Search results for: Semiconductor Manufacturing Process.
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 5987

Search results for: Semiconductor Manufacturing Process.

5417 Experimental Investigation on Freeze-Concentration Process Desalting for Highly Saline Brines

Authors: H. Al-Jabli

Abstract:

Using the freeze-melting process for the disposing of high saline brines was the aim of the paper by confirming the performance estimation of the treatment system. A laboratory bench scale freezing technique test unit was designed, constructed, and tested at Doha Research Plant (DRP) in Kuwait. The principal unit operations that have been considered for the laboratory study are: ice crystallization, separation, washing, and melting. The applied process is characterized as “the secondary-refrigerant indirect freezing”, which is utilizing normal freezing concept. The high saline brine was used as definite feed water, i.e. average TDS of 250,000 ppm. Kuwait desalination plants were carried out in the experimental study to measure the performance of the proposed treatment system. Experimental analysis shows that the freeze-melting process is capable of dropping the TDS of the feed water from 249,482 ppm to 56,880 ppm of the freeze-melting process in the two-phase’s course, whereas overall recovery results of the salt passage and salt rejection are 31.11%, 19.05%, and 80.95%, correspondingly. Therefore, the freeze-melting process is encouraging for the proposed application, as it shows on the results, which approves the process capability of reducing a major amount of the dissolved salts of the high saline brine with reasonable sensible recovery. This process might be reasonable with other brine disposal processes.

Keywords: High saline brine, freeze-melting process, ice crystallization, brine disposal process.

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5416 Impact of Mergers and Acquisitions on Consumers- Welfare: Experience of Indian Manufacturing Sector

Authors: Pulak Mishra, P V Kiran Kumar

Abstract:

In the context of introduction of deregulatory policy measures and subsequent wave of mergers and acquisitions (M&A) in Indian corporate sector since 1991, the present paper attempts to examine the welfare implications of this wave. It is found that M&A do not have any significant impact on consumers- welfare. Instead, consumers- welfare is significantly influenced by exports intensity, imports intensity, advertising intensity, technology related efforts, and past profitability of the firms. While the industries with higher exports orientation or greater product differentiation or better financial performance experience greater loss in consumers- welfare, it is less in the industries with greater competition from imports or better technology. Hence, the wave of M&A in Indian manufacturing sector in the post-liberalization era may not be a matter of serious concern from consumers- welfare point of view. Instead, in many cases, M&A can help the firms in consolidating their business and enhancing competitiveness, and this may benefit the consumers in the form of greater efficiency and lower prices.

Keywords: Mergers, acquisitions, concentration, welfare, IndiaJEL CodesÔÇöL1, L2, L4, L5

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5415 Measurement of I-V Characteristics of a PtSi/p-Si Schottky Barrier Diode at low Temperatures

Authors: Somayeh Gholami, Meysam Khakbaz

Abstract:

The current-voltage characteristics of a PtSi/p-Si Schottky barrier diode was measured at the temperature of 85 K and from the forward bias region of the I-V curve, the electrical parameters of the diode were measured by three methods. The results obtained from the two methods which considered the series resistance were in close agreement with each other and from them barrier height (), ideality factor (n) and series resistance () were found to be 0.2045 eV, 2.877 and 14.556 K respectively. By measuring the I-V characteristics in the temperature range of 85-136 K the electrical parameters were observed to have strong dependency on temperature. The increase of barrier height and decrease of ideality factor with increasing temperature is attributed to the existence of barrier height inhomogeneities in the silicide-semiconductor structure.

Keywords: Schottky diode, barrier height, series resistance, I-V, barrier height inhomogeneities.

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5414 Integration and Selectivity in Open Innovation:An Empirical Analysis in SMEs

Authors: Chiara Verbano, Maria Crema, Karen Venturini

Abstract:

The company-s ability to draw on a range of external sources to meet their needs for innovation, has been termed 'open innovation' (OI). Very few empirical analyses have been conducted on Small and Medium Enterprises (SMEs) to the extent that they describe and understand the characteristics and implications of this new paradigm. The study's objective is to identify and characterize different modes of OI, (considering innovation process phases and the variety and breadth of the collaboration), determinants, barriers and motivations in SMEs. Therefore a survey was carried out among Italian manufacturing firms and a database of 105 companies was obtained. With regard to data elaboration, a factorial and cluster analysis has been conducted and three different OI modes have emerged: selective low open, unselective open upstream, and mid- partners integrated open. The different behaviours of the three clusters in terms of determinants factors, performance, firm-s technology intensity, barriers and motivations have been analyzed and discussed.

