Search results for: Simulation Packages

Authors: J.Zouhair, D.Ellison

Abstract:

This paper includes a review of three physics simulation packages that can be used to provide researchers with a virtual ground for modeling, implementing and simulating complex models, as well as testing their control methods with less cost and time of development. The inverted pendulum model was used as a test bed for comparing ODE, DANCE and Webots, while Linear State Feedback was used to control its behavior. The packages were compared with respect to model creation, solving systems of differential equation, data storage, setting system variables, control the experiment and ease of use. The purpose of this paper is to give an overview about our experience with these environments and to demonstrate some of the benefits and drawbacks involved in practice for each package.

Keywords: DANCE, Inverted Pendulum, ODE, Simulation Packages, Webots.

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Authors: Arijit Roy

Abstract:

Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.

Keywords: Instrumentation, Popcorn, Real-time, Solder Reflow, Strain Gauge.

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Authors: Choon Ki Ahn, Jung Hun Park, Wook Hyun Kwon

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CEMTool is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 2D & 3D finite element method (FEM) packages for CEMTool. We discuss the detailed structures and the important features of pre-processor, solver, and post-processor of CEMTool 2D & 3D FEM packages. In contrast to the existing MATLAB PDE Toolbox, our proposed FEM packages can deal with the combination of the reserved words. Also, we can control the mesh in a very effective way. With the introduction of new mesh generation algorithm and fast solving technique, our FEM packages can guarantee the shorter computational time than MATLAB PDE Toolbox. Consequently, with our new FEM packages, we can overcome some disadvantages or limitations of the existing MATLAB PDE Toolbox.

Keywords: CEMTool, Finite element method (FEM), Numericalanalysis, Partial differential equation (PDE)

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Authors: Ali Youniss Aidbaiss, G. Unnikrishnan, Anoob Hakim

Abstract:

Scope changes, scope creeps, cost and time overruns have become common in projects in the oil and gas sector. Even in repetitive projects, failure to implement lessons learnt and correct past mistakes have resulted in various setbacks. This paper describes the concept of reusing successfully implemented design packages as templates for repetitive projects, and thereby lowering the instances of project failures. Units or systems successfully installed in projects can be identified and taken up for preparing template design packages. Standardization of units and systems helps to develop templates from successful designs which can be repeatedly used with confidence. These packages can be used with minimum modifications for developing FEED packages faster, saving cost and other valuable resources. Lessons learnt from the completed project incorporated in the templates avoid repeating past mistakes during detailed design, procurement and execution. With template packages, consistent quality can be maintained for similar projects, avoiding scope creep and scope changes which will ultimately result in cost and time savings.

Keywords: Engineering work package, repetitive construction, template design package, time saving in projects.

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Authors: Z. W. Zhong, C. Xu, W. K. Choi

Abstract:

To build a thin fan-out wafer-level package, the package had to be ground to a thin level. In this work, the influence of the grinding processes on the strength of the fan-out wafer-level packages was investigated. After different grinding processes, all specimens were placed on a three-point-bending fixture installed on a universal tester for three-point-bending testing, and the strength of the fan-out wafer-level packages was measured. The experiments revealed that the average flexure strength increased with the decreasing surface roughness height of the fan-out wafer-level package tested. The grinding processes had a significant influence on the strength of the fan-out wafer-level packages investigated.

Keywords: FOWLP strength, surface roughness, three-point bending, grinding.

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Authors: Ilya Kavalchuk, Hayrettin Arisoy, Alex Stojcevski, Aman Maun Than Oo

Abstract:

Electric vehicles are one of the most complicated electric devices to simulate due to the significant number of different processes involved in electrical structure of it. There are concurrent processes of energy consumption and generation with different onboard systems, which make simulation tasks more complicated to perform. More accurate simulation on energy consumption can provide a better understanding of all energy management for electric transport. As a result of all those processes, electric transport can allow for a more sustainable future and become more convenient in relation to the distance range and recharging time. This paper discusses the problems of energy consumption simulations for electric vehicles using different software packages to provide ideas on how to make this process more precise, which can help engineers create better energy management strategies for electric vehicles.

Keywords: Electric Vehicles, EV, Power Consumption, Power Management, Simulation.

