Search results for: lowest cost chip set

Authors: Jae Young Park, Soongyu Kwon, Kyu Han Kim, Hyeong Geon Lee, Jong Tae Kim

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This paper considers the problem of finding low cost chip set for a minimum cost partitioning of a large logic circuits. Chip sets are selected from a given library. Each chip in the library has a different price, area, and I/O pin. We propose a low cost chip set selection algorithm. Inputs to the algorithm are a netlist and a chip information in the library. Output is a list of chip sets satisfied with area and maximum partitioning number and it is sorted by cost. The algorithm finds the sorted list of chip sets from minimum cost to maximum cost. We used MCNC benchmark circuits for experiments. The experimental results show that all of chip sets found satisfy the multiple partitioning constraints.

Keywords: lowest cost chip set, MCNC benchmark, multi-way partitioning.

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Authors: Muthana Saleh Alalaki, Michael Opoku Agyeman

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The growth in the number of Intellectual Properties (IPs) or the number of cores on the same chip becomes a critical issue in System-on-Chip (SoC) due to the intra-communication problem between the chip elements. As a result, Network-on-Chip (NoC) has emerged as a system architecture to overcome intra-communication issues. This paper presents a study of recent contributions on simulation tools for NoC. Furthermore, an overview of NoC is covered as well as a comparison between some NoC simulators to help facilitate research in on-chip communication.

Keywords: Network-on-Chip, System-on-Chip, embedded systems, computer architecture.

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Authors: Thomas Canhao Xu, Bo Yang, Alexander Wei Yin, Pasi Liljeberg, Hannu Tenhunen

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With the increasing number of on-chip components and the critical requirement for processing power, Chip Multiprocessor (CMP) has gained wide acceptance in both academia and industry during the last decade. However, the conventional bus-based onchip communication schemes suffer from very high communication delay and low scalability in large scale systems. Network-on-Chip (NoC) has been proposed to solve the bottleneck of parallel onchip communications by applying different network topologies which separate the communication phase from the computation phase. Observing that the memory bandwidth of the communication between on-chip components and off-chip memory has become a critical problem even in NoC based systems, in this paper, we propose a novel 3D NoC with on-chip Dynamic Random Access Memory (DRAM) in which different layers are dedicated to different functionalities such as processors, cache or memory. Results show that, by using our proposed architecture, average link utilization has reduced by 10.25% for SPLASH-2 workloads. Our proposed design costs 1.12% less execution cycles than the traditional design on average.

Keywords: 3D integration, network-on-chip, memory-on-chip, DRAM, chip multiprocessor.

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Authors: Minsoo Lee, Yearn Jeong Kim, Yun-mi Kim, Sujeung Cheong, Sookyung Song

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Bio-chips are used for experiments on genes and contain various information such as genes, samples and so on. The two-dimensional bio-chips, in which one axis represent genes and the other represent samples, are widely being used these days. Instead of experimenting with real genes which cost lots of money and much time to get the results, bio-chips are being used for biological experiments. And extracting data from the bio-chips with high accuracy and finding out the patterns or useful information from such data is very important. Bio-chip analysis systems extract data from various kinds of bio-chips and mine the data in order to get useful information. One of the commonly used methods to mine the data is classification. The algorithm that is used to classify the data can be various depending on the data types or number characteristics and so on. Considering that bio-chip data is extremely large, an algorithm that imitates the ecosystem such as the ant algorithm is suitable to use as an algorithm for classification. This paper focuses on finding the classification rules from the bio-chip data using the Ant Colony algorithm which imitates the ecosystem. The developed system takes in consideration the accuracy of the discovered rules when it applies it to the bio-chip data in order to predict the classes.

Keywords: Ant Colony System, DNA chip data, Classification.

