Search results for: equivalent thermal circuit.
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 2142

Search results for: equivalent thermal circuit.

1992 A Test Methodology to Measure the Open-Loop Voltage Gain of an Operational Amplifier

Authors: Maninder Kaur Gill, Alpana Agarwal

Abstract:

It is practically not feasible to measure the open-loop voltage gain of the operational amplifier in the open loop configuration. It is because the open-loop voltage gain of the operational amplifier is very large. In order to avoid the saturation of the output voltage, a very small input should be given to operational amplifier which is not possible to be measured practically by a digital multimeter. A test circuit for measurement of open loop voltage gain of an operational amplifier has been proposed and verified using simulation tools as well as by experimental methods on breadboard. The main advantage of this test circuit is that it is simple, fast, accurate, cost effective, and easy to handle even on a breadboard. The test circuit requires only the device under test (DUT) along with resistors. This circuit has been tested for measurement of open loop voltage gain for different operational amplifiers. The underlying goal is to design testable circuits for various analog devices that are simple to realize in VLSI systems, giving accurate results and without changing the characteristics of the original system. The DUTs used are LM741CN and UA741CP. For LM741CN, the simulated gain and experimentally measured gain (average) are calculated as 89.71 dB and 87.71 dB, respectively. For UA741CP, the simulated gain and experimentally measured gain (average) are calculated as 101.15 dB and 105.15 dB, respectively. These values are found to be close to the datasheet values.

Keywords: Device under test, open-loop voltage gain, operational amplifier, test circuit.

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1991 Assessing and Evaluating the Course Outcomes of Electrical Circuit Course for Bachelor of Science in Electrical and Electronic Engineering Program

Authors: Muhibul Haque Bhuyan, Sher Shermin Azmiri Khan

Abstract:

At present, it is an imperative and stimulating task to grow the concepts and skills of undergraduate students in any course. Educators must build up students' higher-order complex and critical thinking abilities. But many of them find it difficult to assess and evaluate these abilities of students who undertake their courses during undergraduate studies. In this research work, a simple assessment and evaluation process for the electrical circuit course of the undergraduate Electrical and Electronic Engineering (EEE) program is reported using the Outcome-Based Education (OBE) approach. The methodology of the work, course contents design, course outcomes (COs) preparation and mapping it with program outcomes (POs), question setting following Bloom's taxonomy, assessment strategy of the students, CO and PO evaluation records, statistics, and charts have been reported for a student-cohort of electrical circuit course taken in Spring 2019 Semester at EEE Department of Southeast University (SEU). It is found that the benchmark fixed by the course instructor has been achieved by the students of that course through CO assessment and evaluation. Recommendations of the course teacher for further quality enhancement based on CO achievement are also presented.

Keywords: OBE, COs, POs, assessment and evaluation, electrical circuit course.

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1990 Comparative Study of Ant Colony and Genetic Algorithms for VLSI Circuit Partitioning

Authors: Sandeep Singh Gill, Rajeevan Chandel, Ashwani Chandel

Abstract:

This paper presents a comparative study of Ant Colony and Genetic Algorithms for VLSI circuit bi-partitioning. Ant colony optimization is an optimization method based on behaviour of social insects [27] whereas Genetic algorithm is an evolutionary optimization technique based on Darwinian Theory of natural evolution and its concept of survival of the fittest [19]. Both the methods are stochastic in nature and have been successfully applied to solve many Non Polynomial hard problems. Results obtained show that Genetic algorithms out perform Ant Colony optimization technique when tested on the VLSI circuit bi-partitioning problem.

Keywords: Partitioning, genetic algorithm, ant colony optimization, non-polynomial hard, netlist, mutation.

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1989 Innovative Techniques for Characterization of Nonwoven Insulation Materials Embedded with Aerogel

Authors: Mohanapriya Venkataraman, Rajesh Mishra, Jakub Weiner, Adnan Mazari, Jiri Militky, Veera Kumar Arumugam

Abstract:

The major objective of this study is to understand the potential of a newly fabricated equipment to study the thermal properties of nonwoven textile fabrics treated with aerogel at subzero temperatures. Thermal conductivity was calculated by using the empirical relation Fourier’s law, The relationship between the thermal conductivity and thermal resistance of the samples were studied at various environmental temperatures (which was set in the clima temperature system between +25oC to -25oC). The newly fabricated equipment was found to be a suitable for measuring at subzero temperatures. This field of measurements is being developed and will be the subject of further research which will be more suitable for measurement of the various thermal characteristics.

