Search results for: Chip test
2916 A Study of Recent Contribution on Simulation Tools for Network-on-Chip
Authors: Muthana Saleh Alalaki, Michael Opoku Agyeman
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The growth in the number of Intellectual Properties (IPs) or the number of cores on the same chip becomes a critical issue in System-on-Chip (SoC) due to the intra-communication problem between the chip elements. As a result, Network-on-Chip (NoC) has emerged as a system architecture to overcome intra-communication issues. This paper presents a study of recent contributions on simulation tools for NoC. Furthermore, an overview of NoC is covered as well as a comparison between some NoC simulators to help facilitate research in on-chip communication.Keywords: Network-on-Chip, System-on-Chip, embedded systems, computer architecture.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 14532915 Low Cost Chip Set Selection Algorithm for Multi-way Partitioning of Digital System
Authors: Jae Young Park, Soongyu Kwon, Kyu Han Kim, Hyeong Geon Lee, Jong Tae Kim
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This paper considers the problem of finding low cost chip set for a minimum cost partitioning of a large logic circuits. Chip sets are selected from a given library. Each chip in the library has a different price, area, and I/O pin. We propose a low cost chip set selection algorithm. Inputs to the algorithm are a netlist and a chip information in the library. Output is a list of chip sets satisfied with area and maximum partitioning number and it is sorted by cost. The algorithm finds the sorted list of chip sets from minimum cost to maximum cost. We used MCNC benchmark circuits for experiments. The experimental results show that all of chip sets found satisfy the multiple partitioning constraints.Keywords: lowest cost chip set, MCNC benchmark, multi-way partitioning.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 15032914 3D Network-on-Chip with on-Chip DRAM: An Empirical Analysis for Future Chip Multiprocessor
Authors: Thomas Canhao Xu, Bo Yang, Alexander Wei Yin, Pasi Liljeberg, Hannu Tenhunen
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With the increasing number of on-chip components and the critical requirement for processing power, Chip Multiprocessor (CMP) has gained wide acceptance in both academia and industry during the last decade. However, the conventional bus-based onchip communication schemes suffer from very high communication delay and low scalability in large scale systems. Network-on-Chip (NoC) has been proposed to solve the bottleneck of parallel onchip communications by applying different network topologies which separate the communication phase from the computation phase. Observing that the memory bandwidth of the communication between on-chip components and off-chip memory has become a critical problem even in NoC based systems, in this paper, we propose a novel 3D NoC with on-chip Dynamic Random Access Memory (DRAM) in which different layers are dedicated to different functionalities such as processors, cache or memory. Results show that, by using our proposed architecture, average link utilization has reduced by 10.25% for SPLASH-2 workloads. Our proposed design costs 1.12% less execution cycles than the traditional design on average.
Keywords: 3D integration, network-on-chip, memory-on-chip, DRAM, chip multiprocessor.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 24462913 The Methodology of Flip Chip Using Astro Place and Route Tool
Authors: Rohaya Abdul Wahab, Raja Mohd Fuad Tengku Aziz, Nazaliza Othman, Sharifah Saleh, Nabihah Razali, Rozaimah Baharim, Md Hanif Md Nasir
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This paper will discuss flip chip methodology, in which I/O pads, standard cells, macros and bump cells array are placed in the floorplan, then routed using Astro place and route tool. Final DRC and LVS checking is done using Calibre verification tool. The design vehicle to run this methodology is an OpenRISC design targeted to Silterra 0.18 micrometer technology with 6 metal layers for routing. Astro has extensive support for flip chip placement and routing. Astro tool commands for flip chip are straightforward approach like the conventional standard wire bond packaging. However since we do not have flip chip commands in our Astro tool, no LEF file for bump cell and no LEF file for flip chip I/O pad, we create our own methodology to prepare for future flip chip tapeout.