Keywords: Open innovation, R&D management, SMEs.

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5413 XPM Response of Multiple Quantum Well chirped DFB-SOA All Optical Flip-Flop Switching

Authors: Masoud Jabbari, Mohammad Kazem Moravvej-Farshi, Rahim Ghayour, Abbas Zarifkar

Abstract:

In this paper, based on the coupled-mode and carrier rate equations, derivation of a dynamic model and numerically analysis of a MQW chirped DFB-SOA all-optical flip-flop is done precisely. We have analyzed the effects of strains of QW and MQW and cross phase modulation (XPM) on the dynamic response, and rise and fall times of the DFB-SOA all optical flip flop. We have shown that strained MQW active region in under an optimized condition into a DFB-SOA with chirped grating can improve the switching ON speed limitation in such a of the device, significantly while the fall time is increased. The values of the rise times for such an all optical flip-flop, are obtained in an optimized condition, areas tr=255ps.

Keywords: All-Optical Flip-Flop (AO-FF), Distributed feedback semiconductor optical amplifier (DFB-SOA), Optical Bistability, Multi quantum well (MQW)

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5412 A Novel Model for Simultaneously Minimising Costs and Risks in Just-in-Time Systems Using Multi-Backup Suppliers: Part 1- Modelling

Authors: Faraj El Dabee, Romeo Marian, Yousef Amer

Abstract:

Just-In-Time (JIT) is a lean manufacturing tool, which provides the benefits of efficiency, and of minimizing unnecessary costs for many organisations. However, the risks arising from these benefits have been disregarded. These risks impact on system processes disrupting the whole supply chain. This paper proposes an inventory model that can simultaneously reduce costs and risks in JIT systems. This model is developed to ascertain an optimal ordering strategy for procuring raw materials by using regular multi-external and local backup suppliers to reduce the total cost of the products, and at the same time to reduce the risks arising from this cost reduction within production systems. Some results that will be illustrated in the second part of this paper are presented.

Keywords: Lean manufacturing, Just-in-Time (JIT), production system, cost-risk reduction, inventory model, eternal supplier, local backup supplier.

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5411 Directionally-Sensitive Personal Wearable Radiation Dosimeter

Authors: Hai Huu Le, Paul Junor, Moshi Geso, Graeme O’Keefe

Abstract:

In this paper, the authors propose a personal wearable directionally-sensitive radiation dosimeter using multiple semiconductor CdZnTe detectors. The proposed dosimeter not only measures the real-time dose rate but also provide the direction of the radioactive source. A linear relationship between radioactive source direction and the radiation intensity measured by each detectors is established and an equation to determine the source direction is derived by the authors. The efficiency and accuracy of the proposed dosimeter is verified by simulation using Geant4 package. Results have indicated that in a measurement duration of about 7 seconds, the proposed dosimeter was able to estimate the direction of a 10μCi 137/55Cs radioactive source to within 2 degrees.

Keywords: Dose rate, Geant4 package, radiation detectors, radioactive source direction.

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5410 Overriding Moral Intuitions – Does It Make Us Immoral? Dual-Process Theory of Higher Cognition Account for Moral Reasoning

Authors: Michał Białek, Simon J. Handley

Abstract:

Moral decisions are considered as an intuitive process, while conscious reasoning is mostly used only to justify those intuitions. This problem is described in few different dual-process theories of mind, that are being developed e.g. by Frederick and Kahneman, Stanovich and Evans. Those theories recently evolved into tri-process theories with a proposed process that makes ultimate decision or allows to paraformal processing with focal bias.. Presented experiment compares the decision patterns to the implications of those models. In presented study participants (n=179) considered different aspects of trolley dilemma or its footbridge version and decided after that. Results show that in the control group 70% of people decided to use the lever to change tracks for the running trolley, and 20% chose to push the fat man down the tracks. In contrast, after experimental manipulation almost no one decided to act. Also the decision time difference between dilemmas disappeared after experimental manipulation. The result supports the idea of three co-working processes: intuitive (TASS), paraformal (reflective mind) and algorithmic process.

Keywords: Moral reasoning, moral decision, reflection, trolley problem, dual-process theory of reasoning, tri-process theory of cognition.

