Search results for: semiconductor manufacturing.
499 Analysis of Noodle Production Process at Yan Hu Food Manufacturing: Basis for Production Improvement
Authors: Rhadinia Tayag-Relanes, Felina C. Young
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This study was conducted to analyze the noodle production process at Yan Hu Food Manufacturing for the basis of production improvement. The study utilized the Plan, Do, Check, Act (PDCA) approach and record review in the gathering of data for the calendar year 2019, specifically from August to October, focusing on the noodle products miki, canton, and misua. A causal-comparative research design was employed to establish cause-effect relationships among the variables, using descriptive statistics and correlation to compute the data gathered. The findings indicate that miki, canton, and misua production have distinct cycle times and production outputs in every set of its production processes, as well as varying levels of wastage. The company has not yet established a formal allowable rejection rate for wastage; instead, this paper used a 1% wastage limit. We recommended the following: machines used for each process of the noodle product must be consistently maintained and monitored; an assessment of all the production operators should be conducted by assessing their performance statistically based on the output and the machine performance; a root cause analysis must be conducted to identify solutions to production issues; and, an improved recording system for input and output of the production process of each noodle product should be established to eliminate the poor recording of data.
Keywords: Production, continuous improvement, process, operations, Plan, Do, Check, Act approach.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 35498 Effects of Dopant Concentrations on Radiative Properties of Nanoscale Multilayer with Coherent Formulation for Visible Wavelengths
Authors: S. A. A. Oloomi , M. Omidpanah
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Semiconductor materials with coatings have a wide range of applications in MEMS and NEMS. This work uses transfermatrix method for calculating the radiative properties. Dopped silicon is used and the coherent formulation is applied. The Drude model for the optical constants of doped silicon is employed. Results showed that for the visible wavelengths, more emittance occurs in greater concentrations and the reflectance decreases as the concentration increases. In these wavelengths, transmittance is negligible. Donars and acceptors act similar in visible wavelengths. The effect of wave interference can be understood by plotting the spectral properties such as reflectance or transmittance of a thin dielectric film versus the film thickness and analyzing the oscillations of properties due to constructive and destructive interferences. But this effect has not been shown at visible wavelengths. At room temperature, the scattering process is dominated by lattice scattering for lightly doped silicon, and the impurity scattering becomes important for heavily doped silicon when the dopant concentration exceeds1018cm-3 .
Keywords: Dopant Concentrations, Radiative Properties, Nanoscale Multilayer, Coherent Formulation, Visible Wavelengths
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1442497 Hybrid Pulse Width Modulation Techniques for the Reduction of Switching Losses and Voltage Harmonics in Cascaded Multilevel Inverters
Authors: Venkata Reddy Kota
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These days, the industrial trend is moving away from heavy and bulky passive components to power converter systems that use more and more semiconductor elements. Also, it is difficult to connect the traditional converters to the high and medium voltage. For these reasons, a new family of multilevel inverters has appeared as a solution for working with higher voltage levels. Different modulation topologies like Sinusoidal Pulse Width Modulation (SPWM), Selective Harmonic Elimination Pulse Width Modulation (SHE-PWM) are available for multilevel inverters. In this work, different hybrid modulation techniques which are combination of fundamental frequency modulation and multilevel sinusoidal-modulation are compared. The main characteristic of these modulations are reduction of switching losses with good harmonic performance and balanced power loss dissipation among the device. The proposed hybrid modulation schemes are developed and simulated in Matlab/Simulink for cascaded H-bridge inverter. The results validate the applicability of the proposed schemes for cascaded multilevel inverter.
