Search results for: Semiconductor Manufacturing Process.
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 5928

Search results for: Semiconductor Manufacturing Process.

5868 Knowledge Sharing based on Semantic Nets and Mereology to Avoid Risks in Manufacturing

Authors: Ulrich Berger, Yuliya Lebedynska, Veronica Vargas

Abstract:

The right information at the right time influences the enterprise and technical success. Sharing knowledge among members of a big organization may be a complex activity. And as long as the knowledge is not shared, can not be exploited by the organization. There are some mechanisms which can originate knowledge sharing. It is intended, in this paper, to trigger these mechanisms by using semantic nets. Moreover, the intersection and overlapping of terms and sub-terms, as well as their relationships will be described through the mereology science for the whole knowledge sharing system. It is proposed a knowledge system to supply to operators with the right information about a specific process and possible risks, e.g. at the assembly process, at the right time in an automated manufacturing environment, such as at the automotive industry.

Keywords: Automated manufacturing, knowledge sharing, mereology, risk management, semantic net.

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5867 A CUSUM Control Chart to Monitor Wafer Quality

Authors: Sheng-Shu Cheng, Fong-Jung Yu

Abstract:

C-control chart assumes that process nonconformities follow a Poisson distribution. In actuality, however, this Poisson distribution does not always occur. A process control for semiconductor based on a Poisson distribution always underestimates the true average amount of nonconformities and the process variance. Quality is described more accurately if a compound Poisson process is used for process control at this time. A cumulative sum (CUSUM) control chart is much better than a C control chart when a small shift will be detected. This study calculates one-sided CUSUM ARLs using a Markov chain approach to construct a CUSUM control chart with an underlying Poisson-Gamma compound distribution for the failure mechanism. Moreover, an actual data set from a wafer plant is used to demonstrate the operation of the proposed model. The results show that a CUSUM control chart realizes significantly better performance than EWMA.

Keywords: Nonconformities, Compound Poisson distribution, CUSUM control chart.

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5866 Real-Time Testing of Steel Strip Welds based on Bayesian Decision Theory

Authors: Julio Molleda, Daniel F. García, Juan C. Granda, Francisco J. Suárez

Abstract:

One of the main trouble in a steel strip manufacturing line is the breakage of whatever weld carried out between steel coils, that are used to produce the continuous strip to be processed. A weld breakage results in a several hours stop of the manufacturing line. In this process the damages caused by the breakage must be repaired. After the reparation and in order to go on with the production it will be necessary a restarting process of the line. For minimizing this problem, a human operator must inspect visually and manually each weld in order to avoid its breakage during the manufacturing process. The work presented in this paper is based on the Bayesian decision theory and it presents an approach to detect, on real-time, steel strip defective welds. This approach is based on quantifying the tradeoffs between various classification decisions using probability and the costs that accompany such decisions.

Keywords: Classification, Pattern Recognition, ProbabilisticReasoning, Statistical Data Analysis.

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5865 Application of Machine Learning Methods to Online Test Error Detection in Semiconductor Test

Authors: Matthias Kirmse, Uwe Petersohn, Elief Paffrath

Abstract:

As in today's semiconductor industries test costs can make up to 50 percent of the total production costs, an efficient test error detection becomes more and more important. In this paper, we present a new machine learning approach to test error detection that should provide a faster recognition of test system faults as well as an improved test error recall. The key idea is to learn a classifier ensemble, detecting typical test error patterns in wafer test results immediately after finishing these tests. Since test error detection has not yet been discussed in the machine learning community, we define central problem-relevant terms and provide an analysis of important domain properties. Finally, we present comparative studies reflecting the failure detection performance of three individual classifiers and three ensemble methods based upon them. As base classifiers we chose a decision tree learner, a support vector machine and a Bayesian network, while the compared ensemble methods were simple and weighted majority vote as well as stacking. For the evaluation, we used cross validation and a specially designed practical simulation. By implementing our approach in a semiconductor test department for the observation of two products, we proofed its practical applicability.

