Search results for: evaluation and selectionof ERP packages
Commenced in January 2007
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Edition: International
Paper Count: 2301

Search results for: evaluation and selectionof ERP packages

2301 Towards a Systematic, Cost-Effective Approach for ERP Selection

Authors: Hassan Haghighi, Omid Mafi

Abstract:

Existing experiences indicate that one of the most prominent reasons that some ERP implementations fail is related to selecting an improper ERP package. Among those important factors resulting in inappropriate ERP selections, one is to ignore preliminary activities that should be done before the evaluation of ERP packages. Another factor yielding these unsuitable selections is that usually organizations employ prolonged and costly selection processes in such extent that sometimes the process would never be finalized or sometimes the evaluation team might perform many key final activities in an incomplete or inaccurate way due to exhaustion, lack of interest or out-of-date data. In this paper, a systematic approach that recommends some activities to be done before and after the main selection phase is introduced for choosing an ERP package. On the other hand, the proposed approach has utilized some ideas that accelerates the selection process at the same time that reduces the probability of an erroneous final selection.

Keywords: enterprise resource planning, evaluation and selectionof ERP packages, organizational readiness for employing ERP, evaluationlists.

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2300 Real-Time Physics Simulation Packages: An Evaluation Study

Authors: J.Zouhair, D.Ellison

Abstract:

This paper includes a review of three physics simulation packages that can be used to provide researchers with a virtual ground for modeling, implementing and simulating complex models, as well as testing their control methods with less cost and time of development. The inverted pendulum model was used as a test bed for comparing ODE, DANCE and Webots, while Linear State Feedback was used to control its behavior. The packages were compared with respect to model creation, solving systems of differential equation, data storage, setting system variables, control the experiment and ease of use. The purpose of this paper is to give an overview about our experience with these environments and to demonstrate some of the benefits and drawbacks involved in practice for each package.

Keywords: DANCE, Inverted Pendulum, ODE, Simulation Packages, Webots.

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2299 2D and 3D Finite Element Method Packages of CEMTool for Engineering PDE Problems

Authors: Choon Ki Ahn, Jung Hun Park, Wook Hyun Kwon

Abstract:

CEMTool is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 2D & 3D finite element method (FEM) packages for CEMTool. We discuss the detailed structures and the important features of pre-processor, solver, and post-processor of CEMTool 2D & 3D FEM packages. In contrast to the existing MATLAB PDE Toolbox, our proposed FEM packages can deal with the combination of the reserved words. Also, we can control the mesh in a very effective way. With the introduction of new mesh generation algorithm and fast solving technique, our FEM packages can guarantee the shorter computational time than MATLAB PDE Toolbox. Consequently, with our new FEM packages, we can overcome some disadvantages or limitations of the existing MATLAB PDE Toolbox.

Keywords: CEMTool, Finite element method (FEM), Numericalanalysis, Partial differential equation (PDE)

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2298 The Effect of Nano-Silver Packaging on Quality Maintenance of Fresh Strawberry

Authors: Naser Valipour Motlagh, Majid Aliabadi, Elnaz Rahmani, Samira Ghorbanpour

Abstract:

Strawberry is one of the most favored fruits all along the world. But due to its vulnerability to microbial contamination and short life storage, there are lots of problems in industrial production and transportation of this fruit. Therefore, lots of ideas have tried to increase the storage life of strawberries especially through proper packaging. This paper works on efficient packaging as well. The primary material used is produced through simple mixing of low-density polyethylene (LDPE) and silver nanoparticles in different weight fractions of 0.5 and 1% in presence of dicumyl peroxide as a cross-linking agent. Final packages were made in a twin-screw extruder. Then, their effect on the quality maintenance of strawberry is evaluated. The SEM images of nano-silver packages show the distribution of silver nanoparticles in the packages. Total bacteria count, mold, yeast and E. coli are measured for microbial evaluation of all samples. Texture, color, appearance, odor, taste and total acceptance of various samples are evaluated by trained panelists and based on 9-point hedonic scale method. The results show a decrease in total bacteria count and mold in nano-silver packages compared to the samples packed in polyethylene packages for the same storage time. The optimum concentration of silver nanoparticles for the lowest bacteria count and mold is predicted to be around 0.5% which has attained the most acceptance from the panelist as well. Moreover, organoleptic properties of strawberry are preserved for a longer period in nano-silver packages. It can be concluded that using nano-silver particles in strawberry packages has improved the storage life and quality maintenance of the fruit.