Keywords: Hybrid PWM techniques, Cascaded Multilevel Inverters, Switching loss minimization.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1989496 Wetting Characterization of High Aspect Ratio Nanostructures by Gigahertz Acoustic Reflectometry
Authors: C. Virgilio, J. Carlier, P. Campistron, M. Toubal, P. Garnier, L. Broussous, V. Thomy, B. Nongaillard
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Wetting efficiency of microstructures or nanostructures patterned on Si wafers is a real challenge in integrated circuits manufacturing. In fact, bad or non-uniform wetting during wet processes limits chemical reactions and can lead to non-complete etching or cleaning inside the patterns and device defectivity. This issue is more and more important with the transistors size shrinkage and concerns mainly high aspect ratio structures. Deep Trench Isolation (DTI) structures enabling pixels’ isolation in imaging devices are subject to this phenomenon. While low-frequency acoustic reflectometry principle is a well-known method for Non Destructive Test applications, we have recently shown that it is also well suited for nanostructures wetting characterization in a higher frequency range. In this paper, we present a high-frequency acoustic reflectometry characterization of DTI wetting through a confrontation of both experimental and modeling results. The acoustic method proposed is based on the evaluation of the reflection of a longitudinal acoustic wave generated by a 100 µm diameter ZnO piezoelectric transducer sputtered on the silicon wafer backside using MEMS technologies. The transducers have been fabricated to work at 5 GHz corresponding to a wavelength of 1.7 µm in silicon. The DTI studied structures, manufactured on the wafer frontside, are crossing trenches of 200 nm wide and 4 µm deep (aspect ratio of 20) etched into a Si wafer frontside. In that case, the acoustic signal reflection occurs at the bottom and at the top of the DTI enabling its characterization by monitoring the electrical reflection coefficient of the transducer. A Finite Difference Time Domain (FDTD) model has been developed to predict the behavior of the emitted wave. The model shows that the separation of the reflected echoes (top and bottom of the DTI) from different acoustic modes is possible at 5 Ghz. A good correspondence between experimental and theoretical signals is observed. The model enables the identification of the different acoustic modes. The evaluation of DTI wetting is then performed by focusing on the first reflected echo obtained through the reflection at Si bottom interface, where wetting efficiency is crucial. The reflection coefficient is measured with different water / ethanol mixtures (tunable surface tension) deposited on the wafer frontside. Two cases are studied: with and without PFTS hydrophobic treatment. In the untreated surface case, acoustic reflection coefficient values with water show that liquid imbibition is partial. In the treated surface case, the acoustic reflection is total with water (no liquid in DTI). The impalement of the liquid occurs for a specific surface tension but it is still partial for pure ethanol. DTI bottom shape and local pattern collapse of the trenches can explain these incomplete wetting phenomena. This high-frequency acoustic method sensitivity coupled with a FDTD propagative model thus enables the local determination of the wetting state of a liquid on real structures. Partial wetting states for non-hydrophobic surfaces or low surface tension liquids are then detectable with this method.
Keywords: Wetting, acoustic reflectometry, gigahertz, semiconductor.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1302495 Optimization of HALO Structure Effects in 45nm p-type MOSFETs Device Using Taguchi Method
Authors: F. Salehuddin, I. Ahmad, F. A. Hamid, A. Zaharim, H. A. Elgomati, B. Y. Majlis, P. R. Apte
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In this study, the Taguchi method was used to optimize the effect of HALO structure or halo implant variations on threshold voltage (VTH) and leakage current (ILeak) in 45nm p-type Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) device. Besides halo implant dose, the other process parameters which used were Source/Drain (S/D) implant dose, oxide growth temperature and silicide anneal temperature. This work was done using TCAD simulator, consisting of a process simulator, ATHENA and device simulator, ATLAS. These two simulators were combined with Taguchi method to aid in design and optimize the process parameters. In this research, the most effective process parameters with respect to VTH and ILeak are halo implant dose (40%) and S/D implant dose (52%) respectively. Whereas the second ranking factor affecting VTH and ILeak are oxide growth temperature (32%) and halo implant dose (34%) respectively. The results show that after optimizations approaches is -0.157V at ILeak=0.195mA/μm.
Keywords: Optimization, p-type MOSFETs device, HALO Structure, Taguchi Method.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 2040494 Multifunctional Bending and Straightening Machines for Shipbuilding
Authors: V. Yu. Shungin, A. V. Popov
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The paper gives basic information on application of rotation bending for manufacturing ship hull parts from steel plates and on MGPS machines, employed for this purpose.
Keywords: Roller bending, steel plates, shipbuilding, ship repair.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 2520493 Solving Process Planning, Weighted Earliest Due Date Scheduling and Weighted Due Date Assignment Using Simulated Annealing and Evolutionary Strategies
Authors: Halil Ibrahim Demir, Abdullah Hulusi Kokcam, Fuat Simsir, Özer Uygun
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Traditionally, three important manufacturing functions which are process planning, scheduling and due-date assignment are performed sequentially and separately. Although there are numerous works on the integration of process planning and scheduling and plenty of works focusing on scheduling with due date assignment, there are only a few works on integrated process planning, scheduling and due-date assignment. Although due-dates are determined without taking into account of weights of the customers in the literature, here weighted due-date assignment is employed to get better performance. Jobs are scheduled according to weighted earliest due date dispatching rule and due dates are determined according to some popular due date assignment methods by taking into account of the weights of each job. Simulated Annealing, Evolutionary Strategies, Random Search, hybrid of Random Search and Simulated Annealing, and hybrid of Random Search and Evolutionary Strategies, are applied as solution techniques. Three important manufacturing functions are integrated step-by-step and higher integration levels are found better. Search meta-heuristics are found to be very useful while improving performance measure.
