Search results for: Thin Wafer
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 392

Search results for: Thin Wafer

242 Static and Dynamic Analysis of Hyperboloidal Helix Having Thin Walled Open and Close Sections

Authors: Merve Ermis, Murat Yılmaz, Nihal Eratlı, Mehmet H. Omurtag

Abstract:

The static and dynamic analyses of hyperboloidal helix having the closed and the open square box sections are investigated via the mixed finite element formulation based on Timoshenko beam theory. Frenet triad is considered as local coordinate systems for helix geometry. Helix domain is discretized with a two-noded curved element and linear shape functions are used. Each node of the curved element has 12 degrees of freedom, namely, three translations, three rotations, two shear forces, one axial force, two bending moments and one torque. Finite element matrices are derived by using exact nodal values of curvatures and arc length and it is interpolated linearly throughout the element axial length. The torsional moments of inertia for close and open square box sections are obtained by finite element solution of St. Venant torsion formulation. With the proposed method, the torsional rigidity of simply and multiply connected cross-sections can be also calculated in same manner. The influence of the close and the open square box cross-sections on the static and dynamic analyses of hyperboloidal helix is investigated. The benchmark problems are represented for the literature.

Keywords: Hyperboloidal helix, squared cross section, thin walled cross section, torsional rigidity.

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241 Geometrically Non-Linear Axisymmetric Free Vibrations of Thin Isotropic Annular Plates

Authors: Boutahar Lhoucine, El Bikri Khalid, Benamar Rhali

Abstract:

The effects of large vibration amplitudes on the first axisymetric mode shape of thin isotropic annular plates having both edges clamped are examined in this paper. The theoretical model based on Hamilton’s principle and spectral analysis by using a basis of Bessel’s functions is adapted اhere to the case of annular plates. The model effectively reduces the large amplitude free vibration problem to the solution of a set of non-linear algebraic equations.

The governing non-linear eigenvalue problem has been linearised in the neighborhood of each resonance and a new one-step iterative technique has been proposed as a simple alternative method of solution to determine the basic function contributions to the non-linear mode shape considered.

Numerical results are given for the first non-linear mode shape for a wide range of vibration amplitudes. For each value of the vibration amplitude considered, the corresponding contributions of the basic functions defining the non-linear transverse displacement function and the associated non-linear frequency, the membrane and bending stress distributions are given. By comparison with the iterative method of solution, it was found that the present procedure is efficient for a wide range of vibration amplitudes, up to at least 1.8 times the plate thickness,

Keywords: Non-linear vibrations, Annular plates, Large vibration amplitudes.

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240 Effect of Curing Profile to Eliminate the Voids / Black Dots Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging

Authors: Zainudin Kornain, Azman Jalar, Rozaidi Rasid, Fong Chee Seng

Abstract:

Void formation in underfill is considered as failure in flip chip manufacturing process. Void formation possibly caused by several factors such as poor soldering and flux residue during die attach process, void entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the comparison of single step and two steps curing profile towards the void and black dots formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). Statistic analysis was conducted to analyze how different factors such as wafer lot, sawing technique, underfill fillet height and curing profile recipe were affected the formation of voids and black dots. A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids and black dots. It was shown that the 2 steps curing profile provided solution for void elimination and black dots in underfill after curing process.

Keywords: black dots formation, curing profile, FC-CBGA, underfill, void formation,

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239 Deposition Rate and Energy Enhancements of TiN Thin-Film in a Magnetized Sheet Plasma Source

Authors: Hamdi Muhyuddin D. Barra, Henry J. Ramos

Abstract:

Titanium nitride (TiN) has been synthesized using the sheet plasma negative ion source (SPNIS). The parameters used for its effective synthesis has been determined from previous experiments and studies. In this study, further enhancement of the deposition rate of TiN synthesis and advancement of the SPNIS operation is presented. This is primarily achieved by the addition of Sm-Co permanent magnets and a modification of the configuration in the TiN deposition process. The magnetic enhancement is aimed at optimizing the sputtering rate and the sputtering yield of the process. The Sm-Co permanent magnets are placed below the Ti target for better sputtering by argon. The Ti target is biased from –250V to – 350V and is sputtered by Ar plasma produced at discharge current of 2.5–4A and discharge potential of 60–90V. Steel substrates of dimensions 20x20x0.5mm3 were prepared with N2:Ar volumetric ratios of 1:3, 1:5 and 1:10. Ocular inspection of samples exhibit bright gold color associated with TiN. XRD characterization confirmed the effective TiN synthesis as all samples exhibit the (200) and (311) peaks of TiN and the non-stoichiometric Ti2N (220) facet. Cross-sectional SEM results showed increase in the TiN deposition rate of up to 0.35μm/min. This doubles what was previously obtained [1]. Scanning electron micrograph results give a comparative morphological picture of the samples. Vickers hardness results gave the largest hardness value of 21.094GPa.

