Search results for: Tool-chip interface temperature.
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 3122

Search results for: Tool-chip interface temperature.

3092 Thermal Evaluation of Printed Circuit Board Design Options and Voids in Solder Interface by a Simulation Tool

Authors: B. Arzhanov, A. Correia, P. Delgado, J. Meireles

Abstract:

Quad Flat No-Lead (QFN) packages have become very popular for turners, converters and audio amplifiers, among others applications, needing efficient power dissipation in small footprints. Since semiconductor junction temperature (TJ) is a critical parameter in the product quality. And to ensure that die temperature does not exceed the maximum allowable TJ, a thermal analysis conducted in an earlier development phase is essential to avoid repeated re-designs process with huge losses in cost and time. A simulation tool capable to estimate die temperature of components with QFN package was developed. Allow establish a non-empirical way to define an acceptance criterion for amount of voids in solder interface between its exposed pad and Printed Circuit Board (PCB) to be applied during industrialization process, and evaluate the impact of PCB designs parameters. Targeting PCB layout designer as an end user for the application, a user-friendly interface (GUI) was implemented allowing user to introduce design parameters in a convenient and secure way and hiding all the complexity of finite element simulation process. This cost effective tool turns transparent a simulating process and provides useful outputs after acceptable time, which can be adopted by PCB designers, preventing potential risks during the design stage and make product economically efficient by not oversizing it. This article gathers relevant information related to the design and implementation of the developed tool, presenting a parametric study conducted with it. The simulation tool was experimentally validated using a Thermal-Test-Chip (TTC) in a QFN open-cavity, in order to measure junction temperature (TJ) directly on the die under controlled and knowing conditions. Providing a short overview about standard thermal solutions and impacts in exposed pad packages (i.e. QFN), accurately describe the methods and techniques that the system designer should use to achieve optimum thermal performance, and demonstrate the effect of system-level constraints on the thermal performance of the design.

Keywords: Quad Flat No-Lead packages, exposed pads, junction temperature, thermal management and measurements.

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3091 Experimental Investigation on the Effect of Bond Thickness on the Interface Behaviour of Fibre Reinforced Polymer Sheet Bonded to Timber

Authors: Abbas Vahedian, Rijun Shrestha, Keith Crews

Abstract:

The bond mechanism between timber and fibre reinforced polymer (FRP) is relatively complex and is influenced by a number of variables including bond thickness, bond width, bond length, material properties, and geometries. This study investigates the influence of bond thickness on the behaviour of interface, failure mode, and bond strength of externally bonded FRP-to-timber interface. In the present study, 106 single shear joint specimens have been investigated. Experiment results showed that higher layers of FRP increase the ultimate load carrying capacity of interface; conversely, such increase led to decrease the slip of interface. Moreover, samples with more layers of FRPs may fail in a brittle manner without noticeable warning that collapse is imminent.

Keywords: FRP, single shear test, bond thickness, bond strength.

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3090 Producing Graphical User Interface from Activity Diagrams

Authors: Ebitisam K. Elberkawi, Mohamed M. Elammari

Abstract:

Graphical User Interface (GUI) is essential to programming, as is any other characteristic or feature, due to the fact that GUI components provide the fundamental interaction between the user and the program. Thus, we must give more interest to GUI during building and development of systems. Also, we must give a greater attention to the user who is the basic corner in the dealing with the GUI. This paper introduces an approach for designing GUI from one of the models of business workflows which describe the workflow behavior of a system, specifically through Activity Diagrams (AD).

Keywords: Activity Diagram, Graphical User Interface.

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3089 Developing the Color Temperature Histogram Method for Improving the Content-Based Image Retrieval

Authors: P. Phokharatkul, S. Chaisriya, S. Somkuarnpanit, S. Phaiboon, C. Kimpan

Abstract:

This paper proposes a new method for image searches and image indexing in databases with a color temperature histogram. The color temperature histogram can be used for performance improvement of content–based image retrieval by using a combination of color temperature and histogram. The color temperature histogram can be represented by a range of 46 colors. That is more than the color histogram and the dominant color temperature. Moreover, with our method the colors that have the same color temperature can be separated while the dominant color temperature can not. The results showed that the color temperature histogram retrieved an accurate image more often than the dominant color temperature method or color histogram method. This also took less time so the color temperature can be used for indexing and searching for images.

Keywords: Color temperature histogram, color temperature, animage retrieval and content-based image retrieval.