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5409 A Study on Stochastic Integral Associated with Catastrophes

Authors: M. Reni Sagayaraj, S. Anand Gnana Selvam, R. Reynald Susainathan

Abstract:

We analyze stochastic integrals associated with a mutation process. To be specific, we describe the cell population process and derive the differential equations for the joint generating functions for the number of mutants and their integrals in generating functions and their applications. We obtain first-order moments of the processes of the two-way mutation process in first-order moment structure of X (t) and Y (t) and the second-order moments of a one-way mutation process. In this paper, we obtain the limiting behaviour of the integrals in limiting distributions of X (t) and Y (t).

Keywords: Stochastic integrals, single–server queue model, catastrophes, busy period.

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5408 Rapid Data Acquisition System for Complex Algorithm Testing in Plastic Molding Industry

Authors: A. Tellaeche, R. Arana

Abstract:

Injection molding is a very complicated process to monitor and control. With its high complexity and many process parameters, the optimization of these systems is a very challenging problem. To meet the requirements and costs demanded by the market, there has been an intense development and research with the aim to maintain the process under control. This paper outlines the latest advances in necessary algorithms for plastic injection process and monitoring, and also a flexible data acquisition system that allows rapid implementation of complex algorithms to assess their correct performance and can be integrated in the quality control process. This is the main topic of this paper. Finally, to demonstrate the performance achieved by this combination, a real case of use is presented.

Keywords: Plastic injection, machine learning, rapid complex algorithm prototyping.

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5407 Determining Optimal Production Plan by Revised Surrogate Worth Trade-off Method

Authors: Tunjo Peric, Zoran Babic

Abstract:

The authors of this work indicate by means of a concrete example that it is possible to apply efficaciously the method of multiple criteria programming in dealing with the problem of determining the optimal production plan for a certain period of time. The work presents: (1) the selection of optimization criteria, (2) the setting of the problem of determining an optimal production plan, (3) the setting of the model of multiple criteria programming in finding a solution to a given problem, (4) the revised surrogate trade-off method, (5) generalized multicriteria model for solving production planning problem and problem of choosing technological variants in the metal manufacturing industry. In the final part of this work the authors reflect on the application of the method of multiple criteria programming while determining the optimal production plan in manufacturing enterprises.

Keywords: multi-criteria programming, production planning, technological variant, Surrogate Worth Trade-off Method.

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5406 Effect of Scanning Speed on Material Efficiency of Laser Metal Deposited Ti6Al4V

Authors: Esther T. Akinlabi, Rasheedat M. Mahamood, Mukul Shukla, Sisa. Pityana

Abstract:

The study of effect of laser scanning speed on material efficiency in Ti6Al4V application is very important because unspent powder is not reusable because of high temperature oxygen pick-up and contamination. This study carried out an extensive study on the effect of scanning speed on material efficiency by varying the speed between 0.01 to 0.1m/sec. The samples are wire brushed and cleaned with acetone after each deposition to remove un-melted particles from the surface of the deposit. The substrate is weighed before and after deposition. A formula was developed to calculate the material efficiency and the scanning speed was compared with the powder efficiency obtained. The results are presented and discussed. The study revealed that the optimum scanning speed exists for this study at 0.01m/sec, above and below which the powder efficiency will drop

Keywords: Additive Manufacturing, Laser Metal Deposition Process, Material efficiency, Processing Parameter, Titanium alloy.

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5405 A Linearization and Decomposition Based Approach to Minimize the Non-Productive Time in Transfer Lines

Authors: Hany Osman, M. F. Baki

Abstract:

We address the balancing problem of transfer lines in this paper to find the optimal line balancing that minimizes the nonproductive time. We focus on the tool change time and face orientation change time both of which influence the makespane. We consider machine capacity limitations and technological constraints associated with the manufacturing process of auto cylinder heads. The problem is represented by a mixed integer programming model that aims at distributing the design features to workstations and sequencing the machining processes at a minimum non-productive time. The proposed model is solved by an algorithm established using linearization schemes and Benders- decomposition approach. The experiments show the efficiency of the algorithm in reaching the exact solution of small and medium problem instances at reasonable time.

Keywords: Transfer line balancing, Benders' decomposition, Linearization.

