Search results for: differential interconnect
768 Analysis of CNT Bundle and its Comparison with Copper for FPGAs Interconnects
Authors: Kureshi Abdul Kadir, Mohd. Hasan
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Each new semiconductor technology node brings smaller transistors and wires. Although this makes transistors faster, wires get slower. In nano-scale regime, the standard copper (Cu) interconnect will become a major hurdle for FPGA interconnect due to their high resistivity and electromigration. This paper presents the comprehensive evaluation of mixed CNT bundle interconnects and investigates their prospects as energy efficient and high speed interconnect for future FPGA routing architecture. All HSPICE simulations are carried out at operating frequency of 1GHz and it is found that mixed CNT bundle implemented in FPGAs as interconnect can potentially provide a substantial delay and energy reduction over traditional interconnects at 32nm process technology.Keywords: CMOS, Copper Interconnect, Mixed CNT Bundle Interconnect, FPGAs.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1636767 Transceiver for Differential Wave Pipe-Lined Serial Interconnect with Surfing
Authors: Bhaskar M., Venkataramani B.
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In the literature, surfing technique has been proposed for single ended wave-pipelined serial interconnects to increase the data transfer rate. In this paper a novel surfing technique is proposed for differential wave-pipelined serial interconnects, which uses a 'Controllable inverter pair' for surfing. To evaluate the efficiency of this technique, a transceiver with transmitter, receiver, delay locked loop (DLL) along with 40mm metal 4 interconnects using the proposed surfing technique is implemented in UMC 180nm technology and their performances are studied through post layout simulations. From the study, it is observed that the proposed scheme permits 1.875 times higher data transmission rate compared to the single ended scheme whose maximum data transfer rate is 1.33 GB/s. The proposed scheme has the ability to receive the correct data even with stuck-at-faults in the complementary line.
Keywords: Controllable inverter pair, differential interconnect, serial link, surfing, wave pipelining.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1671766 Skin Effect: A Natural Phenomenon for Minimization of Ground Bounce in VLSI RC Interconnect
Authors: Shilpi Lavania
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As the frequency of operation has attained a range of GHz and signal rise time continues to increase interconnect technology is suffering due to various high frequency effects as well as ground bounce problem. In some recent studies a high frequency effect i.e. skin effect has been modeled and its drawbacks have been discussed. This paper strives to make an impression on the advantage side of modeling skin effect for interconnect line. The proposed method has considered a CMOS with RC interconnect. Delay and noise considering ground bounce problem and with skin effect are discussed. The simulation results reveal an advantage of considering skin effect for minimization of ground bounce problem during the working of the model. Noise and delay variations with temperature are also presented.
Keywords: Interconnect, Skin effect, Ground Bounce, Delay, Noise.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 3139765 Dual-Link Hierarchical Cluster-Based Interconnect Architecture for 3D Network on Chip
Authors: Guang Sun, Yong Li, Yuanyuan Zhang, Shijun Lin, Li Su, Depeng Jin, Lieguang zeng
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Network on Chip (NoC) has emerged as a promising on chip communication infrastructure. Three Dimensional Integrate Circuit (3D IC) provides small interconnection length between layers and the interconnect scalability in the third dimension, which can further improve the performance of NoC. Therefore, in this paper, a hierarchical cluster-based interconnect architecture is merged with the 3D IC. This interconnect architecture significantly reduces the number of long wires. Since this architecture only has approximately a quarter of routers in 3D mesh-based architecture, the average number of hops is smaller, which leads to lower latency and higher throughput. Moreover, smaller number of routers decreases the area overhead. Meanwhile, some dual links are inserted into the bottlenecks of communication to improve the performance of NoC. Simulation results demonstrate our theoretical analysis and show the advantages of our proposed architecture in latency, throughput and area, when compared with 3D mesh-based architecture.Keywords: Network on Chip (NoC), interconnect architecture, performance, area, Three Dimensional Integrate Circuit (3D IC).