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3088 Optical Wireless Sensor Networks Based on VLC with PLC-Ethernet Interface

Authors: Heejin Lee, Yeonjoo Kim, Kyungrak Sohn

Abstract:

We present a white LED-based optical wireless communication systems for indoor ubiquitous sensor networks. Each sensor node could access to the server through the PLC (Power Line Communication)-Ethernet interface. The proposed system offers a full-duplex wireless link by using different wavelengths to reduce the inter-symbol interference between uplink and downlink. Through the 1-to-n optical wireless sensor network and PLC modem, the mobile terminals send a temperature data to server. The data transmission speed and distance are 115.2kbps and about 60cm, respectively.

Keywords: Visible light communications, LED lighting, powerline communications, ubiquitous sensor networks, full-duplex links

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3087 A Capacitive Sensor Interface Circuit Based on Phase Differential Method

Authors: H. A. Majid, N. Razali, M. S. Sulaiman, A. K. A'ain

Abstract:

A new interface circuit for capacitive sensor is presented. This paper presents the design and simulation of soil moisture capacitive sensor interface circuit based on phase differential technique. The circuit has been designed and fabricated using MIMOS- 0.35"m CMOS technology. Simulation and test results show linear characteristic from 36 – 52 degree phase difference, representing 0 – 100% in soil moisture level. Test result shows the circuit has sensitivity of 0.79mV/0.10 phase difference, translating into resolution of 10% soil moisture level.

Keywords: Capacitive sensor, interface, phase differential.

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3086 Monitorization of Junction Temperature Using a Thermal-Test-Device

Authors: B. Arzhanov, A. Correia, P. Delgado, J. Meireles

Abstract:

Due to the higher power loss levels in electronic components, the thermal design of PCBs (Printed Circuit Boards) of an assembled device becomes one of the most important quality factors in electronics. Nonetheless, some of leading causes of the microelectronic component failures are due to higher temperatures, the leakages or thermal-mechanical stress, which is a concern, is the reliability of microelectronic packages. This article presents an experimental approach to measure the junction temperature of exposed pad packages. The implemented solution is in a prototype phase, using a temperature-sensitive parameter (TSP) to measure temperature directly on the die, validating the numeric results provided by the Mechanical APDL (Ansys Parametric Design Language) under same conditions. The physical device-under-test is composed by a Thermal Test Chip (TTC-1002) and assembly in a QFN cavity, soldered to a test-board according to JEDEC Standards. Monitoring the voltage drop across a forward-biased diode, is an indirectly method but accurate to obtain the junction temperature of QFN component with an applied power range between 0,3W to 1.5W. The temperature distributions on the PCB test-board and QFN cavity surface were monitored by an infra-red thermal camera (Goby-384) controlled and images processed by the Xeneth software. The article provides a set-up to monitorize in real-time the junction temperature of ICs, namely devices with the exposed pad package (i.e. QFN). Presenting the PCB layout parameters that the designer should use to improve thermal performance, and evaluate the impact of voids in solder interface in the device junction temperature.

Keywords: Quad Flat No-Lead packages, exposed pads, junction temperature, thermal management, measurements.

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3085 Low Power Capacitance-to-Voltage Converter for Magnetometer Interface IC

Authors: Dipankar Nag, Choe Andrew Kunil, Kevin Chai Tshun Chuan, Minkyu Je

Abstract:

This paper presents the design and implementation of a fully integrated Capacitance-to-Voltage Converter (CVC) as the analog front-end for magnetometer interface IC. The application demands very low power solution operating in the frequency of around 20 KHz. The design adapts low power architecture to create low noise electronic interface for Capacitive Micro-machined Lorentz force magnetometer sensor. Using a 0.18-μm CMOS process, simulation results of this interface IC show that the proposed CVC can provide 33 dB closed loop gain, 20 nV/√Hz input referred noise at 20 KHz, while consuming 65 μA current from 1.8-V supply. 

Keywords: Analog front end, Capacitance-to-Voltage Converter, Magnetometer, MEMS, Recycling Folded Cascode.

