%0 Journal Article
	%A Hyu Sang Jo and  Gyo Woo Lee
	%D 2014
	%J International Journal of Mechanical and Mechatronics Engineering
	%B World Academy of Science, Engineering and Technology
	%I Open Science Index 95, 2014
	%T Thermal Expansion Coefficient and Young’s Modulus of Silica-Reinforced Epoxy Composite
	%U https://publications.waset.org/pdf/9999635
	%V 95
	%X In this study, the evaluation of thermal stability of the
micrometer-sized silica particle reinforced epoxy composite was
carried out through the measurement of thermal expansion coefficient
and Young’s modulus of the specimens. For all the specimens in this
study from the baseline to those containing 50 wt% silica filler, the
thermal expansion coefficients and the Young’s moduli were
gradually decreased down to 20% and increased up to 41%,
respectively. The experimental results were compared with fillervolume-
based simple empirical relations. The experimental results of
thermal expansion coefficients correspond with those of Thomas’s
model which is modified from the rule of mixture. However, the
measured result for Young’s modulus tends to be increased slightly.
The differences in increments of the moduli between experimental and
numerical model data are quite large.

	%P 1188 - 1191