Keywords: Thermal Measurements, Aerogel, Nonwoven, Hot plate Heading.

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1988 A Study on the Condition Monitoring of Transmission Line by On-line Circuit Parameter Measurement

Authors: Il Dong Kim, Jin Rak Lee, Young Jun Ko, Young Taek Jin

Abstract:

An on-line condition monitoring method for transmission line is proposed using electrical circuit theory and IT technology in this paper. It is reasonable that the circuit parameters such as resistance (R), inductance (L), conductance (g) and capacitance (C) of a transmission line expose the electrical conditions and physical state of the line. Those parameters can be calculated from the linear equation composed of voltages and currents measured by synchro-phasor measurement technique at both end of the line. A set of linear voltage drop equations containing four terminal constants (A, B ,C ,D ) are mathematical models of the transmission line circuits. At least two sets of those linear equations are established from different operation condition of the line, they may mathematically yield those circuit parameters of the line. The conditions of line connectivity including state of connecting parts or contacting parts of the switching device may be monitored by resistance variations during operation. The insulation conditions of the line can be monitored by conductance (g) and capacitance(C) measurements. Together with other condition monitoring devices such as partial discharge, sensors and visual sensing device etc.,they may give useful information to monitor out any incipient symptoms of faults. The prototype of hardware system has been developed and tested through laboratory level simulated transmission lines. The test has shown enough evident to put the proposed method to practical uses.

Keywords: Transmission Line, Condition Monitoring, Circuit Parameters, Synchro- phasor Measurement.

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1987 Memristor: The Missing Circuit Element and its Application

Authors: Vishnu Pratap Singh Kirar

Abstract:

Memristor is also known as the fourth fundamental passive circuit element. When current flows in one direction through the device, the electrical resistance increases and when current flows in the opposite direction, the resistance decreases. When the current is stopped, the component retains the last resistance that it had, and when the flow of charge starts again, the resistance of the circuit will be what it was when it was last active. It behaves as a nonlinear resistor with memory. Recently memristors have generated wide research interest and have found many applications. In this paper we survey the various applications of memristors which include non volatile memory, nanoelectronic memories, computer logic, neuromorphic computer architectures low power remote sensing applications, crossbar latches as transistor replacements, analog computations and switches.

Keywords: Memristor, non-volatile memory, arithmatic operation, programmable resistor.

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1986 Field Experience with Sweep Frequency Response Analysis for Power Transformer Diagnosis

Authors: Ambuj Kumar, Sunil Kumar Singh, Shrikant Singh

Abstract:

Sweep frequency response analysis has been turning out a powerful tool for investigation of mechanical as well as electrical integration of transformers. In this paper various aspect of practical application of SFRA has been studied. Open circuit and short circuit measurement were done on different phases of high voltage and low voltage winding. A case study was presented for the transformer of rating 31.5 MVA for various frequency ranges. A clear picture was presented for sub- frequency ranges for HV as well as LV winding. The main motive of work is to investigate high voltage short circuit response. The theoretical concept about SFRA responses is validated with expert system software results.

Keywords: Frequency deviation, OCT & SCT, SFRA, Transformer winding.

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1985 Power MOSFET Models Including Quasi-Saturation Effect

Authors: Abdelghafour Galadi

Abstract:

In this paper, accurate power MOSFET models including quasi-saturation effect are presented. These models have no internal node voltages determined by the circuit simulator and use one JFET or one depletion mode MOSFET transistors controlled by an “effective” gate voltage taking into account the quasi-saturation effect. The proposed models achieve accurate simulation results with an average error percentage less than 9%, which is an improvement of 21 percentage points compared to the commonly used standard power MOSFET model. In addition, the models can be integrated in any available commercial circuit simulators by using their analytical equations. A description of the models will be provided along with the parameter extraction procedure.

Keywords: Power MOSFET, drift layer, quasi-saturation effect, SPICE model, circuit simulation.

