Search results for: electronics assembly
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 330

Search results for: electronics assembly

270 Generic Data Warehousing for Consumer Electronics Retail Industry

Authors: S. Habte, K. Ouazzane, P. Patel, S. Patel

Abstract:

The dynamic and highly competitive nature of the consumer electronics retail industry means that businesses in this industry are experiencing different decision making challenges in relation to pricing, inventory control, consumer satisfaction and product offerings. To overcome the challenges facing retailers and create opportunities, we propose a generic data warehousing solution which can be applied to a wide range of consumer electronics retailers with a minimum configuration. The solution includes a dimensional data model, a template SQL script, a high level architectural descriptions, ETL tool developed using C#, a set of APIs, and data access tools. It has been successfully applied by ASK Outlets Ltd UK resulting in improved productivity and enhanced sales growth.

Keywords: Consumer electronics retail, dimensional data model, data analysis, generic data warehousing, reporting.

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269 Decision Location and Resource Requirement for Relief Goods Assembly

Authors: Glenda Minguito, Jenith Banluta

Abstract:

One of the critical aspects of humanitarian operations is the distribution of relief goods to an affected community. The common assumption is that relief goods are prepositioned during disasters which are not applicable in developing countries like the Philippines. During disasters, the on-the-ground government agencies and responders have to procure, sort, weigh and pack the relief goods. There is a need to review the relief goods preparation as it seriously affects the delivery of necessary aid for human survival. This study also identifies the ideal location of the assembly hub to minimize the distance to the affected community. This paper reveals that location and resources are dependent on the type of disasters encountered at the local level. The Center-of-Gravity method and Multiple Activity Chart were applied in the analysis.

Keywords: Humanitarian supply chain, location decision, resource allocation, local level.

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268 The use of a Bespoke Computer Game For Teaching Analogue Electronics

Authors: Olaf Hallan Graven, Dag Andreas Hals Samuelsen

Abstract:

An implementation of a design for a game based virtual learning environment is described. The game is developed for a course in analogue electronics, and the topic is the design of a power supply. This task can be solved in a number of different ways, with certain constraints, giving the students a certain amount of freedom, although the game is designed not to facilitate trial-and error approach. The use of storytelling and a virtual gaming environment provides the student with the learning material in a MMORPG environment. The game is tested on a group of second year electrical engineering students with good results.

Keywords: analogue electronics, e-learning, computer games for learning, virtual reality

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267 The Operating Behaviour of Unbalanced Unpaced Merging Assembly Lines

Authors: S. Shaaban, T. McNamara, S. Hudson

Abstract:

This paper reports on the performance of deliberately unbalanced, reliable, non-automated and assembly lines that merge, whose workstations differ in terms of their mean operation times. Simulations are carried out on 5- and 8-station lines with 1, 2 and 4 buffer capacity units, % degrees of line imbalance of 2, 5 and 12, and 24 different patterns of means imbalance. Data on two performance measures, namely throughput and average buffer level were gathered, statistically analysed and compared to a merging balanced line counterpart. It was found that the best configurations are a balanced line arrangement and a monotone decreasing order for each of the parallel merging lines, with the first generally resulting in a lower throughput and the second leading to a lower average buffer level than those of a balanced line.

Keywords: Average buffer level, merging lines, simulation, throughput, unbalanced.

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266 Comparison of Regime Transition between Ellipsoidal and Spherical Particle Assemblies in a Model Shear Cell

Authors: M. Hossain, H. P. Zhu, A. B. Yu

Abstract:

This paper presents a numerical investigation of regime transition of flow of ellipsoidal particles and a comparison with that of spherical particle assembly. Particle assemblies constituting spherical and ellipsoidal particle of 2.5:1 aspect ratio are examined at separate instances in similar flow conditions in a shear cell model that is numerically developed based on the discrete element method. Correlations among elastically scaled stress, kinetically scaled stress, coordination number and volume fraction are investigated, and show important similarities and differences for the spherical and ellipsoidal particle assemblies. In particular, volume fractions at points of regime transition are identified for both types of particles. It is found that compared with spherical particle assembly, ellipsoidal particle assembly has higher volume fraction for the quasistatic to intermediate regime transition and lower volume fraction for the intermediate to inertial regime transition. Finally, the relationship between coordination number and volume fraction shows strikingly distinct features for the two cases, suggesting that different from spherical particles, the effect of the shear rate on the coordination number is not significant for ellipsoidal particles. This work provides a glimpse of currently running work on one of the most attractive scopes of research in this field and has a wide prospect in understanding rheology of more complex shaped particles in light of the strong basis of simpler spherical particle rheology.