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3084 An AR/VR Based Approach Towards the Intuitive Control of Mobile Rescue Robots

Authors: Jürgen Roßmann, André Kupetz, Roland Wischnewski

Abstract:

An intuitive user interface for the teleoperation of mobile rescue robots is one key feature for a successful exploration of inaccessible and no-go areas. Therefore, we have developed a novel framework to embed a flexible and modular user interface into a complete 3-D virtual reality simulation system. Our approach is based on a client-server architecture to allow for a collaborative control of the rescue robot together with multiple clients on demand. Further, it is important that the user interface is not restricted to any specific type of mobile robot. Therefore, our flexible approach allows for the operation of different robot types with a consistent concept and user interface. In laboratory tests, we have evaluated the validity and effectiveness of our approach with the help of two different robot platforms and several input devices. As a result, an untrained person can intuitively teleoperate both robots without needing a familiarization time when changing the operating robot.

Keywords: Teleoperation of mobile robots, augmented reality, user interface, virtual reality.

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3083 Micromechanics of Stress Transfer across the Interface Fiber-Matrix Bonding

Authors: Fatiha Teklal, Bachir Kacimi, Arezki Djebbar

Abstract:

The study and application of composite materials are a truly interdisciplinary endeavor that has been enriched by contributions from chemistry, physics, materials science, mechanics and manufacturing engineering. The understanding of the interface (or interphase) in composites is the central point of this interdisciplinary effort. From the early development of composite materials of various nature, the optimization of the interface has been of major importance. Even more important, the ideas linking the properties of composites to the interface structure are still emerging. In our study, we need a direct characterization of the interface; the micromechanical tests we are addressing seem to meet this objective and we chose to use two complementary tests simultaneously. The microindentation test that can be applied to real composites and the drop test, preferred to the pull-out because of the theoretical possibility of studying systems with high adhesion (which is a priori the case with our systems). These two tests are complementary because of the principle of the model specimen used for both the first "compression indentation" and the second whose fiber is subjected to tensile stress called the drop test. Comparing the results obtained by the two methods can therefore be rewarding.

Keywords: Interface, micromechanics, pull-out, composite, fiber, matrix.

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3082 Influence of Cyclic Thermal Loading on Fatigue Behavior of Thermal Barrier Coatings

Authors: Vidyasagar H. N., S. Gopal Prakash, Shivrudraiah, K. V. Sharma

Abstract:

Thermally insulating ceramic coatings also known as thermal barrier coatings (TBCs) have been essential technologies to improve the performance and efficiency of advanced gas turbines in service at extremely high temperatures. The damage mechanisms of air-plasma sprayed YSZ thermal barrier coatings (TBC) with various microstructures were studied by microscopic techniques after thermal cycling. The typical degradation of plasma TBCs that occurs during cyclic furnace testing of an YSZ and alumina coating on a Titanium alloy are analyzed. During the present investigation the effects of topcoat thickness, bond coat oxidation, thermal cycle lengths and test temperature are investigated using thermal cycling. These results were correlated with stresses measured by a spectroscopic technique in order to understand specific damage mechanism. The failure mechanism of former bond coats was found to involve fracture initiation at the thermally grown oxide (TGO) interface and at the TGO bond coat interface. The failure mechanism of the YZ was found to involve combination of fracture along the interface between TGO and bond coat.

Keywords: Thermal barrier coatings, thermal loading.

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3081 A High Level Implementation of a High Performance Data Transfer Interface for NoC

Authors: Mansi Jhamb, R. K. Sharma, A. K. Gupta

Abstract:

The distribution of a single global clock across a chip has become the major design bottleneck for high performance VLSI systems owing to the power dissipation, process variability and multicycle cross-chip signaling. A Network-on-Chip (NoC) architecture partitioned into several synchronous blocks has become a promising approach for attaining fine-grain power management at the system level. In a NoC architecture the communication between the blocks is handled asynchronously. To interface these blocks on a chip operating at different frequencies, an asynchronous FIFO interface is inevitable. However, these asynchronous FIFOs are not required if adjacent blocks belong to the same clock domain. In this paper, we have designed and analyzed a 16-bit asynchronous micropipelined FIFO of depth four, with the awareness of place and route on an FPGA device. We have used a commercially available Spartan 3 device and designed a high speed implementation of the asynchronous 4-phase micropipeline. The asynchronous FIFO implemented on the FPGA device shows 76 Mb/s throughput and a handshake cycle of 109 ns for write and 101.3 ns for read at the simulation under the worst case operating conditions (voltage = 0.95V) on a working chip at the room temperature.

Keywords: Asynchronous, FIFO, FPGA, GALS, Network-on- Chip (NoC), VHDL.