Keywords: Ensemble methods, fault detection, machine learning, semiconductor test.

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5864 Multicasting Characteristics of All-Optical Triode Based On Negative Feedback Semiconductor Optical Amplifiers

Authors: S. Aisyah Azizan, M. Syafiq Azmi, Yuki Harada, Yoshinobu Maeda, Takaomi Matsutani

Abstract:

We introduced an all-optical multicasting characteristics with wavelength conversion based on a novel all-optical triode using negative feedback semiconductor optical amplifier. This study was demonstrated with a transfer speed of 10 Gb/s to a non-return zero 231-1 pseudorandom bit sequence system. This multi-wavelength converter device can simultaneously provide three channels of output signal with the support of non-inverted and inverted conversion. We studied that an all-optical multicasting and wavelength conversion accomplishing cross gain modulation is effective in a semiconductor optical amplifier which is effective to provide an inverted conversion thus negative feedback. The relationship of received power of back to back signal and output signals with wavelength 1535 nm, 1540 nm, 1545 nm, 1550 nm, and 1555 nm with bit error rate was investigated. It was reported that the output signal wavelengths were successfully converted and modulated with a power penalty of less than 8.7 dB, which the highest is 8.6 dB while the lowest is 4.4 dB. It was proved that all-optical multicasting and wavelength conversion using an optical triode with a negative feedback by three channels at the same time at a speed of 10 Gb/s is a promising device for the new wavelength conversion technology.

Keywords: Cross gain modulation, multicasting, negative feedback optical amplifier, semiconductor optical amplifier.

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5863 Systematic Mapping Study of Digitization and Analysis of Manufacturing Data

Authors: R. Clancy, M. Ahern, D. O’Sullivan, K. Bruton

Abstract:

The manufacturing industry is currently undergoing a digital transformation as part of the mega-trend Industry 4.0. As part of this phase of the industrial revolution, traditional manufacturing processes are being combined with digital technologies to achieve smarter and more efficient production. To successfully digitally transform a manufacturing facility, the processes must first be digitized. This is the conversion of information from an analogue format to a digital format. The objective of this study was to explore the research area of digitizing manufacturing data as part of the worldwide paradigm, Industry 4.0. The formal methodology of a systematic mapping study was utilized to capture a representative sample of the research area and assess its current state. Specific research questions were defined to assess the key benefits and limitations associated with the digitization of manufacturing data. Research papers were classified according to the type of research and type of contribution to the research area. Upon analyzing 54 papers identified in this area, it was noted that 23 of the papers originated in Germany. This is an unsurprising finding as Industry 4.0 is originally a German strategy with supporting strong policy instruments being utilized in Germany to support its implementation. It was also found that the Fraunhofer Institute for Mechatronic Systems Design, in collaboration with the University of Paderborn in Germany, was the most frequent contributing Institution of the research papers with three papers published. The literature suggested future research directions and highlighted one specific gap in the area. There exists an unresolved gap between the data science experts and the manufacturing process experts in the industry. The data analytics expertise is not useful unless the manufacturing process information is utilized. A legitimate understanding of the data is crucial to perform accurate analytics and gain true, valuable insights into the manufacturing process. There lies a gap between the manufacturing operations and the information technology/data analytics departments within enterprises, which was borne out by the results of many of the case studies reviewed as part of this work. To test the concept of this gap existing, the researcher initiated an industrial case study in which they embedded themselves between the subject matter expert of the manufacturing process and the data scientist. Of the papers resulting from the systematic mapping study, 12 of the papers contributed a framework, another 12 of the papers were based on a case study, and 11 of the papers focused on theory. However, there were only three papers that contributed a methodology. This provides further evidence for the need for an industry-focused methodology for digitizing and analyzing manufacturing data, which will be developed in future research.

Keywords: Analytics, digitization, industry 4.0, manufacturing.