Keywords: Chemical vapor deposition, Magnetized sheetplasma, Thin-film synthesis, Titanium nitride.

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238 HPTLC Fingerprint Profiling of Protorhus longifolia Methanolic Leaf Extract and Qualitative Analysis of Common Biomarkers

Authors: P. S. Seboletswe, Z. Mkhize, L. M. Katata-Seru

Abstract:

Protorhus longifolia is known as a medicinal plant that has been used traditionally to treat various ailments such as hemiplegic paralysis, blood clotting related diseases, diarrhoea, heartburn, etc. The study reports a High-Performance Thin Layer Chromatography (HPTLC) fingerprint profile of Protorhus longifolia methanolic extract and its qualitative analysis of gallic acid, rutin, and quercetin. HPTLC analysis was achieved using CAMAG HPTLC system equipped with CAMAG automatic TLC sampler 4, CAMAG Automatic Developing Chamber 2 (ADC2), CAMAG visualizer 2, CAMAG Thin Layer Chromatography (TLC) scanner and visionCATS CAMAG HPTLC software. Mobile phase comprising toluene, ethyl acetate, formic acid (21:15:3) was used for qualitative analysis of gallic acid and revealed eight peaks while the mobile phase containing ethyl acetate, water, glacial acetic acid, formic acid (100:26:11:11) for qualitative analysis of rutin and quercetin revealed six peaks. HPTLC sillica gel 60 F254 glass plates (10 × 10) were used as the stationary phase. Gallic acid was detected at the Rf = 0.35; while rutin and quercetin were not evident in the extract. Further studies will be performed to quantify gallic acid in Protorhus longifolia leaves and also identify other biomarkers.

Keywords: Biomarkers, fingerprint profiling, gallic acid, HPTLC, Protorhus longifolia.

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237 Advanced Compound Coating for Delaying Corrosion of Fast-Dissolving Alloy in High Temperature and Corrosive Environment

Authors: Lei Zhao, Yi Song, Tim Dunne, Jiaxiang (Jason) Ren, Wenhan Yue, Lei Yang, Li Wen, Yu Liu

Abstract:

Fasting dissolving magnesium (DM) alloy technology has contributed significantly to the “Shale Revolution” in oil and gas industry. This application requires DM downhole tools dissolving initially at a slow rate, rapidly accelerating to a high rate after certain period of operation time (typically 8 h to 2 days), a contradicting requirement that can hardly be addressed by traditional Mg alloying or processing itself. Premature disintegration has been broadly reported in downhole DM tool from field trials. To address this issue, “temporary” thin polymers of various formulations are currently coated onto DM surface to delay its initial dissolving. Due to conveying parts, harsh downhole condition, and high dissolving rate of the base material, the current delay coatings relying on pure polymers are found to perform well only at low temperature (typical < 100 ℃) and parts without sharp edges or corners, as severe geometries prevent high quality thin film coatings from forming effectively. In this study, a coating technology combining Plasma Electrolytic Oxide (PEO) coatings with advanced thin film deposition has been developed, which can delay DM complex parts (with sharp corners) in corrosive fluid at 150 ℃ for over 2 days. Synergistic effects between porous hard PEO coating and chemical inert elastic-polymer sealing leads to its delaying dissolution improvement, and strong chemical/physical bonding between these two layers has been found to play essential role. Microstructure of this advanced coating and compatibility between PEO and various polymer selections has been thoroughly investigated and a model is also proposed to explain its delaying performance. This study could not only benefit oil and gas industry to unplug their High Temperature High Pressure (HTHP) unconventional resources inaccessible before, but also potentially provides a technical route for other industries (e.g., bio-medical, automobile, aerospace) where primer anti-corrosive protection on light Mg alloy is highly demanded.

Keywords: Dissolvable magnesium, coating, plasma electrolytic oxide, sealer.

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236 Post Elevated Temperature Effect on the Strength and Microstructure of Thin High Performance Cementitious Composites (THPCC)

Authors: A. Q. Sobia, A. Shyzleen, M. S. Hamidah, I. Azmi, S. F. A. Rafeeqi, S. Ahmad

Abstract:

Reinforced Concrete (RC) structures strengthened with fiber reinforced polymer (FRP) lack in thermal resistance under elevated temperatures in the event of fire. This phenomenon led to the lining of strengthened concrete with thin high performance cementitious composites (THPCC) to protect the substrate against elevated temperature. Elevated temperature effects on THPCC, based on different cementitious materials have been studied in the past but high-alumina cement (HAC)-based THPCC have not been well characterized. This research study will focus on the THPCC based on HAC replaced by 60%, 70%, 80% and 85% of ground granulated blast furnace slag (GGBS). Samples were evaluated by the measurement of their mechanical strength (28 & 56 days of curing) after exposed to 400°C, 600°C and 28°C of room temperature for comparison and corroborated by their microstructure study. Results showed that among all mixtures, the mix containing only HAC showed the highest compressive strength after exposed to 600°C as compared to other mixtures. However, the tensile strength of THPCC made of HAC and 60% GGBS content was comparable to the THPCC with HAC only after exposed to 600°C. Field emission scanning electron microscopy (FESEM) images of THPCC accompanying Energy Dispersive X-ray (EDX) microanalysis revealed that the microstructure deteriorated considerably after exposure to elevated temperatures which led to the decrease in mechanical strength.