Keywords: Antimicrobial properties, polyethylene, silver nanoparticles, strawberry.

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2297 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow

Authors: Arijit Roy

Abstract:

Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.

Keywords: Instrumentation, Popcorn, Real-time, Solder Reflow, Strain Gauge.

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2296 Template Design Packages for Repetitive Construction Projects

Authors: Ali Youniss Aidbaiss, G. Unnikrishnan, Anoob Hakim

Abstract:

Scope changes, scope creeps, cost and time overruns have become common in projects in the oil and gas sector. Even in repetitive projects, failure to implement lessons learnt and correct past mistakes have resulted in various setbacks. This paper describes the concept of reusing successfully implemented design packages as templates for repetitive projects, and thereby lowering the instances of project failures. Units or systems successfully installed in projects can be identified and taken up for preparing template design packages. Standardization of units and systems helps to develop templates from successful designs which can be repeatedly used with confidence. These packages can be used with minimum modifications for developing FEED packages faster, saving cost and other valuable resources. Lessons learnt from the completed project incorporated in the templates avoid repeating past mistakes during detailed design, procurement and execution. With template packages, consistent quality can be maintained for similar projects, avoiding scope creep and scope changes which will ultimately result in cost and time savings.

Keywords: Engineering work package, repetitive construction, template design package, time saving in projects.

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2295 The Grinding Influence on the Strength of Fan-Out Wafer-Level Packages

Authors: Z. W. Zhong, C. Xu, W. K. Choi

Abstract:

To build a thin fan-out wafer-level package, the package had to be ground to a thin level. In this work, the influence of the grinding processes on the strength of the fan-out wafer-level packages was investigated. After different grinding processes, all specimens were placed on a three-point-bending fixture installed on a universal tester for three-point-bending testing, and the strength of the fan-out wafer-level packages was measured. The experiments revealed that the average flexure strength increased with the decreasing surface roughness height of the fan-out wafer-level package tested. The grinding processes had a significant influence on the strength of the fan-out wafer-level packages investigated.

Keywords: FOWLP strength, surface roughness, three-point bending, grinding.

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2294 A Large Dataset Imputation Approach Applied to Country Conflict Prediction Data

Authors: Benjamin D. Leiby, Darryl K. Ahner

Abstract:

This study demonstrates an alternative stochastic imputation approach for large datasets when preferred commercial packages struggle to iterate due to numerical problems. A large country conflict dataset motivates the search to impute missing values well over a common threshold of 20% missingness. The methodology capitalizes on correlation while using model residuals to provide the uncertainty in estimating unknown values. Examination of the methodology provides insight toward choosing linear or nonlinear modeling terms. Static tolerances common in most packages are replaced with tailorable tolerances that exploit residuals to fit each data element. The methodology evaluation includes observing computation time, model fit, and the comparison of known  values to replaced values created through imputation. Overall, the country conflict dataset illustrates promise with modeling first-order interactions, while presenting a need for further refinement that mimics predictive mean matching.

Keywords: Correlation, country conflict, imputation, stochastic regression.

