Search results for: Fast wafer level reliability
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 4762

Search results for: Fast wafer level reliability

4762 Influence of Measurement System on Negative Bias Temperature Instability Characterization: Fast BTI vs Conventional BTI vs Fast Wafer Level Reliability

Authors: Vincent King Soon Wong, Hong Seng Ng, Florinna Sim

Abstract:

Negative Bias Temperature Instability (NBTI) is one of the critical degradation mechanisms in semiconductor device reliability that causes shift in the threshold voltage (Vth). However, thorough understanding of this reliability failure mechanism is still unachievable due to a recovery characteristic known as NBTI recovery. This paper will demonstrate the severity of NBTI recovery as well as one of the effective methods used to mitigate, which is the minimization of measurement system delays. Comparison was done in between two measurement systems that have significant differences in measurement delays to show how NBTI recovery causes result deviations and how fast measurement systems can mitigate NBTI recovery. Another method to minimize NBTI recovery without the influence of measurement system known as Fast Wafer Level Reliability (FWLR) NBTI was also done to be used as reference.

Keywords: Fast vs slow BTI, Fast wafer level reliability, Negative bias temperature instability, NBTI measurement system, metal-oxide-semiconductor field-effect transistor, MOSFET, NBTI recovery, reliability.

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4761 The Grinding Influence on the Strength of Fan-Out Wafer-Level Packages

Authors: Z. W. Zhong, C. Xu, W. K. Choi

Abstract:

To build a thin fan-out wafer-level package, the package had to be ground to a thin level. In this work, the influence of the grinding processes on the strength of the fan-out wafer-level packages was investigated. After different grinding processes, all specimens were placed on a three-point-bending fixture installed on a universal tester for three-point-bending testing, and the strength of the fan-out wafer-level packages was measured. The experiments revealed that the average flexure strength increased with the decreasing surface roughness height of the fan-out wafer-level package tested. The grinding processes had a significant influence on the strength of the fan-out wafer-level packages investigated.

Keywords: FOWLP strength, surface roughness, three-point bending, grinding.

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4760 Wafer Fab Operational Cost Monitoring and Controlling with Cost per Equivalent Wafer Out

Authors: Ian Kree, Davina Chin Lee Yien

Abstract:

This paper presents Cost per Equivalent Wafer Out, which we find useful in wafer fab operational cost monitoring and controlling. It removes the loading and product mix effect in the cost variance analysis. The operation heads, therefore, could immediately focus on identifying areas for cost improvement. Without this, they would have to measure the impact of the loading variance and product mix variance between actual and budgeted prior to make any decision on cost improvement. Cost per Equivalent Wafer Out, thereby, increases efficiency in wafer fab operational cost monitoring and controlling.

Keywords: Cost Control, Cost Variance, Operational Expenditure, Semiconductor.

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4759 Development and Optimization of Automated Dry-Wafer Separation

Authors: Tim Giesen, Christian Fischmann, Fabian Böttinger, Alexander Ehm, Alexander Verl

Abstract:

In a state-of-the-art industrial production line of photovoltaic products the handling and automation processes are of particular importance and implication. While processing a fully functional crystalline solar cell an as-cut photovoltaic wafer is subject to numerous repeated handling steps. With respect to stronger requirements in productivity and decreasing rejections due to defects the mechanical stress on the thin wafers has to be reduced to a minimum as the fragility increases by decreasing wafer thicknesses. In relation to the increasing wafer fragility, researches at the Fraunhofer Institutes IPA and CSP showed a negative correlation between multiple handling processes and the wafer integrity. Recent work therefore focused on the analysis and optimization of the dry wafer stack separation process with compressed air. The achievement of a wafer sensitive process capability and a high production throughput rate is the basic motivation in this research.