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Authors: Rohaya Abdul Wahab, Raja Mohd Fuad Tengku Aziz, Nazaliza Othman, Sharifah Saleh, Nabihah Razali, Rozaimah Baharim, Md Hanif Md Nasir

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This paper will discuss flip chip methodology, in which I/O pads, standard cells, macros and bump cells array are placed in the floorplan, then routed using Astro place and route tool. Final DRC and LVS checking is done using Calibre verification tool. The design vehicle to run this methodology is an OpenRISC design targeted to Silterra 0.18 micrometer technology with 6 metal layers for routing. Astro has extensive support for flip chip placement and routing. Astro tool commands for flip chip are straightforward approach like the conventional standard wire bond packaging. However since we do not have flip chip commands in our Astro tool, no LEF file for bump cell and no LEF file for flip chip I/O pad, we create our own methodology to prepare for future flip chip tapeout. 

Keywords: Astro, bump cell, Calibre, flip chip, LEF, methodology, SCHEME, TCL.

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Authors: V.Sivaraman, S. Sankaran, L. Vijayaraghavan

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Machining through turning was carried out in a lathe to study the chip formation of Multiphase Ferrite (F-B-M) microalloyed steel. Taguchi orthogonal array was employed to perform the machining. Continuous and discontinuous chips were formed for different cutting parameters like speed, feed and depth of cut. Optical and scanning electron microscope was employed to identify the chip morphology.

Keywords: Multiphase microalloyed steel, chip formation, Taguchi technique, turning, cutting parameters

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Authors: Haiyi Zhang, Jianli Guo, Daqian Yang

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This Classifying Bird Sounds (chip notes) project-s purpose is to reduce the unwanted noise from recorded bird sound chip notes, design a scheme to detect differences and similarities between recorded chip notes, and classify bird sound chip notes. The technologies of determining the similarities of sound waves have been used in communication, sound engineering and wireless sound applications for many years. Our research is focused on the similarity of chip notes, which are the sounds from different birds. The program we use is generated by Microsoft Cµ.

Keywords: Classify Bird Sounds, Noise Filter, High-pass, Lowpass, Band-pass, Band-stop Filter, FIR.

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Authors: Ziaddin Daie Koozekanani, Mina Zolfy Lighvan

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One of the most challengeable issues in ESL (Electronic System Level) design is the lack of a general modeling scheme for on chip communication architecture. In this paper some of the mostly used methodologies for modeling and representation of on chip communication are investigated. Our goal is studying the existing methods to extract the requirements of a general representation scheme for communication architecture synthesis. The next step, will be introducing a modeling and representation method for being used in automatically synthesis process of on chip communication architecture.

Keywords: Communication architecture, System on Chip, Communication Modeling and Representation

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Authors: AL.AL, M. B. I. Reaz, S. M. A. Motakabber, Mohd Alauddin Mohd Ali

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Nowadays it is a trend for electronic circuit designers to integrate all system components on a single-chip. This paper proposed the design of a single-chip proportional to absolute temperature (PTAT) sensor including a voltage reference circuit using CEDEC 0.18m CMOS Technology. It is a challenge to design asingle-chip wide range linear response temperature sensor for many applications. The channel widths between the compensation transistor and the reference transistor are critical to design the PTAT temperature sensor circuit. The designed temperature sensor shows excellent linearity between -100°C to 200° and the sensitivity is about 0.05mV/°C. The chip is designed to operate with a single voltage source of 1.6V.

Keywords: PTAT, single-chip circuit, linear temperature sensor, CMOS technology.

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Authors: Ching-Feng Chen, Ching-Chih Tsai

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With the size of the transistor gradually approaching the physical limit, it challenges the persistence of Moore’s Law due to such issues of the short channel effect and the development of the high numerical aperture (NA) lithography equipment. In the context of the ever-increasing technical requirements of portable devices and high-performance computing (HPC), relying on the law continuation to enhance the chip density will no longer support the prospects of the electronics industry. Weighing the chip’s power consumption-performance-area-cost-cycle time to market (PPACC) is an updated benchmark to drive the evolution of the advanced wafer nanometer (nm). The advent of two and half- and three-dimensional (2.5 and 3D)- Very-Large-Scale Integration (VLSI) packaging based on Through Silicon Via (TSV) technology has updated the traditional die assembly methods and provided the solution. This overview investigates the up-to-date and cutting-edge packaging technologies for 2.5D and 3D integrated circuits (IC) based on the updated transistor structure and technology nodes. We conclude that multi-chip solutions for 2.5D and 3D IC packaging can prolong Moore’s Law.