Keywords: Discrete element method, granular rheology, non-spherical particles, regime transition

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265 Batch-Oriented Setting Time Optimisation in an Aerodynamic Feeding System

Authors: Jan Busch, Maurice Schmidt, Peter Nyhuis

Abstract:

The change of conditions for production companies in high-wage countries is characterized by the globalization of competition and the transition of a supplier´s to a buyer´s market. The companies need to face the challenges of reacting flexibly to these changes. Due to the significant and increasing degree of automation, assembly has become the most expensive production process. Regarding the reduction of production cost, assembly consequently offers a considerable rationalizing potential. Therefore, an aerodynamic feeding system has been developed at the Institute of Production Systems and Logistics (IFA), Leibniz Universitaet Hannover. This system has been enabled to adjust itself by using a genetic algorithm. The longer this genetic algorithm is executed the better is the feeding quality. In this paper, the relation between the system´s setting time and the feeding quality is observed and a function which enables the user to achieve the minimum of the total feeding time is presented.

Keywords: Aerodynamic feeding system, batch size, optimisation, setting time.

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264 Improvement of Realization Quality of Aerospace Products Using Augmented Reality Technology

Authors: Nuran Bahar, Mehmet A. Akcayol

Abstract:

In the aviation industry, many faults may occur frequently during the maintenance processes and assembly operations of complex structured aircrafts because of their high dependencies of components. These faults affect the quality of aircraft parts or developed modules adversely. Technical employee requires long time and high labor force while checking the correctness of each component. In addition, the person must be trained regularly because of the ever-growing and changing technology. Generally, the cost of this training is very high. Augmented Reality (AR) technology reduces the cost of training radically and improves the effectiveness of the training. In this study, the usage of AR technology in the aviation industry has been investigated and the effectiveness of AR with heads-up display glasses has been examined. An application has been developed for comparison of production process with AR and manual one.

Keywords: Aerospace, assembly quality, augmented reality, heads-up display.

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263 Controllable Electrical Power Plug Adapters Made As A ZigBee Wireless Sensor Network

Authors: Toshihiko Sasama, Takao Kawamura, Kazunori Sugahara

Abstract:

Using Internet communication, new home electronics have functions of monitoring and control from remote. However in many case these electronics work as standalone, and old electronics are not followed. Then, we developed the total remote system include not only new electronics but olds. This systems node is a adapter of electrical power plug that embed relay switch and some sensors, and these nodes communicate with each other. the system server was build on the Internet, and users access to this system from web browsers. To reduce the cost to set up of this system, communication between adapters are used ZigBee wireless network instead of wired LAN cable[3]. From measured RSSI(received signal strength indicator) information between each nodes, the system can estimate roughly adapters were mounted on which room, and where in the room. So also it reduces the cost of mapping nodes. Using this system, energy saving and house monitoring are expected.

Keywords: outlet, remote monitor, remote control, mobile ad hocnetwork, sensor network, zigbee.

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262 General Process Control for Intelligent Systems

Authors: Radovan Holubek, Matus Vlasek, Peter Kostal

Abstract:

Development of intelligent assembly cell conception includes new solution kind of how to create structures of automated and flexible assembly system. The current trend of the final product quality increasing is affected by time analysis of the entire manufacturing process. The primary requirement of manufacturing is to produce as many products as soon as possible, at the lowest possible cost, but of course with the highest quality. Such requirements may be satisfied only if all the elements entering and affecting the production cycle are in a fully functional condition. These elements consist of sensory equipment and intelligent control elements that are essential for building intelligent manufacturing systems. Intelligent behavior of the system as the control system will repose on monitoring of important parameters of the system in the real time. Intelligent manufacturing system itself should be a system that can flexibly respond to changes in entering and exiting the process in interaction with the surroundings.