Keywords: Automation, Photovoltaic Manufacturing, Thin Wafer, Material Handling

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4758 Integration of CMOS Biosensor into a Polymeric Lab-on-a-Chip System

Authors: T. Brettschneider, C. Dorrer, H. Suy, T. Braun, E. Jung, R. Hoofman, M. Bründel, R. Zengerle, F. Lärmer

Abstract:

We present an integration approach of a CMOS biosensor into a polymer based microfluidic environment suitable for mass production. It consists of a wafer-level-package for the silicon die and laser bonding process promoted by an intermediate hot melt foil to attach the sensor package to the microfluidic chip, without the need for dispensing of glues or underfiller. A very good condition of the sensing area was obtained after introducing a protection layer during packaging. A microfluidic flow cell was fabricated and shown to withstand pressures up to Δp = 780 kPa without leakage. The employed biosensors were electrically characterized in a dry environment.

Keywords: CMOS biosensor, laser bonding, silicon polymer integration, wafer level packaging.

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4757 Optimal Sizing of a Hybrid Wind/PV Plant Considering Reliability Indices

Authors: S. Dehghan, B. Kiani, A. Kazemi, A. Parizad

Abstract:

The utilization of renewable energy sources in electric power systems is increasing quickly because of public apprehensions for unpleasant environmental impacts and increase in the energy costs involved with the use of conventional energy sources. Despite the application of these energy sources can considerably diminish the system fuel costs, they can also have significant influence on the system reliability. Therefore an appropriate combination of the system reliability indices level and capital investment costs of system is vital. This paper presents a hybrid wind/photovoltaic plant, with the aim of supplying IEEE reliability test system load pattern while the plant capital investment costs is minimized by applying a hybrid particle swarm optimization (PSO) / harmony search (HS) approach, and the system fulfills the appropriate level of reliability.

Keywords: Distributed Generation, Fuel Cell, HS, Hybrid Power Plant, PSO, Photovoltaic, Reliability.

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4756 GEP Considering Purchase Prices, Profits of IPPs and Reliability Criteria Using Hybrid GA and PSO

Authors: H. Shayeghi, H. Hosseini, A. Shabani, M. Mahdavi

Abstract:

In this paper, optimal generation expansion planning (GEP) is investigated considering purchase prices, profits of independent power producers (IPPs) and reliability criteria using a new method based on hybrid coded Genetic Algorithm (GA) and Particle Swarm Optimization (PSO). In this approach, optimal purchase price of each IPP is obtained by HCGA and reliability criteria are calculated by PSO technique. It should be noted that reliability criteria and the rate of carbon dioxide (CO2) emission have been considered as constraints of the GEP problem. Finally, the proposed method has been tested on the case study system. The results evaluation show that the proposed method can simply obtain optimal purchase prices of IPPs and is a fast method for calculation of reliability criteria in expansion planning. Also, considering the optimal purchase prices and profits of IPPs in generation expansion planning are caused that the expansion costs are decreased and the problem is solved more exactly.

Keywords: GEP Problem, IPPs, Reliability Criteria, GA, PSO.

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4755 Intelligent Face-Up CMP System Integrated with On-Line Optical Measurements

Authors: Sheng-Ming Huang, Nan-Chyuan Tsai, Chih-Che Lin, Chun-Chi Lin

Abstract:

An innovative design for intelligent Chemical Mechanical Polishing (CMP) system is proposed and verified by experiments in this report. On-line measurement and real-time feedback are integrated to eliminate the shortcomings of traditional approaches, e.g., the batch-to-batch discrepancy of required polishing time, over consumption of chemical slurry, and non-uniformity across the wafer. The major advantage of the proposed method is that the finish of local surface roughness can be consistent, no matter where the inner-ring region or outer-ring region is concerned. Secondly, it is able to eliminate the Edge effect. Conventionally, the interfacial induced stress near the wafer edge is generally much higher than that near the wafer center. At last, by using the proposed intelligent chemical mechanical polishing strategy, the cost of the entire machining cycle can be much reduced while the quality of the finished goods certainly upgraded.

Keywords: Chemical Mechanical Polishing, Active Magnetic Actuator, On-Line Measurement.