Keywords: Evolutionary strategies, hybrid searches, process planning, simulated annealing, weighted due-date assignment, weighted scheduling.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1160492 Synthesis and Characterization of Nickel and Sulphur Sensitized Zinc Oxide Structures
Authors: Ella C. Linganiso, Bonex W. Mwakikunga, Trilock Singh, Sanjay Mathur, Odireleng M. Ntwaeaborwa
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The use of nanostructured semiconducting material to catalyze degradation of environmental pollutants still receives much attention to date. One of the desired characteristics for pollutant degradation under ultra-violet visible light is the materials with extended carrier charge separation that allows for electronic transfer between the catalyst and the pollutants. In this work, zinc oxide n-type semiconductor vertically aligned structures were fabricated on silicon (100) substrates using the chemical bath deposition method. The as-synthesized structures were treated with nickel and sulphur. X-ray diffraction, scanning electron microscopy, energy dispersive X-ray spectroscopy were used to characterize the phase purity, structural dimensions and elemental composition of the obtained structures respectively. Photoluminescence emission measurements showed a decrease in both the near band edge emission as well as the defect band emission upon addition of nickel and sulphur with different concentrations. This was attributed to increased charger-carrier-separation due to the presence of Ni-S material on ZnO surface, which is linked to improved charge transfer during photocatalytic reactions.
Keywords: Carrier-charge-separation, nickel, sulphur, zinc oxide, photoluminescence.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 856491 The Analysis of Radial/Axial Error Motion on a Precision Rotation Stage
Authors: Jinho Kim, Dongik Shin, Deokwon Yun, Changsoo Han
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Rotating stages in semiconductor, display industry and many other fields require challenging accuracy to perform their functions properly. Especially, Axis of rotation error on rotary system is significant; such as the spindle error motion of the aligner, wire bonder and inspector machine which result in the poor state of manufactured goods. To evaluate and improve the performance of such precision rotary stage, unessential movements on the other 5 degrees of freedom of the rotary stage must be measured and analyzed. In this paper, we have measured the three translations and two tilt motions of a rotating stage with high precision capacitive sensors. To obtain the radial error motion from T.I.R (Total Indicated Reading) of radial direction, we have used Donaldson's reversal technique. And the axial components of the spindle tilt error motion can be obtained accurately from the axial direction outputs of sensors by Estler face motion reversal technique. Further more we have defined and measured the sensitivity of positioning error to the five error motions.Keywords: Donaldson's reversal methods, Estler face motionreversal method, Error motion, sensitivity, T.I.R (Total IndicatedReading).
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 3543490 Resilient Manufacturing: Use of Augmented Reality to Advance Training and Operating Practices in Manual Assembly
Authors: L. C. Moreira, M. Kauffman
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This paper outlines the results of an experimental research on deploying an emerging augmented reality (AR) system for real-time task assistance (or work instructions) of highly customised and high-risk manual operations. The focus is on human operators’ training effectiveness and performance and the aim is to test if such technologies can support enhancing the knowledge retention levels and accuracy of task execution to improve health and safety (H&S). An AR enhanced assembly method is proposed and experimentally tested using a real industrial process as case study for electric vehicles’ (EV) battery module assembly. The experimental results revealed that the proposed method improved the training practices and performance through increases in the knowledge retention levels from 40% to 84%, and accuracy of task execution from 20% to 71%, when compared to the traditional paper-based method. The results of this research validate and demonstrate how emerging technologies are advancing the choice for manual, hybrid or fully automated processes by promoting the XR-assisted processes, and the connected worker (a vision for Industry 4 and 5.0), and supporting manufacturing become more resilient in times of constant market changes.
Keywords: Augmented reality, extended reality, connected worker, XR-assisted operator, manual assembly 4.0, industry 5.0, smart training, battery assembly.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 380489 Variable Input Range Continuous-time Switched Current Delta-sigma Analog Digital Converter for RFID CMOS Biosensor Applications
Authors: Boram Kim, Shigeyasu Uno, Kazuo Nakazato
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Continuous-time delta-sigma analog digital converter (ADC) for radio frequency identification (RFID) complementary metal oxide semiconductor (CMOS) biosensor has been reported. This delta-sigma ADC is suitable for digital conversion of biosensor signal because of small process variation, and variable input range. As the input range of continuous-time switched current delta-sigma ADC (Dynamic range : 50 dB) can be limited by using current reference, amplification of biosensor signal is unnecessary. The input range is switched to wide input range mode or narrow input range mode by command of current reference. When the narrow input range mode, the input range becomes ± 0.8 V. The measured power consumption is 5 mW and chip area is 0.31 mm^2 using 1.2 um standard CMOS process. Additionally, automatic input range detecting system is proposed because of RFID biosensor applications.