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2293 Simulated Annealing Algorithm for Data Aggregation Trees in Wireless Sensor Networks and Comparison with Genetic Algorithm

Authors: Ladan Darougaran, Hossein Shahinzadeh, Hajar Ghotb, Leila Ramezanpour

Abstract:

In ad hoc networks, the main issue about designing of protocols is quality of service, so that in wireless sensor networks the main constraint in designing protocols is limited energy of sensors. In fact, protocols which minimize the power consumption in sensors are more considered in wireless sensor networks. One approach of reducing energy consumption in wireless sensor networks is to reduce the number of packages that are transmitted in network. The technique of collecting data that combines related data and prevent transmission of additional packages in network can be effective in the reducing of transmitted packages- number. According to this fact that information processing consumes less power than information transmitting, Data Aggregation has great importance and because of this fact this technique is used in many protocols [5]. One of the Data Aggregation techniques is to use Data Aggregation tree. But finding one optimum Data Aggregation tree to collect data in networks with one sink is a NP-hard problem. In the Data Aggregation technique, related information packages are combined in intermediate nodes and form one package. So the number of packages which are transmitted in network reduces and therefore, less energy will be consumed that at last results in improvement of longevity of network. Heuristic methods are used in order to solve the NP-hard problem that one of these optimization methods is to solve Simulated Annealing problems. In this article, we will propose new method in order to build data collection tree in wireless sensor networks by using Simulated Annealing algorithm and we will evaluate its efficiency whit Genetic Algorithm.

Keywords: Data aggregation, wireless sensor networks, energy efficiency, simulated annealing algorithm, genetic algorithm.

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2292 Economical Analysis of Thermal Energy Storage by Partially Operation

Authors: Z. Noranai, M.Z. Md Yusof

Abstract:

Building Sector is the major electricity consumer and it is costly to building owners. Therefore the application of thermal energy storage (TES) has gained attractive to reduce energy cost. Many attractive tariff packages are being offered by the electricity provider to promote TES. The tariff packages offered higher cost of electricity during peak period and lower cost of electricity during off peak period. This paper presented the return of initial investment by implementing a centralized air-conditioning plant integrated with thermal energy storage with partially operation strategies. Building load profile will be calculated hourly according to building specification and building usage trend. TES operation conditions will be designed according to building load demand profile, storage capacity, tariff packages and peak/off peak period. The Payback Period analysis method was used to evaluate economic analysis. The investment is considered a good investment where by the initial cost is recovered less than ten than seven years.

Keywords: building load profile, energy consumption, payback period, thermal energy storage

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2291 A Case Study: Experiences with Building an Online Exhibition System using Web Services

Authors: Atakan Kurt, Arzu Naiboğlu

Abstract:

We present an implementation of an Online Exhibition System (OES) web service(s) that reflects our experiences with using web service development packages and software process models. The system provides major functionality that exists in similar packages. While developing such a complex web service, we gained insightful experience (i) in the traditional software development processes: waterfall model and evolutionary development and their fitness to web services development, (ii) in the fitness and effectiveness of a major web services development kit.

Keywords: Web Services, Online Exhibition System, Software Engineering, Waterfall Model, e-business.

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2290 Evaluating and Selecting Optimization Software Packages: A Framework for Business Applications

Authors: Waleed Abohamad, Amr Arisha

Abstract:

Owing the fact that optimization of business process is a crucial requirement to navigate, survive and even thrive in today-s volatile business environment, this paper presents a framework for selecting a best-fit optimization package for solving complex business problems. Complexity level of the problem and/or using incorrect optimization software can lead to biased solutions of the optimization problem. Accordingly, the proposed framework identifies a number of relevant factors (e.g. decision variables, objective functions, and modeling approach) to be considered during the evaluation and selection process. Application domain, problem specifications, and available accredited optimization approaches are also to be regarded. A recommendation of one or two optimization software is the output of the framework which is believed to provide the best results of the underlying problem. In addition to a set of guidelines and recommendations on how managers can conduct an effective optimization exercise is discussed.

Keywords: Complex Business Problems, Optimization, Selection Criteria, Software Evaluation.