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4754 Operation Strategy of Multi-Energy Storage System Considering Power System Reliability

Authors: Wook-Won Kim, Je-Seok Shin, Jin-O Kim

Abstract:

As the penetration of Energy Storage System (ESS) increases in the power system due to higher performance and lower cost than ever, ESS is expanding its role to the ancillary service as well as the storage of extra energy from the intermittent renewable energy resources. For multi-ESS with different capacity and SOC level each other, it is required to make the optimal schedule of SOC level use the multi-ESS effectively. This paper proposes the energy allocation method for the multiple battery ESS with reliability constraint, in order to make the ESS discharge the required energy as long as possible. A simple but effective method is proposed in this paper, to satisfy the power for the spinning reserve requirement while improving the system reliability. Modelling of ESS is also proposed, and reliability is evaluated by using the combined reliability model which includes the proposed ESS model and conventional generation one. In the case study, it can be observed that the required power is distributed to each ESS adequately and accordingly, the SOC is scheduled to improve the reliability indices such as Loss of Load Probability (LOLP) and Loss of Load Expectation (LOLE).

Keywords: Multiple energy storage system, energy allocation method, SOC schedule, reliability constraints.

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4753 Lightweight Robotic Material Handling in Photovoltaic Module Manufacturing-Silicon Wafer and Thin Film Technologies

Authors: N. Asadi, M. Jackson

Abstract:

Today, the central role of industrial robots in automation in general and in material handling in particular is crystal clear. Based on the current status of Photovoltaics and by focusing on lightweight material handling, PV industry has turned into a potential candidate for introducing a fresh “pick and place" robot technology. Thus, to examine the industry needs in this regard, firstly the best suited applications for such robotic automation,and then the essential prerequisites in PV industry should be identified. The objective of this paper is to present holistic views on the industry trends, general automation status and existing challenges facing lightweight robotic material handling in PV Silicon Wafer and Thin Film technologies. The results of this study show that currently no uniform pick and place solution prevails among PV Silicon Wafer manufacturers and the industry calls for a new robot solution to satisfy its needs in new directions.

Keywords: Automation, Material handling, Photovoltaic, Robot.

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4752 Analysis of Testing and Operational Software Reliability in SRGM based on NHPP

Authors: S. Thirumurugan, D. R. Prince Williams

Abstract:

Software Reliability is one of the key factors in the software development process. Software Reliability is estimated using reliability models based on Non Homogenous Poisson Process. In most of the literature the Software Reliability is predicted only in testing phase. So it leads to wrong decision-making concept. In this paper, two Software Reliability concepts, testing and operational phase are studied in detail. Using S-Shaped Software Reliability Growth Model (SRGM) and Exponential SRGM, the testing and operational reliability values are obtained. Finally two reliability values are compared and optimal release time is investigated.

Keywords: Error Detection Rate, Estimation of Parameters, Instantaneous Failure Rate, Mean Value Function, Non Homogenous Poisson Process (NHPP), Software Reliability.

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4751 Techniques for Reliability Evaluation in Distribution System Planning

Authors: T. Lantharthong, N. Phanthuna

Abstract:

This paper presents reliability evaluation techniques which are applied in distribution system planning studies and operation. Reliability of distribution systems is an important issue in power engineering for both utilities and customers. Reliability is a key issue in the design and operation of electric power distribution systems and load. Reliability evaluation of distribution systems has been the subject of many recent papers and the modeling and evaluation techniques have improved considerably.

Keywords: Reliability Evaluation, Optimization Technique, Reliability Indices

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4750 Improving Survivability in Wireless Ad Hoc Network

Authors: Seyed Ali Sadat Noori, Elham Sahebi Bazaz

Abstract:

Topological changes in mobile ad hoc networks frequently render routing paths unusable. Such recurrent path failures have detrimental effects on quality of service. A suitable technique for eliminating this problem is to use multiple backup paths between the source and the destination in the network. This paper proposes an effective and efficient protocol for backup and disjoint path set in ad hoc wireless network. This protocol converges to a highly reliable path set very fast with no message exchange overhead. The paths selection according to this algorithm is beneficial for mobile ad hoc networks, since it produce a set of backup paths with more high reliability. Simulation experiments are conducted to evaluate the performance of our algorithm in terms of route numbers in the path set and its reliability. In order to acquire link reliability estimates, we use link expiration time (LET) between two nodes.