Keywords: Ground granulated blast furnace slag, high aluminacement, microstructure at elevated temperature and residual strength.

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235 Application of Molecular Materials in the Manufacture of Flexible and Organic Devices for Photovoltaic Applications

Authors: M. Gómez-Gómez, M. E. Sánchez-Vergara

Abstract:

Many sustainable approaches to generate electric energy have emerged in the last few decades; one of them is through solar cells. Yet, this also has the disadvantage of highly polluting inorganic semiconductor manufacturing processes. Therefore, the use of molecular semiconductors must be considered. In this work, allene compounds C24H26O4 and C24H26O5 were used as dopants to manufacture semiconductor films based on PbPc by high-vacuum evaporation technique. IR spectroscopy was carried out to determine the phase and any significant chemical changes which may occur during the thermal evaporation. According to UV-visible spectroscopy and Tauc’s model, the deposition process generated thin films with an activation energy range of 1.47 eV to 1.55 eV for direct transitions and 1.29 eV to 1.33 eV for indirect transitions. These values place the manufactured films within the range of low bandgap semiconductors. The flexible devices were manufactured: polyethylene terephthalate (PET), Indium tin oxide (ITO)/organic semiconductor/Cubic Close Packed (CCP). The characterization of the devices was carried out by evaluating electrical conductivity using the four-probe collinear method. I-V curves were obtained under different lighting conditions at room temperature. OS1 (PbPc/C24H26O4) showed an Ohmic behavior, while OS2 (PbPc/C24H26O5) reached higher current values at lower voltages. The results obtained show that the semiconductor devices doped with allene compounds can be used in the manufacture of optoelectronic devices.

Keywords: Electrical properties, optical gap, phthalocyanine, thin film.

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234 Quantitative Assessment of Different Formulations of Antimalarials in Sentinel Sites of India

Authors: Taruna Katyal Arora, Geeta Kumari, Hari Shankar, Neelima Mishra

Abstract:

Substandard and counterfeit antimalarials is a major problem in malaria endemic areas. The availability of counterfeit/ substandard medicines is not only decreasing the efficacy in patients, but it is also one of the contributing factors for developing antimalarial drug resistance. Owing to this, a pilot study was conducted to survey quality of drugs collected from different malaria endemic areas of India. Artesunate+Sulphadoxine-Pyrimethamine (AS+SP), Artemether-Lumefantrine (AL), Chloroquine (CQ) tablets were randomly picked from public health facilities in selected states of India. The quality of antimalarial drugs from these areas was assessed by using Global Pharma Health Fund Minilab test kit. This includes physical/visual inspection and disintegration test. Thin-layer chromatography (TLC) was carried out for semi-quantitative assessment of active pharmaceutical ingredients. A total of 45 brands, out of which 21 were for CQ, 14 for AL and 10 for AS+SP were tested from Uttar Pradesh (U.P.), Mizoram, Meghalaya and Gujrat states. One out of 45 samples showed variable disintegration and retension factor. The variable disintegration and retention factor which would have been due to substandard quality or other factors including storage. However, HPLC analysis confirms standard active pharmaceutical ingredient, but may be due to humid temperature and moisture in storage may account for the observed result.

Keywords: Antimalarial medicines, counterfeit, substandard, thin layer chromatography.

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233 Integrated Flavor Sensor Using Microbead Array

Authors: Ziba Omidi, Min-Ki Kim

Abstract:

This research presents the design, fabrication and application of a flavor sensor for an integrated electronic tongue and electronic nose that can allow rapid characterization of multi-component mixtures in a solution. The odor gas and liquid are separated using hydrophobic porous membrane in micro fluidic channel. The sensor uses an array composed of microbeads in micromachined cavities localized on silicon wafer. Sensing occurs via colorimetric and fluorescence changes to receptors and indicator molecules that are attached to termination sites on the polymeric microbeads. As a result, the sensor array system enables simultaneous and near-real-time analyses using small samples and reagent volumes with the capacity to incorporate significant redundancies. One of the key parts of the system is a passive pump driven only by capillary force. The hydrophilic surface of the fluidic structure draws the sample into the sensor array without any moving mechanical parts. Since there is no moving mechanical component in the structure, the size of the fluidic structure can be compact and the fabrication becomes simple when compared to the device including active microfluidic components. These factors should make the proposed system inexpensive to mass-produce, portable and compatible with biomedical applications.

Keywords: Optical Sensor, Semiconductor manufacturing, Smell sensor, Taste sensor.