Keywords: Astro, bump cell, Calibre, flip chip, LEF, methodology, SCHEME, TCL.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 27572912 Chip Formation during Turning Multiphase Microalloyed Steel
Authors: V.Sivaraman, S. Sankaran, L. Vijayaraghavan
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Machining through turning was carried out in a lathe to study the chip formation of Multiphase Ferrite (F-B-M) microalloyed steel. Taguchi orthogonal array was employed to perform the machining. Continuous and discontinuous chips were formed for different cutting parameters like speed, feed and depth of cut. Optical and scanning electron microscope was employed to identify the chip morphology.Keywords: Multiphase microalloyed steel, chip formation, Taguchi technique, turning, cutting parameters
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 16412911 The Design and Implementation of Classifying Bird Sounds
Authors: Haiyi Zhang, Jianli Guo, Daqian Yang
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This Classifying Bird Sounds (chip notes) project-s purpose is to reduce the unwanted noise from recorded bird sound chip notes, design a scheme to detect differences and similarities between recorded chip notes, and classify bird sound chip notes. The technologies of determining the similarities of sound waves have been used in communication, sound engineering and wireless sound applications for many years. Our research is focused on the similarity of chip notes, which are the sounds from different birds. The program we use is generated by Microsoft Cµ.Keywords: Classify Bird Sounds, Noise Filter, High-pass, Lowpass, Band-pass, Band-stop Filter, FIR.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 12442910 SoC Communication Architecture Modeling
Authors: Ziaddin Daie Koozekanani, Mina Zolfy Lighvan
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One of the most challengeable issues in ESL (Electronic System Level) design is the lack of a general modeling scheme for on chip communication architecture. In this paper some of the mostly used methodologies for modeling and representation of on chip communication are investigated. Our goal is studying the existing methods to extract the requirements of a general representation scheme for communication architecture synthesis. The next step, will be introducing a modeling and representation method for being used in automatically synthesis process of on chip communication architecture.Keywords: Communication architecture, System on Chip, Communication Modeling and Representation
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 14152909 A Single-chip Proportional to Absolute Temperature Sensor Using CMOS Technology
Authors: AL.AL, M. B. I. Reaz, S. M. A. Motakabber, Mohd Alauddin Mohd Ali
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Nowadays it is a trend for electronic circuit designers to integrate all system components on a single-chip. This paper proposed the design of a single-chip proportional to absolute temperature (PTAT) sensor including a voltage reference circuit using CEDEC 0.18m CMOS Technology. It is a challenge to design asingle-chip wide range linear response temperature sensor for many applications. The channel widths between the compensation transistor and the reference transistor are critical to design the PTAT temperature sensor circuit. The designed temperature sensor shows excellent linearity between -100°C to 200° and the sensitivity is about 0.05mV/°C. The chip is designed to operate with a single voltage source of 1.6V.Keywords: PTAT, single-chip circuit, linear temperature sensor, CMOS technology.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 34312908 Long-Term On-Chip Storage and Release of Liquid Reagents for Diagnostic Lab-on-a-Chip Applications
Authors: D. Czurratis, Y. Beyl, S. Zinober, R. Zengerle, F. Lärmer
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A new concept for long-term reagent storage for Labon- a-Chip (LoC) devices is described. Here we present a polymer multilayer stack with integrated stick packs for long-term storage of several liquid reagents, which are necessary for many diagnostic applications. Stick packs are widely used in packaging industry for storing solids and liquids for long time. The storage concept fulfills two main requirements: First, a long-term storage of reagents in stick packs without significant losses and interaction with surroundings, second, on demand releasing of liquids, which is realized by pushing a membrane against the stick pack through pneumatic pressure. This concept enables long-term on-chip storage of liquid reagents at room temperature and allows an easy implementation in different LoC devices.
Keywords: Lab-on-a-Chip, long-term storage, reagent storage, stick pack.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 30622907 Electrode Engineering for On-Chip Liquid Driving by Using Electrokinetic Effect
Authors: Reza Hadjiaghaie Vafaie, Aysan Madanpasandi, Behrooz Zare Desari, Seyedmohammad Mousavi
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High lamination in microchannel is one of the main challenges in on-chip components like micro total analyzer systems and lab-on-a-chips. Electro-osmotic force is highly effective in chip-scale. This research proposes a microfluidic-based micropump for low ionic strength solutions. Narrow microchannels are designed to generate an efficient electroosmotic flow near the walls. Microelectrodes are embedded in the lateral sides and actuated by low electric potential to generate pumping effect inside the channel. Based on the simulation study, the fluid velocity increases by increasing the electric potential amplitude. We achieve a net flow velocity of 100 µm/s, by applying +/- 2 V to the electrode structures. Our proposed low voltage design is of interest in conventional lab-on-a-chip applications.
Keywords: Integration, electrokinetic, on-chip, fluid pumping, microfluidic.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 8442906 LFSR Counter Implementation in CMOS VLSI
Authors: Doshi N. A., Dhobale S. B., Kakade S. R.