Keywords: Wireless Ad Hoc Networks, Reliability, Routing, Disjoint Path

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4749 Performance Analysis of Software Reliability Models using Matrix Method

Authors: RajPal Garg, Kapil Sharma, Rajive Kumar, R. K. Garg

Abstract:

This paper presents a computational methodology based on matrix operations for a computer based solution to the problem of performance analysis of software reliability models (SRMs). A set of seven comparison criteria have been formulated to rank various non-homogenous Poisson process software reliability models proposed during the past 30 years to estimate software reliability measures such as the number of remaining faults, software failure rate, and software reliability. Selection of optimal SRM for use in a particular case has been an area of interest for researchers in the field of software reliability. Tools and techniques for software reliability model selection found in the literature cannot be used with high level of confidence as they use a limited number of model selection criteria. A real data set of middle size software project from published papers has been used for demonstration of matrix method. The result of this study will be a ranking of SRMs based on the Permanent value of the criteria matrix formed for each model based on the comparison criteria. The software reliability model with highest value of the Permanent is ranked at number – 1 and so on.

Keywords: Matrix method, Model ranking, Model selection, Model selection criteria, Software reliability models.

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4748 A Spatial Point Pattern Analysis to Recognize Fail Bit Patterns in Semiconductor Manufacturing

Authors: Youngji Yoo, Seung Hwan Park, Daewoong An, Sung-Shick Kim, Jun-Geol Baek

Abstract:

The yield management system is very important to produce high-quality semiconductor chips in the semiconductor manufacturing process. In order to improve quality of semiconductors, various tests are conducted in the post fabrication (FAB) process. During the test process, large amount of data are collected and the data includes a lot of information about defect. In general, the defect on the wafer is the main causes of yield loss. Therefore, analyzing the defect data is necessary to improve performance of yield prediction. The wafer bin map (WBM) is one of the data collected in the test process and includes defect information such as the fail bit patterns. The fail bit has characteristics of spatial point patterns. Therefore, this paper proposes the feature extraction method using the spatial point pattern analysis. Actual data obtained from the semiconductor process is used for experiments and the experimental result shows that the proposed method is more accurately recognize the fail bit patterns.

Keywords: Semiconductor, wafer bin map (WBM), feature extraction, spatial point patterns, contour map.

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4747 Reliability Assessment of Bangladesh Power System Using Recursive Algorithm

Authors: Nahid-Al-Masood, Jubaer Ahmed, Amina Hasan Abedin, S. R. Deeba, Faeza Hafiz, Mahmuda Begum

Abstract:

An electric utility-s main concern is to plan, design, operate and maintain its power supply to provide an acceptable level of reliability to its users. This clearly requires that standards of reliability be specified and used in all three sectors of the power system, i.e., generation, transmission and distribution. That is why reliability of a power system is always a major concern to power system planners. This paper presents the reliability analysis of Bangladesh Power System (BPS). Reliability index, loss of load probability (LOLP) of BPS is evaluated using recursive algorithm and considering no de-rated states of generators. BPS has sixty one generators and a total installed capacity of 5275 MW. The maximum demand of BPS is about 5000 MW. The relevant data of the generators and hourly load profiles are collected from the National Load Dispatch Center (NLDC) of Bangladesh and reliability index 'LOLP' is assessed for the period of last ten years.

Keywords: Recursive algorithm, LOLP, forced outage rate, cumulative probability.

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4746 Series-Parallel Systems Reliability Optimization Using Genetic Algorithm and Statistical Analysis

Authors: Essa Abrahim Abdulgader Saleem, Thien-My Dao

Abstract:

The main objective of this paper is to optimize series-parallel system reliability using Genetic Algorithm (GA) and statistical analysis; considering system reliability constraints which involve the redundant numbers of selected components, total cost, and total weight. To perform this work, firstly the mathematical model which maximizes system reliability subject to maximum system cost and maximum system weight constraints is presented; secondly, a statistical analysis is used to optimize GA parameters, and thirdly GA is used to optimize series-parallel systems reliability. The objective is to determine the strategy choosing the redundancy level for each subsystem to maximize the overall system reliability subject to total cost and total weight constraints. Finally, the series-parallel system case study reliability optimization results are showed, and comparisons with the other previous results are presented to demonstrate the performance of our GA.