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1527764 Design of Local Interconnect Network Controller for Automotive Applications
Authors: Jong-Bae Lee, Seongsoo Lee
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Local interconnect network (LIN) is a communication protocol that combines sensors, actuators, and processors to a functional module in automotive applications. In this paper, a LIN ver. 2.2A controller was designed in Verilog hardware description language (Verilog HDL) and implemented in field-programmable gate array (FPGA). Its operation was verified by making full-scale LIN network with the presented FPGA-implemented LIN controller, commercial LIN transceivers, and commercial processors. When described in Verilog HDL and synthesized in 0.18 μm technology, its gate size was about 2,300 gates.
Keywords: Local interconnect network, controller, transceiver, processor.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1588763 Interconnect Analysis of a Novel Multiplexer Based Full-Adder Cell for Power and Propagation Delay Optimizations
Authors: G.Ramana Murthy, C.Senthilpari, P.Velrajkumar, Lim Tien Sze
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The proposed multiplexer-based novel 1-bit full adder cell is schematized by using DSCH2 and its layout is generated by using microwind VLSI CAD tool. The adder cell layout interconnect analysis is performed by using BSIM4 layout analyzer. The adder circuit is compared with other six existing adder circuits for parametric analysis. The proposed adder cell gives better performance than the other existing six adder circuits in terms of power, propagation delay and PDP. The proposed adder circuit is further analyzed for interconnect analysis, which gives better performance than other adder circuits in terms of layout thickness, width and height.Keywords: Full Adder, Interconnect Analysis, Low-Power, Multiplexer, Propagation Delay, Parametric Analysis.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1552762 Physical Parameter Based Compact Expression for Propagation Constant of SWCNT Interconnects
Authors: Kollarama Subramanyam, Nisha Kuruvilla, J. P. Raina
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Novel compact expressions for propagation constant (γ) of SWCNT and bundled SWCNTs interconnect, in terms of physical parameters such as length, operating frequency and diameter of CNTs is proposed in this work. These simplified expressions enable physical insight and accurate estimation of signal attenuation level and its phase change at any length for a particular frequency. The proposed expressions are validated against SPICE simulated results of lumped as well as distributed equivalent electrical RLC nets of CNT interconnect. These expressions also help us to evaluate the cut off frequencies of SWCNTs for different interconnect lengths.
Keywords: Attenuation constant, Bundled SWCNT, CNT interconnects, Propagation Constant.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1675761 Closed form Delay Model for on-Chip VLSIRLCG Interconnects for Ramp Input for Different Damping Conditions
Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar
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Fast delay estimation methods, as opposed to simulation techniques, are needed for incremental performance driven layout synthesis. On-chip inductive effects are becoming predominant in deep submicron interconnects due to increasing clock speed and circuit complexity. Inductance causes noise in signal waveforms, which can adversely affect the performance of the circuit and signal integrity. Several approaches have been put forward which consider the inductance for on-chip interconnect modelling. But for even much higher frequency, of the order of few GHz, the shunt dielectric lossy component has become comparable to that of other electrical parameters for high speed VLSI design. In order to cope up with this effect, on-chip interconnect has to be modelled as distributed RLCG line. Elmore delay based methods, although efficient, cannot accurately estimate the delay for RLCG interconnect line. In this paper, an accurate analytical delay model has been derived, based on first and second moments of RLCG interconnection lines. The proposed model considers both the effect of inductance and conductance matrices. We have performed the simulation in 0.18μm technology node and an error of as low as less as 5% has been achieved with the proposed model when compared to SPICE. The importance of the conductance matrices in interconnect modelling has also been discussed and it is shown that if G is neglected for interconnect line modelling, then it will result an delay error of as high as 6% when compared to SPICE.Keywords: Delay Modelling; On-Chip Interconnect; RLCGInterconnect; Ramp Input; Damping; VLSI
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 2048760 Synthesizing CuFe2O4 Spinel Powders by a Combustion-Like Process for Solid Oxide Fuel Cell Interconnect Coatings
Authors: S. N. Hosseini, M. H. Enayati, F. Karimzadeh, N. M. Sammes