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As chip manufacturing technology is suddenly on the threshold of major evaluation, which shrinks chip in size and performance, LFSR (Linear Feedback Shift Register) is implemented in layout level which develops the low power consumption chip, using recent CMOS, sub-micrometer layout tools. Thus LFSR counter can be a new trend setter in cryptography and is also beneficial as compared to GRAY & BINARY counter and variety of other applications. This paper compares 3 architectures in terms of the hardware implementation, CMOS layout and power consumption, using Microwind CMOS layout tool. Thus it provides solution to a low power architecture implementation of LFSR in CMOS VLSI.Keywords: Chip technology, Layout level, LFSR, Pass transistor
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 45122905 Comparative Analysis of Transient-Fault Tolerant Schemes for Network on Chips
Authors: Muhammad Ali, Awais Adnan
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Network on a chip (NoC) has been proposed as a viable solution to counter the inefficiency of buses in the current VLSI on-chip interconnects. However, as the silicon chip accommodates more transistors, the probability of transient faults is increasing, making fault tolerance a key concern in scaling chips. In packet based communication on a chip, transient failures can corrupt the data packet and hence, undermine the accuracy of data communication. In this paper, we present a comparative analysis of transient fault tolerant techniques including end-to-end, node-by-node, and stochastic communication based on flooding principle.
Keywords: NoC, fault-tolerance, transient faults.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 13632904 Classifying Bio-Chip Data using an Ant Colony System Algorithm
Authors: Minsoo Lee, Yearn Jeong Kim, Yun-mi Kim, Sujeung Cheong, Sookyung Song
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Bio-chips are used for experiments on genes and contain various information such as genes, samples and so on. The two-dimensional bio-chips, in which one axis represent genes and the other represent samples, are widely being used these days. Instead of experimenting with real genes which cost lots of money and much time to get the results, bio-chips are being used for biological experiments. And extracting data from the bio-chips with high accuracy and finding out the patterns or useful information from such data is very important. Bio-chip analysis systems extract data from various kinds of bio-chips and mine the data in order to get useful information. One of the commonly used methods to mine the data is classification. The algorithm that is used to classify the data can be various depending on the data types or number characteristics and so on. Considering that bio-chip data is extremely large, an algorithm that imitates the ecosystem such as the ant algorithm is suitable to use as an algorithm for classification. This paper focuses on finding the classification rules from the bio-chip data using the Ant Colony algorithm which imitates the ecosystem. The developed system takes in consideration the accuracy of the discovered rules when it applies it to the bio-chip data in order to predict the classes.Keywords: Ant Colony System, DNA chip data, Classification.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 14672903 Design and Microfabrication of a High Throughput Thermal Cycling Platform with Various Annealing Temperatures
Authors: Sin J. Chen, Jyh J. Chen
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This study describes a micro device integrated with multi-chamber for polymerase chain reaction (PCR) with different annealing temperatures. The device consists of the reaction polydimethylsiloxane (PDMS) chip, a cover glass chip, and is equipped with cartridge heaters, fans, and thermocouples for temperature control. In this prototype, commercial software is utilized to determine the geometric and operational parameters those are responsible for creating the denaturation, annealing, and extension temperatures within the chip. Two cartridge heaters are placed at two sides of the chip and maintained at two different temperatures to achieve a thermal gradient on the chip during the annealing step. The temperatures on the chip surface are measured via an infrared imager. Some thermocouples inserted into the reaction chambers are used to obtain the transient temperature profiles of the reaction chambers during several thermal cycles. The experimental temperatures compared to the simulated results show a similar trend. This work should be interesting to persons involved in the high-temperature based reactions and genomics or cell analysis.Keywords: Polymerase chain reaction, thermal cycles, temperature gradient, micro-fabrication.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 16492902 Test Data Compression Using a Hybrid of Bitmask Dictionary and 2n Pattern Runlength Coding Methods
Authors: C. Kalamani, K. Paramasivam
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In VLSI, testing plays an important role. Major problem in testing are test data volume and test power. The important solution to reduce test data volume and test time is test data compression. The Proposed technique combines the bit maskdictionary and 2n pattern run length-coding method and provides a substantial improvement in the compression efficiency without introducing any additional decompression penalty. This method has been implemented using Mat lab and HDL Language to reduce test data volume and memory requirements. This method is applied on various benchmark test sets and compared the results with other existing methods. The proposed technique can achieve a compression ratio up to 86%.Keywords: Bit Mask dictionary, 2n pattern run length code, system-on-chip, SOC, test data compression.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 19212901 Independent Spanning Trees on Systems-on-chip Hypercubes Routing
Authors: Eduardo Sant'Ana da Silva, Andre Luiz Pires Guedes, Eduardo Todt
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Independent spanning trees (ISTs) provide a number of advantages in data broadcasting. One can cite the use in fault tolerance network protocols for distributed computing and bandwidth. However, the problem of constructing multiple ISTs is considered hard for arbitrary graphs. In this paper we present an efficient algorithm to construct ISTs on hypercubes that requires minimum resources to be performed.