Keywords: Genetic algorithm, optimization, reliability, statistical analysis.

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4745 The Characterisation of TLC NAND Flash Memory, Leading to a Definable Endurance/Retention Trade-Off

Authors: Sorcha Bennett, Joe Sullivan

Abstract:

Triple-Level Cell (TLC) NAND Flash memory at, and below, 20nm (nanometer) is still largely unexplored by researchers, and with the ever more commonplace existence of Flash in consumer and enterprise applications there is a need for such gaps in knowledge to be filled. At the time of writing, there was little published data or literature on TLC, and more specifically reliability testing, with a further emphasis on both endurance and retention. This paper will give an introduction to NAND Flash memory, followed by an overview of the relevant current research on the reliability of Flash memory, along with the planned future work which will provide results to help characterise the reliability of TLC memory.

Keywords: TLC NAND flash memory, reliability, endurance, retention, trade-off, raw flash, patterns.

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4744 Multi-Objective Optimization of Combined System Reliability and Redundancy Allocation Problem

Authors: Vijaya K. Srivastava, Davide Spinello

Abstract:

This paper presents established 3n enumeration procedure for mixed integer optimization problems for solving multi-objective reliability and redundancy allocation problem subject to design constraints. The formulated problem is to find the optimum level of unit reliability and the number of units for each subsystem. A number of illustrative examples are provided and compared to indicate the application of the superiority of the proposed method.

Keywords: Integer programming, mixed integer programming, multi-objective optimization, reliability redundancy allocation.

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4743 Reliability Evaluation using Triangular Intuitionistic Fuzzy Numbers Arithmetic Operations

Authors: G. S. Mahapatra, T. K. Roy

Abstract:

In general fuzzy sets are used to analyze the fuzzy system reliability. Here intuitionistic fuzzy set theory for analyzing the fuzzy system reliability has been used. To analyze the fuzzy system reliability, the reliability of each component of the system as a triangular intuitionistic fuzzy number is considered. Triangular intuitionistic fuzzy number and their arithmetic operations are introduced. Expressions for computing the fuzzy reliability of a series system and a parallel system following triangular intuitionistic fuzzy numbers have been described. Here an imprecise reliability model of an electric network model of dark room is taken. To compute the imprecise reliability of the above said system, reliability of each component of the systems is represented by triangular intuitionistic fuzzy numbers. Respective numerical example is presented.

Keywords: Fuzzy set, Intuitionistic fuzzy number, Systemreliability, Triangular intuitionistic fuzzy number.

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4742 Sensitivity Analysis in Power Systems Reliability Evaluation

Authors: A.R Alesaadi, M. Nafar, A.H. Gheisari

Abstract:

In this paper sensitivity analysis is performed for reliability evaluation of power systems. When examining the reliability of a system, it is useful to recognize how results change as component parameters are varied. This knowledge helps engineers to understand the impact of poor data, and gives insight on how reliability can be improved. For these reasons, a sensitivity analysis can be performed. Finally, a real network was used for testing the presented method.

Keywords: sensitivity analysis, reliability evaluation, powersystems.

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4741 Effective Scheduling of Semiconductor Manufacturing using Simulation

Authors: Ingy A. El-Khouly, Khaled S. El-Kilany, Aziz E. El-Sayed

Abstract:

The process of wafer fabrication is arguably the most technologically complex and capital intensive stage in semiconductor manufacturing. This large-scale discrete-event process is highly reentrant, and involves hundreds of machines, restrictions, and processing steps. Therefore, production control of wafer fabrication facilities (fab), specifically scheduling, is one of the most challenging problems that this industry faces. Dispatching rules have been extensively applied to the scheduling problems in semiconductor manufacturing. Moreover, lot release policies are commonly used in this manufacturing setting to further improve the performance of such systems and reduce its inherent variability. In this work, simulation is used in the scheduling of re-entrant flow shop manufacturing systems with an application in semiconductor wafer fabrication; where, a simulation model has been developed for the Intel Five-Machine Six Step Mini-Fab using the ExtendTM simulation environment. The Mini-Fab has been selected as it captures the challenges involved in scheduling the highly re-entrant semiconductor manufacturing lines. A number of scenarios have been developed and have been used to evaluate the effect of different dispatching rules and lot release policies on the selected performance measures. Results of simulation showed that the performance of the Mini-Fab can be drastically improved using a combination of dispatching rules and lot release policy.