Keywords: Moore’s Law, High Numerical Aperture, Power Consumption-Performance-Area-Cost-Cycle Time to Market, PPACC, 2.5 and 3D-Very-Large-Scale Integration Packaging, Through Silicon Vi.

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Authors: Guoliang Fan, Aiping Li, Nan Xie, Liyun Xu, Xuemei Liu

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Mass customization production increases the difficulty of the production line layout planning. The material distribution process for variety of parts is very complex, which greatly increases the cost of material handling and logistics. In response to this problem, this paper presents an approach of production line layout planning based on complexity measurement. Firstly, by analyzing the influencing factors of equipment layout, the complexity model of production line is established by using information entropy theory. Then, the cost of the part logistics is derived considering different variety of parts. Furthermore, the function of optimization including two objectives of the lowest cost, and the least configuration complexity is built. Finally, the validity of the function is verified in a case study. The results show that the proposed approach may find the layout scheme with the lowest logistics cost and the least complexity. Optimized production line layout planning can effectively improve production efficiency and equipment utilization with lowest cost and complexity.

Keywords: Production line, layout planning, complexity measurement, optimization, mass customization.

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Authors: Rafiqul Tarefder, Mohiuddin Ahmad, Mohammad Hossain

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While millings materials from old pavement surface can be an important component of cost effective maintenance operation, their use in maintenance projects are not uniform and well documented. This study documents the different maintenance practices followed by four transportation districts of New Mexico Department of Transportation (NMDOT) in an attempt to find whether millings are being used in maintenance projects by those districts. Based on existing literature, a questionnaire was developed related to six common maintenance practices. NMDOT district personal were interviewed face to face to discuss and get answers to that questionnaire. It revealed that NMDOT districts mainly use chip seal and patching. Other maintenance procedures such as sand seal, scrub seal, slurry seal, and thin overlay have limited use. Two out of four participating districts do not have any documents on chip sealing; rather they employ the experiences of the chip seal crew. All districts use polymer modified high float emulsion (HFE100P) for chip seal with an application rate ranging from 0.4 to 0.56 gallons per square yard. Chip application rate varies from 15 to 40 lb/ square yard. State wide, the thickness of chip seal varies from 3/8'' to 1'' and life varies from 3 to 10 years. NMDOT districts mainly use three type of patching: pothole, dig-out and blade patch. Pothole patches are used for small potholes and during emergency, dig-out patches are used for all type of potholes sometimes after pothole patching, and blade patch is used when a significant portion of the pavement is damaged. Pothole patches last as low as three days whereas, blade patch lasts as long as 3 years. It was observed that all participating districts use millings in maintenance projects.

Keywords: Chip seal, sand seal, scrub seal, slurry seal, overlay, patching, millings.

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Authors: Ahmed Madian, Muaz Aljarhi

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Coordinate Rotation Digital Computer (CORDIC) is a unique digital computing unit intended for the computation of mathematical operations and functions. This paper presents A multi CORDIC processor that integrates different CORDIC architectures on a single FPGA chip and allows the user to select the CORDIC architecture to proceed with based on what he wants to calculate and his needs. Synthesis show that radix 2 CORDIC has the lowest clock delay, radix 8 CORDIC has the highest LUT usage and lowest register usage while Hybrid Radix 4 CORDIC had the highest clock delay.

Keywords: Multi, CORDIC, FPGA, Processor.