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Authors: Naser Valipour Motlagh, Majid Aliabadi, Elnaz Rahmani, Samira Ghorbanpour

Abstract:

Strawberry is one of the most favored fruits all along the world. But due to its vulnerability to microbial contamination and short life storage, there are lots of problems in industrial production and transportation of this fruit. Therefore, lots of ideas have tried to increase the storage life of strawberries especially through proper packaging. This paper works on efficient packaging as well. The primary material used is produced through simple mixing of low-density polyethylene (LDPE) and silver nanoparticles in different weight fractions of 0.5 and 1% in presence of dicumyl peroxide as a cross-linking agent. Final packages were made in a twin-screw extruder. Then, their effect on the quality maintenance of strawberry is evaluated. The SEM images of nano-silver packages show the distribution of silver nanoparticles in the packages. Total bacteria count, mold, yeast and E. coli are measured for microbial evaluation of all samples. Texture, color, appearance, odor, taste and total acceptance of various samples are evaluated by trained panelists and based on 9-point hedonic scale method. The results show a decrease in total bacteria count and mold in nano-silver packages compared to the samples packed in polyethylene packages for the same storage time. The optimum concentration of silver nanoparticles for the lowest bacteria count and mold is predicted to be around 0.5% which has attained the most acceptance from the panelist as well. Moreover, organoleptic properties of strawberry are preserved for a longer period in nano-silver packages. It can be concluded that using nano-silver particles in strawberry packages has improved the storage life and quality maintenance of the fruit.

Keywords: Antimicrobial properties, polyethylene, silver nanoparticles, strawberry.

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Authors: B. Arzhanov, A. Correia, P. Delgado, J. Meireles

Abstract:

Quad Flat No-Lead (QFN) packages have become very popular for turners, converters and audio amplifiers, among others applications, needing efficient power dissipation in small footprints. Since semiconductor junction temperature (T_J) is a critical parameter in the product quality. And to ensure that die temperature does not exceed the maximum allowable T_J, a thermal analysis conducted in an earlier development phase is essential to avoid repeated re-designs process with huge losses in cost and time. A simulation tool capable to estimate die temperature of components with QFN package was developed. Allow establish a non-empirical way to define an acceptance criterion for amount of voids in solder interface between its exposed pad and Printed Circuit Board (PCB) to be applied during industrialization process, and evaluate the impact of PCB designs parameters. Targeting PCB layout designer as an end user for the application, a user-friendly interface (GUI) was implemented allowing user to introduce design parameters in a convenient and secure way and hiding all the complexity of finite element simulation process. This cost effective tool turns transparent a simulating process and provides useful outputs after acceptable time, which can be adopted by PCB designers, preventing potential risks during the design stage and make product economically efficient by not oversizing it. This article gathers relevant information related to the design and implementation of the developed tool, presenting a parametric study conducted with it. The simulation tool was experimentally validated using a Thermal-Test-Chip (TTC) in a QFN open-cavity, in order to measure junction temperature (T_J) directly on the die under controlled and knowing conditions. Providing a short overview about standard thermal solutions and impacts in exposed pad packages (i.e. QFN), accurately describe the methods and techniques that the system designer should use to achieve optimum thermal performance, and demonstrate the effect of system-level constraints on the thermal performance of the design.

Keywords: Quad Flat No-Lead packages, exposed pads, junction temperature, thermal management and measurements.

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Authors: Mostafa.A. Fellani, Daw .E. Abaid

Abstract:

This paper deals with stability analysis for synchronous reluctance motors drive. Special attention is paid to the transient performance with variations in motor's parameters such as Ld and Rs. A study of the dynamic control using d-q model is presented first in order to clarify the stability of the motor drive system. Based on the experimental parameters of the synchronous reluctance motor, this paper gives some simulation results using MATLAB/SIMULINK software packages. It is concluded that the motor parameters, especially Ld, affect the estimator stability and hence the whole drive system.

Keywords: Dynamic Simulation, MATLAB, PWM-inverter, Reluctance Machine, Sensorless Control

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Authors: Ladan Darougaran, Hossein Shahinzadeh, Hajar Ghotb, Leila Ramezanpour

Abstract:

In ad hoc networks, the main issue about designing of protocols is quality of service, so that in wireless sensor networks the main constraint in designing protocols is limited energy of sensors. In fact, protocols which minimize the power consumption in sensors are more considered in wireless sensor networks. One approach of reducing energy consumption in wireless sensor networks is to reduce the number of packages that are transmitted in network. The technique of collecting data that combines related data and prevent transmission of additional packages in network can be effective in the reducing of transmitted packages- number. According to this fact that information processing consumes less power than information transmitting, Data Aggregation has great importance and because of this fact this technique is used in many protocols [5]. One of the Data Aggregation techniques is to use Data Aggregation tree. But finding one optimum Data Aggregation tree to collect data in networks with one sink is a NP-hard problem. In the Data Aggregation technique, related information packages are combined in intermediate nodes and form one package. So the number of packages which are transmitted in network reduces and therefore, less energy will be consumed that at last results in improvement of longevity of network. Heuristic methods are used in order to solve the NP-hard problem that one of these optimization methods is to solve Simulated Annealing problems. In this article, we will propose new method in order to build data collection tree in wireless sensor networks by using Simulated Annealing algorithm and we will evaluate its efficiency whit Genetic Algorithm.

Keywords: Data aggregation, wireless sensor networks, energy efficiency, simulated annealing algorithm, genetic algorithm.

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Authors: R. O. Ocaya, J. J. Terblans

Abstract:

The laws of Newtonian mechanics allow ab-initio molecular dynamics to model and simulate particle trajectories in material science by defining a differentiable potential function. This paper discusses some considerations for the coding of ab-initio programs for simulation on a standalone computer and illustrates the approach by C language codes in the context of embedded metallic atoms in the face-centred cubic structure. The algorithms use velocity-time integration to determine particle parameter evolution for up to several thousands of particles in a thermodynamical ensemble. Such functions are reusable and can be placed in a redistributable header library file. While there are both commercial and free packages available, their heuristic nature prevents dissection. In addition, developing own codes has the obvious advantage of teaching techniques applicable to new problems.

Keywords: C-language, molecular dynamics, simulation, embedded atom method.

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Authors: P. Vazan, P. Tanuska

Abstract:

The paper provides the basic overview of simulation optimization. The procedure of its practical using is demonstrated on the real example in simulator Witness. The simulation optimization is presented as a good tool for solving many problems in real praxis especially in production systems. The authors also characterize their own experiences and they mention the strengths and weakness of simulation optimization.

Keywords: discrete event simulation, simulation optimization, Witness

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Authors: Z. Noranai, M.Z. Md Yusof

Abstract:

Building Sector is the major electricity consumer and it is costly to building owners. Therefore the application of thermal energy storage (TES) has gained attractive to reduce energy cost. Many attractive tariff packages are being offered by the electricity provider to promote TES. The tariff packages offered higher cost of electricity during peak period and lower cost of electricity during off peak period. This paper presented the return of initial investment by implementing a centralized air-conditioning plant integrated with thermal energy storage with partially operation strategies. Building load profile will be calculated hourly according to building specification and building usage trend. TES operation conditions will be designed according to building load demand profile, storage capacity, tariff packages and peak/off peak period. The Payback Period analysis method was used to evaluate economic analysis. The investment is considered a good investment where by the initial cost is recovered less than ten than seven years.

Keywords: building load profile, energy consumption, payback period, thermal energy storage

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Authors: F. Hosseinpour, H. Hajihosseini

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Simulation is a very helpful and valuable work tool in manufacturing. It can be used in industrial field allowing the system`s behavior to be learnt and tested. Simulation provides a low cost, secure and fast analysis tool. It also provides benefits, which can be reached with many different system configurations. Topics to be discussed include: Applications, Modeling, Validating, Software and benefits of simulation. This paper provides a comprehensive literature review on research efforts in simulation.

Keywords: Manufacturing, modeling, simulation, training.

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Authors: Atakan Kurt, Arzu Naiboğlu

Abstract:

We present an implementation of an Online Exhibition System (OES) web service(s) that reflects our experiences with using web service development packages and software process models. The system provides major functionality that exists in similar packages. While developing such a complex web service, we gained insightful experience (i) in the traditional software development processes: waterfall model and evolutionary development and their fitness to web services development, (ii) in the fitness and effectiveness of a major web services development kit.

Keywords: Web Services, Online Exhibition System, Software Engineering, Waterfall Model, e-business.

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Authors: R. Gunabalan, V. Subbiah

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This paper discusses the novel graphical approach for stability analysis of multi induction motor drive controlled by a single inverter. Stability issue arises in parallel connected induction motors under unbalanced load conditions. The two powerful globally accepted modeling and simulation software packages such as MATLAB and LabVIEW are selected to perform the stability analysis. The stability investigation is performed for different load conditions and difference in stator and rotor resistances among the two motors. It is very simple and effective than the techniques presented to obtain the stability of the parallel connected induction motor drive under unbalanced load conditions. Approximate transfer functions are considered to model the induction motors, load dynamics, speed controllers and inverter. Simulink library tools are utilized to model the entire drive scheme in MATLAB. Stability study is discussed in LabVIEW using control design and simulation toolkits. Simulation results are illustrated for various running conditions to demonstrate the effectiveness of the transfer function method.