Keywords: Dispatching rules, lot release policy, re-entrant flowshop, semiconductor manufacturing.

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4740 Prediction of the Total Decay Heat from Fast Neutron Fission of 235U and 239Pu

Authors: Sherif. S. Nafee, Ameer. K. Al-Ramady, Salem. A. Shaheen

Abstract:

The analytical prediction of the decay heat results from the fast neutron fission of actinides was initiated under a project, 10-MAT1134-3, funded by king Abdulaziz City of Science and Technology (KASCT), Long-Term Comprehensive National Plan for Science, Technology and Innovations, managed by a team from King Abdulaziz University (KAU), Saudi Arabia, and supervised by Argonne National Laboratory (ANL) has collaborated with KAU's team to assist in the computational analysis. In this paper, the numerical solution of coupled linear differential equations that describe the decays and buildups of minor fission product MFA, has been used to predict the total decay heat and its components from the fast neutron fission of 235U and 239Pu. The reliability of the present approach is illustrated via systematic comparisons with the measurements reported by the University of Tokyo, in YAYOI reactor.

Keywords: Decay heat, fast neutron fission, and Numerical Solution of Linear Differential Equations.

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4739 Software Reliability Prediction Model Analysis

Authors: L. Mirtskhulava, M. Khunjgurua, N. Lomineishvili, K. Bakuria

Abstract:

Software reliability prediction gives a great opportunity to measure the software failure rate at any point throughout system test. A software reliability prediction model provides with the technique for improving reliability. Software reliability is very important factor for estimating overall system reliability, which depends on the individual component reliabilities. It differs from hardware reliability in that it reflects the design perfection. Main reason of software reliability problems is high complexity of software. Various approaches can be used to improve the reliability of software. We focus on software reliability model in this article, assuming that there is a time redundancy, the value of which (the number of repeated transmission of basic blocks) can be an optimization parameter. We consider given mathematical model in the assumption that in the system may occur not only irreversible failures, but also a failure that can be taken as self-repairing failures that significantly affect the reliability and accuracy of information transfer. Main task of the given paper is to find a time distribution function (DF) of instructions sequence transmission, which consists of random number of basic blocks. We consider the system software unreliable; the time between adjacent failures has exponential distribution.

Keywords: Exponential distribution, conditional mean time to failure, distribution function, mathematical model, software reliability.

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4738 Building the Reliability Prediction Model of Component-Based Software Architectures

Authors: Pham Thanh Trung, Huynh Quyet Thang

Abstract:

Reliability is one of the most important quality attributes of software. Based on the approach of Reussner and the approach of Cheung, we proposed the reliability prediction model of component-based software architectures. Also, the value of the model is shown through the experimental evaluation on a web server system.

Keywords: component-based architecture, reliability prediction model, software reliability engineering.

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4737 Sub-Image Detection Using Fast Neural Processors and Image Decomposition

Authors: Hazem M. El-Bakry, Qiangfu Zhao

Abstract:

In this paper, an approach to reduce the computation steps required by fast neural networksfor the searching process is presented. The principle ofdivide and conquer strategy is applied through imagedecomposition. Each image is divided into small in sizesub-images and then each one is tested separately usinga fast neural network. The operation of fast neuralnetworks based on applying cross correlation in thefrequency domain between the input image and theweights of the hidden neurons. Compared toconventional and fast neural networks, experimentalresults show that a speed up ratio is achieved whenapplying this technique to locate human facesautomatically in cluttered scenes. Furthermore, fasterface detection is obtained by using parallel processingtechniques to test the resulting sub-images at the sametime using the same number of fast neural networks. Incontrast to using only fast neural networks, the speed upratio is increased with the size of the input image whenusing fast neural networks and image decomposition.