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2289 The Study on Evaluation System and Method of Legacy System

Authors: Chao Qi, Fuyang Peng, Bo Deng, Xiaoyan Su

Abstract:

In the upgrade process of enterprise information systems, how to deal with and utilize those legacy systems affects the efficiency of construction and development of the new system. We propose an evaluation system, which comprehensively describes the capacity of legacy information systems in five aspects. Then we propose a practical legacy systems evaluation method. Base on the evaluation result, we can determine the current state of legacy system which was evaluated.

Keywords: Legacy Information Systems, Evaluation IndexSystem, Evaluation Method, Evaluation Level

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2288 Investigation of Overstrength of Dual System by Non-Linear Static and Dynamic Analyses

Authors: Nina Øystad-Larsen, Miran Cemalovic, Amir M. Kaynia

Abstract:

The nonlinear static and dynamic analysis procedures presented in EN 1998-1 for the structural response of a RC wall-frame building are assessed. The structure is designed according to the guidelines for high ductility (DCH) in 1998-1. The finite element packages SeismoStruct and OpenSees are utilized and evaluated. The structural response remains nearly in the elastic range even though the building was designed for high ductility. The overstrength is a result of oversized and heavily reinforced members, with emphasis on the lower storey walls. Nonlinear response history analysis in the software packages give virtually identical results for displacements.

Keywords: Behaviour factor, Dual system, OpenSEES, Overstrength, SeismoStruct.

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2287 Current Issues on Enterprise Architecture Implementation Evaluation

Authors: Fatemeh Nikpay, Rodina Binti Ahmad, Babak Darvish Rouhani

Abstract:

Enterprise Architecture (EA) is employed by enterprises for providing integrated Information Systems (ISs) in order to support alignment of their business and Information Technology (IT). Evaluation of EA implementation can support enterprise to reach intended goals. There are some problems in current evaluation methods of EA implementation that lead to ineffectiveness implementation of EA. This paper represents current issues on evaluation of EA implementation. In this regard, we set the framework in order to represent evaluation’s issues based on their functionality and structure. The results of this research not only increase the knowledge of evaluation, but also could be useful for both academics and practitioners in order to realize the current situation of evaluations.

Keywords: Current issues on EA, implementation evaluation, Evaluation, Enterprise Architecture, Evaluation of Enterprise Architecture Implementation.

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2286 Static Analysis of Security Issues of the Python Packages Ecosystem

Authors: Adam Gorine, Faten Spondon

Abstract:

Python is considered the most popular programming language and offers its own ecosystem for archiving and maintaining open-source software packages. This system is called the Python Package Index (PyPI), the repository of this programming language. Unfortunately, one-third of these software packages have vulnerabilities that allow attackers to execute code automatically when a vulnerable or malicious package is installed. This paper contributes to large-scale empirical studies investigating security issues in the Python ecosystem by evaluating package vulnerabilities. These provide a series of implications that can help the security of software ecosystems by improving the process of discovering, fixing, and managing package vulnerabilities. The vulnerable dataset is generated using the NVD, the National Vulnerability Database, and the Snyk vulnerability dataset. In addition, we evaluated 807 vulnerability reports in the NVD and 3900 publicly known security vulnerabilities in Python Package Manager (Pip) from the Snyk database from 2002 to 2022. As a result, many Python vulnerabilities appear in high severity, followed by medium severity. The most problematic areas have been improper input validation and denial of service attacks. A hybrid scanning tool that combines the three scanners, Bandit, Snyk and Dlint, which provide a clear report of the code vulnerability, is also described.

Keywords: Python vulnerabilities, Bandit, Snyk, Dlint, Python Package Index, ecosystem, static analysis, malicious attacks.