Keywords: Control system, intelligent manufacturing / assemble systems, manufacturing, monitoring process.

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261 Change of the Thermal Conductivity of Polystyrene Insulation in term of Temperature at the Mid Thickness of the Insulation Material: Impact on the Cooling Load

Authors: M. Khoukhi

Abstract:

Accurate prediction of the cooling/heating load and consequently, the sizing of the heating, ventilating, and air-conditioning equipment require precise calculation of the heat transfer mainly by conduction through envelope components of a building. The thermal resistance of most thermal insulation materials depends on the operating temperature. The temperature to which the insulation materials are exposed varies, depending on the thermal resistance of the materials, the location of the insulation layer within the assembly system, and the effective temperature which depends on the amount of solar radiation received on the surface of the assembly. The main objective of this paper is to investigate the change of the thermal conductivity of polystyrene insulation material in terms of the temperature at the mid-thickness of the material and its effect on the cooling load required by the building.

Keywords: Operating temperature, polystyrene insulation, thermal conductivity, cooling load.

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260 Research and Development of Intelligent Cooling Channels Design System

Authors: Q. Niu, X. H. Zhou, W. Liu

Abstract:

The cooling channels of injection mould play a crucial role in determining the productivity of moulding process and the product quality. It’s not a simple task to design high quality cooling channels. In this paper, an intelligent cooling channels design system including automatic layout of cooling channels, interference checking and assembly of accessories is studied. Automatic layout of cooling channels using genetic algorithm is analyzed. Through integrating experience criteria of designing cooling channels, considering the factors such as the mould temperature and interference checking, the automatic layout of cooling channels is implemented. The method of checking interference based on distance constraint algorithm and the function of automatic and continuous assembly of accessories are developed and integrated into the system. Case studies demonstrate the feasibility and practicality of the intelligent design system.

Keywords: Injection mould, cooling channel, automatic layout, interference checking.

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259 Review, Analysis and Simulation of Advanced Technology Solutions of Selected Components in Power Electronics Systems (PES) of More Electric Aircraft

Authors: Lucjan Setlak, Emil Ruda

Abstract:

The subject of this paper is to review, comparative analysis and simulation of selected components of power electronic systems (PES), consistent with the concept of a more electric aircraft (MEA). Comparative analysis and simulation in software environment MATLAB / Simulink were carried out on the base of a group of representatives of civil aircraft (B-787, A-380) and military (F-22 Raptor, F-35) in the context of multi-pulse converters used in them (6- and 12-pulse, and 18- and 24-pulse), which are key components of high-tech electronics on-board power systems of autonomous power systems (ASE) of modern aircraft (airplanes of the future).

Keywords: Converters, electrical machinery, more electric aircraft, MEA, power electronics systems, PES.

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258 An MCDM Approach to Selection Scheduling Rule in Robotic Flexibe Assembly Cells

Authors: Khalid Abd, Kazem Abhary, Romeo Marian

Abstract:

Multiple criteria decision making (MCDM) is an approach to ranking the solutions and finding the best one when two or more solutions are provided. In this study, MCDM approach is proposed to select the most suitable scheduling rule of robotic flexible assembly cells (RFACs). Two MCDM approaches, Analytic Hierarchy Process (AHP) and Technique for Order Preference by Similarity to Ideal Solution (TOPSIS) are proposed for solving the scheduling rule selection problem. The AHP method is employed to determine the weights of the evaluation criteria, while the TOPSIS method is employed to obtain final ranking order of scheduling rules. Four criteria are used to evaluate the scheduling rules. Also, four scheduling policies of RFAC are examined to choose the most appropriate one for this purpose. A numerical example illustrates applications of the suggested methodology. The results show that the methodology is practical and works in RFAC settings.