Keywords: Induction motor, Modeling, Stability analysis, Transfer function model.

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Authors: Nina Øystad-Larsen, Miran Cemalovic, Amir M. Kaynia

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The nonlinear static and dynamic analysis procedures presented in EN 1998-1 for the structural response of a RC wall-frame building are assessed. The structure is designed according to the guidelines for high ductility (DCH) in 1998-1. The finite element packages SeismoStruct and OpenSees are utilized and evaluated. The structural response remains nearly in the elastic range even though the building was designed for high ductility. The overstrength is a result of oversized and heavily reinforced members, with emphasis on the lower storey walls. Nonlinear response history analysis in the software packages give virtually identical results for displacements.

Keywords: Behaviour factor, Dual system, OpenSEES, Overstrength, SeismoStruct.

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Authors: Brahim Belattar, Abdelhabib Bourouis

Abstract:

This paper describes important features of JAPROSIM, a free and open source simulation library implemented in Java programming language. It provides a framework for building discrete event simulation models. The process interaction world view adopted by JAPROSIM is discussed. We present the architecture and major components of the simulation library. A pedagogical example is given in order to illustrate how to use JAPROSIM for building discrete event simulation models. Further motivations are discussed and suggestions for improving our work are given.

Keywords: Discrete Event Simulation, Object-Oriented Simulation, JAPROSIM, Process Interaction Worldview, Java-based modeling and simulation.

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Authors: Adam Gorine, Faten Spondon

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Python is considered the most popular programming language and offers its own ecosystem for archiving and maintaining open-source software packages. This system is called the Python Package Index (PyPI), the repository of this programming language. Unfortunately, one-third of these software packages have vulnerabilities that allow attackers to execute code automatically when a vulnerable or malicious package is installed. This paper contributes to large-scale empirical studies investigating security issues in the Python ecosystem by evaluating package vulnerabilities. These provide a series of implications that can help the security of software ecosystems by improving the process of discovering, fixing, and managing package vulnerabilities. The vulnerable dataset is generated using the NVD, the National Vulnerability Database, and the Snyk vulnerability dataset. In addition, we evaluated 807 vulnerability reports in the NVD and 3900 publicly known security vulnerabilities in Python Package Manager (Pip) from the Snyk database from 2002 to 2022. As a result, many Python vulnerabilities appear in high severity, followed by medium severity. The most problematic areas have been improper input validation and denial of service attacks. A hybrid scanning tool that combines the three scanners, Bandit, Snyk and Dlint, which provide a clear report of the code vulnerability, is also described.

Keywords: Python vulnerabilities, Bandit, Snyk, Dlint, Python Package Index, ecosystem, static analysis, malicious attacks.

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Authors: Hassan Haghighi, Omid Mafi

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Existing experiences indicate that one of the most prominent reasons that some ERP implementations fail is related to selecting an improper ERP package. Among those important factors resulting in inappropriate ERP selections, one is to ignore preliminary activities that should be done before the evaluation of ERP packages. Another factor yielding these unsuitable selections is that usually organizations employ prolonged and costly selection processes in such extent that sometimes the process would never be finalized or sometimes the evaluation team might perform many key final activities in an incomplete or inaccurate way due to exhaustion, lack of interest or out-of-date data. In this paper, a systematic approach that recommends some activities to be done before and after the main selection phase is introduced for choosing an ERP package. On the other hand, the proposed approach has utilized some ideas that accelerates the selection process at the same time that reduces the probability of an erroneous final selection.

Keywords: enterprise resource planning, evaluation and selectionof ERP packages, organizational readiness for employing ERP, evaluationlists.

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Authors: Sadaf Khalid, Fahim Arif

Abstract:

Wide applicability of concurrent programming practices in developing various software applications leads to different concurrency errors amongst which data race is the most important. Java provides greatest support for concurrent programming by introducing various concurrency packages. Aspect oriented programming (AOP) is modern programming paradigm facilitating the runtime interception of events of interest and can be effectively used to handle the concurrency problems. AspectJ being an aspect oriented extension to java facilitates the application of concepts of AOP for data race detection. Volatile variables are usually considered thread safe, but they can become the possible candidates of data races if non-atomic operations are performed concurrently upon them. Various data race detection algorithms have been proposed in the past but this issue of volatility and atomicity is still unaddressed. The aim of this research is to propose some suggestions for incorporating certain conditions for data race detection in java programs at the volatile fields by taking into account support for atomicity in java concurrency packages and making use of pointcuts. Two simple test programs will demonstrate the results of research. The results are verified on two different Java Development Kits (JDKs) for the purpose of comparison.