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2285 Thermal Evaluation of Printed Circuit Board Design Options and Voids in Solder Interface by a Simulation Tool

Authors: B. Arzhanov, A. Correia, P. Delgado, J. Meireles

Abstract:

Quad Flat No-Lead (QFN) packages have become very popular for turners, converters and audio amplifiers, among others applications, needing efficient power dissipation in small footprints. Since semiconductor junction temperature (TJ) is a critical parameter in the product quality. And to ensure that die temperature does not exceed the maximum allowable TJ, a thermal analysis conducted in an earlier development phase is essential to avoid repeated re-designs process with huge losses in cost and time. A simulation tool capable to estimate die temperature of components with QFN package was developed. Allow establish a non-empirical way to define an acceptance criterion for amount of voids in solder interface between its exposed pad and Printed Circuit Board (PCB) to be applied during industrialization process, and evaluate the impact of PCB designs parameters. Targeting PCB layout designer as an end user for the application, a user-friendly interface (GUI) was implemented allowing user to introduce design parameters in a convenient and secure way and hiding all the complexity of finite element simulation process. This cost effective tool turns transparent a simulating process and provides useful outputs after acceptable time, which can be adopted by PCB designers, preventing potential risks during the design stage and make product economically efficient by not oversizing it. This article gathers relevant information related to the design and implementation of the developed tool, presenting a parametric study conducted with it. The simulation tool was experimentally validated using a Thermal-Test-Chip (TTC) in a QFN open-cavity, in order to measure junction temperature (TJ) directly on the die under controlled and knowing conditions. Providing a short overview about standard thermal solutions and impacts in exposed pad packages (i.e. QFN), accurately describe the methods and techniques that the system designer should use to achieve optimum thermal performance, and demonstrate the effect of system-level constraints on the thermal performance of the design.

Keywords: Quad Flat No-Lead packages, exposed pads, junction temperature, thermal management and measurements.

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2284 Application of Java-based Pointcuts in Aspect Oriented Programming (AOP) for Data Race Detection

Authors: Sadaf Khalid, Fahim Arif

Abstract:

Wide applicability of concurrent programming practices in developing various software applications leads to different concurrency errors amongst which data race is the most important. Java provides greatest support for concurrent programming by introducing various concurrency packages. Aspect oriented programming (AOP) is modern programming paradigm facilitating the runtime interception of events of interest and can be effectively used to handle the concurrency problems. AspectJ being an aspect oriented extension to java facilitates the application of concepts of AOP for data race detection. Volatile variables are usually considered thread safe, but they can become the possible candidates of data races if non-atomic operations are performed concurrently upon them. Various data race detection algorithms have been proposed in the past but this issue of volatility and atomicity is still unaddressed. The aim of this research is to propose some suggestions for incorporating certain conditions for data race detection in java programs at the volatile fields by taking into account support for atomicity in java concurrency packages and making use of pointcuts. Two simple test programs will demonstrate the results of research. The results are verified on two different Java Development Kits (JDKs) for the purpose of comparison.

Keywords: Aspect Bench Compiler (abc), Aspect OrientedProgramming (AOP), AspectJ, Aspects, Concurrency packages, Concurrent programming, Cross-cutting Concerns, Data race, Eclipse, Java, Java Development Kits (JDKs), Pointcuts

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2283 WiFi Data Offloading: Bundling Method in a Canvas Business Model

Authors: Majid Mokhtarnia, Alireza Amini

Abstract:

Mobile operators deal with increasing in the data traffic as a critical issue. As a result, a vital responsibility of the operators is to deal with such a trend in order to create added values. This paper addresses a bundling method in a Canvas business model in a WiFi Data Offloading (WDO) strategy by which some elements of the model may be affected. In the proposed method, it is supposed to sell a number of data packages for subscribers in which there are some packages with a free given volume of data-offloaded WiFi complimentary. The paper on hands analyses this method in the views of attractiveness and profitability. The results demonstrate that the quality of implementation of the WDO strongly affects the final result and helps the decision maker to make the best one.

Keywords: Bundling, canvas business model, telecommunication, WiFi Data Offloading.