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3080 Dissimilar Materials Joint and Effect of Angle Junction on Stress Distribution at Interface

Authors: Ali Baladi, Alireza Fallahi Arezoodar

Abstract:

in dissimilar material joints, failure often occurs along the interface between two materials due to stress singularity. Stress distribution and its concentration depend on materials and geometry of the junction. Inhomogenity of stress distribution at the interface of junction of two materials with different elastic modules and stress concentration in this zone are the main factors resulting in rupture of the junction. Effect of joining angle in the interface of aluminum-polycarbonate will be discussed in this paper. Computer simulation and finite element analysis by ABAQUS showed that convex interfacial joint leads to stress reduction at junction corners in compare with straight joint. This finding is confirmed by photoelastic experimental results.

Keywords: Elastic Modules, Stress Concentration, JoiningAngle, Photoelastic.

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3079 Automatic Rearrangement of Localized Graphical User Interface

Authors: Ágoston Winkler, Sándor Juhász

Abstract:

The localization of software products is essential for reaching the users of the international market. An important task for this is the translation of the user interface into local national languages. As graphical interfaces are usually optimized for the size of the texts in the original language, after the translation certain user controls (e.g. text labels and buttons in dialogs) may grow in such a manner that they slip above each other. This not only causes an unpleasant appearance but also makes the use of the program more difficult (or even impossible) which implies that the arrangement of the controls must be corrected subsequently. The correction should preserve the original structure of the interface (e.g. the relation of logically coherent controls), furthermore, it is important to keep the nicely proportioned design: the formation of large empty areas should be avoided. This paper describes an algorithm that automatically rearranges the controls of a graphical user interface based on the principles above. The algorithm has been implemented and integrated into a translation support system and reached results pleasant for the human eye in most test cases.

Keywords: Graphical user interface, GUI, natural languages, software localization, translation support systems.

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3078 Isotropic Stress Distribution in Cu/(001) Fe Two Sheets

Authors: A. Derardja, L. Baroura, M. Brioua

Abstract:

The nanotechnology based on epitaxial systems includes single or arranged misfit dislocations. In general, whatever is the type of dislocation or the geometry of the array formed by the dislocations; it is important for experimental studies to know exactly the stress distribution for which there is no analytical expression [1, 2]. This work, using a numerical analysis, deals with relaxation of epitaxial layers having at their interface a periodic network of edge misfit dislocations. The stress distribution is estimated by using isotropic elasticity. The results show that the thickness of the two sheets is a crucial parameter in the stress distributions and then in the profile of the two sheets. A comparative study between the case of single dislocation and the case of parallel network shows that the layers relaxed better when the interface is covered by a parallel arrangement of misfit. Consequently, a single dislocation at the interface produces an important stress field which can be reduced by inserting a parallel network of dislocations with suitable periodicity.

Keywords: Parallel array of misfit, interface, isotropic elasticity, single crystalline substrates, coherent interface

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3077 Ab Initio Molecular Dynamics Simulations of Furfural at the Liquid-Solid Interface

Authors: Sanwu Wang, Hongli Dang, Wenhua Xue, Darwin Shields, Xin Liu, Friederike C. Jentoft, Daniel E. Resasco

Abstract:

The bonding configuration and the heat of adsorption of a furfural molecule on the Pd(111) surface were determined by ab initio density-functional-theory calculations. The dynamics of pure liquid water, the liquid-solid interface formed by liquid water and the Pd(111) surface, as well as furfural at the water-Pd interface, were investigated by ab initio molecular dynamics simulations at finite temperatures. Calculations and simulations suggest that the bonding configurations at the water-Pd interface promote decarbonylation of furfural.

Keywords: Ab initio molecular dynamics simulations, bio-fuels, density functional theory, liquid-solid interfaces.

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3076 Investigation of Stoneley Waves in Multilayered Plates

Authors: Bing Li, Tong Lu, Lei Qiang

Abstract:

Stoneley waves are interface waves that propagate at the interface between two solid media. In this study, the dispersion characteristics and wave structures of Stoneley waves in elastic multilayered plates are displayed and investigated. With a perspective of bulk wave, a reasonable assumption of the potential function forms of the expansion wave and shear wave in nth layer medium is adopted, and the characteristic equation of Stoneley waves in a three-layered plate is given in a determinant form. The dispersion curves and wave structures are solved and presented in both numerical and simulation results. It is observed that two Stoneley wave modes exist in a three-layered plate, that conspicuous dispersion occurs on low frequency band, that the velocity of each Stoneley wave mode approaches the corresponding Stoneley wave velocity at interface between two half infinite spaces. The wave structures reveal that the in-plane displacement of Stoneley waves are relatively high at interfaces, which shows great potential for interface defects detection.