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Authors: D. Czurratis, Y. Beyl, S. Zinober, R. Zengerle, F. Lärmer

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A new concept for long-term reagent storage for Labon- a-Chip (LoC) devices is described. Here we present a polymer multilayer stack with integrated stick packs for long-term storage of several liquid reagents, which are necessary for many diagnostic applications. Stick packs are widely used in packaging industry for storing solids and liquids for long time. The storage concept fulfills two main requirements: First, a long-term storage of reagents in stick packs without significant losses and interaction with surroundings, second, on demand releasing of liquids, which is realized by pushing a membrane against the stick pack through pneumatic pressure. This concept enables long-term on-chip storage of liquid reagents at room temperature and allows an easy implementation in different LoC devices.

Keywords: Lab-on-a-Chip, long-term storage, reagent storage, stick pack.

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Authors: Reza Hadjiaghaie Vafaie, Aysan Madanpasandi, Behrooz Zare Desari, Seyedmohammad Mousavi

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High lamination in microchannel is one of the main challenges in on-chip components like micro total analyzer systems and lab-on-a-chips. Electro-osmotic force is highly effective in chip-scale. This research proposes a microfluidic-based micropump for low ionic strength solutions. Narrow microchannels are designed to generate an efficient electroosmotic flow near the walls. Microelectrodes are embedded in the lateral sides and actuated by low electric potential to generate pumping effect inside the channel. Based on the simulation study, the fluid velocity increases by increasing the electric potential amplitude. We achieve a net flow velocity of 100 µm/s, by applying +/- 2 V to the electrode structures. Our proposed low voltage design is of interest in conventional lab-on-a-chip applications.

Keywords: Integration, electrokinetic, on-chip, fluid pumping, microfluidic.

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Authors: Doshi N. A., Dhobale S. B., Kakade S. R.

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As chip manufacturing technology is suddenly on the threshold of major evaluation, which shrinks chip in size and performance, LFSR (Linear Feedback Shift Register) is implemented in layout level which develops the low power consumption chip, using recent CMOS, sub-micrometer layout tools. Thus LFSR counter can be a new trend setter in cryptography and is also beneficial as compared to GRAY & BINARY counter and variety of other applications. This paper compares 3 architectures in terms of the hardware implementation, CMOS layout and power consumption, using Microwind CMOS layout tool. Thus it provides solution to a low power architecture implementation of LFSR in CMOS VLSI.

Keywords: Chip technology, Layout level, LFSR, Pass transistor

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Authors: Muhammad Ali, Awais Adnan

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Network on a chip (NoC) has been proposed as a viable solution to counter the inefficiency of buses in the current VLSI on-chip interconnects. However, as the silicon chip accommodates more transistors, the probability of transient faults is increasing, making fault tolerance a key concern in scaling chips. In packet based communication on a chip, transient failures can corrupt the data packet and hence, undermine the accuracy of data communication. In this paper, we present a comparative analysis of transient fault tolerant techniques including end-to-end, node-by-node, and stochastic communication based on flooding principle.

Keywords: NoC, fault-tolerance, transient faults.

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Authors: Sin J. Chen, Jyh J. Chen

Abstract:

This study describes a micro device integrated with multi-chamber for polymerase chain reaction (PCR) with different annealing temperatures. The device consists of the reaction polydimethylsiloxane (PDMS) chip, a cover glass chip, and is equipped with cartridge heaters, fans, and thermocouples for temperature control. In this prototype, commercial software is utilized to determine the geometric and operational parameters those are responsible for creating the denaturation, annealing, and extension temperatures within the chip. Two cartridge heaters are placed at two sides of the chip and maintained at two different temperatures to achieve a thermal gradient on the chip during the annealing step. The temperatures on the chip surface are measured via an infrared imager. Some thermocouples inserted into the reaction chambers are used to obtain the transient temperature profiles of the reaction chambers during several thermal cycles. The experimental temperatures compared to the simulated results show a similar trend. This work should be interesting to persons involved in the high-temperature based reactions and genomics or cell analysis.

Keywords: Polymerase chain reaction, thermal cycles, temperature gradient, micro-fabrication.