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2282 FPGA Implementation of Adaptive Clock Recovery for TDMoIP Systems

Authors: Semih Demir, Anil Celebi

Abstract:

Circuit switched networks widely used until the end of the 20th century have been transformed into packages switched networks. Time Division Multiplexing over Internet Protocol (TDMoIP) is a system that enables Time Division Multiplexing (TDM) traffic to be carried over packet switched networks (PSN). In TDMoIP systems, devices that send TDM data to the PSN and receive it from the network must operate with the same clock frequency. In this study, it was aimed to implement clock synchronization process in Field Programmable Gate Array (FPGA) chips using time information attached to the packages received from PSN. The designed hardware is verified using the datasets obtained for the different carrier types and comparing the results with the software model. Field tests are also performed by using the real time TDMoIP system.

Keywords: Clock recovery on TDMoIP, FPGA, MATLAB reference model, clock synchronization.

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2281 Monitorization of Junction Temperature Using a Thermal-Test-Device

Authors: B. Arzhanov, A. Correia, P. Delgado, J. Meireles

Abstract:

Due to the higher power loss levels in electronic components, the thermal design of PCBs (Printed Circuit Boards) of an assembled device becomes one of the most important quality factors in electronics. Nonetheless, some of leading causes of the microelectronic component failures are due to higher temperatures, the leakages or thermal-mechanical stress, which is a concern, is the reliability of microelectronic packages. This article presents an experimental approach to measure the junction temperature of exposed pad packages. The implemented solution is in a prototype phase, using a temperature-sensitive parameter (TSP) to measure temperature directly on the die, validating the numeric results provided by the Mechanical APDL (Ansys Parametric Design Language) under same conditions. The physical device-under-test is composed by a Thermal Test Chip (TTC-1002) and assembly in a QFN cavity, soldered to a test-board according to JEDEC Standards. Monitoring the voltage drop across a forward-biased diode, is an indirectly method but accurate to obtain the junction temperature of QFN component with an applied power range between 0,3W to 1.5W. The temperature distributions on the PCB test-board and QFN cavity surface were monitored by an infra-red thermal camera (Goby-384) controlled and images processed by the Xeneth software. The article provides a set-up to monitorize in real-time the junction temperature of ICs, namely devices with the exposed pad package (i.e. QFN). Presenting the PCB layout parameters that the designer should use to improve thermal performance, and evaluate the impact of voids in solder interface in the device junction temperature.

Keywords: Quad Flat No-Lead packages, exposed pads, junction temperature, thermal management, measurements.

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2280 Optimization of the Transfer Molding Process by Implementation of Online Monitoring Techniques for Electronic Packages

Authors: Burcu Kaya, Jan-Martin Kaiser, Karl-Friedrich Becker, Tanja Braun, Klaus-Dieter Lang

Abstract:

Quality of the molded packages is strongly influenced by the process parameters of the transfer molding. To achieve a better package quality and a stable transfer molding process, it is necessary to understand the influence of the process parameters on the package quality. This work aims to comprehend the relationship between the process parameters, and to identify the optimum process parameters for the transfer molding process in order to achieve less voids and wire sweep. To achieve this, a DoE is executed for process optimization and a regression analysis is carried out. A systematic approach is represented to generate models which enable an estimation of the number of voids and wire sweep. Validation experiments are conducted to verify the model and the results are presented.

Keywords: Epoxy molding compounds, optimization, regression analysis, transfer molding process, voids, wire sweep.

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2279 The Influence of Organisational Culture on the Implementation of Enterprise Resource Planning

Authors: Redha M. Elhuni

Abstract:

The critical key success factors, which have to be targeted with appropriate change management, are the user acceptance and support of a new Enterprise Resource Planning (ERP) system at the early implementation stages. This becomes even more important in Arab context where national and organisational culture with a different value and belief system, resulting in different management styles, might not complement with Western business culture embedded in the predefined standard business processes of existing ERP packages. This study explains and critically evaluates research into national and organizational culture and the influence of different national cultures on the implementation and reengineering process of ERP packages in an Arab context. Using a case study, realized through a quantitative survey testing five of Martinsons’s and Davison’s propositions in a Libyan sample company, confirmed the expected results from the literature review that culture has an impact on the implementation process and that employee empowerment is an unavoidable consequence of an ERP implementation.