Keywords: AHP, TOPSIS, Scheduling rules selection

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257 Optimization of Assembly and Welding of Complex 3D Structures on the Base of Modeling with Use of Finite Elements Method

Authors: M. N. Zelenin, V. S. Mikhailov, R. P. Zhivotovsky

Abstract:

It is known that residual welding deformations give negative effect to processability and operational quality of welded structures, complicating their assembly and reducing strength. Therefore, selection of optimal technology, ensuring minimum welding deformations, is one of the main goals in developing a technology for manufacturing of welded structures. Through years, JSC SSTC has been developing a theory for estimation of welding deformations and practical activities for reducing and compensating such deformations during welding process. During long time a methodology was used, based on analytic dependence. This methodology allowed defining volumetric changes of metal due to welding heating and subsequent cooling. However, dependences for definition of structures deformations, arising as a result of volumetric changes of metal in the weld area, allowed performing calculations only for simple structures, such as units, flat sections and sections with small curvature. In case of complex 3D structures, estimations on the base of analytic dependences gave significant errors. To eliminate this shortage, it was suggested to use finite elements method for resolving of deformation problem. Here, one shall first calculate volumes of longitudinal and transversal shortenings of welding joints using method of analytic dependences and further, with obtained shortenings, calculate forces, which action is equivalent to the action of active welding stresses. Further, a finiteelements model of the structure is developed and equivalent forces are added to this model. Having results of calculations, an optimal sequence of assembly and welding is selected and special measures to reduce and compensate welding deformations are developed and taken.

Keywords: Finite elements method, modeling, expected welding deformations, welding, assembling.

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256 A Simple Electronic Curvy Length Measurement System: Application to Geography

Authors: Arijit Roy, Sharmistha Roy, Dibyendu Chatterjee

Abstract:

This article describes an interesting and inexpensive laboratory experiment for undergraduate students of electronics, geography and related disciplines. The objective of the proposed experiment is to improve the students’ exposure on the basic principles of instrumentation and to demonstrate an electronic measurement system. A simple electronic curvy length measurement system is presented here. Such a system can be used to measure curvy lengths e.g. length of a river, road or railway line etc. from topographical map. The proposed system is composed of simple functional blocks which are usually demonstrated in laboratory or in theory course of electronics at the undergraduate level. The experiment is assigned to a group of students and it is found that the experiment can fulfill its objectives with high degree of satisfaction.

Keywords: Curvy length measurement, Education, Electronics, Laboratory experiment, Topographical map.

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255 An Experimental Study on Development of the Connection System of Concrete Barriers Applicable to Modular Bridge

Authors: Seung-Kyung Kye, Sang-Seung Lee, Dooyong Cho, Sun-Kyu Park

Abstract:

Although many studies on the assembly technology of the bridge construction have dealt mostly with on the pier, girder or the deck of the bridge, studies on the prefabricated barrier have rarely been performed. For understanding structural characteristics and application of the concrete barrier in the modular bridge, which is an assembly of structure members, static loading test was performed. Structural performances as a road barrier of the three methods, conventional cast-in-place(ST), vertical bolt connection(BVC) and horizontal bolt connection(BHC) were evaluated and compared through the analyses of load-displacement curves, strain curves of the steel, concrete strain curves and the visual appearances of crack patterns. The vertical bolt connection(BVC) method demonstrated comparable performance as an alternative to conventional cast-in-place(ST) while providing all the advantages of prefabricated technology. Necessities for the future improvement in nuts enforcement as well as legal standard and regulation are also addressed.

Keywords: Modular Bridge, Concrete Barrier, Bolt Connection

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254 E-Learning Platform with SPICE Web Service

Authors: A. Braeken, L. Sterckx, A. Touhafi, Y. Verbelen

Abstract:

When studying electronics, hands-on experience is considered to be very valuable for a better understanding of the concepts of electricity and electronics. Students lacking sufficient time in the lab are often put at disadvantage. A way to overcome this, is by using interactive multimedia in a virtual environment. Instead of proposing another new ad-hoc simulator for e-learning, we propose in this paper an e-learning platform integrating the SPICE simulator as a web service. This enables to make use of all the functions of the de-facto standard simulator SPICE inelectronics when developing new simulations.