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232 Nano-Texturing of Single Crystalline Silicon via Cu-Catalyzed Chemical Etching

Authors: A. A. Abaker Omer, H. B. Mohamed Balh, W. Liu, A. Abas, J. Yu, S. Li, W. Ma, W. El Kolaly, Y. Y. Ahmed Abuker

Abstract:

We have discovered an important technical solution that could make new approaches in the processing of wet silicon etching, especially in the production of photovoltaic cells. During its inferior light-trapping and structural properties, the inverted pyramid structure outperforms the conventional pyramid textures and black silicone. The traditional pyramid textures and black silicon can only be accomplished with more advanced lithography, laser processing, etc. Importantly, our data demonstrate the feasibility of an inverted pyramidal structure of silicon via one-step Cu-catalyzed chemical etching (CCCE) in Cu (NO3)2/HF/H2O2/H2O solutions. The effects of etching time and reaction temperature on surface geometry and light trapping were systematically investigated. The conclusion shows that the inverted pyramid structure has ultra-low reflectivity of ~4.2% in the wavelength of 300~1000 nm; introduce of Cu particles can significantly accelerate the dissolution of the silicon wafer. The etching and the inverted pyramid structure formation mechanism are discussed. Inverted pyramid structure with outstanding anti-reflectivity includes useful applications throughout the manufacture of semi-conductive industry-compatible solar cells, and can have significant impacts on industry colleagues and populations.

Keywords: Cu-catalyzed chemical etching, inverted pyramid nanostructured, reflection, solar cells.

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231 An Analysis of Collapse Mechanism of Thin- Walled Circular Tubes Subjected to Bending

Authors: Somya Poonaya, Chawalit Thinvongpituk, Umphisak Teeboonma

Abstract:

Circular tubes have been widely used as structural members in engineering application. Therefore, its collapse behavior has been studied for many decades, focusing on its energy absorption characteristics. In order to predict the collapse behavior of members, one could rely on the use of finite element codes or experiments. These tools are helpful and high accuracy but costly and require extensive running time. Therefore, an approximating model of tubes collapse mechanism is an alternative for early step of design. This paper is also aimed to develop a closed-form solution of thin-walled circular tube subjected to bending. It has extended the Elchalakani et al.-s model (Int. J. Mech. Sci.2002; 44:1117-1143) to include the rate of energy dissipation of rolling hinge in the circumferential direction. The 3-D geometrical collapse mechanism was analyzed by adding the oblique hinge lines along the longitudinal tube within the length of plastically deforming zone. The model was based on the principal of energy rate conservation. Therefore, the rates of internal energy dissipation were calculated for each hinge lines which are defined in term of velocity field. Inextensional deformation and perfect plastic material behavior was assumed in the derivation of deformation energy rate. The analytical result was compared with experimental result. The experiment was conducted with a number of tubes having various D/t ratios. Good agreement between analytical and experiment was achieved.

Keywords: Bending, Circular tube, Energy, Mechanism.

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230 Application of Machine Learning Methods to Online Test Error Detection in Semiconductor Test

Authors: Matthias Kirmse, Uwe Petersohn, Elief Paffrath

Abstract:

As in today's semiconductor industries test costs can make up to 50 percent of the total production costs, an efficient test error detection becomes more and more important. In this paper, we present a new machine learning approach to test error detection that should provide a faster recognition of test system faults as well as an improved test error recall. The key idea is to learn a classifier ensemble, detecting typical test error patterns in wafer test results immediately after finishing these tests. Since test error detection has not yet been discussed in the machine learning community, we define central problem-relevant terms and provide an analysis of important domain properties. Finally, we present comparative studies reflecting the failure detection performance of three individual classifiers and three ensemble methods based upon them. As base classifiers we chose a decision tree learner, a support vector machine and a Bayesian network, while the compared ensemble methods were simple and weighted majority vote as well as stacking. For the evaluation, we used cross validation and a specially designed practical simulation. By implementing our approach in a semiconductor test department for the observation of two products, we proofed its practical applicability.

Keywords: Ensemble methods, fault detection, machine learning, semiconductor test.

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229 A Comparative Study of Single- and Multi-Walled Carbon Nanotube Incorporation to Indium Tin Oxide Electrodes for Solar Cells