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5862 Justification and Classification of Issues for the Selection and Implementation of Advanced Manufacturing Technologies

Authors: Zahra Banakar, Farzad Tahriri

Abstract:

It has often been said that the strength of any country resides in the strength of its industrial sector, and Progress in industrial society has been accomplished by the creation of new technologies. Developments have been facilitated by the increasing availability of advanced manufacturing technology (AMT), in addition the implementation of advanced manufacturing technology (AMT) requires careful planning at all levels of the organization to ensure that the implementation will achieve the intended goals. Justification and implementation of advanced manufacturing technology (AMT) involves decisions that are crucial for the practitioners regarding the survival of business in the present days of uncertain manufacturing world. This paper assists the industrial managers to consider all the important criteria for success AMT implementation, when purchasing new technology. Concurrently, this paper classifies the tangible benefits of a technology that are evaluated by addressing both cost and time dimensions, and the intangible benefits are evaluated by addressing technological, strategic, social and human issues to identify and create awareness of the essential elements in the AMT implementation process and identify the necessary actions before implementing AMT.

Keywords: Advanced Manufacturing Technology (AMT), Justification and Classification.

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5861 Semiconductor Supported Gold Nanoparticles for Photodegradation of Rhodamine B

Authors: Ahmad Alshammari, Abdulaziz Bagabas

Abstract:

Rhodamine B (RB) is a toxic dye used extensively in textile industry, which must be remediated before its drainage to environment. In the present study, supported gold nanoparticles on commercially available titania and zincite were successfully prepared and then their activity on the photodegradation of RB under UV A light irradiation were evaluated. The synthesized photocatalysts were characterized by ICP, BET, XRD, and TEM. Kinetic results showed that Au/TiO2 was an inferior photocatalyst to Au/ZnO. This observation could be attributed to the strong reflection of UV irradiation by gold nanoparticles over TiO2 support.

Keywords: Supported AuNPs, Semiconductor photocatalyst, Photodegradation, Rhodamine B.

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5860 Efficiency Enhancement of PWM Controlled Water Electrolysis Cells

Authors: S.K. Mazloomi, Nasri b. Sulaiman

Abstract:

By analyzing the sources of energy and power loss in PWM (Pulse Width Modulation) controlled drivers of water electrolysis cells, it is possible to reduce the power dissipation and enhance the efficiency of such hydrogen production units. A PWM controlled power driver is based on a semiconductor switching element where its power dissipation might be a remarkable fraction of the total power demand of an electrolysis system. Power dissipation in a semiconductor switching element is related to many different parameters which could be fitted into two main categories: switching losses and conduction losses. Conduction losses are directly related to the built, structure and capabilities of a switching device itself and indeed the conditions in which the element is handling the switching application such as voltage, current, temperature and of course the fabrication technology. On the other hand, switching losses have some other influencing variables other than the mentioned such as control system, switching method and power electronics circuitry of the PWM power driver. By analyzings the characteristics of recently developed power switching transistors from different families of Bipolar Junction Transistors (BJT), Metal Oxide Semiconductor Field Effect Transistors (MOSFET) and Insulated Gate Bipolar Transistors (IGBT), some recommendations are made in this paper which are able to lead to achieve higher hydrogen production efficiency by utilizing PWM controlled water electrolysis cells.

Keywords: Power switch, PWM, Semiconductor switch, Waterelectrolysis

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5859 Simulation Modeling and Analysis of In-Plant Logistics at a Cement Manufacturing Plant in India

Authors: Sachin Kamble, Shradha Gawankar

Abstract:

This paper presents the findings of successful implementation of Business Process Reengineering (BPR) of cement dispatch activities in a cement manufacturing plant located in India. Simulation model was developed for the purpose of identifying and analyzing the areas for improvement. The company was facing a problem of low throughput rate and subsequent forced stoppages of the plant leading to a high production loss of 15000MT per month. It was found from the study that the present systems and procedures related to the in-plant logistics plant required significant changes. The major recommendations included process improvement at the entry gate, reducing the cycle time at the security gate and installation of an additional weigh bridge. This paper demonstrates how BPR can be implemented for improving the in-plant logistics process. Various recommendations helped the plant to increase its throughput by 14%.

Keywords: Business process reengineering, simulation modeling, in-plant logistics, distribution process, cement industry.