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5404 Modeling and Simulations of Surface Plasmon Waveguide Structures

Authors: Moussa Hamdan, Abdulati Abdullah

Abstract:

This paper presents an investigation of the fabrication of the optical devices in terms of their characteristics based on the use of the electromagnetic waves. Planar waveguides are used to examine the field modes (bound modes) and the parameters required for this structure. The modifications are conducted on surface plasmons based waveguides. Simple symmetric dielectric slab structure is used and analyzed in terms of transverse electric mode (TE-Mode) and transverse magnetic mode (TM-Mode. The paper presents mathematical and numerical solutions for solving simple symmetric plasmons and provides simulations of surface plasmons for field confinement. Asymmetric TM-mode calculations for dielectric surface plasmons are also provided.

Keywords: Surface plasmons, optical waveguides, semiconductor lasers, refractive index, slab dialectical.

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5403 Supply Chain Competitiveness: A Review of Select Enablers

Authors: Ajay Verma, Nitin Seth

Abstract:

In present days market environment, supply chains has to be competitive enough to handle pressures like varying customer’s expectations, low cost high quality products to be delivered at the minimum time and the most important is throat cutting competition at world wide scale. Recently, supply chain competitiveness has been, therefore, accepted as one of the most important philosophies in the supply chain literature. Various researchers and practitioners have tried to identify and implement enablers in supply chains which can bring competitiveness in the supply chains i.e. supply chain competitiveness. The purpose of this paper is to suggest select enablers for supply chain competitiveness in the Indian manufacturing sector using an integrated approach of literature review and exploratory interviews with eminent professionals from the supply chain area in various industries, academia and research. The aim of the paper is to highlight the important enablers in the area of supply chain competitiveness and suggest recommendations to the industry and managers of manufacturing supply chains with a view to encourage more efforts in this wider domain area.

Keywords: Supply Chain Competitiveness, Supply Chain Collaboration, Coordination, Quality Management, Cost.

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5402 Using the Monte Carlo Simulation to Predict the Assembly Yield

Authors: C. Chahin, M. C. Hsu, Y. H. Lin, C. Y. Huang

Abstract:

Electronics Products that achieve high levels of integrated communications, computing and entertainment, multimedia features in small, stylish and robust new form factors are winning in the market place. Due to the high costs that an industry may undergo and how a high yield is directly proportional to high profits, IC (Integrated Circuit) manufacturers struggle to maximize yield, but today-s customers demand miniaturization, low costs, high performance and excellent reliability making the yield maximization a never ending research of an enhanced assembly process. With factors such as minimum tolerances, tighter parameter variations a systematic approach is needed in order to predict the assembly process. In order to evaluate the quality of upcoming circuits, yield models are used which not only predict manufacturing costs but also provide vital information in order to ease the process of correction when the yields fall below expectations. For an IC manufacturer to obtain higher assembly yields all factors such as boards, placement, components, the material from which the components are made of and processes must be taken into consideration. Effective placement yield depends heavily on machine accuracy and the vision of the system which needs the ability to recognize the features on the board and component to place the device accurately on the pads and bumps of the PCB. There are currently two methods for accurate positioning, using the edge of the package and using solder ball locations also called footprints. The only assumption that a yield model makes is that all boards and devices are completely functional. This paper will focus on the Monte Carlo method which consists in a class of computational algorithms (information processed algorithms) which depends on repeated random samplings in order to compute the results. This method utilized in order to recreate the simulation of placement and assembly processes within a production line.

Keywords: Monte Carlo simulation, placement yield, PCBcharacterization, electronics assembly

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5401 The Development of the Quality Management Processes for the Building and Environment of the Basic Education Schools

Authors: Suppara Charoenpoom

Abstract:

The objectives of this research was to design and develop a quality management of the school buildings and environment. A quantitative and qualitative mixed research methodology was used. The population sample included 14 directors of primary schools. Two research tools were used. The first research tool included an in-depth interview and questionnaire. The second research tool included the Quality Business Process and Quality Work Procedure, and a Key Performance Indicator of each activity. The statistics included mean and standard deviation. The findings for the development of a quality management process of buildings and environment administration of the basic schools consisted of one quality business process (QBP) and seven quality work processes (QWP). The result from the experts’ evaluation revealed that the process and implementation of quality management of the school buildings and environment has passed the inspection process with consensus. This implies that the process of quality management of the school buildings and environment is suitable for implementation. Moreover, the level of agreement in the feasibility of the implementation of this plan had the mean in the range of 0.64-1.00 which suggests the design of the new plan is acceptable.