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1984 Influence of Cyclic Thermal Loading on Fatigue Behavior of Thermal Barrier Coatings

Authors: Vidyasagar H. N., S. Gopal Prakash, Shivrudraiah, K. V. Sharma

Abstract:

Thermally insulating ceramic coatings also known as thermal barrier coatings (TBCs) have been essential technologies to improve the performance and efficiency of advanced gas turbines in service at extremely high temperatures. The damage mechanisms of air-plasma sprayed YSZ thermal barrier coatings (TBC) with various microstructures were studied by microscopic techniques after thermal cycling. The typical degradation of plasma TBCs that occurs during cyclic furnace testing of an YSZ and alumina coating on a Titanium alloy are analyzed. During the present investigation the effects of topcoat thickness, bond coat oxidation, thermal cycle lengths and test temperature are investigated using thermal cycling. These results were correlated with stresses measured by a spectroscopic technique in order to understand specific damage mechanism. The failure mechanism of former bond coats was found to involve fracture initiation at the thermally grown oxide (TGO) interface and at the TGO bond coat interface. The failure mechanism of the YZ was found to involve combination of fracture along the interface between TGO and bond coat.

Keywords: Thermal barrier coatings, thermal loading.

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1983 Novel Approach to Design of a Class-EJ Power Amplifier Using High Power Technology

Authors: F. Rahmani, F. Razaghian, A. R. Kashaninia

Abstract:

This article proposes a new method for application in communication circuit systems that increase efficiency, PAE, output power and gain in the circuit. The proposed method is based on a combination of switching class-E and class-J and has been termed class-EJ. This method was investigated using both theory and simulation to confirm ∼72% PAE and output power of >39dBm. The combination and design of the proposed power amplifier accrues gain of over 15dB in the 2.9 to 3.5GHz frequency bandwidth. This circuit was designed using MOSFET and high power transistors. The loadand source-pull method achieved the best input and output networks using lumped elements. The proposed technique was investigated for fundamental and second harmonics having desirable amplitudes for the output signal.

Keywords: Power Amplifier (PA), GaN HEMT, Class-J and Class-E, High Efficiency.

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1982 Thermal and Flammability Properties of Paraffin/Nanoclay Composite Phase Change Materials Incorporated in Building Materials for Thermal Energy Storage

Authors: Awni H. Alkhazaleh, Baljinder K. Kandola

Abstract:

In this study, a form-stable composite Paraffin/Nanoclay (PA-NC) has been prepared by absorbing PA into porous particles of NC to be used for low-temperature latent heat thermal energy storage. The leakage test shows that the maximum mass fraction of PA that can be incorporated in NC without leakage is 60 wt.%. Differential scanning calorimetry (DSC) has been used to measure the thermal properties of the PA and PA-NC both before and after incorporation in plasterboard (PL). The mechanical performance of the samples has been evaluated in flexural mode. The thermal energy storage performance has been studied using a small test chamber (100 mm × 100 mm × 100 mm) made from 10 mm thick PL and measuring the temperatures using thermocouples. The flammability of the PL+PL-NC has been discussed using a cone calorimeter. The results indicate that the form composite PA has good potential for use as thermal energy storage materials in building applications.

Keywords: Flammability, paraffin, plasterboard, thermal energy storage.

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1981 The Influence of Fiber Volume Fraction on Thermal Conductivity of Pultruded Profile

Authors: V. Lukášová, P. Peukert, V. Votrubec

Abstract:

Thermal conductivity in the x, y and z-directions was measured on a pultruded profile that was manufactured by the technology of pulling from glass fibers and a polyester matrix. The results of measurements of thermal conductivity showed considerable variability in different directions. The caused variability in thermal conductivity was expected due fraction variations. The cross-section of the pultruded profile was scanned. An image analysis illustrated an uneven distribution of the fibers and the matrix in the cross-section. The distribution of these inequalities was processed into a Voronoi diagram in the observed area of the pultruded profile cross-section. In order to verify whether the variation of the fiber volume fraction in the pultruded profile can affect its thermal conductivity, the numerical simulations in the ANSYS Fluent were performed. The simulation was based on the geometry reconstructed from image analysis. The aim is to quantify thermal conductivity numerically. Above all, images with different volume fractions were chosen. The results of the measured thermal conductivity were compared with the calculated thermal conductivity. The evaluated data proved a strong correlation between volume fraction and thermal conductivity of the pultruded profile. Based on presented results, a modification of production technology may be proposed.

Keywords: Numerical simulation, pultruded profile, volume fraction, thermal conductivity.