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The synthesis of CuFe2O4 spinel powders by an optimized combustion-like process followed by calcination is described herein. The samples were characterized using X-ray diffraction (XRD), differential thermal analysis (TG/DTA), scanning electron microscopy (SEM), dilatometry and 4-probe DC methods. Different glycine to nitrate (G/N) ratios of 1 (fuel-deficient), 1.48 (stoichiometric) and 2 (fuel-rich) were employed. Calcining the asprepared powders at 800 and 1000°C for 5 hours showed that the G/N ratio of 2 results in the formation of the desired copper spinel single phase at both calcination temperatures. For G/N=1, formation of CuFe2O4 takes place in three steps. First, iron and copper nitrates decompose to iron oxide and pure copper. Then, copper transforms to copper oxide and finally, copper and iron oxides react with each other to form a copper ferrite spinel phase. The electrical conductivity and the coefficient of thermal expansion of the sintered pelletized samples were 2 S.cm-1 (800°C) and 11×10-6 °C-1 (25-800°C), respectively.Keywords: SOFC interconnect coatings, Copper ferrite, Spinels, Electrical conductivity, Glycine–nitrate process.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 2484759 A Superior Delay Estimation Model for VLSI Interconnect in Current Mode Signaling
Authors: Sunil Jadav, Rajeevan Chandel Munish Vashishath
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Today’s VLSI networks demands for high speed. And in this work the compact form mathematical model for current mode signalling in VLSI interconnects is presented.RLC interconnect line is modelled using characteristic impedance of transmission line and inductive effect. The on-chip inductance effect is dominant at lower technology node is emulated into an equivalent resistance. First order transfer function is designed using finite difference equation, Laplace transform and by applying the boundary conditions at the source and load termination. It has been observed that the dominant pole determines system response and delay in the proposed model. The novel proposed current mode model shows superior performance as compared to voltage mode signalling. Analysis shows that current mode signalling in VLSI interconnects provides 2.8 times better delay performance than voltage mode. Secondly the damping factor of a lumped RLC circuit is shown to be a useful figure of merit.
Keywords: Current Mode, Voltage Mode, VLSI Interconnect.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 2450758 Accurate Crosstalk Analysis for RLC On-Chip VLSI Interconnect
Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar
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This work proposes an accurate crosstalk noise estimation method in the presence of multiple RLC lines for the use in design automation tools. This method correctly models the loading effects of non switching aggressors and aggressor tree branches using resistive shielding effect and realistic exponential input waveforms. Noise peak and width expressions have been derived. The results obtained are at good agreement with SPICE results. Results show that average error for noise peak is 4.7% and for the width is 6.15% while allowing a very fast analysis.
Keywords: Crosstalk, distributed RLC segments, On-Chip interconnect, output response, VLSI, noise peak, noise width.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1645757 Interconnection of Autonomous PROFIBUS Segments through IEEE 802.16 WMAN
Authors: M. İskefiyeli, İ. Özçelik
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PROFIBUS (PROcess FIeld BUS) which is defined with international standarts (IEC61158, EN50170) is the most popular fieldbus, and provides a communication between industrial applications which are located in different control environment and location in manufacturing, process and building automation. Its communication speed is from 9.6 Kbps to 12 Mbps over distances from 100 to 1200 meters, and so it is to be often necessary to interconnect them in order to break these limits. Unfortunately this interconnection raises several issues and the solutions found so far are not very satisfactory. In this paper, we propose a new solution to interconnect PROFIBUS segments, which uses a wireless MAN based on the IEEE 802.16 standard as a backbone system. Also, the solution which is described a model for internetworking unit integrates the traffic generated by PROFIBUS segments into IEEE 802.16 wireless MAN using encapsulation technique.
Keywords: Internetworking Unit, PROFIBUS, WiMAX, WMAN, 802.16.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1696756 Development of Extended Trapezoidal Method for Numerical Solution of Volterra Integro-Differential Equations
Authors: Fuziyah Ishak, Siti Norazura Ahmad
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Volterra integro-differential equations appear in many models for real life phenomena. Since analytical solutions for this type of differential equations are hard and at times impossible to attain, engineers and scientists resort to numerical solutions that can be made as accurately as possible. Conventionally, numerical methods for ordinary differential equations are adapted to solve Volterra integro-differential equations. In this paper, numerical solution for solving Volterra integro-differential equation using extended trapezoidal method is described. Formulae for the integral and differential parts of the equation are presented. Numerical results show that the extended method is suitable for solving first order Volterra integro-differential equations.