Keywords: E-learning, SPICE, virtual experiments, web service.

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253 A Low Cost and High Quality Duty-Cycle Modulation Scheme and Applications

Authors: B. Lonla Moffo, J. Mbihi, L. Nneme Nneme

Abstract:

In this paper, a low cost duty-cycle modulation scheme is studied in depth and compared to the standard pulse width modulation technique. Using a mix of analytical reasoning and electronics simulation tools, it is shown that under the same operating conditions, most characteristics of the proposed duty-cycle modulation scheme are better than those provided by a standard pulse width modulation technique. The simulation results obtained when testing both modulation control policies on prototyping systems, indicate that the proposed duty-cycle modulation approach, appears to be a high quality control policy in a wide variety of application areas, including A/D and D/A conversion, signal transmission and switching control in power electronics.

Keywords: Duty-cycle Modulation, Operational amplifiers, Pulse width modulation, Power electronics, Signal processing.

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252 Protection of Human Rights in Europe: The Parliamentary Dimension

Authors: Aleksandra Chiniaeva

Abstract:

The following paper describes the activity of national and international parliamentary assemblies of the European region in protection and promotion of human rights. It may be said that parliamentarians have a “double mandate” — as members of the international assembly and of their respective national parliaments. In other words, parliamentarization at both international and national level provides a situation for parliamentarians, where they link people, national governments and international organizations. The paper is aimed towards demonstrating that the activity of the main international parliamentary assemblies of the European region have a real positive impact on the human rights situation in the European region. In addition, the paper describes the assemblies that include protection of human rights in their Agenda as one of the main subjects: the EP, the PACE, the OSCE PA and the IPA CIS. Co-operation activities such as joint election observation; participation in inter-parliamentary associations, such as the IPU; conclusion agreements allow assemblies to provide observation of human right situation in the states that are not members of the particular organization and as consequence make their impact broader.

Keywords: Human rights, International parliamentary assembly, IPU, EP, PACE, OSCE, IPA CIS, international election observation.

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251 Study of Some Innovant Reactors without on- Site Refueling with Triso and Cermet Fuel

Authors: A.Chetaine, A. Benchrif, H. Amsil, V. Kuznetsov, Y. Shimazu

Abstract:

The evaluation of unit cell neutronic parameters and lifetime for some innovant reactors without on sit-refuling will be held in this work. the behavior of some small and medium reactors without on site refueling with triso and cermet fuel. For the FBNR long life except we propose to change the enrichment of the Cermet MFE to 9%. For the AFPR reactor we can see that the use of the Cermet MFE can extend the life of this reactor but to maintain the same life period for AFPR-SC we most use burnup poison to have the same slope for Kinf (Burnup). PFPWR50 cell behaves almost in same way using both fuels Cermet and TRISO. So we can conclude that PFPWR50 reactor, with CERMET Fuel, is kept among the long cycle reactors and with the new configuration we avoid subcriticality at the beginning of cycle. The evaluation of unit cell neutronic parameters reveals a good agreement with the goal of BWR-PB concept. It is found out that the Triso fuel assembly lifetime can be extended for a reasonably long period without being refueled, approximately up to 48GWd/t burnup. Using coated particles fuels with the Cermet composition can be more extended the fuel assembly life time, approximately 52 GWd/t.

Keywords: Cermet., Trisot, without on site refueling.

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250 Mechanisms in Regulating Language Practices in Electronics Engineering: A Program Plan for Outcomes-Based Education

Authors: Analiza Acuña-Villacorte

Abstract:

The underlying principle behind the harmonization in international education does not solely aim for the comparability but also the compatibility of outputs produced. The international standard in the different professions particularly in engineering defines the required graduate attributes to attain suitable qualifications and recognitions. This study described the language practices of the Electronics Engineering students of Bulacan State University, Philippines who will be deployed for their internship program. The purpose of the study was achieved by determining the language proficiency of the students in terms of speaking, listening, reading, and writing, and checking the adherence of the University to the commitment of intensifying community building for the Association of Southeast Asian Nation Vision 2020. The analysis of variance of the variables defined the significance between the causal variables and dependent variables. Thus, this study identified the mechanism that would regulate language practices in the Electronics Engineering program.