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1980 Preserved Relative Differences between Regions of Different Thermal Scans

Authors: Tahir Majeed, Michael Handschuh, René Meier

Abstract:

Rheumatoid Arthritis patients have swelling and pain in joints of the hand. The regions where the patient feels pain also show increased body temperature. Thermal cameras can be used to detect the rise in temperature of the affected regions. To monitor the progression of Rheumatoid Arthritis, patients must visit the clinic regularly for scanning and examination. After scanning and evaluation, the dosage of the medicine is regulated accordingly. To monitor the disease progression over time, the correlation of the images between different visits must be established. It has been observed that the thermal measurements do not remain the same over time, even within a single scanning, when low-cost thermal cameras are used. In some situations, temperatures can vary as much as 2◦C within the same scanning sequence. In this paper, it has been shown that although the absolute temperature varies over time, the relative difference between different regions remains similar. Results have been computed over four scanning sequences and are presented.

Keywords: Relative thermal difference, rheumatoid arthritis, thermal imaging, thermal sensors.

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1979 Numerical Simulation of the Effects of Nanofluid on a Heat Pipe Thermal Performance

Authors: Barzin Gavtash, Khalid Hussain, Mohammad Layeghi, Saeed Sadeghi Lafmejani

Abstract:

This research aims at modeling and simulating the effects of nanofluids on cylindrical heat pipes thermal performance using the ANSYS-FLUENT CFD commercial software. The heat pipe outer wall temperature distribution, thermal resistance, liquid pressure and axial velocity in presence of suspended nano-scaled solid particle (i.e. Cu, Al2O3 and TiO2) within the fluid (water) were investigated. The effect of particle concentration and size were explored and it is concluded that the thermal performance of the heat pipe is improved when using nanofluid as the system working fluid. Additionally, it was observed that the thermal resistance of the heat pipe drops as the particle concentration level increases and particle radius decreases.

Keywords: CFD, Heat Pipe, Nanofluid, Thermal resistance

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1978 Thermal Analysis of a Sliding Electric Contact System Using Finite Element Method

Authors: Adrian T. Pleșca

Abstract:

In this paper a three dimensional thermal model of a sliding contact system is proposed for both steady-state or transient conditions. The influence of contact force, electric current and ambient temperature on the temperature distribution, has been investigated. A thermal analysis of the different type of the graphite material of fixed electric contact and its influence on contact system temperature rise, has been performed. To validate the three dimensional thermal model, some experimental tests have been done. There is a good correlation between experimental and simulation results.

Keywords: Sliding electric contact, temperature distribution, thermal analysis.

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1977 Cyclic Heating Effect on Hardness of Copper

Authors: Tahany W. Sadak

Abstract:

Presented work discusses research results concerning the effect of the heat treatment process. Thermal fatigue which expresses repeated heating and cooling processes affect the ductility or the brittleness of the material. In this research, 70 specimens of copper (1.5 mm thickness, 85 mm length, 32 mm width) are subjected to thermal fatigue at different conditions. Heating temperatures Th are 100, 300 and 500 °C. Number of repeated cycles N is from 1 to 100. Heating time th =600 Sec, and Cooling time; tC= 900 Sec.  Results are evaluated and then compared to each other and to that of specimens without subjected to thermal fatigue.

Keywords: Copper, hardness, heat treatment, thermal fatigue, thermal analysis.

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1976 Shaping the Input Side Current Waveform of a 3-ϕ Rectifier into a Pure Sine Wave

Authors: Sikder Mohammad Faruk, Mir Mofajjal Hossain, Muhibul Haque Bhuyan

Abstract:

In this investigative research paper, we have presented the simulation results of a three-phase rectifier circuit to improve the input side current using the passive filters, such as capacitors and inductors at the output and input terminals of the rectifier circuit respectively. All simulation works were performed in a personal computer using the PSPICE simulator software, which is a virtual circuit design and simulation software package. The output voltages and currents were measured across a resistive load of 1 k. We observed that the output voltage levels, input current wave shapes, harmonic contents through the harmonic spectrum, and total harmonic distortion improved due to the use of such filters.