Keywords: Characteristic equation, interface waves, dispersion curves, potential function, Stoneley waves, wave structures.

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3075 Influence of Flash Temperature on Exergetical Performance of Organic Flash Cycle

Authors: Kyoung Hoon Kim, Chul Ho Han

Abstract:

Organic Flash Cycle (OFC) has potential of improving efficiency for recovery of low temperature heat sources mainly due to reducing temperature mismatch in the heat exchanger. In this work exergetical performance analysis of ORC is conducted for recovery of low grade heat source. Effects of system parameters such as flash evaporation temperature or heating temperature are theoretically investigated on the exergy destructions (anergies) at various components of the system as well as exergy efficiency. Results show that exergy efficiency has a peak with respect to the flash temperature, and the optimum flash temperature increases with the heating temperature. The component where the largest exergy destruction occurs varies with the flash temperature or heating temperature.

Keywords: Organic flash cycle (OFC), low grade heat source, exergy, anergy, flash temperature.

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3074 Numerical Study of Vortex Formation inside a Stirred Tank

Authors: Divya Rajavathsavai, Akhilesh Khapre, Basudeb Munshi

Abstract:

The computational fluid dynamics (CFD) study of stirred tank with the air-water interface are carried out in the presence of different types of the impeller and with or without baffles. A multiple reference frame (MRF) approach with the volume of fluid (VOF) method is used to capture the air-water interface. The RANS (Reynolds Averaged Navier-Stokes) equations with k-ε turbulence model are solved to predict the flow behavior of water and air phase which are treated as a different phases. The predicted results have shown that the VOF method is able to capture the interface in the unbaffled tank. While, the VOF method is showing an unfeasible results in the baffled tank with high rotational impeller speed. For continuous stirred tank, the air-water interface is disturbed by the inflow and the level of water is also increased with time.

Keywords: Computational Fluid Dynamics, stirred tank, airwater interface, multiple reference frame, volume of fluid, Reynolds Averaged Navier-Stokes equations.

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3073 Effect of Laser Input Energy on the Laser Joining of Polyethylene Terephthalate to Titanium

Authors: Y. J. Chen, T. M. Yue, Z. N. Guo

Abstract:

This paper reports the effects of laser energy on the characteristics of bubbles generated in the weld zone and the formation of new chemical bonds at the Polyethylene Terephthalate (PET)/Ti joint interface in laser joining of PET to Ti. The samples were produced by using different laser energies ranging from 1.5 J – 6 J in steps of 1.5 J, while all other joining parameters remained unchanged. The types of chemical bonding at the joint interface were analysed by the x-ray photoelectron spectroscopy (XPS) depth-profiling method. The results show that the characteristics of the bubbles and the thickness of the chemically bonded interface, which contains the laser generated bonds of Ti–C and Ti–O, increase markedly with increasing laser energy input. The tensile failure load of the joint depends on the combined effect of the amount and distribution of the bubbles formed and the chemical bonding intensity of the joint interface.

Keywords: Laser direct joining, Ti/PET interface, laser energy, XPS depth profiling, chemical bond, tensile failure load.

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3072 Richtmyer-Meshkov Instability and Gas-Particle Interaction of Contoured Shock-Tube Flows: A Numerical Study

Authors: Yi Liu

Abstract:

In this paper, computational fluid dynamics (CFD) is utilized to characterize a prototype biolistic delivery system, the biomedical device based on the contoured-shock-tube design (CST), with the aim at investigating shocks induced flow instabilities within the contoured shock tube. The shock/interface interactions, the growth of perturbation at an interface between two fluids of different density are interrogated. The key features of the gas dynamics and gas-particle interaction are discussed

Keywords: Simulation, Shock wave, Particle, Interface, Supersonic, Richtmyer-Meshkov Instability

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3071 Experimental Investigations on the Mechanism of Stratified Liquid Mixing in a Cylinder

Authors: Chai Mingming, Li Lei, Lu Xiaoxia

Abstract:

In this paper, the mechanism of stratified liquids’ mixing in a cylinder is investigated. It is focused on the effects of Rayleigh-Taylor Instability (RTI) and rotation of the cylinder on liquid interface mixing. For miscible liquids, Planar Laser Induced Fluorescence (PLIF) technique is applied to record the concentration field for one liquid. Intensity of Segregation (IOS) is used to describe the mixing status. For immiscible liquids, High Speed Camera is adopted to record the development of the interface. The experiment of RTI indicates that it plays a great role in the mixing process, and meanwhile the large-scale mixing is triggered, and subsequently the span of the stripes decreases, showing that the mesoscale mixing is coming into being. The rotation experiments show that the spin-down process has a great role in liquid mixing, during which the upper liquid falls down rapidly along the wall and crashes into the lower liquid. During this process, a lot of interface instabilities are excited. Liquids mix rapidly in the spin-down process. It can be concluded that no matter what ways have been adopted to speed up liquid mixing, the fundamental reason is the interface instabilities which increase the area of the interface between liquids and increase the relative velocity of the two liquids.

Keywords: Interface instability, liquid mixing, Rayleigh-Taylor Instability, spin-down process, spin-up process.

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3070 An Efficient Run Time Interface for Heterogeneous Architecture of Large Scale Supercomputing System

Authors: Prabu D., Andrew Aaron James, Vanamala V., Vineeth Simon, Sanjeeb Kumar Deka, Sridharan R., Prahlada Rao B.B., Mohanram N.

Abstract:

In this paper we propose a novel Run Time Interface (RTI) technique to provide an efficient environment for MPI jobs on the heterogeneous architecture of PARAM Padma. It suggests an innovative, unified framework for the job management interface system in parallel and distributed computing. This approach employs proxy scheme. The implementation shows that the proposed RTI is highly scalable and stable. Moreover RTI provides the storage access for the MPI jobs in various operating system platforms and improve the data access performance through high performance C-DAC Parallel File System (C-PFS). The performance of the RTI is evaluated by using the standard HPC benchmark suites and the simulation results show that the proposed RTI gives good performance on large scale supercomputing system.

Keywords: RTI, C-MPI, C-PFS, Scheduler Interface.

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3069 A High Performance MPI for Parallel and Distributed Computing

Authors: Prabu D., Vanamala V., Sanjeeb Kumar Deka, Sridharan R., Prahlada Rao B. B., Mohanram N.

Abstract:

Message Passing Interface is widely used for Parallel and Distributed Computing. MPICH and LAM are popular open source MPIs available to the parallel computing community also there are commercial MPIs, which performs better than MPICH etc. In this paper, we discuss a commercial Message Passing Interface, CMPI (C-DAC Message Passing Interface). C-MPI is an optimized MPI for CLUMPS. It is found to be faster and more robust compared to MPICH. We have compared performance of C-MPI and MPICH on Gigabit Ethernet network.

Keywords: C-MPI, C-VIA, HPC, MPICH, P-COMS, PMB

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3068 Interface Analysis of Annealed Al/Cu Cladded Sheet

Authors: Joon Ho Kim, Tae Kwon Ha

Abstract:

Effect of aging treatment on microstructural aspects of interfacial layers of the Cu/Al clad sheet produced by differential speed rolling (DSR) process were studied by electron back scattered diffraction (EBSD). Clad sheet of Al/Cu has been fabricated by using DSR, which caused severe shear deformation between Al and Cu plate to easily bond to each other. Rolling was carried out at 100oC with speed ratio of 2, in which the total thickness reduction was 45%. Interface layers of clad sheet were analyzed by EBSD after subsequent annealing at 400oC for 30 to 120min. With increasing annealing time, thickness of interface layer and fraction of high angle grain boundary were increased and average grain size was decreased.

Keywords: Aluminum/Copper clad sheet, differential speed rolling, interface layer, microstructure, annealing, electron back scattered diffraction.

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3067 From Modeling of Data Structures towards Automatic Programs Generating

Authors: Valentin P. Velikov

Abstract:

Automatic program generation saves time, human resources, and allows receiving syntactically clear and logically correct modules. The 4-th generation programming languages are related to drawing the data and the processes of the subject area, as well as, to obtain a frame of the respective information system. The application can be separated in interface and business logic. That means, for an interactive generation of the needed system to be used an already existing toolkit or to be created a new one.