Keywords: Accuracy, extended trapezoidal method, numerical solution, Volterra integro-differential equations.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1657755 Signal Transmission Analysis of Differential Pairs Using Semicircle-Shaped Via Structure
Authors: Moonjung Kim, Chang-Ho Hyun, Won-Ho Kim
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In this paper, the signal transmission analysis of the semicircle-shaped via structure for the differential pairs is presented in the frequency range up to 10 GHz. In order to improve the signal transmission properties in the differential pairs, single via is separated centrally into two semicircle-shaped sections, which are interconnected with the traces of differential pairs respectively. This via structure make possible to route differential pairs using only one via. In addition, it can improve impedance discontinuity around its region and then enhance the signal transmission properties in the differential pairs. The electrical analysis such as S-parameter calculation and eye diagram simulation has been performed to investigate the improvement of the signal transmission property in the differential pairs with new via structure.Keywords: Differential pairs, signal transmission property, via, S-parameter.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 3928754 Noise Analysis of Single-Ended Input Differential Amplifier using Stochastic Differential Equation
Authors: Tarun Kumar Rawat, Abhirup Lahiri, Ashish Gupta
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In this paper, we analyze the effect of noise in a single- ended input differential amplifier working at high frequencies. Both extrinsic and intrinsic noise are analyzed using time domain method employing techniques from stochastic calculus. Stochastic differential equations are used to obtain autocorrelation functions of the output noise voltage and other solution statistics like mean and variance. The analysis leads to important design implications and suggests changes in the device parameters for improved noise characteristics of the differential amplifier.
Keywords: Single-ended input differential amplifier, Noise, stochastic differential equation, mean and variance.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1724753 Laplace Technique to Find General Solution of Differential Equations without Initial Conditions
Authors: Adil Al-Rammahi
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Laplace transformations have wide applications in engineering and sciences. All previous studies of modified Laplace transformations depend on differential equation with initial conditions. The purpose of our paper is to solve the linear differential equations (not initial value problem) and then find the general solution (not particular) via the Laplace transformations without needed any initial condition. The study involves both types of differential equations, ordinary and partial.
Keywords: Differential Equations, Laplace Transformations.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 3185752 A Sandwich-type Theorem with Applications to Univalent Functions
Authors: Sukhwinder Singh Billing, Sushma Gupta, Sukhjit Singh Dhaliwal
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In the present paper, we obtain a sandwich-type theorem. As applications of our main result, we discuss the univalence and starlikeness of analytic functions in terms of certain differential subordinations and differential inequalities.Keywords: Univalent function, Starlike function, Differential subordination, Differential superordination.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1325751 Integral Image-Based Differential Filters
Authors: Kohei Inoue, Kenji Hara, Kiichi Urahama
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We describe a relationship between integral images and differential images. First, we derive a simple difference filter from conventional integral image. In the derivation, we show that an integral image and the corresponding differential image are related to each other by simultaneous linear equations, where the numbers of unknowns and equations are the same, and therefore, we can execute the integration and differentiation by solving the simultaneous equations. We applied the relationship to an image fusion problem, and experimentally verified the effectiveness of the proposed method.
Keywords: Integral images, differential images, differential filters, image fusion.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 2099750 Application of the Hybrid Methods to Solving Volterra Integro-Differential Equations
Authors: G.Mehdiyeva, M.Imanova, V.Ibrahimov
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Beginning from the creator of integro-differential equations Volterra, many scientists have investigated these equations. Classic method for solving integro-differential equations is the quadratures method that is successfully applied up today. Unlike these methods, Makroglou applied hybrid methods that are modified and generalized in this paper and applied to the numerical solution of Volterra integro-differential equations. The way for defining the coefficients of the suggested method is also given.Keywords: Integro-differential equations, initial value problem, hybrid methods, predictor-corrector method
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1733749 Study of the Oxidation Resistance of Coated AISI 441 Ferritic Stainless Steel for SOFCs
Authors: M. B. Limooei, Hadi Ebrahimifar, Sh. Hosseini
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Protective coatings that resist oxide scale growth and decrease chromium evaporation are necessary to make stainless steel interconnect materials for long-term durable operation of solid oxide fuel cells (SOFCs). In this study a layer of cobalt was electroplated on the surface of AISI 441 ferritic stainless steel which is used in solid oxide fuel cells for interconnect applications. The oxidation behavior of coated substrates was studied as a function of time at operating conditions of SOFCs. Cyclic oxidation has been also tested at 800ºC for 100 cycles. Cobalt coating during isothermal oxidation caused to the oxide growth resistance by limiting the outward diffusion of Cr cation and the inward diffusion of oxygen anion. Results of cyclic oxidation exhibited that coated substrates demonstrate an excellent resistance against the spallation and cracking.