Keywords: Process, Building, Environment.

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5400 Chips of Ti-6Al-2Sn-4Zr-6Mo Alloy – A Detailed Geometry Study

Authors: Dmytro Ostroushko, Karel Saksl, Carsten Siemers, Zuzana Rihova

Abstract:

Titanium alloys like Ti-6Al-2Sn-4Zr-6Mo (Ti- 6246) are widely used in aerospace applications. Component manufacturing, however, is difficult and expensive as their machinability is extremely poor. A thorough understanding of the chip formation process is needed to improve related metal cutting operations.In the current study, orthogonal cutting experiments have been performed and theresulting chips were analyzed by optical microscopy and scanning electron microscopy.Chips from aTi- 6246ingot were produced at different cutting speeds and cutting depths. During the experiments, depending of the cutting conditions, continuous or segmented chips were formed. Narrow, highly deformed and grain oriented zones, the so-called shear zone, separated individual segments. Different material properties have been measured in the shear zones and the segments.

Keywords: Titanium alloy, Ti-6246, chip formation, machining, shear zone, microstructure

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5399 Hazard Rate Estimation of Temporal Point Process, Case Study: Earthquake Hazard Rate in Nusatenggara Region

Authors: Sunusi N., Kresna A. J., Islamiyati A., Raupong

Abstract:

Hazard rate estimation is one of the important topics in forecasting earthquake occurrence. Forecasting earthquake occurrence is a part of the statistical seismology where the main subject is the point process. Generally, earthquake hazard rate is estimated based on the point process likelihood equation called the Hazard Rate Likelihood of Point Process (HRLPP). In this research, we have developed estimation method, that is hazard rate single decrement HRSD. This method was adapted from estimation method in actuarial studies. Here, one individual associated with an earthquake with inter event time is exponentially distributed. The information of epicenter and time of earthquake occurrence are used to estimate hazard rate. At the end, a case study of earthquake hazard rate will be given. Furthermore, we compare the hazard rate between HRLPP and HRSD method.

Keywords: Earthquake forecast, Hazard Rate, Likelihood point process, Point process.

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5398 Waste-Based Surface Modification to Enhance Corrosion Resistance of Aluminium Bronze Alloy

Authors: Wilson Handoko, Farshid Pahlevani, Isha Singla, Himanish Kumar, Veena Sahajwalla

Abstract:

Aluminium bronze alloys are well known for their superior abrasion, tensile strength and non-magnetic properties, due to the co-presence of iron (Fe) and aluminium (Al) as alloying elements and have been commonly used in many industrial applications. However, continuous exposure to the marine environment will accelerate the risk of a tendency to Al bronze alloys parts failures. Although a higher level of corrosion resistance properties can be achieved by modifying its elemental composition, it will come at a price through the complex manufacturing process and increases the risk of reducing the ductility of Al bronze alloy. In this research, the use of ironmaking slag and waste plastic as the input source for surface modification of Al bronze alloy was implemented. Microstructural analysis conducted using polarised light microscopy and scanning electron microscopy (SEM) that is equipped with energy dispersive spectroscopy (EDS). An electrochemical corrosion test was carried out through Tafel polarisation method and calculation of protection efficiency against the base-material was determined. Results have indicated that uniform modified surface which is as the result of selective diffusion process, has enhanced corrosion resistance properties up to 12.67%. This approach has opened a new opportunity to access various industrial utilisations in commercial scale through minimising the dependency on natural resources by transforming waste sources into the protective coating in environmentally friendly and cost-effective ways.

Keywords: Aluminium bronze, waste-based surface modification, Tafel polarisation, corrosion resistance.

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5397 Framework for the Modeling of the Supply Chain Collaborative Planning Process

Authors: D. Pérez, M. M. E. Alemany

Abstract:

In this work, a framework to model the Supply Chain (SC) Collaborative Planning (CP) process is proposed. The main contributions of this framework concern 1) the presentation of the decision view, the most important one due to the characteristics of the process, jointly within the physical, organisation and information views, and 2) the simultaneous consideration of the spatial and temporal integration among the different supply chain decision centres. This framework provides the basis for a realistic and integrated perspective of the supply chain collaborative planning process and also the analytical modeling of each of its decisional activities.

Keywords: Collaborative Planning, Decision View, Distributed Decision-Making, Framework.