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Authors: Eduardo Sant'Ana da Silva, Andre Luiz Pires Guedes, Eduardo Todt

Abstract:

Independent spanning trees (ISTs) provide a number of advantages in data broadcasting. One can cite the use in fault tolerance network protocols for distributed computing and bandwidth. However, the problem of constructing multiple ISTs is considered hard for arbitrary graphs. In this paper we present an efficient algorithm to construct ISTs on hypercubes that requires minimum resources to be performed.

Keywords: Hypercube, Independent Spanning Trees, Networks On Chip, Systems On Chip.

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Authors: Mansi Jhamb, R. K. Sharma, A. K. Gupta

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The distribution of a single global clock across a chip has become the major design bottleneck for high performance VLSI systems owing to the power dissipation, process variability and multicycle cross-chip signaling. A Network-on-Chip (NoC) architecture partitioned into several synchronous blocks has become a promising approach for attaining fine-grain power management at the system level. In a NoC architecture the communication between the blocks is handled asynchronously. To interface these blocks on a chip operating at different frequencies, an asynchronous FIFO interface is inevitable. However, these asynchronous FIFOs are not required if adjacent blocks belong to the same clock domain. In this paper, we have designed and analyzed a 16-bit asynchronous micropipelined FIFO of depth four, with the awareness of place and route on an FPGA device. We have used a commercially available Spartan 3 device and designed a high speed implementation of the asynchronous 4-phase micropipeline. The asynchronous FIFO implemented on the FPGA device shows 76 Mb/s throughput and a handshake cycle of 109 ns for write and 101.3 ns for read at the simulation under the worst case operating conditions (voltage = 0.95V) on a working chip at the room temperature.

Keywords: Asynchronous, FIFO, FPGA, GALS, Network-on- Chip (NoC), VHDL.

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Authors: Samy E. Oraby, Ayman M. Alaskari

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The importance of machining process in today-s industry requires the establishment of more practical approaches to clearly represent the intimate and severe contact on the tool-chipworkpiece interfaces. Mathematical models are developed using the measured force signals to relate each of the tool-chip friction components on the rake face to the operating cutting parameters in rough turning operation using multilayers coated carbide inserts. Nonlinear modeling proved to have high capability to detect the nonlinear functional variability embedded in the experimental data. While feedrate is found to be the most influential parameter on the friction coefficient and its related force components, both cutting speed and depth of cut are found to have slight influence. Greater deformed chip thickness is found to lower the value of friction coefficient as the sliding length on the tool-chip interface is reduced.

Keywords: Mathematical modeling, Cutting forces, Frictionforces, Friction coefficient and Chip ratio.

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Authors: Md. Anayet U. Patwari, Mohammad Ahsan Habib, Md. Tanzib Ehsan, Md Golam Ahnaf, Md. S. I. Chowdhury

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Surface roughness is one of the key quality parameters of the finished product. During any machining operation, high temperatures are generated at the tool-chip interface impairing surface quality and dimensional accuracy of products. Cutting fluids are generally applied during machining to reduce temperature at the tool-chip interface. However, usages of cutting fluids give rise to problems such as waste disposal, pollution, high cost, and human health hazard. Researchers, now-a-days, are opting towards dry machining and other cooling techniques to minimize use of coolants during machining while keeping surface roughness of products within desirable limits. In this paper, a concept of using peltier cooling effects during aluminium milling operation has been presented and adopted with an aim to improve surface roughness of the machined surface. Experimental evidence shows that peltier cooling effect provides better surface roughness of the machined surface compared to dry machining.

Keywords: Aluminium, surface roughness, Peltier cooling effect, milling operation.

