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Optimization of the Transfer Molding Process by Implementation of Online Monitoring Techniques for Electronic Packages

Authors: Burcu Kaya, Jan-Martin Kaiser, Karl-Friedrich Becker, Tanja Braun, Klaus-Dieter Lang


Quality of the molded packages is strongly influenced by the process parameters of the transfer molding. To achieve a better package quality and a stable transfer molding process, it is necessary to understand the influence of the process parameters on the package quality. This work aims to comprehend the relationship between the process parameters, and to identify the optimum process parameters for the transfer molding process in order to achieve less voids and wire sweep. To achieve this, a DoE is executed for process optimization and a regression analysis is carried out. A systematic approach is represented to generate models which enable an estimation of the number of voids and wire sweep. Validation experiments are conducted to verify the model and the results are presented.

Keywords: Epoxy molding compounds, optimization, regression analysis, transfer molding process, voids, wire sweep.

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[1] K.W. Tong, C.K. Kwong, and K.M. Yu, “Process optimization of transfer moulding for electronic packages using artificial neural networks and multiobjective optimization techniques,” International Journal of Advanced Manufacturing Technology, vol. 24, 2004, pp. 675-685.
[2] L.T. Nguyen, “Reactive flow simulation in transfer molding of IC Packages,” Proceedings 43rd IEEE Electronic Components and Technology Conference, 1993, pp. 375-390.
[3] J. H. Wu, A. A. O. Tay, K. S. Yeo, and T. B. Lim, “A three-dimensional modeling of wire sweep incorporating resin cure,” IEEE Transactions on components, packaging, and manufacturing technology, Part B, vol. 21, no.1, 1998, pp. 65-72.
[4] T. Wember, Technische Statistik und statistische Versuchsplanung, Einführung in statistische Methoden mit Anwendungsschwerpunkt in der Analyse technischer Daten für Techniker, Ingenieure und Naturwissenschaftler; P & P Informationstechnologie GmbH, 2008.
[5] W. Kleppmann, Taschenbuch Versuchsplanung: Produkte und Prozesse optimieren; 5. Auflage; Hanser: München; ISBN 978-3-446-41595-9 2008.