Keywords: Fast Neural Networks, 2D-FFT, CrossCorrelation, Image decomposition, Parallel Processing.

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4736 Implementing a Strategy of Reliability Centered Maintenance (RCM) in the Libyan Cement Industry

Authors: Khalid M. Albarkoly, Kenneth S. Park

Abstract:

The substantial development of the construction industry has forced the cement industry, its major support, to focus on achieving maximum productivity to meet the growing demand for this material. This means that the reliability of a cement production system needs to be at the highest level that can be achieved by good maintenance. This paper studies the extent to which the implementation of RCM is needed as a strategy for increasing the reliability of the production systems component can be increased, thus ensuring continuous productivity. In a case study of four Libyan cement factories, 80 employees were surveyed and 12 top and middle managers interviewed. It is evident that these factories usually breakdown more often than once per month which has led to a decline in productivity. In many times they cannot achieve the minimum level of production amount. This has resulted from the poor reliability of their production systems as a result of poor or insufficient maintenance. It has been found that most of the factories’ employees misunderstand maintenance and its importance. The main cause of this problem is the lack of qualified and trained staff, but in addition it has been found that most employees are not found to be motivated as a result of a lack of management support and interest. In response to these findings, it has been suggested that the RCM strategy should be implemented in the four factories. The results show the importance of the development of maintenance strategies through the implementation of RCM in these factories. The purpose of it would be to overcome the problems that could secure the reliability of the production systems. This study could be a useful source of information for academic researchers and the industrial organizations which are still experiencing problems in maintenance practices.

Keywords: Libyan cement industry, maintenance, production, reliability centered maintenance, reliability.

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4735 Combinatorial Approach to Reliability Evaluation of Network with Unreliable Nodes and Unreliable Edges

Authors: Y. Shpungin

Abstract:

Estimating the reliability of a computer network has been a subject of great interest. It is a well known fact that this problem is NP-hard. In this paper we present a very efficient combinatorial approach for Monte Carlo reliability estimation of a network with unreliable nodes and unreliable edges. Its core is the computation of some network combinatorial invariants. These invariants, once computed, directly provide pure and simple framework for computation of network reliability. As a specific case of this approach we obtain tight lower and upper bounds for distributed network reliability (the so called residual connectedness reliability). We also present some simulation results.

Keywords: Combinatorial invariants, Monte Carlo simulation, reliability, unreliable nodes and unreliable edges.

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4734 A CUSUM Control Chart to Monitor Wafer Quality

Authors: Sheng-Shu Cheng, Fong-Jung Yu

Abstract:

C-control chart assumes that process nonconformities follow a Poisson distribution. In actuality, however, this Poisson distribution does not always occur. A process control for semiconductor based on a Poisson distribution always underestimates the true average amount of nonconformities and the process variance. Quality is described more accurately if a compound Poisson process is used for process control at this time. A cumulative sum (CUSUM) control chart is much better than a C control chart when a small shift will be detected. This study calculates one-sided CUSUM ARLs using a Markov chain approach to construct a CUSUM control chart with an underlying Poisson-Gamma compound distribution for the failure mechanism. Moreover, an actual data set from a wafer plant is used to demonstrate the operation of the proposed model. The results show that a CUSUM control chart realizes significantly better performance than EWMA.

Keywords: Nonconformities, Compound Poisson distribution, CUSUM control chart.

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4733 Bounds on Reliability of Parallel Computer Interconnection Systems

Authors: Ranjan Kumar Dash, Chita Ranjan Tripathy

Abstract:

The evaluation of residual reliability of large sized parallel computer interconnection systems is not practicable with the existing methods. Under such conditions, one must go for approximation techniques which provide the upper bound and lower bound on this reliability. In this context, a new approximation method for providing bounds on residual reliability is proposed here. The proposed method is well supported by two algorithms for simulation purpose. The bounds on residual reliability of three different categories of interconnection topologies are efficiently found by using the proposed method

Keywords: Parallel computer network, reliability, probabilisticgraph, interconnection networks.

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