Keywords: Hypercube, Independent Spanning Trees, Networks On Chip, Systems On Chip.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 18862900 A High Level Implementation of a High Performance Data Transfer Interface for NoC
Authors: Mansi Jhamb, R. K. Sharma, A. K. Gupta
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The distribution of a single global clock across a chip has become the major design bottleneck for high performance VLSI systems owing to the power dissipation, process variability and multicycle cross-chip signaling. A Network-on-Chip (NoC) architecture partitioned into several synchronous blocks has become a promising approach for attaining fine-grain power management at the system level. In a NoC architecture the communication between the blocks is handled asynchronously. To interface these blocks on a chip operating at different frequencies, an asynchronous FIFO interface is inevitable. However, these asynchronous FIFOs are not required if adjacent blocks belong to the same clock domain. In this paper, we have designed and analyzed a 16-bit asynchronous micropipelined FIFO of depth four, with the awareness of place and route on an FPGA device. We have used a commercially available Spartan 3 device and designed a high speed implementation of the asynchronous 4-phase micropipeline. The asynchronous FIFO implemented on the FPGA device shows 76 Mb/s throughput and a handshake cycle of 109 ns for write and 101.3 ns for read at the simulation under the worst case operating conditions (voltage = 0.95V) on a working chip at the room temperature.Keywords: Asynchronous, FIFO, FPGA, GALS, Network-on- Chip (NoC), VHDL.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 20402899 Mathematical Modeling Experimental Approach of the Friction on the Tool-Chip Interface of Multicoated Carbide Turning Inserts
Authors: Samy E. Oraby, Ayman M. Alaskari
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The importance of machining process in today-s industry requires the establishment of more practical approaches to clearly represent the intimate and severe contact on the tool-chipworkpiece interfaces. Mathematical models are developed using the measured force signals to relate each of the tool-chip friction components on the rake face to the operating cutting parameters in rough turning operation using multilayers coated carbide inserts. Nonlinear modeling proved to have high capability to detect the nonlinear functional variability embedded in the experimental data. While feedrate is found to be the most influential parameter on the friction coefficient and its related force components, both cutting speed and depth of cut are found to have slight influence. Greater deformed chip thickness is found to lower the value of friction coefficient as the sliding length on the tool-chip interface is reduced.Keywords: Mathematical modeling, Cutting forces, Frictionforces, Friction coefficient and Chip ratio.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 31242898 An Innovational Intermittent Algorithm in Networks-On-Chip (NOC)
Authors: Ahmad M. Shafiee, Mehrdad Montazeri, Mahdi Nikdast
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Every day human life experiences new equipments more automatic and with more abilities. So the need for faster processors doesn-t seem to finish. Despite new architectures and higher frequencies, a single processor is not adequate for many applications. Parallel processing and networks are previous solutions for this problem. The new solution to put a network of resources on a chip is called NOC (network on a chip). The more usual topology for NOC is mesh topology. There are several routing algorithms suitable for this topology such as XY, fully adaptive, etc. In this paper we have suggested a new algorithm named Intermittent X, Y (IX/Y). We have developed the new algorithm in simulation environment to compare delay and power consumption with elders' algorithms.Keywords: Computer architecture, parallel computing, NOC, routing algorithm.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 16772897 Design of a Pulse Generator Based on a Programmable System-on-Chip (PSoC) for Ultrasonic Applications
Authors: Pedro Acevedo, Carlos Díaz, Mónica Vázquez, Joel Durán
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This paper describes the design of a pulse generator based on the Programmable System-on-Chip (PSoC) module. In this module, using programmable logic is possible to implement different pulses which are required for ultrasonic applications, either in a single channel or multiple channels. This module can operate with programmable frequencies from 3-74 MHz; its programming may be versatile covering a wide range of ultrasonic applications. It is ideal for low-power ultrasonic applications where PZT or PVDF transducers are used.Keywords: pulse generator, PVDF, Programmable System-on-Chip (PSoC), ultrasonic transducer
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 20042896 Interaction Effect of Feed Rate and Cutting Speed in CNC-Turning on Chip Micro-Hardness of 304- Austenitic Stainless Steel
Authors: G. H. Senussi