Keywords: continuous time, delta sigma, A/D converter, RFID, biosensor, CMOS
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1563488 A Design for Supply Chain Model by Integrated Evaluation of Design Value and Supply Chain Cost
Authors: Yuan-Jye Tseng, Jia-Shu Li
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To design a product with the given product requirement and design objective, there can be alternative ways to propose the detailed design specifications of the product. In the design modeling stage, alternative design cases with detailed specifications can be modeled to fulfill the product requirement and design objective. Therefore, in the design evaluation stage, it is required to perform an evaluation of the alternative design cases for deciding the final design. The purpose of this research is to develop a product evaluation model for evaluating the alternative design cases by integrated evaluating the criteria of functional design, Kansei design, and design for supply chain. The criteria in the functional design group include primary function, expansion function, improved function, and new function. The criteria in the Kansei group include geometric shape, dimension, surface finish, and layout. The criteria in the design for supply chain group include material, manufacturing process, assembly, and supply chain operation. From the point of view of value and cost, the criteria in the functional design group and Kansei design group represent the design value of the product. The criteria in the design for supply chain group represent the supply chain and manufacturing cost of the product. It is required to evaluate the design value and the supply chain cost to determine the final design. For the purpose of evaluating the criteria in the three criteria groups, a fuzzy analytic network process (FANP) method is presented to evaluate a weighted index by calculating the total relational values among the three groups. A method using the technique for order preference by similarity to ideal solution (TOPSIS) is used to compare and rank the design alternative cases according to the weighted index using the total relational values of the criteria. The final decision of a design case can be determined by using the ordered ranking. For example, the design case with the top ranking can be selected as the final design case. Based on the criteria in the evaluation, the design objective can be achieved with a combined and weighted effect of the design value and manufacturing cost. An example product is demonstrated and illustrated in the presentation. It shows that the design evaluation model is useful for integrated evaluation of functional design, Kansei design, and design for supply chain to determine the best design case and achieve the design objective.
Keywords: Design evaluation, functional design, Kansei design, supply chain, design value, manufacturing cost, fuzzy analytic network process, technique for order preference by similarity to ideal solution.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 794487 Trap Assisted Tunneling Model for Gate Current in Nano Scale MOSFET with High-K Gate Dielectrics
Authors: Ashwani K. Rana, Narottam Chand, Vinod Kapoor
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This paper presents a new compact analytical model of the gate leakage current in high-k based nano scale MOSFET by assuming a two-step inelastic trap-assisted tunneling (ITAT) process as the conduction mechanism. This model is based on an inelastic trap-assisted tunneling (ITAT) mechanism combined with a semiempirical gate leakage current formulation in the BSIM 4 model. The gate tunneling currents have been calculated as a function of gate voltage for different gate dielectrics structures such as HfO2, Al2O3 and Si3N4 with EOT (equivalent oxide thickness) of 1.0 nm. The proposed model is compared and contrasted with santaurus simulation results to verify the accuracy of the model and excellent agreement is found between the analytical and simulated data. It is observed that proposed analytical model is suitable for different highk gate dielectrics simply by adjusting two fitting parameters. It was also shown that gate leakages reduced with the introduction of high-k gate dielectric in place of SiO2.Keywords: Analytical model, High-k gate dielectrics, inelastic trap assisted tunneling, metal–oxide–semiconductor (MOS) devices.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 3308486 InAlGaN Quaternary Multi-Quantum Wells UVLaser Diode Performance and Characterization
Authors: S. M. Thahab, H. Abu Hassan, Z. Hassan
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The InAlGaN alloy has only recently began receiving serious attention into its growth and application. High quality InGaN films have led to the development of light emitting diodes (LEDs) and blue laser diodes (LDs). The quaternary InAlGaN however, represents a more versatile material since the bandgap and lattice constant can be independently varied. We report an ultraviolet (UV) quaternary InAlGaN multi-quantum wells (MQWs) LD study by using the simulation program of Integrated System Engineering (ISE TCAD). Advanced physical models of semiconductor properties were used in order to obtain an optimized structure. The device performance which is affected by piezoelectric and thermal effects was studied via drift-diffusion model for carrier transport, optical gain and loss. The optical performance of the UV LD with different numbers of quantum wells was numerically investigated. The main peak of the emission wavelength for double quantum wells (DQWs) was shifted from 358 to 355.8 nm when the forward current was increased. Preliminary simulated results indicated that better output performance and lower threshold current could be obtained when the quantum number is four, with output power of 130 mW and threshold current of 140 mA.Keywords: Nitride semiconductors, InAlGaN quaternary, UVLD, numerical simulation.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1939485 Topochemical Synthesis of Epitaxial Silicon Carbide on Silicon
Authors: Andrey V. Osipov, Sergey A. Kukushkin, Andrey V. Luk’yanov
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A method is developed for the solid-phase synthesis of epitaxial layers when the substrate itself is involved into a topochemical reaction and the reaction product grows in the interior of substrate layer. It opens up new possibilities for the relaxation of the elastic energy due to the attraction of point defects formed during the topochemical reaction in anisotropic media. The presented method of silicon carbide (SiC) formation employs a topochemical reaction between the single-crystalline silicon (Si) substrate and gaseous carbon monoxide (CO). The corresponding theory of interaction of point dilatation centers in anisotropic crystals is developed. It is eliminated that the most advantageous location of the point defects is the direction (111) in crystals with cubic symmetry. The single-crystal SiC films with the thickness up to 200 nm have been grown on Si (111) substrates owing to the topochemical reaction with CO. Grown high-quality single-crystal SiC films do not contain misfit dislocations despite the huge lattice mismatch value of ~20%. Also the possibility of growing of thick wide-gap semiconductor films on these templates SiC/Si(111) and, accordingly, its integration into Si electronics, is demonstrated. Finally, the ab initio theory of SiC formation due to the topochemical reaction has been developed.