Keywords: Communicative competence, descriptive design, language practices, mechanisms, outcomes-based education.

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249 Immunity of Integrated Drive System, Effects of Radiated and Conducted Emission

Authors: M. Ektesabi

Abstract:

In this paper the problems associated with immunity of embedded systems used in Motor-Drive systems are investigated and appropriate solutions are presented. Integration of VSD motor systems (Integral Motor) while partially reducing some of these effects, adds to immunity problem of their embedded systems. Fail safe operation of an Integral Motor in arduous industrial environments is considered. In this paper an integral motor with a unique design is proposed to overcome critical issues such as heat, vibration and electromagnetic interference which are damaging to sensitive electronics without requirement of any additional cooling system. Advantages of the proposed Integral motor are compactness of combo motor and drive system with no external cabling/wiring. This motor provides a perfect shielding for least amount of radiated emission. It has an inbuilt filter for EMC compliance and has been designed to provide lower EMC noise for immunity of the internal electronics as well as the other neighbouring systems.

Keywords: Electromagnetic Interference, Immunity, IntegralMotor, Radiated & Conducted Emission, Sensitive Electronics, Variable Speed Drive

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248 Study on the Effect of Bolt Locking Method on the Deformation of Bipolar Plate in PEMFC

Authors: Tao Chen, ShiHua Liu, JiWei Zhang

Abstract:

Assembly of the proton exchange membrane fuel cells (PEMFC) has a very important influence on its performance and efficiency. The various components of PEMFC stack are usually locked and fixed by bolts. Locking bolt will cause the deformation of the bipolar plate and the other components, which will affect directly the deformation degree of the integral parts of the PEMFC as well as the performance of PEMFC. This paper focuses on the object of three-cell stack of PEMFC. Finite element simulation is used to investigate the deformation of bipolar plate caused by quantity and layout of bolts, bolt locking pressure, and bolt locking sequence, etc. Finally, we made a conclusion that the optimal combination packaging scheme was adopted to assemble the fuel cell stack. The scheme was in use of 3.8 MPa locking pressure imposed on the fuel cell stack, type Ⅱ of four locking bolts and longitudinal locking method. The scheme was obtained by comparatively analyzing the overall displacement contour of PEMFC stack, absolute displacement curve of bipolar plate along the given three paths in the Z direction and the polarization curve of fuel cell. The research results are helpful for the fuel cell stack assembly.

Keywords: Bipolar plate, deformation, finite element simulation, fuel cell, locking bolt.

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247 Overview of Multi-Chip Alternatives for 2.5D and 3D Integrated Circuit Packagings

Authors: Ching-Feng Chen, Ching-Chih Tsai

Abstract:

With the size of the transistor gradually approaching the physical limit, it challenges the persistence of Moore’s Law due to such issues of the short channel effect and the development of the high numerical aperture (NA) lithography equipment. In the context of the ever-increasing technical requirements of portable devices and high-performance computing (HPC), relying on the law continuation to enhance the chip density will no longer support the prospects of the electronics industry. Weighing the chip’s power consumption-performance-area-cost-cycle time to market (PPACC) is an updated benchmark to drive the evolution of the advanced wafer nanometer (nm). The advent of two and half- and three-dimensional (2.5 and 3D)- Very-Large-Scale Integration (VLSI) packaging based on Through Silicon Via (TSV) technology has updated the traditional die assembly methods and provided the solution. This overview investigates the up-to-date and cutting-edge packaging technologies for 2.5D and 3D integrated circuits (IC) based on the updated transistor structure and technology nodes. We conclude that multi-chip solutions for 2.5D and 3D IC packaging can prolong Moore’s Law.