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5858 Digital Manufacturing: Evolution and a Process Oriented Approach to Align with Business Strategy

Authors: Abhimanyu Pati, Prabir K. Bandyopadhyay

Abstract:

The paper intends to highlight the significance of Digital Manufacturing (DM) strategy in support and achievement of business strategy and goals of any manufacturing organization. Towards this end, DM initiatives have been given a process perspective, while not undermining its technological significance, with a view to link its benefits directly with fulfilment of customer needs and expectations in a responsive and cost-effective manner. A digital process model has been proposed to categorize digitally enabled organizational processes with a view to create synergistic groups, which adopt and use digital tools having similar characteristics and functionalities. This will throw future opportunities for researchers and developers to create a unified technology environment for integration and orchestration of processes. Secondly, an effort has been made to apply “what” and “how” features of Quality Function Deployment (QFD) framework to establish the relationship between customers’ needs – both for external and internal customers, and the features of various digital processes, which support for the achievement of these customer expectations. The paper finally concludes that in the present highly competitive environment, business organizations cannot thrive to sustain unless they understand the significance of digital strategy and integrate it with their business strategy with a clearly defined implementation roadmap. A process-oriented approach to DM strategy will help business executives and leaders to appreciate its value propositions and its direct link to organization’s competitiveness.

Keywords: Digital manufacturing, digital process model, quality function deployment, business strategy.

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5857 Application of Strong Optical Feedback to Enhance the Modulation Bandwidth of Semiconductor Lasers to the Millimeter-Wave Band

Authors: Moustafa Ahmed, Ahmed Bakry, Fumio Koyama

Abstract:

We report on the use of strong external optical feedback to enhance the modulation response of semiconductor lasers over a frequency passband around modulation frequencies higher than 60 GHz. We show that this modulation enhancement is a type of photon-photon resonance (PPR) of oscillating modes in the external cavity formed between the laser and the external reflector. The study is based on a time-delay rate equation model that takes into account both the strong feedback and multiple reflections in the external cavity. We examine the harmonic and intermodulation distortions associated with single and two-tone modulations in the mm-wave band of the resonant modulation. We show that compared with solitary lasers modulated around the carrier-photon resonance frequency, the present mm-wave modulated signal has lower distortions.

Keywords: Distortion, intensity modulation, optical feedback, semiconductor laser.

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5856 An Integrated Supply Chain Management to Manufacturing Industries

Authors: Kittipong Tissayakorn, Fumio Akagi, Yu Song

Abstract:

Manufacturers have been exploring innovative strategies to achieve and sustain competitive advantages as they face a new era of intensive global competition. Such strategy is known as Supply Chain Management (SCM), which has gained a tremendous amount of attention from both researchers and practitioners over the last decade. Supply chain management (SCM) is considered as the most popular operating strategy for improving organizational competitiveness in the twenty-first century. It has attracted a lot of attention recently due to its role involving all of the activities in industrial organizations, ranging from raw material procurement to final product delivery to customers. Well-designed supply chain systems can substantially improve efficiency and product quality, and eventually enhance customer satisfaction and profitability. In this paper, a manufacturing engineering perspective on supply chain integration is presented. Research issues discussed include the product and process design for the supply chain, design evaluation of manufacturing in the supply chain, agent-based techniques for supply chain integration, intelligent information for sharing across the supply chain, and a development of standards for product, process, and production data exchange to facilitate electronic commerce. The objective is to provide guidelines and references for manufacturing engineers and researchers interested in supply chain integration.

Keywords: Supply Chain, Supply Chain Management, Supply Chain Integration, Manufacturing Industries.