Keywords: Epitaxy, silicon carbide, topochemical reaction, wide-bandgap semiconductors.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1083484 Electronic Nose Based On Metal Oxide Semiconductor Sensors as an Alternative Technique for the Spoilage Classification of Oat Milk
Authors: A. Deswal, N. S. Deora, H. N. Mishra
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The aim of the present study was to develop a rapid method for electronic nose for online quality control of oat milk. Analysis by electronic nose and bacteriological measurements were performed to analyze spoilage kinetics of oat milk samples stored at room temperature and refrigerated conditions for up to 15 days. Principal component analysis (PCA), Discriminant Factorial Analysis (DFA) and Soft Independent Modelling by Class Analogy (SIMCA) classification techniques were used to differentiate the samples of oat milk at different days. The total plate count (bacteriological method) was selected as the reference method to consistently train the electronic nose system. The e-nose was able to differentiate between the oat milk samples of varying microbial load. The results obtained by the bacteria total viable countsshowed that the shelf-life of oat milk stored at room temperature and refrigerated conditions were 20hrs and 13 days, respectively. The models built classified oat milk samples based on the total microbial population into “unspoiled” and “spoiled”.
Keywords: Electronic-nose, bacteriological, shelf-life, classification.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 3274483 Additive Friction Stir Manufacturing Process: Interest in Understanding Thermal Phenomena and Numerical Modeling of the Temperature Rise Phase
Authors: A. Lauvray, F. Poulhaon, P. Michaud, P. Joyot, E. Duc
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Additive Friction Stir Manufacturing, or AFSM, is a new industrial process that follows the emergence of friction-based processes. The AFSM process is a solid-state additive process using the energy produced by the friction at the interface between a rotating non-consumable tool and a substrate. Friction depends on various parameters like axial force, rotation speed or friction coefficient. The feeder material is a metallic rod that flows through a hole in the tool. There is still a lack in understanding of the physical phenomena taking place during the process. This research aims at a better AFSM process understanding and implementation, thanks to numerical simulation and experimental validation performed on a prototype effector. Such an approach is considered a promising way for studying the influence of the process parameters and to finally identify a process window that seems relevant. The deposition of material through the AFSM process takes place in several phases. In chronological order these phases are the docking phase, the dwell time phase, the deposition phase, and the removal phase. The present work focuses on the dwell time phase that enables the temperature rise of the system due to pure friction. An analytic modeling of heat generation based on friction considers as main parameters the rotational speed and the contact pressure. Another parameter considered influential is the friction coefficient assumed to be variable, due to the self-lubrication of the system with the rise in temperature or the materials in contact roughness smoothing over time. This study proposes through a numerical modeling followed by an experimental validation to question the influence of the various input parameters on the dwell time phase. Rotation speed, temperature, spindle torque and axial force are the main monitored parameters during experimentations and serve as reference data for the calibration of the numerical model. This research shows that the geometry of the tool as well as fluctuations of the input parameters like axial force and rotational speed are very influential on the temperature reached and/or the time required to reach the targeted temperature. The main outcome is the prediction of a process window which is a key result for a more efficient process implementation.
Keywords: numerical model, additive manufacturing, frictional heat generation, process
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 519482 Semi Classical Three-Valley Monte Carlo Simulation Analysis of Steady-State and Transient Electron Transport within Bulk Ga0.38In0.62P
Authors: N. Massoum, B. Bouazza, H. Tahir, C. Sayah, A. Guen Bouazza
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to simulate the phenomenon of electronic transport in semiconductors, we try to adapt a numerical method, often and most frequently it’s that of Monte Carlo. In our work, we applied this method in the case of a ternary alloy semiconductor GaInP in its cubic form; The Calculations are made using a non-parabolic effective-mass energy band model. We consider a band of conduction to three valleys (ΓLX), major of the scattering mechanisms are taken into account in this modeling, as the interactions with the acoustic phonons (elastic collisions) and optics (inelastic collisions). The polar optical phonons cause anisotropic collisions, intra-valleys, very probable in the III-V semiconductors. Other optical phonons, no polar, allow transitions inter-valleys. Initially, we present the full results obtained by the simulation of Monte Carlo in GaInP in stationary regime. We consider thereafter the effects related to the application of an electric field varying according to time, we thus study the transient phenomenon which make their appearance in ternary material
Keywords: Monte Carlo simulation, steady-state electron transport, transient electron transport, alloy scattering.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1770481 Interoperable CNC System for Turning Operations
Authors: Yusri Yusof, Stephen Newman, Aydin Nassehi, Keith Case