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The present work is concerned with the effect of turning process parameters (cutting speed, feed rate, and depth of cut) and distance from the center of work piece as input variables on the chip micro-hardness as response or output. Three experiments were conducted; they were used to investigate the chip micro-hardness behavior at diameter of work piece for 30[mm], 40[mm], and 50[mm]. Response surface methodology (R.S.M) is used to determine and present the cause and effect of the relationship between true mean response and input control variables influencing the response as a two or three dimensional hyper surface. R.S.M has been used for designing a three factor with five level central composite rotatable factors design in order to construct statistical models capable of accurate prediction of responses. The results obtained showed that the application of R.S.M can predict the effect of machining parameters on chip micro-hardness. The five level factorial designs can be employed easily for developing statistical models to predict chip micro-hardness by controllable machining parameters. Results obtained showed that the combined effect of cutting speed at it?s lower level, feed rate and depth of cut at their higher values, and larger work piece diameter can result increasing chi micro-hardness.Keywords: Machining Parameters, Chip Micro-Hardness, CNCMachining, 304-Austenic Stainless Steel.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 32832895 Trends in Use of Millings in Pavement Maintenance
Authors: Rafiqul Tarefder, Mohiuddin Ahmad, Mohammad Hossain
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While millings materials from old pavement surface can be an important component of cost effective maintenance operation, their use in maintenance projects are not uniform and well documented. This study documents the different maintenance practices followed by four transportation districts of New Mexico Department of Transportation (NMDOT) in an attempt to find whether millings are being used in maintenance projects by those districts. Based on existing literature, a questionnaire was developed related to six common maintenance practices. NMDOT district personal were interviewed face to face to discuss and get answers to that questionnaire. It revealed that NMDOT districts mainly use chip seal and patching. Other maintenance procedures such as sand seal, scrub seal, slurry seal, and thin overlay have limited use. Two out of four participating districts do not have any documents on chip sealing; rather they employ the experiences of the chip seal crew. All districts use polymer modified high float emulsion (HFE100P) for chip seal with an application rate ranging from 0.4 to 0.56 gallons per square yard. Chip application rate varies from 15 to 40 lb/ square yard. State wide, the thickness of chip seal varies from 3/8'' to 1'' and life varies from 3 to 10 years. NMDOT districts mainly use three type of patching: pothole, dig-out and blade patch. Pothole patches are used for small potholes and during emergency, dig-out patches are used for all type of potholes sometimes after pothole patching, and blade patch is used when a significant portion of the pavement is damaged. Pothole patches last as low as three days whereas, blade patch lasts as long as 3 years. It was observed that all participating districts use millings in maintenance projects.
Keywords: Chip seal, sand seal, scrub seal, slurry seal, overlay, patching, millings.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 19962894 Influence of Organic Supplements on Shoot Multiplication Efficiency of Phaius tankervilleae var. alba
Authors: T. Punjansing, M. Nakkuntod, S. Homchan, P. Inthima, A. Kongbangkerd
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The influence of organic supplements on growth and multiplication efficiency of Phaius tankervilleae var. alba seedlings was investigated. 12 week-old seedlings were cultured on half-strength semi-solid Murashige and Skoog (MS) medium supplemented with 30 g/L sucrose, 8 g/L agar and various concentrations of coconut water (0, 50, 100, 150 and 200 mL/L) combined with potato extract (0, 25 and 50 g/L) and the pH was adjusted to 5.8 prior to autoclaving. The cultures were then kept under constant photoperiod (16 h light: 8 h dark) at 25 ± 2 °C for 12 weeks. The highest number of shoots (3.0 shoots/explant) was obtained when cultured on the medium added with 50 ml/L coconut water and 50 g/L potato extract whereas the highest number of leaves (5.9 leaves/explant) and roots (6.1 roots/explant) could receive on the medium supplemented with 150 ml/L coconut water and 50 g/L potato extract. with 150 ml/L coconut water and 50 g/L potato extract. Additionally, plantlets of P. tankervilleae var. alba were transferred to grow into seven different substrates i.e. soil, sand, coconut husk chip, soil-sand mix (1: 1), soil-coconut husk chip mix (1: 1), sand-coconut husk chip mix (1: 1) and soil-sand-coconut husk chip mix (1: 1: 1) for four weeks. The results found that acclimatized plants showed 100% of survivals when sand, coconut husk chip and sand-coconut husk chip mix are used as substrates. The number of leaves induced by sand-coconut husk chip mix was significantly higher than that planted in other substrates (P > 0.05). Meanwhile, no significant difference in new shoot formation among these substrates was observed (P < 0.05). This precursory developing protocol was likely to be applied for more large scale of plant production as well as conservation of germplasm of this orchid species.