Keywords: input current wave, three-phase rectifier, passive filter, PSPICE Simulation

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1975 A Soft Error Rates Evaluation Method of Combinational Logic Circuit Based on Linear Energy Transfers

Authors: Man Li, Wanting Zhou, Lei Li

Abstract:

Communication stability is the primary concern of communication satellites. Communication satellites are easily affected by particle radiation to generate single event effects (SEE), which leads to soft errors (SE) of combinational logic circuit. The existing research on soft error rates (SER) of combined logic circuit is mostly based on the assumption that the logic gates being bombarded have the same pulse width. However, in the actual radiation environment, the pulse widths of the logic gates being bombarded are different due to different linear energy transfers (LET). In order to improve the accuracy of SER evaluation model, this paper proposes a soft error rates evaluation method based on LET. In this paper, we analyze the influence of LET on the pulse width of combinational logic and establish the pulse width model based on LET. Based on this model, the error rate of test circuit ISCAS’85 is calculated. Experimental results show that this model can be used for SER evaluation.

Keywords: Communication satellite, pulse width, soft error rates, linear energy transfer, LET.

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1974 Reversible Signed Division for Computing Systems

Authors: D. Krishnaveni, M. Geetha Priya

Abstract:

Applications of reversible logic gates in the design of complex integrated circuits provide power optimization.  This technique finds a great use in low power CMOS design, optical computing, quantum computing and nanotechnology. This paper proposes a reversible signed division circuit that can divide an n-bit signed dividend with an n-bit signed divisor using non-restoration division logic. The proposed design adequately addresses the ‘delay’ there by improving the efficiency of the circuit. An attempt is made to design a reversible signed division circuit. This paper provides a threshold to build more complex arithmetic systems using reversible logic, thus increasing the performance of computing systems.

Keywords: Low power CMOS, quantum computing, reversible logic gates, shift register, signed division.

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1973 A Neural Network Approach for an Automatic Detection and Localization of an Open Phase Circuit of a Five-Phase Induction Machine Used in a Drivetrain of an Electric Vehicle

Authors: S. Chahba, R. Sehab, A. Akrad, C. Morel

Abstract:

Nowadays, the electric machines used in urban electric vehicles are, in most cases, three-phase electric machines with or without a magnet in the rotor. Permanent Magnet Synchronous Machine (PMSM) and Induction Machine (IM) are the main components of drive trains of electric and hybrid vehicles. These machines have very good performance in healthy operation mode, but they are not redundant to ensure safety in faulty operation mode. Faced with the continued growth in the demand for electric vehicles in the automotive market, improving the reliability of electric vehicles is necessary over the lifecycle of the electric vehicle. Multiphase electric machines respond well to this constraint because, on the one hand, they have better robustness in the event of a breakdown (opening of a phase, opening of an arm of the power stage, intern-turn short circuit) and, on the other hand, better power density. In this work, a diagnosis approach using a neural network for an open circuit fault or more of a five-phase induction machine is developed. Validation on the simulator of the vehicle drivetrain, at reduced power, is carried out, creating one and more open circuit stator phases showing the efficiency and the reliability of the new approach to detect and to locate on-line one or more open phases of a five-induction machine.

Keywords: Electric vehicle drivetrain, multiphase drives, induction machine, control, open circuit fault diagnosis, artificial neural network.

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1972 Experimental Measurements of Evacuated Enclosure Thermal Insulation Effectiveness for Vacuum Flat Plate Solar Thermal Collectors

Authors: Paul Henshall, Philip Eames, Roger Moss, Stan Shire, Farid Arya, Trevor Hyde

Abstract:

Encapsulating the absorber of a flat plate solar thermal collector in vacuum by an enclosure that can be evacuated can result in a significant increase in collector performance and achievable operating temperatures. This is a result of the thermal insulation effectiveness of the vacuum layer surrounding the absorber, as less heat is lost during collector operation. This work describes experimental thermal insulation characterization tests of prototype vacuum flat plate solar thermal collectors that demonstrate the improvement in absorber heat loss coefficients. Furthermore, this work describes the selection and sizing of a getter, suitable for maintaining the vacuum inside the enclosure for the lifetime of the collector, which can be activated at low temperatures.

Keywords: Vacuum, thermal, flat-plate solar collector.

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1971 Simulation of Dynamics of a Permanent Magnet Linear Actuator

Authors: Ivan Yatchev, Ewen Ritchie

Abstract:

Comparison of two approaches for the simulation of the dynamic behaviour of a permanent magnet linear actuator is presented. These are full coupled model, where the electromagnetic field, electric circuit and mechanical motion problems are solved simultaneously, and decoupled model, where first a set of static magnetic filed analysis is carried out and then the electric circuit and mechanical motion equations are solved employing bi-cubic spline approximations of the field analysis results. The results show that the proposed decoupled model is of satisfactory accuracy and gives more flexibility when the actuator response is required to be estimated for different external conditions, e.g. external circuit parameters or mechanical loads.