Keywords: Moore’s Law, High Numerical Aperture, Power Consumption-Performance-Area-Cost-Cycle Time to Market, PPACC, 2.5 and 3D-Very-Large-Scale Integration Packaging, Through Silicon Vi.

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246 Dynamic Modelling and Virtual Simulation of Digital Duty-Cycle Modulation Control Drivers

Authors: J. Mbihi

Abstract:

This paper presents a dynamic architecture of digital duty-cycle modulation control drivers. Compared to most oversampling digital modulation schemes encountered in industrial electronics, its novelty is founded on a number of relevant merits including; embedded positive and negative feedback loops, internal modulation clock, structural simplicity, elementary building operators, no explicit need of samples of the nonlinear duty-cycle function when computing the switching modulated signal, and minimum number of design parameters. A prototyping digital control driver is synthesized and well tested within MATLAB/Simulink workspace. Then, the virtual simulation results and performance obtained under a sample of relevant instrumentation and control systems are presented, in order to show the feasibility, the reliability, and the versatility of target applications, of the proposed class of low cost and high quality digital control drivers in industrial electronics.

Keywords: Dynamic architecture, virtual simulation, duty-cycle modulation, digital control drivers, industrial electronics.

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245 Pre-Analysis of Printed Circuit Boards Based On Multispectral Imaging for Vision Based Recognition of Electronics Waste

Authors: Florian Kleber, Martin Kampel

Abstract:

The increasing demand of gallium, indium and rare-earth elements for the production of electronics, e.g. solid state-lighting, photovoltaics, integrated circuits, and liquid crystal displays, will exceed the world-wide supply according to current forecasts. Recycling systems to reclaim these materials are not yet in place, which challenges the sustainability of these technologies. This paper proposes a multispectral imaging system as a basis for a vision based recognition system for valuable components of electronics waste. Multispectral images intend to enhance the contrast of images of printed circuit boards (single components, as well as labels) for further analysis, such as optical character recognition and entire printed circuit board recognition. The results show, that a higher contrast is achieved in the near infrared compared to ultraviolett and visible light.

Keywords: Electronic Waste, Recycling, Multispectral Imaging, Printed Circuit Boards, Rare-Earth Elements.

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244 Experiment Study on the Influence of Tool Materials on the Drilling of Thick Stacked Plate of 2219 Aluminum Alloy

Authors: G. H. Li, M. Liu, H. J. Qi, Q. Zhu, W. Z. He

Abstract:

The drilling and riveting processes are widely used in the assembly of carrier rocket, which makes the efficiency and quality of drilling become the important factor affecting the assembly process. According to the problem existing in the drilling of thick stacked plate (thickness larger than 10mm) of carrier rocket, such as drill break, large noise and burr etc., experimental study of the influence of tool material on the drilling was carried out. The cutting force was measured by a piezoelectric dynamometer, the aperture was measured with an outline projector, and the burr is observed and measured by a digital stereo microscope. Through the measurement, the effects of tool material on the drilling were analyzed from the aspects of drilling force, diameter, and burr. The results show that, compared with carbide drill and coated carbide one, the drilling force of high speed steel is larger. But, the application of high speed steel also has some advantages, e.g. a higher number of hole can be obtained, the height of burr is small, the exit is smooth and the slim burr is less, and the tool experiences wear but not fracture. Therefore, the high speed steel tool is suitable for the drilling of thick stacked plate of 2219 Aluminum alloy.

Keywords: 2219 aluminum alloy, thick stacked plate, drilling, tool material.