Authors: G. Gokceli, O. Eksik, E. Ozkan Zayim, N. Karatepe

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Alternative electrode materials for optoelectronic devices have been widely investigated in recent years. Since indium tin oxide (ITO) is the most preferred transparent conductive electrode, producing ITO films by simple and cost-effective solution-based techniques with enhanced optical and electrical properties has great importance. In this study, single- and multi-walled carbon nanotubes (SWCNT and MWCNT) incorporated into the ITO structure to increase electrical conductivity, mechanical strength, and chemical stability. Carbon nanotubes (CNTs) were firstly functionalized by acid treatment (HNO3:H2SO4), and the thermal resistance of CNTs after functionalization was determined by thermogravimetric analysis (TGA). Thin films were then prepared by spin coating technique and characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), four-point probe measurement system and UV-Vis spectrophotometer. The effects of process parameters were compared for ITO, MWCNT-ITO, and SWCNT-ITO films. Two factors including CNT concentration and annealing temperature were considered. The UV-Vis measurements demonstrated that the transmittance of ITO films was 83.58% at 550 nm, which was decreased depending on the concentration of CNT dopant. On the other hand, both CNT dopants provided an enhancement in the crystalline structure and electrical conductivity. Due to compatible diameter and better dispersibility of SWCNTs in the ITO solution, the best result in terms of electrical conductivity was obtained by SWCNT-ITO films with the 0.1 g/L SWCNT dopant concentration and heat-treatment at 550 °C for 1 hour.

Keywords: CNT incorporation, ITO electrode, spin coating, thin film.

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228 Carbonate Microfacies Analysis of Sinjar Formation from Qara Dagh Mountains, South–West of Sulaimani City, Kurdistan Region, Iraq

Authors: Heyam Daod

Abstract:

The paper describes the carbonate microfacies identified in the Sinjar Formation (Late Paleocene–Early Eocene) cropping out in Qara Dagh Mountain, near Sulekan Village approximately 20km south–west of Sulaimani (Iraq). One section (62m thick) has been measured in the field and closely sampled to undertake detailed microfaciesal and micropalaeontological studies to determine the formation-s age and environment of deposition. A samples were collected illustrating all the lithological changes along the section. The limestone in the studied area is hard and extremely rich in large foraminifers (soritids, rotaliids, nummulites, miliolids) and green algae (dasycladales). The investigation of the thin sections allowed us to identify the carbonate microfacies (18 types and subtypes) and the micropaleontological association (foraminifers and green algae), to determine the age of formation and to reconstruct the paleoenvironment of deposition (fore-reef, reef, back-reef). Based on the field observations and the studied thin sections, we determined three Units of a carbonate platform (I, II and III) from the base to the top of the section: Unit I with coralgal associations, Unit II is dominated by larger foraminifers and haracterized by the absence of coralgal associations, while Unit III is dominated by small foraminifers (mostly miliolids), peloids and green algae. It is partially dolomitized.

Keywords: Facies analysis, Late Paleocene–Early Eocene, Sinjar Formation, SW Sulaimani (Iraq).

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227 Overview of Multi-Chip Alternatives for 2.5D and 3D Integrated Circuit Packagings

Authors: Ching-Feng Chen, Ching-Chih Tsai

Abstract:

With the size of the transistor gradually approaching the physical limit, it challenges the persistence of Moore’s Law due to such issues of the short channel effect and the development of the high numerical aperture (NA) lithography equipment. In the context of the ever-increasing technical requirements of portable devices and high-performance computing (HPC), relying on the law continuation to enhance the chip density will no longer support the prospects of the electronics industry. Weighing the chip’s power consumption-performance-area-cost-cycle time to market (PPACC) is an updated benchmark to drive the evolution of the advanced wafer nanometer (nm). The advent of two and half- and three-dimensional (2.5 and 3D)- Very-Large-Scale Integration (VLSI) packaging based on Through Silicon Via (TSV) technology has updated the traditional die assembly methods and provided the solution. This overview investigates the up-to-date and cutting-edge packaging technologies for 2.5D and 3D integrated circuits (IC) based on the updated transistor structure and technology nodes. We conclude that multi-chip solutions for 2.5D and 3D IC packaging can prolong Moore’s Law.

Keywords: Moore’s Law, High Numerical Aperture, Power Consumption-Performance-Area-Cost-Cycle Time to Market, PPACC, 2.5 and 3D-Very-Large-Scale Integration Packaging, Through Silicon Vi.

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226 Reliability of Dissimilar Metal Soldered Joint in Fabrication of Electromagnetic Interference Shielded Door Frame

Authors: Rehan Waheed, Hasan Aftab Saeed, Wasim Tarar, Khalid Mahmood, Sajid Ullah Butt

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Electromagnetic Interference (EMI) shielded doors made from brass extruded channels need to be welded with shielded enclosures to attain optimum shielding performance. Control of welding induced distortion is a problem in welding dissimilar metals like steel and brass. In this research, soldering of the steel-brass joint has been proposed to avoid weld distortion. The material used for brass channel is UNS C36000. The thickness of brass is defined by the manufacturing process, i.e. extrusion. The thickness of shielded enclosure material (ASTM A36) can be varied to produce joint between the dissimilar metals. Steel sections of different gauges are soldered using (91% tin, 9% zinc) solder to the brass, and strength of joint is measured by standard test procedures. It is observed that thin steel sheets produce a stronger bond with brass. The steel sections further require to be welded with shielded enclosure steel sheets through TIG welding process. Stresses and deformation in the vicinity of soldered portion is calculated through FE simulation. Crack formation in soldered area is also studied through experimental work. It has been found that in thin sheets deformation produced due to applied force is localized and has no effect on soldered joint area whereas in thick sheets profound cracks have been observed in soldered joint. The shielding effectiveness of EMI shielded door is compromised due to these cracks. The shielding effectiveness of the specimens is tested and results are compared.