Keywords: Coupled problems, dynamic models, finite elementanalysis, linear actuators, permanent magnets.

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1970 Thermal Analysis of the Fuse with Unequal Fuse Links Using Finite Element Method

Authors: Adrian T.Pleşca

Abstract:

In this paper a three dimensional thermal model of high breaking capacity fuse with unequal fuse links is proposed for both steady-state or transient conditions. The influence of ambient temperature and electric current on the temperature distribution inside the fuse, has been investigated. A thermal analysis of the unbalanced distribution of the electric current through the fuse elements and their influence on fuse link temperature rise, has been performed. To validate the three dimensional thermal model, some experimental tests have been done. There is a good correlation between experimental and simulation results.

Keywords: Electric fuse, fuse links, temperature distribution, thermal analysis.

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1969 Modified Buck Boost Circuit for Linear and Non-Linear Piezoelectric Energy Harvesting

Authors: I Made Darmayuda, Chai Tshun Chuan Kevin, Je Minkyu

Abstract:

Plenty researches have reported techniques to harvest energy from piezoelectric transducer. In the earlier years, the researches mainly report linear energy harvesting techniques whereby interface circuitry is designed to have input impedance that match with the impedance of the piezoelectric transducer. In recent years non-linear techniques become more popular. The non-linear technique employs voltage waveform manipulation to boost the available-for-extraction energy at the time of energy transfer.  The fact that non-linear energy extraction provides larger available-for-extraction energy doesn’t mean the linear energy extraction is completely obsolete. In some scenarios, such as where initial power is not available, linear energy extraction is still preferred. A modified Buck Boost circuit which is capable of harvesting piezoelectric energy using both linear and non-linear techniques is reported in this paper. Efficiency of at least 64% can be achieved using this circuit. For linear extraction, the modified Buck Boost circuit is controlled using a fix frequency and duty cycle clock. A voltage sensor and a pulse generator are added as the controller for the non-linear extraction technique. 

Keywords: Buck boost, energy harvester, linear energy harvester, non-linear energy harvester, piezoelectric, synchronized charge extraction.

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1968 Design and Characterization of CMOS Readout Circuit for ISFET and ISE Based Sensors

Authors: Yuzman Yusoff, Siti Noor Harun, Noor Shelida Sallehand Tan Kong Yew

Abstract:

This paper presents the design and characterization of analog readout interface circuits for ion sensitive field effect transistor (ISFET) and ion selective electrode (ISE) based sensor. These interface circuits are implemented using MIMOS’s 0.35um CMOS technology and experimentally characterized under 24-leads QFN package. The characterization evaluates the circuit’s functionality, output sensitivity and output linearity. Commercial sensors for both ISFET and ISE are employed together with glass reference electrode during testing. The test result shows that the designed interface circuits manage to readout signals produced by both sensors with measured sensitivity of ISFET and ISE sensor are 54mV/pH and 62mV/decade, respectively. The characterized output linearity for both circuits achieves above 0.999 rsquare. The readout also has demonstrated reliable operation by passing all qualifications in reliability test plan.

Keywords: Readout interface circuit (ROIC), analog interface circuit, ion sensitive field effect transistor (ISFET), ion selective electrode (ISE), and ion sensor electronics.

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1967 Design and Characterization of CMOS Readout Circuit for ISFET and ISE Based Sensors

Authors: Yuzman Yusoff, Siti Noor Harun, Noor Shelida Sallehand, Tan Kong Yew

Abstract:

This paper presents the design and characterization of analog readout interface circuits for ion sensitive field effect transistor (ISFET) and ion selective electrode (ISE) based sensor. These interface circuits are implemented using MIMOS’s 0.35um CMOS technology and experimentally characterized under 24-leads QFN package. The characterization evaluates the circuit’s functionality, output sensitivity and output linearity. Commercial sensors for both ISFET and ISE are employed together with glass reference electrode during testing. The test result shows that the designed interface circuits manage to readout signals produced by both sensors with measured sensitivity of ISFET and ISE sensor are 54mV/pH and 62mV/decade, respectively. The characterized output linearity for both circuits achieves above 0.999 Rsquare. The readout also has demonstrated reliable operation by passing all qualifications in reliability test plan.