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243 Development of a Real-Time Simulink Based Robotic System to Study Force Feedback Mechanism during Instrument-Object Interaction

Authors: Jaydip M. Desai, Antonio Valdevit, Arthur Ritter

Abstract:

Robotic surgery is used to enhance minimally invasive surgical procedure. It provides greater degree of freedom for surgical tools but lacks of haptic feedback system to provide sense of touch to the surgeon. Surgical robots work on master-slave operation, where user is a master and robotic arms are the slaves. Current, surgical robots provide precise control of the surgical tools, but heavily rely on visual feedback, which sometimes cause damage to the inner organs. The goal of this research was to design and develop a realtime Simulink based robotic system to study force feedback mechanism during instrument-object interaction. Setup includes three VelmexXSlide assembly (XYZ Stage) for three dimensional movement, an end effector assembly for forceps, electronic circuit for four strain gages, two Novint Falcon 3D gaming controllers, microcontroller board with linear actuators, MATLAB and Simulink toolboxes. Strain gages were calibrated using Imada Digital Force Gauge device and tested with a hard-core wire to measure instrument-object interaction in the range of 0-35N. Designed Simulink model successfully acquires 3D coordinates from two Novint Falcon controllers and transfer coordinates to the XYZ stage and forceps. Simulink model also reads strain gages signal through 10-bit analog to digital converter resolution of a microcontroller assembly in real time, converts voltage into force and feedback the output signals to the Novint Falcon controller for force feedback mechanism. Experimental setup allows user to change forward kinematics algorithms to achieve the best-desired movement of the XYZ stage and forceps. This project combines haptic technology with surgical robot to provide sense of touch to the user controlling forceps through machine-computer interface.

Keywords: Haptic feedback, MATLAB, Simulink, Strain Gage, Surgical Robot.

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242 An Algorithm of Finite Capacity Material Requirement Planning System for Multi-stage Assembly Flow Shop

Authors: T. Wuttipornpun, U. Wangrakdiskul, W. Songserm

Abstract:

This paper aims to develop an algorithm of finite capacity material requirement planning (FCMRP) system for a multistage assembly flow shop. The developed FCMRP system has two main stages. The first stage is to allocate operations to the first and second priority work centers and also determine the sequence of the operations on each work center. The second stage is to determine the optimal start time of each operation by using a linear programming model. Real data from a factory is used to analyze and evaluate the effectiveness of the proposed FCMRP system and also to guarantee a practical solution to the user. There are five performance measures, namely, the total tardiness, the number of tardy orders, the total earliness, the number of early orders, and the average flow-time. The proposed FCMRP system offers an adjustable solution which is a compromised solution among the conflicting performance measures. The user can adjust the weight of each performance measure to obtain the desired performance. The result shows that the combination of FCMRP NP3 and EDD outperforms other combinations in term of overall performance index. The calculation time for the proposed FCMRP system is about 10 minutes which is practical for the planners of the factory.

Keywords: Material requirement planning, Finite capacity, Linear programming, Permutation, Application in industry.

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241 Monitorization of Junction Temperature Using a Thermal-Test-Device

Authors: B. Arzhanov, A. Correia, P. Delgado, J. Meireles

Abstract:

Due to the higher power loss levels in electronic components, the thermal design of PCBs (Printed Circuit Boards) of an assembled device becomes one of the most important quality factors in electronics. Nonetheless, some of leading causes of the microelectronic component failures are due to higher temperatures, the leakages or thermal-mechanical stress, which is a concern, is the reliability of microelectronic packages. This article presents an experimental approach to measure the junction temperature of exposed pad packages. The implemented solution is in a prototype phase, using a temperature-sensitive parameter (TSP) to measure temperature directly on the die, validating the numeric results provided by the Mechanical APDL (Ansys Parametric Design Language) under same conditions. The physical device-under-test is composed by a Thermal Test Chip (TTC-1002) and assembly in a QFN cavity, soldered to a test-board according to JEDEC Standards. Monitoring the voltage drop across a forward-biased diode, is an indirectly method but accurate to obtain the junction temperature of QFN component with an applied power range between 0,3W to 1.5W. The temperature distributions on the PCB test-board and QFN cavity surface were monitored by an infra-red thermal camera (Goby-384) controlled and images processed by the Xeneth software. The article provides a set-up to monitorize in real-time the junction temperature of ICs, namely devices with the exposed pad package (i.e. QFN). Presenting the PCB layout parameters that the designer should use to improve thermal performance, and evaluate the impact of voids in solder interface in the device junction temperature.

Keywords: Quad Flat No-Lead packages, exposed pads, junction temperature, thermal management, measurements.

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