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The changing economic climate has made global manufacturing a growing reality over the last decade, forcing companies from east and west and all over the world to collaborate beyond geographic boundaries in the design, manufacture and assemble of products. The ISO10303 and ISO14649 Standards (STEP and STEP-NC) have been developed to introduce interoperability into manufacturing enterprises so as to meet the challenge of responding to production on demand. This paper describes and illustrates a STEP compliant CAD/CAPP/CAM System for the manufacture of rotational parts on CNC turning centers. The information models to support the proposed system together with the data models defined in the ISO14649 standard used to create the NC programs are also described. A structured view of a STEP compliant CAD/CAPP/CAM system framework supporting the next generation of intelligent CNC controllers for turn/mill component manufacture is provided. Finally a proposed computational environment for a STEP-NC compliant system for turning operations (SCSTO) is described. SCSTO is the experimental part of the research supported by the specification of information models and constructed using a structured methodology and object-oriented methods. SCSTO was developed to generate a Part 21 file based on machining features to support the interactive generation of process plans utilizing feature extraction. A case study component has been developed to prove the concept for using the milling and turning parts of ISO14649 to provide a turn-mill CAD/CAPP/CAM environment. Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1990480 Precise Measurement of Displacement using Pixels
Authors: Razif Mahadi, John Billingsley
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Manufacturing processes demand tight dimensional tolerances. The paper concerns a transducer for precise measurement of displacement, based on a camera containing a linescan chip. When tests were conducted using a track of black and white stripes with a 2mm pitch, errors in measuring on individual cycle amounted to 1.75%, suggesting that a precision of 35 microns is achievable.Keywords: Linescan, microcontroller, pixels.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1321479 Interplay of Power Management at Core and Server Level
Authors: Jörg Lenhardt, Wolfram Schiffmann, Jörg Keller
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While the feature sizes of recent Complementary Metal Oxid Semiconductor (CMOS) devices decrease the influence of static power prevails their energy consumption. Thus, power savings that benefit from Dynamic Frequency and Voltage Scaling (DVFS) are diminishing and temporal shutdown of cores or other microchip components become more worthwhile. A consequence of powering off unused parts of a chip is that the relative difference between idle and fully loaded power consumption is increased. That means, future chips and whole server systems gain more power saving potential through power-aware load balancing, whereas in former times this power saving approach had only limited effect, and thus, was not widely adopted. While powering off complete servers was used to save energy, it will be superfluous in many cases when cores can be powered down. An important advantage that comes with that is a largely reduced time to respond to increased computational demand. We include the above developments in a server power model and quantify the advantage. Our conclusion is that strategies from datacenters when to power off server systems might be used in the future on core level, while load balancing mechanisms previously used at core level might be used in the future at server level.Keywords: Power efficiency, static power consumption, dynamic power consumption, CMOS.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1694478 Effects of Double Delta Doping on Millimeter and Sub-millimeter Wave Response of Two-Dimensional Hot Electrons in GaAs Nanostructures
Authors: N. Basanta Singh, Sanjoy Deb, G. P Mishra, Subir Kumar Sarkar
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Carrier mobility has become the most important characteristic of high speed low dimensional devices. Due to development of very fast switching semiconductor devices, speed of computer and communication equipment has been increasing day by day and will continue to do so in future. As the response of any device depends on the carrier motion within the devices, extensive studies of carrier mobility in the devices has been established essential for the growth in the field of low dimensional devices. Small-signal ac transport of degenerate two-dimensional hot electrons in GaAs quantum wells is studied here incorporating deformation potential acoustic, polar optic and ionized impurity scattering in the framework of heated drifted Fermi-Dirac carrier distribution. Delta doping is considered in the calculations to investigate the effects of double delta doping on millimeter and submillimeter wave response of two dimensional hot electrons in GaAs nanostructures. The inclusion of delta doping is found to enhance considerably the two dimensional electron density which in turn improves the carrier mobility (both ac and dc) values in the GaAs quantum wells thereby providing scope of getting higher speed devices in future.Keywords: Carrier mobility, Delta doping, Hot carriers, Quantum wells.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1673477 Ghost Frequency Noise Reduction through Displacement Deviation Analysis
Authors: Paua Ketan, Bhagate Rajkumar, Adiga Ganesh, M. Kiran
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Low gear noise is an important sound quality feature in modern passenger cars. Annoying gear noise from the gearbox is influenced by the gear design, gearbox shaft layout, manufacturing deviations in the components, assembly errors and the mounting arrangement of the complete gearbox. Geometrical deviations in the form of profile and lead errors are often present on the flanks of the inspected gears. Ghost frequencies of a gear are very challenging to identify in standard gear measurement and analysis process due to small wavelengths involved. In this paper, gear whine noise occurring at non-integral multiples of gear mesh frequency of passenger car gearbox is investigated and the root cause is identified using the displacement deviation analysis (DDA) method. DDA method is applied to identify ghost frequency excitations on the flanks of gears arising out of generation grinding. Frequency identified through DDA correlated with the frequency of vibration and noise on the end-of-line machine as well as vehicle level measurements. With the application of DDA method along with standard lead profile measurement, gears with ghost frequency geometry deviations were identified on the production line to eliminate defective parts and thereby eliminate ghost frequency noise from a vehicle. Further, displacement deviation analysis can be used in conjunction with the manufacturing process simulation to arrive at suitable countermeasures for arresting the ghost frequency.