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5396 The Auto-Tuning PID Controller for Interacting Water Level Process

Authors: Satean Tunyasrirut, Tianchai Suksri, Arjin Numsomran, Supan Gulpanich, Kitti Tirasesth

Abstract:

This paper presents the approach to design the Auto- Tuning PID controller for interactive Water Level Process using integral step response. The Integral Step Response (ISR) is the method to model a dynamic process which can be done easily, conveniently and very efficiently. Therefore this method is advantage for design the auto tune PID controller. Our scheme uses the root locus technique to design PID controller. In this paper MATLAB is used for modeling and testing of the control system. The experimental results of the interacting water level process can be satisfyingly illustrated the transient response and the steady state response.

Keywords: Coupled-Tank, Interacting water level process, PIDController, Auto-tuning.

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5395 Diagnosis of Multivariate Process via Nonlinear Kernel Method Combined with Qualitative Representation of Fault Patterns

Authors: Hyun-Woo Cho

Abstract:

The fault detection and diagnosis of complicated production processes is one of essential tasks needed to run the process safely with good final product quality. Unexpected events occurred in the process may have a serious impact on the process. In this work, triangular representation of process measurement data obtained in an on-line basis is evaluated using simulation process. The effect of using linear and nonlinear reduced spaces is also tested. Their diagnosis performance was demonstrated using multivariate fault data. It has shown that the nonlinear technique based diagnosis method produced more reliable results and outperforms linear method. The use of appropriate reduced space yielded better diagnosis performance. The presented diagnosis framework is different from existing ones in that it attempts to extract the fault pattern in the reduced space, not in the original process variable space. The use of reduced model space helps to mitigate the sensitivity of the fault pattern to noise.

Keywords: Real-time Fault diagnosis, triangular representation of patterns in reduced spaces, Nonlinear kernel technique, multivariate statistical modeling.

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5394 Structural and Optical Characterization of Silica@PbS Core–Shell Nanoparticles

Authors: A. Pourahmad, Sh. Gharipour

Abstract:

The present work describes the preparation and characterization of nanosized SiO2@PbS core-shell particles by using a simple wet chemical route. This method utilizes silica spheres formation followed by successive ionic layer adsorption and reaction method assisted lead sulphide shell layer formation. The final product was characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), UV–vis spectroscopic, infrared spectroscopy (IR) and transmission electron microscopy (TEM) experiments. The morphological studies revealed the uniformity in size distribution with core size of 250 nm and shell thickness of 18 nm. The electron microscopic images also indicate the irregular morphology of lead sulphide shell layer. The structural studies indicate the face-centered cubic system of PbS shell with no other trace for impurities in the crystal structure.

Keywords: Core-shell, nanostructure, semiconductor, optical property, XRD.

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5393 Theory of Nanowire Radial p-n-Junction

Authors: Stepan Petrosyan, Ashkhen Yesayan, Suren Nersesyan

Abstract:

We have developed an analytic model for the radial pn-junction in a nanowire (NW) core-shell structure utilizing as a new building block in different semiconductor devices. The potential distribution through the p-n-junction is calculated and the analytical expressions are derived to compute the depletion region widths. We show that the widths of space charge layers, surrounding the core, are the functions of core radius, which is the manifestation of so called classical size effect. The relationship between the depletion layer width and the built-in potential in the asymptotes of infinitely large core radius transforms to square-root dependence specific for conventional planar p-n-junctions. The explicit equation is derived to compute the capacitance of radial p-n-junction. The current-voltage behavior is also carefully determined taking into account the “short base" effects.

Keywords: Snanowire, p-n- junction, barrier capacitance, high injection.

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5392 Short-Term Electric Load Forecasting Using Multiple Gaussian Process Models

Authors: Tomohiro Hachino, Hitoshi Takata, Seiji Fukushima, Yasutaka Igarashi

Abstract:

This paper presents a Gaussian process model-based short-term electric load forecasting. The Gaussian process model is a nonparametric model and the output of the model has Gaussian distribution with mean and variance. The multiple Gaussian process models as every hour ahead predictors are used to forecast future electric load demands up to 24 hours ahead in accordance with the direct forecasting approach. The separable least-squares approach that combines the linear least-squares method and genetic algorithm is applied to train these Gaussian process models. Simulation results are shown to demonstrate the effectiveness of the proposed electric load forecasting.

Keywords: Direct method, electric load forecasting, Gaussian process model, genetic algorithm, separable least-squares method.