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5855 Real Time Compensation of Machining Errors for Machine Tools NC based on Systematic Dispersion

Authors: M. Rahou, A. Cheikh, F. Sebaa

Abstract:

Manufacturing tolerancing is intended to determine the intermediate geometrical and dimensional states of the part during its manufacturing process. These manufacturing dimensions also serve to satisfy not only the functional requirements given in the definition drawing, but also the manufacturing constraints, for example geometrical defects of the machine, vibration and the wear of the cutting tool. In this paper, an experimental study on the influence of the wear of the cutting tool (systematic dispersions) is explored. This study was carried out on three stages .The first stage allows machining without elimination of dispersions (random, systematic) so the tolerances of manufacture according to total dispersions. In the second stage, the results of the first stage are filtered in such way to obtain the tolerances according to random dispersions. Finally, from the two previous stages, the systematic dispersions are generated. The objective of this study is to model by the least squares method the error of manufacture based on systematic dispersion. Finally, an approach of optimization of the manufacturing tolerances was developed for machining on a CNC machine tool

Keywords: Dispersions, Compensation, modeling, manufacturing Tolerance, machine tool.

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5854 Loading Methodology for a Capacity Constrained Job-Shop

Authors: Viraj Tyagi, Ajai Jain, P. K. Jain, Aarushi Jain

Abstract:

This paper presents a genetic algorithm based loading methodology for a capacity constrained job-shop with the consideration of alternative process plans for each part to be produced. Performance analysis of the proposed methodology is carried out for two case studies by considering two different manufacturing scenarios. Results obtained indicate that the methodology is quite effective in improving the shop load balance, and hence, it can be included in the frameworks of manufacturing planning systems of job-shop oriented industries.

Keywords: Manufacturing planning, loading, genetic algorithm, Job-Shop

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5853 Quantifying Key Factors Affecting Leagile Manufacturing System

Authors: Naveen Virmani, Rajeev Saha, Rajeshwar Sahai

Abstract:

In today’s market, striving hard has become necessary for the industries to survive due to the intense competition and globalization. In earlier days, there were few sellers and limited numbers of buyers, so customers were having fewer options to buy the product. But today, the market is highly competitive and volatile. Industries are focusing on robotics, advance manufacturing methods like AJM (Abrasive Jet Machining), EDM (Electric Discharge Machining), ECM (Electrochemical Machining) etc., CAD/CAM, CAE to make quality products and market them in shortest possible time. Leagile manufacturing system is ensuring best available solution at minimum cost to meet the market demand. This paper tries to assimilate the concept of Leagile manufacturing system in today’s scenario and evaluating key factors affecting Leagile manufacturing using digraph technique.

Keywords: Agile manufacturing, digraph, lean manufacturing, leagile manufacturing.

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5852 Assembly Process Algorithms of Flexible Cell

Authors: M. Kusá, M. Matúšová, A. Javorová, K. Velí

Abstract:

This paper deals about four items assembly process of linear drive. This assembly will be realized in flexible assembly cell on Institute of Manufacturing Systems and Applied Mechanics. There is defined manufacturing cell, individual actuators created our flexible cell. Next chapter is about control type, detailed describe a sequence control type, which will be used in mentioned flexible assembly cell. All cell control is divided in individual steps instructions. There instructions illustrate table number III.

Keywords: assembly, flexible cell, sequence control

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5851 Modeling Reflection and Transmission of Elastodiffussive Wave Sata Semiconductor Interface

Authors: A. A. Sharma, B. J. N. Sharma

Abstract:

This paper deals with the study of reflection and transmission characteristics of acoustic waves at the interface of a semiconductor half-space and elastic solid. The amplitude ratios (reflection and transmission coefficients) of reflected and transmitted waves to that of incident wave varying with the incident angles have been examined for the case of quasi-longitudinal wave. The special cases of normal and grazing incidence have also been derived with the help of Gauss elimination method. The mathematical model consisting of governing partial differential equations of motion and charge carriers’ diffusion of n-type semiconductors and elastic solid has been solved both analytically and numerically in the study. The numerical computations of reflection and transmission coefficients has been carried out by using MATLAB programming software for silicon (Si) semiconductor and copper elastic solid. The computer simulated results have been plotted graphically for Si semiconductors. The study may be useful in semiconductors, geology, and seismology in addition to surface acoustic wave (SAW) devices.

Keywords: Quasilongitudinal, reflection and transmission, semiconductors, acoustics.