Keywords: Dissimilar metals, soldering, joint strength, EMI shielding.

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225 Evaluation of Linear and Geometrically Nonlinear Static and Dynamic Analysis of Thin Shells by Flat Shell Finite Elements

Authors: Djamel Boutagouga, Kamel Djeghaba

Abstract:

The choice of finite element to use in order to predict nonlinear static or dynamic response of complex structures becomes an important factor. Then, the main goal of this research work is to focus a study on the effect of the in-plane rotational degrees of freedom in linear and geometrically non linear static and dynamic analysis of thin shell structures by flat shell finite elements. In this purpose: First, simple triangular and quadrilateral flat shell finite elements are implemented in an incremental formulation based on the updated lagrangian corotational description for geometrically nonlinear analysis. The triangular element is a combination of DKT and CST elements, while the quadrilateral is a combination of DKQ and the bilinear quadrilateral membrane element. In both elements, the sixth degree of freedom is handled via introducing fictitious stiffness. Secondly, in the same code, the sixth degrees of freedom in these elements is handled differently where the in-plane rotational d.o.f is considered as an effective d.o.f in the in-plane filed interpolation. Our goal is to compare resulting shell elements. Third, the analysis is enlarged to dynamic linear analysis by direct integration using Newmark-s implicit method. Finally, the linear dynamic analysis is extended to geometrically nonlinear dynamic analysis where Newmark-s method is used to integrate equations of motion and the Newton-Raphson method is employed for iterating within each time step increment until equilibrium is achieved. The obtained results demonstrate the effectiveness and robustness of the interpolation of the in-plane rotational d.o.f. and present deficiencies of using fictitious stiffness in dynamic linear and nonlinear analysis.

Keywords: Flat shell, dynamic analysis, nonlinear, Newmark, drilling rotation.

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224 An Active Set Method in Image Inpainting

Authors: Marrick Neri, Esmeraldo Ronnie Rey Zara

Abstract:

In this paper, we apply a semismooth active set method to image inpainting. The method exploits primal and dual features of a proposed regularized total variation model, following after the technique presented in [4]. Numerical results show that the method is fast and efficient in inpainting sufficiently thin domains.

Keywords: Active set method, image inpainting, total variation model.

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223 Optical Reflectance of Pure and Doped Tin Oxide: From Thin Films to Poly-Crystalline Silicon/Thin Film Device

Authors: Smaali Assia, Outemzabet Ratiba, Media El Mahdi, Kadi Mohamed

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Films of pure tin oxide SnO2 and in presence of antimony atoms (SnO2-Sb) deposited onto glass substrates have shown a sufficiently high energy gap to be transparent in the visible region, a high electrical mobility and a carrier concentration which displays a good electrical conductivity [1]. In this work, the effects of polycrystalline silicon substrate on the optical properties of pure and Sb doped tin oxide is investigated. We used the APCVD (atmospheric pressure chemical vapour deposition) technique, which is a low-cost and simple technique, under nitrogen ambient, for growing this material. A series of SnO2 and SnO2-Sb have been deposited onto polycrystalline silicon substrates with different contents of antimony atoms at the same conditions of deposition (substrate temperature, flow oxygen, duration and nitrogen atmosphere of the reactor). The effect of the substrate in terms of morphology and nonlinear optical properties, mainly the reflectance, was studied. The reflectance intensity of the device, compared to the reflectance of tin oxide films deposited directly on glass substrate, is clearly reduced on the overall wavelength range. It is obvious that the roughness of the poly-c silicon plays an important role by improving the reflectance and hence the optical parameters. A clear shift in the minimum of the reflectance upon doping level is observed. This minimum corresponds to strong free carrier absorption, resulting in different plasma frequency. This effect is followed by an increase in the reflectance depending of the antimony doping. Applying the extended Drude theory to the combining optical and electrical obtained results these effects are discussed.

Keywords: Doping, oxide, reflectance.

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222 Shear Capacity of Rectangular Duct Panel Experiencing Internal Pressure

Authors: K. S. Sivakumaran, T. Thanga, B. Halabieh

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The end panels of a large rectangular industrial duct, which experience significant internal pressures, also experience considerable transverse shear due to transfer of gravity loads to the supports. The current design practice of such thin plate panels for shear load is based on methods used for the design of plate girder webs. The structural arrangements, the loadings and the resulting behavior associated with the industrial duct end panels are, however, significantly different from those of the web of a plate girder. The large aspect ratio of the end panels gives rise to multiple bands of tension fields, whereas the plate girder web design is based on one tension field. In addition to shear, the industrial end panels are subjected to internal pressure which in turn produces significant membrane action. This paper reports a study which was undertaken to review the current industrial analysis and design methods and to propose a comprehensive method of designing industrial duct end panels for shear resistance. In this investigation, a nonlinear finite element model was developed to simulate the behavior of industrial duct end panel, along with the associated edge stiffeners, subjected to transverse shear and internal pressures. The model considered the geometric imperfections and constitutive relations for steels. Six scale independent dimensionless parameters that govern the behavior of such end panel were identified and were then used in a parametric study. It was concluded that the plate slenderness dominates the shear strength of stockier end panels, and whereas, both the plate slenderness and the aspect ratio influence the shear strength of slender end panels. Based on these studies, this paper proposes design aids for estimating the shear strength of rectangular duct end panels.

