrated. The overall transconductance (G_m) generated by the constant g_m bias circuit is important to maintain the overall gain and noise figure of the LNA circuit. Therefore, investigation is performed to study the variation in G_m with process, temperature and supply voltage (PVT).  Temperature and supply voltage are swept from -10 °C to 85 °C and 1.425 V to 1.575 V respectively, while the process conditions are also varied to the extreme and the g_m variation is eventually concluded at between -3 % to 7 %. With the slight variation in the g_m value, through simulation, at worst condition of state SS, we are able to attain a conversion gain (S₂₁) variation of -3.10 % and a noise figure (NF) variation of 18.71 %. The whole constant g_m circuit draws approximately 100 µA from a 1.5V supply and is designed based on 0.13 µm CMOS process. 

Keywords: Transconductance, LNA, temperature, process.

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Authors: Zia Abbas, Giuseppe Scotti, Mauro Olivieri

Abstract:

Current mode circuits like current conveyors are getting significant attention in current analog ICs design due to their higher band-width, greater linearity, larger dynamic range, simpler circuitry, lower power consumption and less chip area. The second generation current controlled conveyor (CCCII) has the advantage of electronic adjustability over the CCII i.e. in CCCII; adjustment of the X-terminal intrinsic resistance via a bias current is possible. The presented approach is based on the CMOS implementation of second generation positive (CCCII+), negative (CCCII-) and dual Output Current Controlled Conveyor (DOCCCII) and its application as Universal filter. All the circuits have been designed and simulated using 65nm CMOS technology model parameters on Cadence Virtuoso / Spectre using 1V supply voltage. Various simulations have been carried out to verify the linearity between output and input ports, range of operation frequency, etc. The outcomes show good agreement between expected and experimental results.

Keywords: CCCII+, CCCII-, DOCCCII, Electronic tunability, Universal filter

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