Keywords: Computer science, graphical user interface, user dialog interface, dialog frames, data modeling, subject area modeling.

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3066 FACTS Based Stabilization for Smart Grid Applications

Authors: Adel M. Sharaf, Foad H. Gandoman

Abstract:

Nowadays, Photovoltaic-PV Farms/ Parks and large PV-Smart Grid Interface Schemes are emerging and commonly utilized in Renewable Energy distributed generation. However, PVhybrid- Dc-Ac Schemes using interface power electronic converters usually has negative impact on power quality and stabilization of modern electrical network under load excursions and network fault conditions in smart grid. Consequently, robust FACTS based interface schemes are required to ensure efficient energy utilization and stabilization of bus voltages as well as limiting switching/fault onrush current condition. FACTS devices are also used in smart grid- Battery Interface and Storage Schemes with PV-Battery Storage hybrid systems as an elegant alternative to renewable energy utilization with backup battery storage for electric utility energy and demand side management to provide needed energy and power capacity under heavy load conditions. The paper presents a robust interface PV-Li-Ion Battery Storage Interface Scheme for Distribution/Utilization Low Voltage Interface using FACTS stabilization enhancement and dynamic maximum PV power tracking controllers. Digital simulation and validation of the proposed scheme is done using MATLAB/Simulink software environment for Low Voltage- Distribution/Utilization system feeding a hybrid Linear-Motorized inrush and nonlinear type loads from a DC-AC Interface VSC-6- pulse Inverter Fed from the PV Park/Farm with a back-up Li-Ion Storage Battery.

Keywords: AC FACTS, Smart grid, Stabilization, PV-Battery Storage, Switched Filter-Compensation (SFC).

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3065 Numerical Simulation of the Liquid-Vapor Interface Evolution with Material Properties

Authors: Kimou Kouadio Prosper, Souleymane Oumtanaga, Tety Pierre, Adou Kablan Jérôme

Abstract:

A satured liquid is warmed until boiling in a parallelepipedic boiler. The heat is supplied in a liquid through the horizontal bottom of the boiler, the other walls being adiabatic. During the process of boiling, the liquid evaporates through its free surface by deforming it. This surface which subdivides the boiler into two regions occupied on both sides by the boiled liquid (broth) and its vapor which surmounts it. The broth occupying the region and its vapor the superior region. A two- fluids model is used to describe the dynamics of the broth, its vapor and their interface. In this model, the broth is treated as a monophasic fluid (homogeneous model) and form with its vapor adiphasic pseudo fluid (two-fluid model). Furthermore, the interface is treated as a zone of mixture characterized by superficial void fraction noted α* . The aim of this article is to describe the dynamics of the interface between the boiled fluid and its vapor within a boiler. The resolution of the problem allowed us to show the evolution of the broth and the level of the liquid.

Keywords: Two-fluid models, homogeneous model, interface, averaged equations, Jumps conditions, void fraction.

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3064 An Approach to Task Modeling for User Interface Design

Authors: Costin Pribeanu

Abstract:

The model-based approach to user interface design relies on developing separate models capturing various aspects about users, tasks, application domain, presentation and dialog structures. This paper presents a task modeling approach for user interface design and aims at exploring mappings between task, domain and presentation models. The basic idea of our approach is to identify typical configurations in task and domain models and to investigate how they relate each other. A special emphasis is put on applicationspecific functions and mappings between domain objects and operational task structures. In this respect, we will address two layers in task decomposition: a functional (planning) layer and an operational layer.

Keywords: task modeling, user interface design, unit tasks, basic tasks, operational task model.

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3063 Temperature Profile Modelling in Flexible Pavement Design

Authors: Csaba Tóth, Éva Lakatos, László Pethő, Seoyoung Cho

Abstract:

The temperature effect on asphalt pavement structure is a crucial factor at the design stage. In this paper, by applying the German guidelines for temperature along the asphalt depth is estimated. The aim is to consider temperature profiles in different seasons in numerical modelling. The model is built with an elastic and isotropic solid element with 19 subdivisions of asphalt layers to reflect the temperature variation. Comparison with the simple three-layer pavement system (asphalt layers, base, and subgrade layers) will be followed to see the difference in result without temperature variation along with the depth. Finally, the fatigue life calculation was checked to prove the validity of the methodology of considering the temperature in the numerical modelling.

Keywords: Temperature profile, flexible pavement modelling, finite element method, temperature modelling.

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