Keywords: Oxidation resistance, full cell, Cobalt coating, ferritic stainless steel.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 2032748 Explicit Delay and Power Estimation Method for CMOS Inverter Driving on-Chip RLC Interconnect Load
Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar
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The resistive-inductive-capacitive behavior of long interconnects which are driven by CMOS gates are presented in this paper. The analysis is based on the ¤Ç-model of a RLC load and is developed for submicron devices. Accurate and analytical expressions for the output load voltage, the propagation delay and the short circuit power dissipation have been proposed after solving a system of differential equations which accurately describe the behavior of the circuit. The effect of coupling capacitance between input and output and the short circuit current on these performance parameters are also incorporated in the proposed model. The estimated proposed delay and short circuit power dissipation are in very good agreement with the SPICE simulation with average relative error less than 6%.Keywords: Delay, Inverter, Short Circuit Power, ¤Ç-Model, RLCInterconnect, VLSI
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1693747 Strict Stability of Fuzzy Differential Equations with Impulse Effect
Authors: Sanjay K.Srivastava, Bhanu Gupta
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In this paper some results on strict stability heve beeb extended for fuzzy differential equations with impulse effect using Lyapunov functions and Razumikhin technique.
Keywords: Fuzzy differential equations, Impulsive differential equations, Strict stability, Lyapunov function, Razumikhin technique.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1469746 Ψ-Eventual Stability of Differential System with Impulses
Authors: Bhanu Gupta
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In this paper, the criteria of Ψ-eventual stability have been established for generalized impulsive differential systems of multiple dependent variables. The sufficient conditions have been obtained using piecewise continuous Lyapunov function. An example is given to support our theoretical result.
Keywords: impulsive differential equations, Lyapunov function, eventual stability
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 4052745 Step Method for Solving Nonlinear Two Delays Differential Equation in Parkinson’s Disease
Authors: H. N. Agiza, M. A. Sohaly, M. A. Elfouly
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Parkinson's disease (PD) is a heterogeneous disorder with common age of onset, symptoms, and progression levels. In this paper we will solve analytically the PD model as a non-linear delay differential equation using the steps method. The step method transforms a system of delay differential equations (DDEs) into systems of ordinary differential equations (ODEs). On some numerical examples, the analytical solution will be difficult. So we will approximate the analytical solution using Picard method and Taylor method to ODEs.
Keywords: Parkinson's disease, Step method, delay differential equation, simulation.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 734744 Numerical Study of Some Coupled PDEs by using Differential Transformation Method
Authors: Reza Abazari, Rasool Abazari
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In this paper, the two-dimension differential transformation method (DTM) is employed to obtain the closed form solutions of the three famous coupled partial differential equation with physical interest namely, the coupled Korteweg-de Vries(KdV) equations, the coupled Burgers equations and coupled nonlinear Schrödinger equation. We begin by showing that how the differential transformation method applies to a linear and non-linear part of any PDEs and apply on these coupled PDEs to illustrate the sufficiency of the method for this kind of nonlinear differential equations. The results obtained are in good agreement with the exact solution. These results show that the technique introduced here is accurate and easy to apply.