Keywords: Aspect Bench Compiler (abc), Aspect OrientedProgramming (AOP), AspectJ, Aspects, Concurrency packages, Concurrent programming, Cross-cutting Concerns, Data race, Eclipse, Java, Java Development Kits (JDKs), Pointcuts

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Authors: Majid Mokhtarnia, Alireza Amini

Abstract:

Mobile operators deal with increasing in the data traffic as a critical issue. As a result, a vital responsibility of the operators is to deal with such a trend in order to create added values. This paper addresses a bundling method in a Canvas business model in a WiFi Data Offloading (WDO) strategy by which some elements of the model may be affected. In the proposed method, it is supposed to sell a number of data packages for subscribers in which there are some packages with a free given volume of data-offloaded WiFi complimentary. The paper on hands analyses this method in the views of attractiveness and profitability. The results demonstrate that the quality of implementation of the WDO strongly affects the final result and helps the decision maker to make the best one.

Keywords: Bundling, canvas business model, telecommunication, WiFi Data Offloading.

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Authors: Jiri Barta

Abstract:

This paper deals with a simulation programs and technologies using in the educational process for members of the crisis management. Risk analysis, simulation, preparation and planning are among the main activities of workers of crisis management. Made correctly simulation of emergency defines the extent of the danger. On this basis, it is possible to effectively prepare and plan measures to minimize damage. The paper is focused on simulation programs that are trained at the University of Defence. Implementation of the outputs from simulation programs in decision-making processes of crisis staffs is one of the main tasks of the research project.

Keywords: Crisis Management, Continuity, Critical Infrastructure, Dangerous substance, Education, Flood, Simulation Programs.

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Authors: Eugene Kindler

Abstract:

The present paper is oriented to problems of simulation of anticipatory systems, namely those that use simulation models for the aid of anticipation. A certain analogy between use of simulation and imagining will be applied to make the explication more comprehensible. The paper will be completed by notes of problems and by some existing applications. The problems consist in the fact that simulation of the mentioned anticipatory systems end is simulation of simulating systems, i.e. in computer models handling two or more modeled time axes that should be mapped to real time flow in a nondescent manner. Languages oriented to objects, processes and blocks can be used to surmount the problems.

Keywords: Anticipatory systems, Nested computer models, Discrete event simulation, Simula.

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Authors: Semih Demir, Anil Celebi

Abstract:

Circuit switched networks widely used until the end of the 20^th century have been transformed into packages switched networks. Time Division Multiplexing over Internet Protocol (TDMoIP) is a system that enables Time Division Multiplexing (TDM) traffic to be carried over packet switched networks (PSN). In TDMoIP systems, devices that send TDM data to the PSN and receive it from the network must operate with the same clock frequency. In this study, it was aimed to implement clock synchronization process in Field Programmable Gate Array (FPGA) chips using time information attached to the packages received from PSN. The designed hardware is verified using the datasets obtained for the different carrier types and comparing the results with the software model. Field tests are also performed by using the real time TDMoIP system.

Keywords: Clock recovery on TDMoIP, FPGA, MATLAB reference model, clock synchronization.

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Authors: Janis Buls

Abstract:

This paper examines the concept of simulation from a modelling viewpoint. How can one Mealy machine simulate the other one? We create formalism for simulation of Mealy machines. The injective s–morphism of the machine semigroups induces the simulation of machines [1]. We present the example of s–morphism such that it is not a homomorphism of semigroups. The story for the surjective s–morphisms is quite different. These are homomorphisms of semigroups but there exists the surjective s–morphism such that it does not induce the simulation.

Keywords: Mealy machine, simulation, machine semigroup, injective s–morphism, surjective s–morphisms.