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Authors: Ahmad M. Shafiee, Mehrdad Montazeri, Mahdi Nikdast

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Every day human life experiences new equipments more automatic and with more abilities. So the need for faster processors doesn-t seem to finish. Despite new architectures and higher frequencies, a single processor is not adequate for many applications. Parallel processing and networks are previous solutions for this problem. The new solution to put a network of resources on a chip is called NOC (network on a chip). The more usual topology for NOC is mesh topology. There are several routing algorithms suitable for this topology such as XY, fully adaptive, etc. In this paper we have suggested a new algorithm named Intermittent X, Y (IX/Y). We have developed the new algorithm in simulation environment to compare delay and power consumption with elders' algorithms.

Keywords: Computer architecture, parallel computing, NOC, routing algorithm.

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Authors: M. Mahdavi, E. Mahdavi

Abstract:

In this research, STNEP is being studied considering network adequacy and limitation of investment cost by decimal codification genetic algorithm (DCGA). The goal is obtaining the maximum of network adequacy with lowest expansion cost for a specific investment. Finally, the proposed idea is applied to the Garvers 6-bus network. The results show that considering the network adequacy for solution of STNEP problem is caused that among of expansion plans for a determined investment, configuration which has relatively lower expansion cost and higher adequacy is proposed by GA based method. Finally, with respect to the curve of adequacy versus expansion cost it can be said that more optimal configurations for expansion of network are obtained with lower investment costs.

Keywords: TNEP, Network Adequacy, Investment Cost, GA

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Authors: Pedro Acevedo, Carlos Díaz, Mónica Vázquez, Joel Durán

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This paper describes the design of a pulse generator based on the Programmable System-on-Chip (PSoC) module. In this module, using programmable logic is possible to implement different pulses which are required for ultrasonic applications, either in a single channel or multiple channels. This module can operate with programmable frequencies from 3-74 MHz; its programming may be versatile covering a wide range of ultrasonic applications. It is ideal for low-power ultrasonic applications where PZT or PVDF transducers are used.

Keywords: pulse generator, PVDF, Programmable System-on-Chip (PSoC), ultrasonic transducer

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Authors: Ghaleb Y. Abbasi, Sufyan Al-Mrayat

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This study examined the contribution of 36 factors to building construction project’s cost overrun in Jordan. A questionnaire was distributed to a random sample of 350 stakeholders comprised of owners, consultants, and contractors, of which 285 responded. SPSS analysis was conducted to identify the top five causes of cost overrun, which were a large number of variation orders, inadequate quantities provided in the contract, misunderstanding of the project plan, incomplete bid documents, and choosing the lowest price in the contract bidding. There was an agreement among the study participants in ranking the factors contributing to cost overrun, which indicated that these factors were very commonly encountered in most construction projects in Jordan. Thus, it is crucial to enhance the collaboration among the different project stakeholders to understand the project’s objectives and set a realistic plan that takes into consideration all the factors that might influence the project cost, which might eventually prevent cost overrun.

Keywords: Cost, overrun, building construction projects, Jordan.

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Authors: Nawang Chhunid, Gagnesh Kumar

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On-chip memories consume a significant portion of the overall die space and power in modern microprocessors. On-chip caches depend on Static Random-Access Memory (SRAM) cells and scaling of technology occurring as per Moore’s law. Unfortunately, the scaling is affecting stability, performance, and leakage power which will become major problems for future SRAMs in aggressive nanoscale technologies due to increasing device mismatch and variations. 3T1D Dynamic Random-Access Memory (DRAM) cell is a non-destructive read DRAM cell with three transistors and a gated diode. In 3T1D DRAM cell gated diode (D1) acts as a storage device and also as an amplifier, which leads to fast read access. Due to its high tolerance to process variation, high density, and low cost of memory as compared to 6T SRAM cell, it is universally used by the advanced microprocessor for on chip data and program memory. In the present paper, it has been shown that 3T1D DRAM cell can perform better in terms of fast read access as compared to 6T, 4T, 3T SRAM cells, respectively.

Keywords: DRAM cell, read access time, tanner EDA tool write access time and retention time, average power dissipation.