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5391 Impact of Welding Wire Nickel Plating Process Parameters on Ni Layer Thickness

Authors: Sylwia Wiewiorowska, Zbigniew Muskalski

Abstract:

The article presents part of research on the development of nickel plated welding wire production technology, whose application will enable the elimination of the flaws of currently manufactured welding wires. The nickel plated welding wire will be distinguished by high quality, because the Ni layer which is deposited electrochemically onto it from acid baths is characterized by very good adhesion to the steel wire surface, while the ductile nickel well deforms plastically in the drawing process and the adhesion of the Ni layer increases in the drawing process due to the occurring process of diffusion between the Ni and the steel. The Ni layer obtained in the proposed technology, despite a smaller thickness than when the wire is coated with copper, is continuous and tight, thus ensuring high corrosion resistance, as well as unsusceptible to scaling, which should provide a product that meets requirements imposed by the market. The product will also reduce, to some extent, the amount of copper brought in to steel through recycling, while the wire coating nickel introduced to the weld in the welding process is expected, to a degree, to favorably influence its mechanical properties. The paper describes the tests of the process of nickel plating of f1.96 mm-diameter wires using various nickel plating baths with different process parameters.

Keywords: Steel wire, plating baths, welding process, coatings.

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5390 The Light Response Characteristics of Oxide-Based Thin Film Transistors

Authors: Soo-Yeon Lee, Seung-Min Song, Moon-Kyu Song, Woo-Geun Lee, Kap-Soo Yoon, Jang-Yeon Kwon, Min-Koo Han

Abstract:

We fabricated the inverted-staggered etch stopper structure oxide-based TFT and investigated the characteristics of oxide TFT under the 400 nm wavelength light illumination. When 400 nm light was illuminated, the threshold voltage (Vth) decreased and subthreshold slope (SS) increased at forward sweep, while Vth and SS were not altered when larger wavelength lights, such as 650 nm, 550 nm and 450 nm, were illuminated. At reverse sweep, the transfer curve barely changed even under 400 nm light. Our experimental results support that photo-induced hole carriers are captured by donor-like interface trap and it caused the decrease of Vth and increase of SS. We investigated the interface trap density increases proportionally to the photo-induced hole concentration at active layer.

Keywords: thin film transistor, oxide-based semiconductor, lightresponse

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5389 Fabrication and Characterization of Al/Methyl Orange/n-Si Heterojunction Diode

Authors: Muhammad Tahir, Muhammad H. Sayyad, Dil N. Khan, Fazal Wahab

Abstract:

Herein, the organic semiconductor methyl orange (MO), is investigated for the first time for its electronic applications. For this purpose, Al/MO/n-Si heterojunction is fabricated through economical cheap and simple “drop casting” technique. The currentvoltage (I-V) measurements of the device are made at room temperature under dark conditions. The I-V characteristics of Al/MO/n-Si junction exhibits asymmetrical and rectifying behavior that confirms the formation of diode. The diode parameters such as rectification ratio (RR), turn on voltage (Vturn on), reverse saturation current (I0), ideality factor (n), barrier height ( b f ), series resistance (Rs) and shunt resistance (Rsh) are determined from I-V curves using Schottky equations. These values of these parameters are also extracted and verified by applying Cheung’s functions. The conduction mechanisms are explained from the forward bias I-V characteristics using the power law.

Keywords: Electrical properties, Organic/inorganic heterojunction diode, Methyl Orange, Cheungs Functions

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5388 Study of the Effect of Inclusion of TiO2 in Active Flux on Submerged Arc Welding of Low Carbon Mild Steel Plate and Parametric Optimization of the Process by Using DEA Based Bat Algorithm

Authors: Sheetal Kumar Parwar, J. Deb Barma, A. Majumder

Abstract:

Submerged arc welding is a very complex process. It is a very efficient and high performance welding process. In this present study an attempt have been done to reduce the welding distortion by increased amount of oxide flux through TiO2 in submerged arc welding process. Care has been taken to avoid the excessiveness of the adding agent for attainment of significant results. Data Envelopment Analysis (DEA) based BAT algorithm is used for the parametric optimization purpose in which DEA is used to convert multi response parameters into a single response parameter. The present study also helps to know the effectiveness of the addition of TiO2 in active flux during submerged arc welding process.

Keywords: BAT algorithm, design of experiment, optimization, submerged arc welding.

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