Keywords: Enterprise resource planning, ERP systems, organisational culture, Arab context.

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2278 Considering Aerosol Processes in Nuclear Transport Package Containment Safety Cases

Authors: Andrew Cummings, Rhianne Boag, Sarah Bryson, Gordon Turner

Abstract:

Packages designed for transport of radioactive material must satisfy rigorous safety regulations specified by the International Atomic Energy Agency (IAEA). Higher Activity Waste (HAW) transport packages have to maintain containment of their contents during normal and accident conditions of transport (NCT and ACT). To ensure containment criteria is satisfied these packages are required to be leak-tight in all transport conditions to meet allowable activity release rates. Package design safety reports are the safety cases that provide the claims, evidence and arguments to demonstrate that packages meet the regulations and once approved by the competent authority (in the UK this is the Office for Nuclear Regulation) a licence to transport radioactive material is issued for the package(s). The standard approach to demonstrating containment in the RWM transport safety case is set out in BS EN ISO 12807. In this document a method for measuring a leak rate from the package is explained by way of a small interspace test volume situated between two O-ring seals on the underside of the package lid. The interspace volume is pressurised and a pressure drop measured. A small interspace test volume makes the method more sensitive enabling the measurement of smaller leak rates. By ascertaining the activity of the contents, identifying a releasable fraction of material and by treating that fraction of material as a gas, allowable leak rates for NCT and ACT are calculated. The adherence to basic safety principles in ISO12807 is very pessimistic and current practice in the demonstration of transport safety, which is accepted by the UK regulator. It is UK government policy that management of HAW will be through geological disposal. It is proposed that the intermediate level waste be transported to the geological disposal facility (GDF) in large cuboid packages. This poses a challenge for containment demonstration because such packages will have long seals and therefore large interspace test volumes. There is also uncertainty on the releasable fraction of material within the package ullage space. This is because the waste may be in many different forms which makes it difficult to define the fraction of material released by the waste package. Additionally because of the large interspace test volume, measuring the calculated leak rates may not be achievable. For this reason a justification for a lower releasable fraction of material is sought. This paper considers the use of aerosol processes to reduce the releasable fraction for both NCT and ACT. It reviews the basic coagulation and removal processes and applies the dynamic aerosol balance equation. The proposed solution includes only the most well understood physical processes namely; Brownian coagulation and gravitational settling. Other processes have been eliminated either on the basis that they would serve to reduce the release to the environment further (pessimistically in keeping with the essence of nuclear transport safety cases) or that they are not credible in the conditions of transport considered.

Keywords: Aerosol processes, Brownian coagulation, gravitational settling, transport regulations.

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2277 High-Accuracy Satellite Image Analysis and Rapid DSM Extraction for Urban Environment Evaluations (Tripoli-Libya)

Authors: Abdunaser Abduelmula, Maria Luisa M. Bastos, José A. Gonçalves

Abstract:

Modelling of the earth's surface and evaluation of urban environment, with 3D models, is an important research topic. New stereo capabilities of high resolution optical satellites images, such as the tri-stereo mode of Pleiades, combined with new image matching algorithms, are now available and can be applied in urban area analysis. In addition, photogrammetry software packages gained new, more efficient matching algorithms, such as SGM, as well as improved filters to deal with shadow areas, can achieve more dense and more precise results. This paper describes a comparison between 3D data extracted from tri-stereo and dual stereo satellite images, combined with pixel based matching and Wallis filter. The aim was to improve the accuracy of 3D models especially in urban areas, in order to assess if satellite images are appropriate for a rapid evaluation of urban environments. The results showed that 3D models achieved by Pleiades tri-stereo outperformed, both in terms of accuracy and detail, the result obtained from a Geo-eye pair. The assessment was made with reference digital surface models derived from high resolution aerial photography. This could mean that tri-stereo images can be successfully used for the proposed urban change analyses.