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5850 Fabrication of High Aluminum Content Mg alloys using a Horizontal Twin Roll Caster

Authors: H. Harada, S. Nishida, T. Nagumo, M. Endo, H. Watari

Abstract:

This study was aimed for investigating of manufacturing high aluminum content Mg alloys using a horizontal twin roll caster. Recently, weight saving has been key issues for lighter transport equipments as well as electronic component parts. As alternative materials to aluminum alloys, developing magnesium alloy with higher strength has been expected. Normally high Aluminum content Mg alloy has poor ductility and is difficult to be rolled because of its high strength. However, twin roll casting process is suitable for manufacturing wrought Mg alloys because materials can be cast directly from molten metal. In this study, manufacturing of high aluminum content magnesium alloy sheet using the roll casting process has been carried out. Effects of manufacturing parameter, such as roll velocity, pouring temperature and roll gap, on casting was investigated. A microscopic observation of the crystals of cross section of as cast strip as well as rolled strip was conducted.

Keywords: AZ91, AZ111, AZ121, Magnesium alloys, Twin roll casting

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5849 Image Ranking to Assist Object Labeling for Training Detection Models

Authors: Tonislav Ivanov, Oleksii Nedashkivskyi, Denis Babeshko, Vadim Pinskiy, Matthew Putman

Abstract:

Training a machine learning model for object detection that generalizes well is known to benefit from a training dataset with diverse examples. However, training datasets usually contain many repeats of common examples of a class and lack rarely seen examples. This is due to the process commonly used during human annotation where a person would proceed sequentially through a list of images labeling a sufficiently high total number of examples. Instead, the method presented involves an active process where, after the initial labeling of several images is completed, the next subset of images for labeling is selected by an algorithm. This process of algorithmic image selection and manual labeling continues in an iterative fashion. The algorithm used for the image selection is a deep learning algorithm, based on the U-shaped architecture, which quantifies the presence of unseen data in each image in order to find images that contain the most novel examples. Moreover, the location of the unseen data in each image is highlighted, aiding the labeler in spotting these examples. Experiments performed using semiconductor wafer data show that labeling a subset of the data, curated by this algorithm, resulted in a model with a better performance than a model produced from sequentially labeling the same amount of data. Also, similar performance is achieved compared to a model trained on exhaustive labeling of the whole dataset. Overall, the proposed approach results in a dataset that has a diverse set of examples per class as well as more balanced classes, which proves beneficial when training a deep learning model.

Keywords: Computer vision, deep learning, object detection, semiconductor.

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5848 Model Predictive Control Using Thermal Inputs for Crystal Growth Dynamics

Authors: Takashi Shimizu, Tomoaki Hashimoto

Abstract:

Recently, crystal growth technologies have made progress by the requirement for the high quality of crystal materials. To control the crystal growth dynamics actively by external forces is useuful for reducing composition non-uniformity. In this study, a control method based on model predictive control using thermal inputs is proposed for crystal growth dynamics of semiconductor materials. The control system of crystal growth dynamics considered here is governed by the continuity, momentum, energy, and mass transport equations. To establish the control method for such thermal fluid systems, we adopt model predictive control known as a kind of optimal feedback control in which the control performance over a finite future is optimized with a performance index that has a moving initial time and terminal time. The objective of this study is to establish a model predictive control method for crystal growth dynamics of semiconductor materials.

Keywords: Model predictive control, optimal control, crystal growth, process control.

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5847 The Analysis on Leadership Skills in UK Automobile Manufacturing Enterprises

Authors: Yanting Cao, Kazumitsu Nawata

Abstract:

The UK has strong economic growth, which attracts other countries to invest there through globalization. This research process will be based on quantitative and qualitative descriptive analysis using interviews. The secondary analysis will involve a case study approach to understand the important aspects of leadership skills. The research outcomes will be identifying the strength and weakness of the leadership skills of UK automobile manufacturing enterprises and suggest the best practices adopted by the respective countries for better results.