Keywords: Displacement deviation analysis, gear whine, ghost frequency, sound quality.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 805476 Feature Analysis of Predictive Maintenance Models
Authors: Zhaoan Wang
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Research in predictive maintenance modeling has improved in the recent years to predict failures and needed maintenance with high accuracy, saving cost and improving manufacturing efficiency. However, classic prediction models provide little valuable insight towards the most important features contributing to the failure. By analyzing and quantifying feature importance in predictive maintenance models, cost saving can be optimized based on business goals. First, multiple classifiers are evaluated with cross-validation to predict the multi-class of failures. Second, predictive performance with features provided by different feature selection algorithms are further analyzed. Third, features selected by different algorithms are ranked and combined based on their predictive power. Finally, linear explainer SHAP (SHapley Additive exPlanations) is applied to interpret classifier behavior and provide further insight towards the specific roles of features in both local predictions and global model behavior. The results of the experiments suggest that certain features play dominant roles in predictive models while others have significantly less impact on the overall performance. Moreover, for multi-class prediction of machine failures, the most important features vary with type of machine failures. The results may lead to improved productivity and cost saving by prioritizing sensor deployment, data collection, and data processing of more important features over less importance features.
Keywords: Automated supply chain, intelligent manufacturing, predictive maintenance machine learning, feature engineering, model interpretation.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 2005475 An Integrated Design Evaluation and Assembly Sequence Planning Model using a Particle Swarm Optimization Approach
Authors: Feng-Yi Huang, Yuan-Jye Tseng
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In the traditional concept of product life cycle management, the activities of design, manufacturing, and assembly are performed in a sequential way. The drawback is that the considerations in design may contradict the considerations in manufacturing and assembly. The different designs of components can lead to different assembly sequences. Therefore, in some cases, a good design may result in a high cost in the downstream assembly activities. In this research, an integrated design evaluation and assembly sequence planning model is presented. Given a product requirement, there may be several design alternative cases to design the components for the same product. If a different design case is selected, the assembly sequence for constructing the product can be different. In this paper, first, the designed components are represented by using graph based models. The graph based models are transformed to assembly precedence constraints and assembly costs. A particle swarm optimization (PSO) approach is presented by encoding a particle using a position matrix defined by the design cases and the assembly sequences. The PSO algorithm simultaneously performs design evaluation and assembly sequence planning with an objective of minimizing the total assembly costs. As a result, the design cases and the assembly sequences can both be optimized. The main contribution lies in the new concept of integrated design evaluation and assembly sequence planning model and the new PSO solution method. The test results show that the presented method is feasible and efficient for solving the integrated design evaluation and assembly planning problem. In this paper, an example product is tested and illustrated.
Keywords: assembly sequence planning, design evaluation, design for assembly, particle swarm optimization
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1828474 The Reliability of Wireless Sensor Network
Authors: B. Juhasova, I. Halenar, M. Juhas
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The wireless communication is one of the widely used methods of data transfer at the present days. The benefit of this communication method is the partial independence of the infrastructure and the possibility of mobility. In some special applications it is the only way how to connect. This paper presents some problems in the implementation of a sensor network connection for measuring environmental parameters in the area of manufacturing plants.