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Authors: G. H. Senussi

Abstract:

The present work is concerned with the effect of turning process parameters (cutting speed, feed rate, and depth of cut) and distance from the center of work piece as input variables on the chip micro-hardness as response or output. Three experiments were conducted; they were used to investigate the chip micro-hardness behavior at diameter of work piece for 30[mm], 40[mm], and 50[mm]. Response surface methodology (R.S.M) is used to determine and present the cause and effect of the relationship between true mean response and input control variables influencing the response as a two or three dimensional hyper surface. R.S.M has been used for designing a three factor with five level central composite rotatable factors design in order to construct statistical models capable of accurate prediction of responses. The results obtained showed that the application of R.S.M can predict the effect of machining parameters on chip micro-hardness. The five level factorial designs can be employed easily for developing statistical models to predict chip micro-hardness by controllable machining parameters. Results obtained showed that the combined effect of cutting speed at it?s lower level, feed rate and depth of cut at their higher values, and larger work piece diameter can result increasing chi micro-hardness.

Keywords: Machining Parameters, Chip Micro-Hardness, CNCMachining, 304-Austenic Stainless Steel.

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Authors: T. Punjansing, M. Nakkuntod, S. Homchan, P. Inthima, A. Kongbangkerd

Abstract:

The influence of organic supplements on growth and multiplication efficiency of Phaius tankervilleae var. alba seedlings was investigated. 12 week-old seedlings were cultured on half-strength semi-solid Murashige and Skoog (MS) medium supplemented with 30 g/L sucrose, 8 g/L agar and various concentrations of coconut water (0, 50, 100, 150 and 200 mL/L) combined with potato extract (0, 25 and 50 g/L) and the pH was adjusted to 5.8 prior to autoclaving. The cultures were then kept under constant photoperiod (16 h light: 8 h dark) at 25 ± 2 °C for 12 weeks. The highest number of shoots (3.0 shoots/explant) was obtained when cultured on the medium added with 50 ml/L coconut water and 50 g/L potato extract whereas the highest number of leaves (5.9 leaves/explant) and roots (6.1 roots/explant) could receive on the medium supplemented with 150 ml/L coconut water and 50 g/L potato extract. with 150 ml/L coconut water and 50 g/L potato extract. Additionally, plantlets of P. tankervilleae var. alba were transferred to grow into seven different substrates i.e. soil, sand, coconut husk chip, soil-sand mix (1: 1), soil-coconut husk chip mix (1: 1), sand-coconut husk chip mix (1: 1) and soil-sand-coconut husk chip mix (1: 1: 1) for four weeks. The results found that acclimatized plants showed 100% of survivals when sand, coconut husk chip and sand-coconut husk chip mix are used as substrates. The number of leaves induced by sand-coconut husk chip mix was significantly higher than that planted in other substrates (P > 0.05). Meanwhile, no significant difference in new shoot formation among these substrates was observed (P < 0.05). This precursory developing protocol was likely to be applied for more large scale of plant production as well as conservation of germplasm of this orchid species.

Keywords: Acclimatization, coconut water, orchid, Phaius tankervilleae var. alba., potato extract.

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Authors: K. M. Oba

Abstract:

The transportation modelling technique was adopted in the solution of the problem of transportation of Plaster of Paris (POP) cement from three supply locations (construction materials markets) to three demand locations (construction sites) in Port Harcourt. The study was carried out for 40 kg bags of POP cement fully loaded on 600 bags per truck from the three selected construction materials markets in Port Harcourt. The costs of transporting the POP cement were determined and subjected to the North-West Corner, Least Cost, and Vogel’s approximation methods to determine the initial feasible solution. Of the three results, the Least Cost Method turned out to have the lowest cost. Using the Stepping Stone Method, the optimum shipping cost was finally attained after two successive iterations. The optimum shipping cost was calculated to be $1,690 or ₦1,774,500 as of October 2023. As a result of this study, the application of transportation modelling can boost the effective management of the transportation of POP cement in construction projects.

Keywords: Cost of POP cement, management of transportation, optimization of shipping cost, Plaster of Paris, transportation model.

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