Keywords: 3D Models, Environment, Matching, Pleiades.

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2276 Terrain Evaluation Method for Hexapod Robot

Authors: Tomas Luneckas, Dainius Udris

Abstract:

In this paper a simple terrain evaluation method for hexapod robot is introduced. This method is based on feet coordinate evaluation when all are on the ground. Depending on the feet coordinate differences the local terrain evaluation is possible. Terrain evaluation is necessary for right gait selection and/or body position correction. For terrain roughness evaluation three planes are plotted: two of them as definition points use opposite feet coordinates, third coincides with the robot body plane. The leaning angle of body plane is evaluated measuring gravity force using three-axis accelerometer. Terrain roughness evaluation method is based on angle estimation between normal vectors of these planes. Aim of this work is to present a simple method for embedded robot controller, allowing to find the best further movement settings.

Keywords: Hexapod robot, pose estimation, terrain evaluation, terrain roughness.

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2275 Techniques for Reliability Evaluation in Distribution System Planning

Authors: T. Lantharthong, N. Phanthuna

Abstract:

This paper presents reliability evaluation techniques which are applied in distribution system planning studies and operation. Reliability of distribution systems is an important issue in power engineering for both utilities and customers. Reliability is a key issue in the design and operation of electric power distribution systems and load. Reliability evaluation of distribution systems has been the subject of many recent papers and the modeling and evaluation techniques have improved considerably.

Keywords: Reliability Evaluation, Optimization Technique, Reliability Indices

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2274 An Online Mastery Learning Method Based On a Dynamic Formative Evaluation

Authors: Jeongim Kang, Moon Hee Kim, Seong Baeg Kim

Abstract:

This paper proposes a novel e-learning model that is  based on a dynamic formative evaluation. On evaluating the existing  format of e-learning, conditions regarding repetitive learning to  achieve mastery, causes issues for learners to lose tension and become  neglectful of learning. The dynamic formative evaluation proposed is  able to supplement limitation of the existing approaches. Since a  repetitive learning method does not provide a perfect feedback, this  paper puts an emphasis on the dynamic formative evaluation that is  able to maximize learning achievement. Through the dynamic  formative evaluation, the instructor is able to refer to the evaluation  result when making an estimation about the learner. To show the flow  chart of learning, based on the dynamic formative evaluation, the  model proves its effectiveness and validity.

 

Keywords: Online learning, dynamic formative evaluation, mastery learning, repetitive learning method, learning achievement.

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2273 Towards a Systematic Evaluation of Web Design

Authors: Ivayla Trifonova, Naoum Jamous, Holger Schrödl

Abstract:

A good web design is a prerequisite for a successful business nowadays, especially since the internet is the most common way for people to inform themselves. Web design includes the optical composition, the structure, and the user guidance of websites. The importance of each website leads to the question if there is a way to measure its usefulness. The aim of this paper is to suggest a methodology for the evaluation of web design. The desired outcome is to have an evaluation that is concentrated on a specific website and its target group.

Keywords: Evaluation methodology, factor analysis, target group, web design.

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2272 A Virtual Learning Environment for Deaf Children: Design and Evaluation

Authors: Nicoletta Adamo-Villani

Abstract:

The object of this research is the design and evaluation of an immersive Virtual Learning Environment (VLE) for deaf children. Recently we have developed a prototype immersive VR game to teach sign language mathematics to deaf students age K- 4 [1] [2]. In this paper we describe a significant extension of the prototype application. The extension includes: (1) user-centered design and implementation of two additional interactive environments (a clock store and a bakery), and (2) user-centered evaluation including development of user tasks, expert panel-based evaluation, and formative evaluation. This paper is one of the few to focus on the importance of user-centered, iterative design in VR application development, and to describe a structured evaluation method.

Keywords: 3D Animation, Virtual Reality, Virtual Learning Environments, User-Centered Design, User-centered Evaluation.

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