Keywords: Coupled Korteweg-de Vries(KdV) equation, Coupled Burgers equation, Coupled Schrödinger equation, differential transformation method.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 3002743 Closed-Form Solution of Second Order Linear Ordinary Differential Equations
Authors: Saeed Otarod
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A transformational method is employed to obtain closed-form integral solutions for nonhomogeneous second order linear ordinary differential equations in terms of a particular solution of the corresponding homogeneous part. To find the particular solution of the homogeneous part, the equation is first transformed into a simple Riccati equation from which the general solution of the nonhomogeneous second order linear differential equation, in the form of a closed integral equation, is inferred. The method is applied to the solution of Schr¨odinger equation for hydrogen-like atoms. A generic nonhomogeneous second order linear differential equation has also been solved to further exemplify the methodology.
Keywords: Closed form, Second order ordinary differential equations, explicit, linear equations, differential equations.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 11742 Strict Stability of Fuzzy Differential Equations by Lyapunov Functions
Authors: Mustafa Bayram Gücen, Coşkun Yakar
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In this study, we have investigated the strict stability of fuzzy differential systems and we compare the classical notion of strict stability criteria of ordinary differential equations and the notion of strict stability of fuzzy differential systems. In addition that, we present definitions of stability and strict stability of fuzzy differential equations and also we have some theorems and comparison results. Strict Stability is a different stability definition and this stability type can give us an information about the rate of decay of the solutions. Lyapunov’s second method is a standard technique used in the study of the qualitative behavior of fuzzy differential systems along with a comparison result that allows the prediction of behavior of a fuzzy differential system when the behavior of the null solution of a fuzzy comparison system is known. This method is a usefull for investigating strict stability of fuzzy systems. First of all, we present definitions and necessary background material. Secondly, we discuss and compare the differences between the classical notion of stability and the recent notion of strict stability. And then, we have a comparison result in which the stability properties of the null solution of the comparison system imply the corresponding stability properties of the fuzzy differential system. Consequently, we give the strict stability results and a comparison theorem. We have used Lyapunov second method and we have proved a comparison result with scalar differential equations.Keywords: Fuzzy systems, fuzzy differential equations, fuzzy stability, strict stability.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1128741 Three Phase Fault Analysis of DC-Link Rectifier using new Power Differential Protection Concept
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The concept of differential protection based on current quantities has been discussed in many paper and researches. For certificating and inverting of currents and voltages through converter systems, there is no conventional current differential relay, which can compare current quantities, because they are different in form and frequencies. An overview over a new concept of differential protection for converters based on instantaneous power quantities will be discussed in this paper. To drive the power quantities a mathematical background of the space vectors will be introduced. A simple DCLink is preceded in this paper and a power analysis description and simulation is derived using Matlab®/ SimulinkTM concerning a certain construction scheme of Power Differential Relay System. Finally a complete analysis of three phase fault in DC-Link Rectifier is discussed to ensure the ability of Power Differential Protection System to detect the fault in main and selectivity protection sections.
Keywords: Space Vectors, Power Differential Relay (PDR), Short Circuit Power, Diode Recovery Energy, Detected Power Differential Signal (DPDS), Power Space Vector (PSV), Power Space Vector Protection Area (PSVPA).
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 3388740 Existence of Solution for Boundary Value Problems of Differential Equations with Delay
Authors: Xiguang Li
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In this paper , by using fixed point theorem , upper and lower solution-s method and monotone iterative technique , we prove the existence of maximum and minimum solutions of differential equations with delay , which improved and generalize the result of related paper.
Keywords: Banach space, boundary value problem, differential equation, delay.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1232739 Projective Synchronization of a Class of Fractional-Order Chaotic Systems
Authors: Zahra Yaghoubi, Nooshin Bigdeli, Karim Afshar
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This paper at first presents approximate analytical solutions for systems of fractional differential equations using the differential transform method. The application of differential transform method, developed for differential equations of integer order, is extended to derive approximate analytical solutions of systems of fractional differential equations. The solutions of our model equations are calculated in the form of convergent series with easily computable components. After that a drive-response synchronization method with linear output error feedback is presented for “generalized projective synchronization" for a class of fractional-order chaotic systems via a scalar transmitted signal. Genesio_Tesi and Duffing systems are used to illustrate the effectiveness of the proposed synchronization method. Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1813