Keywords: engineering management, leadership, industrial project management, project managers, automobile manufacturing

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5846 Depletion Layer Parameters of Al-MoO3-P-CdTe-Al MOS Structures

Authors: A. C. Sarmah

Abstract:

The Al-MoO3-P-CdTe-Al MOS sandwich structures were fabricated by vacuum deposition method on cleaned glass substrates. Capacitance versus voltage measurements were performed at different frequencies and sweep rates of applied voltages for oxide and semiconductor films of different thicknesses. In the negative voltage region of the C-V curve a high differential capacitance of the semiconductor was observed and at high frequencies (<10 kHz) the transition from accumulation to depletion and further to deep depletion was observed as the voltage was swept from negative to positive. A study have been undertaken to determine the value of acceptor density and some depletion layer parameters such as depletion layer capacitance, depletion width, impurity concentration, flat band voltage, Debye length, flat band capacitance, diffusion or built-in-potential, space charge per unit area etc. These were determined from C-V measurements for different oxide and semiconductor thicknesses.

Keywords: Debye length, Depletion width, flat band capacitance, impurity concentration.

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5845 STEP Implementation on Turn-mill Manufacturing Environment

Authors: Ahmad Majdi Bin Abdul-Rani, Mesfin Gizaw, Yusri Yusof

Abstract:

Researches related to standard product model and development of neutral manufacturing interfaces for numerical control machines becomes a significant topic since the last 25 years. In this paper, a detail description of STEP implementation on turnmill manufacturing has been discussed. It shows requirements of information contents from ISO14649 data model. It covers to describe the design of STEP-NC framework applicable to turn-mill manufacturing. In the framework, EXPRESS-G and UML modeling tools are used to depict the information contents of the system and established the bases of information model requirement. A product and manufacturing data model applicable for STEP compliant manufacturing. The next generation turn-mill operations requirements have been represented by a UML diagram. An object oriented classes of ISO1449 has been developed on Visual Basic dot NET platform for binding the static information model represented by the UML diagram. An architect of the proposed system implementation has been given on the bases of the design and manufacturing module of STEP-NC interface established. Finally, a part 21 file process plan generated for an illustration of turn-mill components.

Keywords: CAPP, ISO14649, Product modeling, STEP-NC

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5844 A Study of Growth Factors on Sustainable Manufacturing in Small and Medium-Sized Enterprises: Case Study of Japan Manufacturing

Authors: Tadayuki Kyoutani, Shigeyuki Haruyama, Ken Kaminishi, Zefry Darmawan

Abstract:

Japan’s semiconductor industries have developed greatly in recent years. Many were started from a Small and Medium-sized Enterprises (SMEs) that found at a good circumstance and now become the prosperous industries in the world. Sustainable growth factors that support the creation of spirit value inside the Japanese company were strongly embedded through performance. Those factors were not clearly defined among each company. A series of literature research conducted to explore quantitative text mining about the definition of sustainable growth factors. Sustainable criteria were developed from previous research to verify the definition of the factors. A typical frame work was proposed as a systematical approach to develop sustainable growth factor in a specific company. Result of approach was review in certain period shows that factors influenced in sustainable growth was importance for the company to achieve the goal.

Keywords: SME, manufacture, sustainable, growth factor.

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5843 Scheduling for a Reconfigurable Manufacturing System with Multiple Process Plans and Limited Pallets/Fixtures

Authors: Jae-Min Yu, Hyoung-Ho Doh, Ji-Su Kim, Dong-Ho Lee, Sung-Ho Nam

Abstract:

A reconfigurable manufacturing system (RMS) is an advanced system designed at the outset for rapid changes in its hardware and software components in order to quickly adjust its production capacity and functionally. Among various operational decisions, this study considers the scheduling problem that determines the input sequence and schedule at the same time for a given set of parts. In particular, we consider the practical constraints that the numbers of pallets/fixtures are limited and hence a part can be released into the system only when the fixture required for the part is available. To solve the integrated input sequencing and scheduling problems, we suggest a priority rule based approach in which the two sub-problems are solved using a combination of priority rules. To show the effectiveness of various rule combinations, a simulation experiment was done on the data for a real RMS, and the test results are reported.