Keywords: Thin plate, transverse shear, tension field, finite element analysis, parametric study, design.

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221 Finite Element Investigation of Transmission Conditions for Non-Monotonic Temperature Interphases

Authors: Hamid Mozafari, Andreas Öchsner, Amran Alias

Abstract:

Imperfect transmission conditions modeling a thin reactive 2D interphases layer between two dissimilar bonded strips have been extracted. In this paper, the soundness of these transmission conditions for heat conduction problems are examined by the finite element method for a strong temperature-dependent source or sink and non-monotonic temperature distributions around the faces..

Keywords: Imperfect interface, Transmission conditions, Finiteelement analysis, Interphase

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220 Ni Metallization on SiGe Nanowire

Authors: Y. Li, K. Buddharaju, X. P. Wang

Abstract:

The mechanism of nickel (Ni) metallization in silicon-germanium (Si0.5Ge0.5) alloy nanowire (NW) was studied. Transmission electron microscope imaging with in-situ annealing was conducted at temperatures of 200oC to 600°C. During rapid formation of Ni germanosilicide, loss of material from from the SiGe NW occurred which led to the formation of a thin Ni germanosilicide filament and eventual void. Energy dispersive X-ray spectroscopy analysis along the SiGe NW before and after annealing determined that Ge atoms tend to out-diffuse from the Ni germanosilicide towards the Ni source in the course of annealing. A model for the Ni germanosilicide formation in SiGe NW is proposed to explain this observation.

Keywords: SiGe, nanowires, germanosilicide.

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219 Image Ranking to Assist Object Labeling for Training Detection Models

Authors: Tonislav Ivanov, Oleksii Nedashkivskyi, Denis Babeshko, Vadim Pinskiy, Matthew Putman

Abstract:

Training a machine learning model for object detection that generalizes well is known to benefit from a training dataset with diverse examples. However, training datasets usually contain many repeats of common examples of a class and lack rarely seen examples. This is due to the process commonly used during human annotation where a person would proceed sequentially through a list of images labeling a sufficiently high total number of examples. Instead, the method presented involves an active process where, after the initial labeling of several images is completed, the next subset of images for labeling is selected by an algorithm. This process of algorithmic image selection and manual labeling continues in an iterative fashion. The algorithm used for the image selection is a deep learning algorithm, based on the U-shaped architecture, which quantifies the presence of unseen data in each image in order to find images that contain the most novel examples. Moreover, the location of the unseen data in each image is highlighted, aiding the labeler in spotting these examples. Experiments performed using semiconductor wafer data show that labeling a subset of the data, curated by this algorithm, resulted in a model with a better performance than a model produced from sequentially labeling the same amount of data. Also, similar performance is achieved compared to a model trained on exhaustive labeling of the whole dataset. Overall, the proposed approach results in a dataset that has a diverse set of examples per class as well as more balanced classes, which proves beneficial when training a deep learning model.

Keywords: Computer vision, deep learning, object detection, semiconductor.

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218 Magnetization of Thin-Film Permalloy Ellipses used for Programmable Motion of Magnetic Particles

Authors: P. Warnicke

Abstract:

Simulations of magnetic microstructure in elliptical Permalloy elements used for controlled motion of magnetic particles are discussed. The saturating field of the elliptical elements was studied with respect to lateral dimensions for one-vortex, cross-tie, diamond and double-diamond states as initial zero-field domain configurations. With aspect ratio of 1:3 the short axis was varied from 125 nm to 1000 nm, whereas the thickness was kept constant at 50 nm.

Keywords: Domain structure, magnetization, micromagnetics, Permalloy.

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217 The Effects of a Thin Liquid Layer on the Hydrodynamic Machine Rotor

Authors: Jaroslav Krutil, František Pochylý, Simona Fialová, Vladimír Habán

Abstract:

A mathematical model of the additional effects of the liquid in the hydrodynamic gap is presented in the paper. An incompressible viscous fluid is considered. Based on computational modeling are determined the matrices of mass, stiffness and damping. The mathematical model is experimentally verified.

Keywords: Computational modeling, mathematical model, hydrodynamic gap, matrices of mass, stiffness and damping.