Keywords: Network, communication, reliability, sensors.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1536473 Efficient Supplies to Assembly Areas from Storage Stages
Authors: Matthias Schmidt, Steffen C. Eickemeyer, Prof. Peter Nyhuis
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Guaranteeing the availability of the required parts at the scheduled time represents a key logistical challenge. This is especially important when several parts are required together. This article describes a tool that supports the positioning in the area of conflict between low stock costs and a high service level for a consumer.Keywords: Systems Modeling, Manufacturing Systems, Simulation & Control, logistics and supply chain management
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1650472 Generative Design of Acoustical Diffuser and Absorber Elements Using Large-Scale Additive Manufacturing
Authors: S. Aziz, B. Alexander, C. Gengnagel, S. Weinzierl
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This paper explores a generative design, simulation, and optimization workflow for the integration of acoustical diffuser and/or absorber geometry with embedded coupled Helmholtz-resonators for full scale 3D printed building components. Large-scale additive manufacturing in conjunction with algorithmic CAD design tools enables a vast amount of control when creating geometry. This is advantageous regarding the increasing demands of comfort standards for indoor spaces and the use of more resourceful and sustainable construction methods and materials. The presented methodology highlights these new technological advancements and offers a multimodal and integrative design solution with the potential for an immediate application in the AEC-Industry. In principle, the methodology can be applied to a wide range of structural elements that can be manufactured by additive manufacturing processes. The current paper focuses on a case study of an application for a biaxial load-bearing beam grillage made of reinforced concrete, which allows for a variety of applications through the combination of additive prefabricated semi-finished parts and in-situ concrete supplementation. The semi-prefabricated parts or formwork bodies form the basic framework of the supporting structure and at the same time have acoustic absorption and diffusion properties that are precisely acoustically programmed for the space underneath the structure. To this end, a hybrid validation strategy is being explored using a digital and cross-platform simulation environment, verified with physical prototyping. The iterative workflow starts with the generation of a parametric design model for the acoustical geometry using the algorithmic visual scripting editor Grasshopper3D inside the Building Information Modeling (BIM) software Revit. Various geometric attributes (i.e., bottleneck and cavity dimensions) of the resonator are parameterized and fed to a numerical optimization algorithm which can modify the geometry with the goal of increasing absorption at resonance and increasing the bandwidth of the effective absorption range. Using Rhino.Inside and LiveLink for Revit the generative model was imported directly into the Multiphysics simulation environment COMSOL. The geometry was further modified and prepared for simulation in a semi-automated process. The incident and scattered pressure fields were simulated from which the surface normal absorption coefficients were calculated. This reciprocal process was repeated to further optimize the geometric parameters. Subsequently the numerical models were compared to a set of 3D concrete printed physical twin models which were tested in a .25 m x .25 m impedance tube. The empirical results served to improve the starting parameter settings of the initial numerical model. The geometry resulting from the numerical optimization was finally returned to grasshopper for further implementation in an interdisciplinary study.
Keywords: Acoustical design, additive manufacturing, computational design, multimodal optimization.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 605471 Distribution of Gamma Radiation Levels in Core Sediment Samples in Gulf of Izmir: Eastern Aegean Sea, Turkey
Authors: D. Kurt, Z. U. Yümün, I. F. Barut, E. Kam
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Since the development of the industrial revolution, industrial plants and settlements have spread widely along coastlines. This concentration of development brings environmental pollution to the seas. This study focuses on the Gulf of Izmir, a natural gulf of the Eastern Aegean Sea, located west of Turkey. Investigating marine current sediment is extremely important to detect pollution. This study considered natural radioactivity pollution of the marine environment. Ground drilling cores (the depth of each sediment is different) were taken from four different locations in the Gulf of izmir, Karşıyaka (12.5-13.5 m), Inciralti (6.5-7.5 m), Cesmealti (4.5-5 m) and Bayrakli (10-12 m). These sediment cores were put in preserving bags with weight around 1 kg, and were dried at room temperature to remove moisture. The samples were then sieved into fine powder (100 mesh), and these samples were relocated to 1000 mL polyethylene Marinelli beakers. The prepared sediments were stored for 40 days to reach radioactive equilibrium between uranium and thorium. Gamma spectrometry measurement of each sample was made using an HPGe (High-Purity Germanium) semiconductor detector. In this study, the results display that the average concentrations of the activity values are 8.4 ± 0.23 Bq kg-1, 19.6 ± 0.51 Bq kg-1, 8 ± 0.96 Bq kg-1, 1.93 ± 0.3 Bq kg-1, and 77.4 ± 0.96 Bq kg-1, respectively.
Keywords: Gamma, Gulf of Izmir, Eastern Aegean Sea, Turkey, natural radionuclides, pollution.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 1243470 Prediction of Optimum Cutting Parameters to obtain Desired Surface in Finish Pass end Milling of Aluminium Alloy with Carbide Tool using Artificial Neural Network
Authors: Anjan Kumar Kakati, M. Chandrasekaran, Amitava Mandal, Amit Kumar Singh
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End milling process is one of the common metal cutting operations used for machining parts in manufacturing industry. It is usually performed at the final stage in manufacturing a product and surface roughness of the produced job plays an important role. In general, the surface roughness affects wear resistance, ductility, tensile, fatigue strength, etc., for machined parts and cannot be neglected in design. In the present work an experimental investigation of end milling of aluminium alloy with carbide tool is carried out and the effect of different cutting parameters on the response are studied with three-dimensional surface plots. An artificial neural network (ANN) is used to establish the relationship between the surface roughness and the input cutting parameters (i.e., spindle speed, feed, and depth of cut). The Matlab ANN toolbox works on feed forward back propagation algorithm is used for modeling purpose. 3-12-1 network structure having minimum average prediction error found as best network architecture for predicting surface roughness value. The network predicts surface roughness for unseen data and found that the result/prediction is better. For desired surface finish of the component to be produced there are many different combination of cutting parameters are available. The optimum cutting parameter for obtaining desired surface finish, to maximize tool life is predicted. The methodology is demonstrated, number of problems are solved and algorithm is coded in Matlab®.Keywords: End milling, Surface roughness, Neural networks.
Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 2164