Keywords: Reconfigurable manufacturing system, scheduling, priority rules, multiple process plans, pallets/fixtures

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5842 The Analysis of Photoconductive Semiconductor Switch Operation in the Frequency of 10 GHz

Authors: Morteza Fathipour, Seyed Nasrolah Anousheh, Kaveh Ghiafeh Davoudi, Vala Fathipour

Abstract:

A device analysis of the photoconductive semiconductor switch is carried out to investigate distribution of electric field and carrier concentrations as well as the current density distribution. The operation of this device was then investigated as a switch operating in X band. It is shown that despite the presence of symmetry geometry, switch current density of the on-state steady state mode is distributed asymmetrically throughout the device.

Keywords: Band X, Gallium-Arsenide, Mixed mode, PCSS, Photoconductivity.

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5841 Optimization of Lean Methodologies in the Textile Industry Using Design of Experiments

Authors: Ahmad Yame, Ahad Ali, Badih Jawad, Daw Al-Werfalli Mohamed Nasser, Sabah Abro

Abstract:

Industries in general have a lot of waste. Wool textile company, Baniwalid, Libya has many complex problems that led to enormous waste generated due to the lack of lean strategies, expertise, technical support and commitment. To successfully address waste at wool textile company, this study will attempt to develop a methodical approach that integrates lean manufacturing tools to optimize performance characteristics such as lead time and delivery. This methodology will utilize Value Stream Mapping (VSM) techniques to identify the process variables that affect production. Once these variables are identified, Design of Experiments (DOE) Methodology will be used to determine the significantly influential process variables, these variables are then controlled and set at their optimal to achieve optimal levels of productivity, quality, agility, efficiency and delivery to analyze the outputs of the simulation model for different lean configurations. The goal of this research is to investigate how the tools of lean manufacturing can be adapted from the discrete to the continuous manufacturing environment and to evaluate their benefits at a specific industrial.

Keywords: Lean manufacturing, DOE, value stream mapping, textiles.

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5840 A Study on Manufacturing of Head-Part of Pipes Using a Rotating Manufacturing Process

Authors: J. H. Park, S. K. Lee, Y. W. Kim, D. C. Ko

Abstract:

A large variety of pipe flange is required in marine and construction industry. Pipe flanges are usually welded or screwed to the pipe end and are connected with bolts. This approach is very simple and widely used for a long time; however, it results in high development cost and low productivity, and the productions made by this approach usually have safety problem at the welding area. In this research, a new approach of forming pipe flange based on cold forging and floating die concept is presented. This innovative approach increases the effectiveness of the material usage and save the time cost compared with conventional welding method. To ensure the dimensional accuracy of the final product, the finite element analysis (FEA) was carried out to simulate the process of cold forging, and the orthogonal experiment methods were used to investigate the influence of four manufacturing factors (pin die angle, pipe flange angle, rpm, pin die distance from clamp jig) and predicted the best combination of them. The manufacturing factors were obtained by numerical and experimental studies and it shows that the approach is very useful and effective for the forming of pipe flange, and can be widely used later.

Keywords: Cold forging, FEA, finite element analysis, Forge- 3D, rotating forming, tubes.

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5839 0.13-µm Complementary Metal-Oxide Semiconductor Vector Modulator for Beamforming System

Authors: J. S. Kim

Abstract:

This paper presents a 0.13-µm Complementary Metal-Oxide Semiconductor (CMOS) vector modulator for beamforming system. The vector modulator features a 360° phase and gain range of -10 dB to 10 dB with a root mean square phase and amplitude error of only 2.2° and 0.45 dB, respectively. These features make it a suitable for wireless backhaul system in the 5 GHz industrial, scientific, and medical (ISM) bands. It draws a current of 20.4 mA from a 1.2 V supply. The total chip size is 1.87x1.34 mm².

Keywords: CMOS, vector modulator, beamforming, wireless backhaul, ISM.

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