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216 3D-Printing Plates without “Support”

Authors: Yasusi Kanada

Abstract:

When printing a plate (or dish) by an FDM 3D printer, the process normally requires support material, which causes several problems. This paper proposes a method for forming thin plates without using wasteful support material. This method requires several extraordinary parameter values when slicing plates. The experiments show that the plates can, for the most part, be successfully formed using a conventional slicer and a 3D printer; however, seams between layers spoil them and the quality of printed objects strongly depends on the slicer.

Keywords: Fused deposition modeling (FDM), 3D printing, Support-less, Layer seam, Slicer.

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215 Localized Non-Stability of the Semi-Infinite Elastic Orthotropic Plate

Authors: Reza Sharifian, Vagharshak Belubekyan

Abstract:

This paper is concerned with an investigation into the localized non-stability of a thin elastic orthotropic semi-infinite plate. In this study, a semi-infinite plate, simply supported on two edges and different boundary conditions, clamped, hinged, sliding contact and free on the other edge, are considered. The mathematical model is used and a general solution is presented the conditions under which localized solutions exist are investigated.

Keywords: Localized, Non-stability, Orthotropic, Semi-infinite

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214 Microstructure and Corrosion Behavior of Laser Welded Magnesium Alloys with Silver Nanoparticles

Authors: M. Ishak, K. Yamasaki, K. Maekawa

Abstract:

Magnesium alloys have gained increased attention in recent years in automotive, electronics, and medical industry. This because of magnesium alloys have better properties than aluminum alloys and steels in respects of their low density and high strength to weight ratio. However, the main problems of magnesium alloy welding are the crack formation and the appearance of porosity during the solidification. This paper proposes a unique technique to weld two thin sheets of AZ31B magnesium alloy using a paste containing Ag nanoparticles. The paste containing Ag nanoparticles of 5 nm in average diameter and an organic solvent was used to coat the surface of AZ31B thin sheet. The coated sheet was heated at 100 °C for 60 s to evaporate the solvent. The dried sheet was set as a lower AZ31B sheet on the jig, and then lap fillet welding was carried out by using a pulsed Nd:YAG laser in a closed box filled with argon gas. The characteristics of the microstructure and the corrosion behavior of the joints were analyzed by opticalmicroscopy (OM), energy dispersive spectrometry (EDS), electron probe micro-analyzer (EPMA), scanning electron microscopy (SEM), and immersion corrosion test. The experimental results show that the wrought AZ31B magnesium alloy can be joined successfully using Ag nanoparticles. Ag nanoparticles insert promote grain refinement, narrower the HAZ width and wider bond width compared to weld without and insert. Corrosion rate of welded AZ31B with Ag nanoparticles reduced up to 44 % compared to base metal. The improvement of corrosion resistance of welded AZ31B with Ag nanoparticles due to finer grains and large grain boundaries area which consist of high Al content. β-phase Mg17Al12 could serve as effective barrier and suppressed further propagation of corrosion. Furthermore, Ag distribution in fusion zone provide much more finer grains and may stabilize the magnesium solid solution making it less soluble or less anodic in aqueous

Keywords: Laser welding, magnesium alloys, nanoparticles, mechanical property

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213 Influence of Thermo-fluid-dynamic Parameters on Fluidics in an Expanding Thermal Plasma Deposition Chamber

Authors: G. Zuppardi, F. Romano

Abstract:

Technology of thin film deposition is of interest in many engineering fields, from electronic manufacturing to corrosion protective coating. A typical deposition process, like that developed at the University of Eindhoven, considers the deposition of a thin, amorphous film of C:H or of Si:H on the substrate, using the Expanding Thermal arc Plasma technique. In this paper a computing procedure is proposed to simulate the flow field in a deposition chamber similar to that at the University of Eindhoven and a sensitivity analysis is carried out in terms of: precursor mass flow rate, electrical power, supplied to the torch and fluid-dynamic characteristics of the plasma jet, using different nozzles. To this purpose a deposition chamber similar in shape, dimensions and operating parameters to the above mentioned chamber is considered. Furthermore, a method is proposed for a very preliminary evaluation of the film thickness distribution on the substrate. The computing procedure relies on two codes working in tandem; the output from the first code is the input to the second one. The first code simulates the flow field in the torch, where Argon is ionized according to the Saha-s equation, and in the nozzle. The second code simulates the flow field in the chamber. Due to high rarefaction level, this is a (commercial) Direct Simulation Monte Carlo code. Gas is a mixture of 21 chemical species and 24 chemical reactions from Argon plasma and Acetylene are implemented in both codes. The effects of the above mentioned operating parameters are evaluated and discussed by 2-D maps and profiles of some important thermo-fluid-dynamic parameters, as per Mach number, velocity and temperature. Intensity, position and extension of the shock wave are evaluated and the influence of the above mentioned test conditions on the film thickness and uniformity of distribution are also evaluated.

Keywords: Deposition chamber, Direct Simulation Mote Carlo method (DSMC), Plasma chemistry, Rarefied gas dynamics.

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