Keywords: Readout interface circuit (ROIC), analog interface circuit, ion sensitive field effect transistor (ISFET), ion selective electrode (ISE), ion sensor electronics.

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1966 Adaptive Thermal Comfort Model for Air-Conditioned Lecture Halls in Malaysia

Authors: B. T. Chew, S. N. Kazi, A. Amiri

Abstract:

This paper presents an adaptive thermal comfort model study in the tropical country of Malaysia. A number of researchers have been interested in applying the adaptive thermal comfort model to different climates throughout the world, but so far no study has been performed in Malaysia. For the use as a thermal comfort model, which better applies to hot and humid climates, the adaptive thermal comfort model was developed as part of this research by using the collected results from a large field study in six lecture halls with 178 students. The relationship between the operative temperature and behavioral adaptations was determined. In the developed adaptive model, the acceptable indoor neutral temperatures lay within the range of 23.9-26.0C, with outdoor temperatures ranging between 27.0-34.6C. The most comfortable temperature for students in lecture hall was 25.7C.

Keywords: Hot and humid, Lecture halls, Neutral temperature, Adaptive thermal comfort model.

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1965 Mapping of C* Elements in Finite Element Method using Transformation Matrix

Authors: G. H. Majzoob, B. Sharifi Hamadani

Abstract:

Mapping between local and global coordinates is an important issue in finite element method, as all calculations are performed in local coordinates. The concern arises when subparametric are used, in which the shape functions of the field variable and the geometry of the element are not the same. This is particularly the case for C* elements in which the extra degrees of freedoms added to the nodes make the elements sub-parametric. In the present work, transformation matrix for C1* (an 8-noded hexahedron element with 12 degrees of freedom at each node) is obtained using equivalent C0 elements (with the same number of degrees of freedom). The convergence rate of 8-noded C1* element is nearly equal to its equivalent C0 element, while it consumes less CPU time with respect to the C0 element. The existence of derivative degrees of freedom at the nodes of C1* element along with excellent convergence makes it superior compared with it equivalent C0 element.

Keywords: Mapping, Finite element method, C* elements, Convergence, C0 elements.

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1964 Thermal Expansion Coefficient and Young’s Modulus of Silica-Reinforced Epoxy Composite

Authors: Hyu Sang Jo, Gyo Woo Lee

Abstract:

In this study, the evaluation of thermal stability of the micrometer-sized silica particle reinforced epoxy composite was carried out through the measurement of thermal expansion coefficient and Young’s modulus of the specimens. For all the specimens in this study from the baseline to those containing 50 wt% silica filler, the thermal expansion coefficients and the Young’s moduli were gradually decreased down to 20% and increased up to 41%, respectively. The experimental results were compared with fillervolume- based simple empirical relations. The experimental results of thermal expansion coefficients correspond with those of Thomas’s model which is modified from the rule of mixture. However, the measured result for Young’s modulus tends to be increased slightly. The differences in increments of the moduli between experimental and numerical model data are quite large.

Keywords: Thermal Stability, Silica-Reinforced, Epoxy Composite, Coefficient of Thermal Expansion, Empirical Model.

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1963 Design and Characterization of a CMOS Process Sensor Utilizing Vth Extractor Circuit

Authors: Rohana Musa, Yuzman Yusoff, Chia Chieu Yin, Hanif Che Lah

Abstract:

This paper presents the design and characterization of a low power Complementary Metal Oxide Semiconductor (CMOS) process sensor. The design is targeted for implementation using Silterra’s 180 nm CMOS process technology. The proposed process sensor employs a voltage threshold (Vth) extractor architecture for detection of variations in the fabrication process. The process sensor generates output voltages in the range of 401 mV (fast-fast corner) to 443 mV (slow-slow corner) at nominal condition. The power dissipation for this process sensor is 6.3 µW with a supply voltage of 1.8V with a silicon area of 190 µm X 60 µm. The preliminary result of this process sensor that was fabricated indicates a close resemblance between test and simulated results.

Keywords: CMOS Process sensor, Process, Voltage and Temperature (PVT) sensor, threshold extractor circuit, Vth extractor circuit.

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