Keywords: Acclimatization, coconut water, orchid, Phaius tankervilleae var. alba., potato extract.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 7862893 Dual-Link Hierarchical Cluster-Based Interconnect Architecture for 3D Network on Chip
Authors: Guang Sun, Yong Li, Yuanyuan Zhang, Shijun Lin, Li Su, Depeng Jin, Lieguang zeng
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Network on Chip (NoC) has emerged as a promising on chip communication infrastructure. Three Dimensional Integrate Circuit (3D IC) provides small interconnection length between layers and the interconnect scalability in the third dimension, which can further improve the performance of NoC. Therefore, in this paper, a hierarchical cluster-based interconnect architecture is merged with the 3D IC. This interconnect architecture significantly reduces the number of long wires. Since this architecture only has approximately a quarter of routers in 3D mesh-based architecture, the average number of hops is smaller, which leads to lower latency and higher throughput. Moreover, smaller number of routers decreases the area overhead. Meanwhile, some dual links are inserted into the bottlenecks of communication to improve the performance of NoC. Simulation results demonstrate our theoretical analysis and show the advantages of our proposed architecture in latency, throughput and area, when compared with 3D mesh-based architecture.Keywords: Network on Chip (NoC), interconnect architecture, performance, area, Three Dimensional Integrate Circuit (3D IC).
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 15262892 Experimental Determination of Large Strain Localization in Cut Steel Chips
Authors: A. Simoneau
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Metal cutting is a severe plastic deformation process involving large strains, high strain rates, and high temperatures. Conventional analysis of the chip formation process is based on bulk material deformation disregarding the inhomogeneous nature of the material microstructure. A series of orthogonal cutting tests of AISI 1045 and 1144 steel were conducted which yielded similar process characteristics and chip formations. With similar shear angles and cut chip thicknesses, shear strains for both chips were found to range from 2.0 up to 2.8. The manganese-sulfide (MnS) precipitate in the 1144 steel has a very distinct and uniform shape which allows for comparison before and after chip formation. From close observations of MnS precipitates in the cut chips it is shown that the conventional approach underestimates plastic strains in metal cutting. Experimental findings revealed local shear strains around a value of 6. These findings and their implications are presented and discussed.Keywords: Machining, metal cutting, microstructure, plastic strains, local strain.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 21212891 Self Compensating ON Chip LDO Voltage Regulator in 180nm
Authors: SreehariRao Patri, K. S. R. KrishnaPrasad
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An on chip low drop out voltage regulator that employs elegant compensation scheme is presented in this paper. The novelty in this design is that the device parasitic capacitances are exploited for compensation at different loads. The proposed LDO is designed to provide a constant voltage of 1.2V and is implemented in UMC 180 nano meter CMOS technology. The voltage regulator presented improves stability even at lighter loads and enhances line and load regulation. Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 25452890 An Ant-based Clustering System for Knowledge Discovery in DNA Chip Analysis Data
Authors: Minsoo Lee, Yun-mi Kim, Yearn Jeong Kim, Yoon-kyung Lee, Hyejung Yoon
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Biological data has several characteristics that strongly differentiate it from typical business data. It is much more complex, usually large in size, and continuously changes. Until recently business data has been the main target for discovering trends, patterns or future expectations. However, with the recent rise in biotechnology, the powerful technology that was used for analyzing business data is now being applied to biological data. With the advanced technology at hand, the main trend in biological research is rapidly changing from structural DNA analysis to understanding cellular functions of the DNA sequences. DNA chips are now being used to perform experiments and DNA analysis processes are being used by researchers. Clustering is one of the important processes used for grouping together similar entities. There are many clustering algorithms such as hierarchical clustering, self-organizing maps, K-means clustering and so on. In this paper, we propose a clustering algorithm that imitates the ecosystem taking into account the features of biological data. We implemented the system using an Ant-Colony clustering algorithm. The system decides the number of clusters automatically. The system processes the input biological data, runs the Ant-Colony algorithm, draws the Topic Map, assigns clusters to the genes and displays the output. We tested the algorithm with a test data of 100 to1000 genes and 24 samples and show promising results for applying this algorithm to clustering DNA chip data.