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Authors: B. Arzhanov, A. Correia, P. Delgado, J. Meireles

Abstract:

Due to the higher power loss levels in electronic components, the thermal design of PCBs (Printed Circuit Boards) of an assembled device becomes one of the most important quality factors in electronics. Nonetheless, some of leading causes of the microelectronic component failures are due to higher temperatures, the leakages or thermal-mechanical stress, which is a concern, is the reliability of microelectronic packages. This article presents an experimental approach to measure the junction temperature of exposed pad packages. The implemented solution is in a prototype phase, using a temperature-sensitive parameter (TSP) to measure temperature directly on the die, validating the numeric results provided by the Mechanical APDL (Ansys Parametric Design Language) under same conditions. The physical device-under-test is composed by a Thermal Test Chip (TTC-1002) and assembly in a QFN cavity, soldered to a test-board according to JEDEC Standards. Monitoring the voltage drop across a forward-biased diode, is an indirectly method but accurate to obtain the junction temperature of QFN component with an applied power range between 0,3W to 1.5W. The temperature distributions on the PCB test-board and QFN cavity surface were monitored by an infra-red thermal camera (Goby-384) controlled and images processed by the Xeneth software. The article provides a set-up to monitorize in real-time the junction temperature of ICs, namely devices with the exposed pad package (i.e. QFN). Presenting the PCB layout parameters that the designer should use to improve thermal performance, and evaluate the impact of voids in solder interface in the device junction temperature.

Keywords: Quad Flat No-Lead packages, exposed pads, junction temperature, thermal management, measurements.

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Authors: Burcu Kaya, Jan-Martin Kaiser, Karl-Friedrich Becker, Tanja Braun, Klaus-Dieter Lang

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Quality of the molded packages is strongly influenced by the process parameters of the transfer molding. To achieve a better package quality and a stable transfer molding process, it is necessary to understand the influence of the process parameters on the package quality. This work aims to comprehend the relationship between the process parameters, and to identify the optimum process parameters for the transfer molding process in order to achieve less voids and wire sweep. To achieve this, a DoE is executed for process optimization and a regression analysis is carried out. A systematic approach is represented to generate models which enable an estimation of the number of voids and wire sweep. Validation experiments are conducted to verify the model and the results are presented.

Keywords: Epoxy molding compounds, optimization, regression analysis, transfer molding process, voids, wire sweep.

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Authors: Bao Jinsong, Hu Xiaofeng, Wang Wei, Yu Dili, Jin Ye

Abstract:

The paper researched and presented a virtual simulation system based on a full-digital lunar terrain, integrated with kinematics and dynamics module as well as autonomous navigation simulation module. The system simulation models are established. Enabling technologies such as digital lunar surface module, kinematics and dynamics simulation, Autonomous navigation are investigated. A prototype system for lunar rover locomotion simulation is developed based on these technologies. Autonomous navigation is a key echnology in lunar rover system, but rarely involved in virtual simulation system. An autonomous navigation simulation module have been integrated in this prototype system, which was proved by the simulation results that the synthetic simulation and visualizing analysis system are established in the system, and the system can provide efficient support for research on the autonomous navigation of lunar rover.

Keywords: Lunar rover, virtual simulation, autonomous navigation, full-digital lunar terrain

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Authors: Carmen Maria Moraru, Iuliana Stefan, Ovidiu Balteanu, Ciprian Bucur, Liviu Stefan, Anisia Bornea, Ioan Stefanescu

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The implementation of the new software and hardware-s technologies for tritium processing nuclear plants, and especially those with an experimental character or of new technology developments shows a coefficient of complexity due to issues raised by the implementation of the performing instrumentation and equipment into a unitary monitoring system of the nuclear technological process of tritium removal. Keeping the system-s flexibility is a demand of the nuclear experimental plants for which the change of configuration, process and parameters is something usual. The big amount of data that needs to be processed stored and accessed for real time simulation and optimization demands the achievement of the virtual technologic platform where the data acquiring, control and analysis systems of the technological process can be integrated with a developed technological monitoring system. Thus, integrated computing and monitoring systems needed for the supervising of the technological process will be executed, to be continued with the execution of optimization system, by choosing new and performed methods corresponding to the technological processes within the tritium removal processing nuclear plants. The developing software applications is executed with the support of the program packages dedicated to industrial processes and they will include acquisition and monitoring sub-modules, named “virtually" as well as the storage sub-module of the process data later required for the software of optimization and simulation of the technological process for tritium removal. The system plays and important role in the environment protection and durable development through new technologies, that is – the reduction of and fight against industrial accidents in the case of tritium processing nuclear plants. Research for monitoring optimisation of nuclear processes is also a major driving force for economic and social development.

Keywords: Monitoring system, process simulation.

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