Keywords: Ant colony system, biological data, clustering, DNA chip.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 19732889 An Electrically Small Silver Ink Printed FR4 Antenna for RF Transceiver Chip CC1101
Authors: F. Majeed, D. V. Thiel, M. Shahpari
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An electrically small meander line antenna is designed for impedance matching with RF transceiver chip CC1101. The design provides the flexibility of tuning the reactance of the antenna over a wide range of values: highly capacitive to highly inductive. The antenna was printed with silver ink on FR4 substrate using the screen printing design process. The antenna impedance was perfectly matched to CC1101 at 433 MHz. The measured radiation efficiency of the antenna was 81.3% at resonance. The 3 dB and 10 dB fractional bandwidth of the antenna was 14.5% and 4.78%, respectively. The read range of the antenna was compared with a copper wire monopole antenna over a distance of five meters. The antenna, with a perfect impedance match with RF transceiver chip CC1101, shows improvement in the read range compared to a monopole antenna over the specified distance.Keywords: Meander line antenna, RFID, Silver ink printing, Impedance matching.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 12832888 Closed form Delay Model for on-Chip VLSIRLCG Interconnects for Ramp Input for Different Damping Conditions
Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar
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Fast delay estimation methods, as opposed to simulation techniques, are needed for incremental performance driven layout synthesis. On-chip inductive effects are becoming predominant in deep submicron interconnects due to increasing clock speed and circuit complexity. Inductance causes noise in signal waveforms, which can adversely affect the performance of the circuit and signal integrity. Several approaches have been put forward which consider the inductance for on-chip interconnect modelling. But for even much higher frequency, of the order of few GHz, the shunt dielectric lossy component has become comparable to that of other electrical parameters for high speed VLSI design. In order to cope up with this effect, on-chip interconnect has to be modelled as distributed RLCG line. Elmore delay based methods, although efficient, cannot accurately estimate the delay for RLCG interconnect line. In this paper, an accurate analytical delay model has been derived, based on first and second moments of RLCG interconnection lines. The proposed model considers both the effect of inductance and conductance matrices. We have performed the simulation in 0.18μm technology node and an error of as low as less as 5% has been achieved with the proposed model when compared to SPICE. The importance of the conductance matrices in interconnect modelling has also been discussed and it is shown that if G is neglected for interconnect line modelling, then it will result an delay error of as high as 6% when compared to SPICE.Keywords: Delay Modelling; On-Chip Interconnect; RLCGInterconnect; Ramp Input; Damping; VLSI
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 20472887 Analysis of Tool-Chip Interface Temperature with FEM and Empirical Verification
Authors: M. Bagheri, P. Mottaghizadeh
Abstract:
Reliable information about tool temperature distribution is of central importance in metal cutting. In this study, tool-chip interface temperature was determined in cutting of ST37 steel workpiece by applying HSS as the cutting tool in dry turning. Two different approaches were implemented for temperature measuring: an embedded thermocouple (RTD) in to the cutting tool and infrared (IR) camera. Comparisons are made between experimental data and results of MSC.SuperForm and FLUENT software. An investigation of heat generation in cutting tool was performed by varying cutting parameters at the stable cutting tool geometry and results were saved in a computer; then the diagrams of tool temperature vs. various cutting parameters were obtained. The experimental results reveal that the main factors of the increasing cutting temperature are cutting speed (V ), feed rate ( S ) and depth of cut ( h ), respectively. It was also determined that simultaneously change in cutting speed and feed rate has the maximum effect on increasing cutting temperature.Keywords: Cutting parameters, Finite element modeling, Temperature measurement, Tool-chip interface temperature.
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